CN204217285U - 薄片状热管及具备薄片状热管的电子设备 - Google Patents

薄片状热管及具备薄片状热管的电子设备 Download PDF

Info

Publication number
CN204217285U
CN204217285U CN201390000266.5U CN201390000266U CN204217285U CN 204217285 U CN204217285 U CN 204217285U CN 201390000266 U CN201390000266 U CN 201390000266U CN 204217285 U CN204217285 U CN 204217285U
Authority
CN
China
Prior art keywords
sheet
heat pipe
container
protrusion tab
shaped heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201390000266.5U
Other languages
English (en)
Chinese (zh)
Inventor
青木博史
池田匡视
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Application granted granted Critical
Publication of CN204217285U publication Critical patent/CN204217285U/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201390000266.5U 2012-02-24 2013-02-14 薄片状热管及具备薄片状热管的电子设备 Expired - Lifetime CN204217285U (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-038136 2012-02-24
JP2012038136A JP5379874B2 (ja) 2012-02-24 2012-02-24 シート状ヒートパイプ、及びシート状ヒートパイプを備えた電子機器
PCT/JP2013/053474 WO2013125427A1 (ja) 2012-02-24 2013-02-14 シート状ヒートパイプ、及びシート状ヒートパイプを備えた電子機器

Publications (1)

Publication Number Publication Date
CN204217285U true CN204217285U (zh) 2015-03-18

Family

ID=49005614

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201390000266.5U Expired - Lifetime CN204217285U (zh) 2012-02-24 2013-02-14 薄片状热管及具备薄片状热管的电子设备

Country Status (5)

Country Link
US (1) US9565786B2 (https=)
JP (1) JP5379874B2 (https=)
CN (1) CN204217285U (https=)
TW (1) TWI510899B (https=)
WO (1) WO2013125427A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111602023A (zh) * 2018-01-22 2020-08-28 株式会社自动网络技术研究所 热输送构件、热输送系统及蓄电模块
TWI824229B (zh) * 2020-01-31 2023-12-01 日商古河電氣工業股份有限公司 蒸氣室
US12117243B2 (en) 2020-01-31 2024-10-15 Furukawa Electric Co., Ltd. Vapor chamber

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6121854B2 (ja) * 2013-09-18 2017-04-26 東芝ホームテクノ株式会社 シート型ヒートパイプまたは携帯情報端末
CN103702549A (zh) * 2013-12-26 2014-04-02 苏州天脉导热科技有限公司 一种用于超薄电子产品的热管
TW201530076A (zh) 2014-01-21 2015-08-01 Htc Corp 電子裝置
CN104797120A (zh) * 2014-01-21 2015-07-22 宏达国际电子股份有限公司 电子装置
US9435590B2 (en) * 2014-04-07 2016-09-06 Microsoft Technology Licensing, Llc Thin heat transfer device for thermal management
JP6023120B2 (ja) * 2014-05-15 2016-11-09 レノボ・シンガポール・プライベート・リミテッド 携帯用情報機器
CN105636406A (zh) * 2014-11-07 2016-06-01 泰硕电子股份有限公司 行动装置的散热模块
JP6548032B2 (ja) * 2015-03-19 2019-07-24 株式会社オートネットワーク技術研究所 冷却部材、及び蓄電モジュール
US10670352B2 (en) * 2016-05-23 2020-06-02 Pimems, Inc. High performance two-phase cooling apparatus for portable applications
US11543188B2 (en) 2016-06-15 2023-01-03 Delta Electronics, Inc. Temperature plate device
US11306974B2 (en) * 2016-06-15 2022-04-19 Delta Electronics, Inc. Temperature plate and heat dissipation device
EP3554054A4 (en) * 2016-12-07 2020-06-17 LG Electronics Inc. -1- MOBILE TERMINAL
CN106714515B (zh) * 2016-12-20 2023-07-25 深圳市欢太科技有限公司 移动终端
JPWO2018147283A1 (ja) * 2017-02-07 2019-07-18 古河電気工業株式会社 ベーパーチャンバ
JP6481803B1 (ja) * 2017-07-06 2019-03-13 株式会社村田製作所 電子機器
JP6400240B1 (ja) * 2018-02-05 2018-10-03 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
DE102018123707B4 (de) * 2018-09-26 2022-07-07 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Batterieeinrichtung
WO2020100533A1 (ja) * 2018-11-16 2020-05-22 株式会社村田製作所 ベーパーチャンバー
WO2020137473A1 (ja) * 2018-12-26 2020-07-02 株式会社巴川製紙所 温度制御ユニット、温度制御装置
TWI738179B (zh) * 2019-01-18 2021-09-01 李克勤 薄形散熱裝置及其製造方法
WO2021178722A1 (en) 2020-03-04 2021-09-10 Transport Phenomena Technologies, Llc Compliant thermal management devices, systems, and methods of fabrication thereof
JP7541570B2 (ja) * 2020-03-19 2024-08-28 Fcnt合同会社 携帯端末
JP7568430B2 (ja) 2020-06-30 2024-10-16 古河電気工業株式会社 ベーパーチャンバおよびベーパーチャンバの製造方法
WO2022025260A1 (ja) * 2020-07-31 2022-02-03 日本電産株式会社 熱伝導ユニットおよび冷却装置
JP7240470B1 (ja) 2021-10-18 2023-03-15 レノボ・シンガポール・プライベート・リミテッド 電子機器及び冷却モジュール
JP7765355B2 (ja) * 2022-07-04 2025-11-06 Ａｓｔｅｍｏ株式会社 半導体装置
WO2024025273A1 (ko) * 2022-07-29 2024-02-01 주식회사 케이엠더블유 히트싱크 구조체

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5560423A (en) * 1994-07-28 1996-10-01 Aavid Laboratories, Inc. Flexible heat pipe for integrated circuit cooling apparatus
JPH09159381A (ja) 1995-12-13 1997-06-20 Fujikura Ltd ヒートパイプを用いた熱伝達構造
JPH11237193A (ja) * 1998-02-19 1999-08-31 Furukawa Electric Co Ltd:The 板型ヒートパイプとそれを用いた実装構造
JP2000065490A (ja) * 1998-08-20 2000-03-03 Furukawa Electric Co Ltd:The 板型ヒートパイプとそれを用いた冷却構造
JP2003322483A (ja) 2002-04-26 2003-11-14 Furukawa Electric Co Ltd:The 板型ヒートパイプおよびその製造方法
JP2004012011A (ja) 2002-06-06 2004-01-15 Furukawa Electric Co Ltd:The 薄型フレキシブルヒートパイプ
JP2004028442A (ja) * 2002-06-25 2004-01-29 Furukawa Electric Co Ltd:The 板型ヒートパイプおよびその実装構造
US7019976B1 (en) * 2003-06-04 2006-03-28 Cisco Technology, Inc. Methods and apparatus for thermally coupling a heat sink to a circuit board component
JP4305644B2 (ja) * 2003-10-30 2009-07-29 大成プラス株式会社 固着機能を有する電子部品の熱保護装置
US20080141872A1 (en) * 2006-12-17 2008-06-19 Jian-Dih Jeng Pressing Method for Sealing Heat Pipe
TW200849295A (en) * 2007-06-15 2008-12-16 Fu-Chia Chang Super-conducting uniform-temperature heat dissipating module
US8069907B2 (en) * 2007-09-13 2011-12-06 3M Innovative Properties Company Flexible heat pipe
JP2009024996A (ja) * 2008-08-21 2009-02-05 Toshiba Home Technology Corp ヒートパイプの製造方

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111602023A (zh) * 2018-01-22 2020-08-28 株式会社自动网络技术研究所 热输送构件、热输送系统及蓄电模块
CN111602023B (zh) * 2018-01-22 2021-05-07 株式会社自动网络技术研究所 热输送构件、热输送系统及蓄电模块
TWI824229B (zh) * 2020-01-31 2023-12-01 日商古河電氣工業股份有限公司 蒸氣室
US12117243B2 (en) 2020-01-31 2024-10-15 Furukawa Electric Co., Ltd. Vapor chamber
US12369274B2 (en) 2020-01-31 2025-07-22 Furukawa Electric Co., Ltd. Vapor chamber

Also Published As

Publication number Publication date
JP2013174376A (ja) 2013-09-05
TWI510899B (zh) 2015-12-01
WO2013125427A1 (ja) 2013-08-29
JP5379874B2 (ja) 2013-12-25
US9565786B2 (en) 2017-02-07
US20140360701A1 (en) 2014-12-11
TW201339814A (zh) 2013-10-01

Similar Documents

Publication Publication Date Title
CN204217285U (zh) 薄片状热管及具备薄片状热管的电子设备
US11971219B2 (en) Heat dissipation device
CN210128646U (zh) 均热板及便携式电子设备
US7602610B2 (en) Electronic device
KR20210058909A (ko) 티타늄 열적 모듈
US10966351B2 (en) Heat pipe and vapor chamber heat dissipation
CN107529315B (zh) 均温板与散热装置
US9995537B2 (en) Heat pipe
CN109154476A (zh) 具有预定扭矩阻力的热管
TWI806885B (zh) 芯構造體及容納芯構造體的熱管
CN104717875B (zh) 散热组件的制造方法
CN107112117A (zh) 磁部件单元
CN207852661U (zh) 手持通讯装置及其薄型散热结构
US11039549B2 (en) Heat transferring module
US20200025460A1 (en) Heat sink
US20220117118A1 (en) Cooling device
TWI417704B (zh) 散熱器結構及其改良方法
CN206349353U (zh) 热传导部件
US20060207747A1 (en) Isothermal plate heat-dissipating device
US10352625B2 (en) Thermal module
CN102646652B (zh) 散热器及其改良方法
CN209524789U (zh) 散热器结构
US20250393104A1 (en) Compliant thermal management devices, systems, and methods of fabrication thereof
JP2010002128A (ja) 熱輸送デバイス及び電子機器
JP2022133169A (ja) 熱伝導部材

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20150318