CN204204826U - Semiconductor chip pick device - Google Patents
Semiconductor chip pick device Download PDFInfo
- Publication number
- CN204204826U CN204204826U CN201420699159.2U CN201420699159U CN204204826U CN 204204826 U CN204204826 U CN 204204826U CN 201420699159 U CN201420699159 U CN 201420699159U CN 204204826 U CN204204826 U CN 204204826U
- Authority
- CN
- China
- Prior art keywords
- semiconductor chip
- pick
- head
- cavity structure
- pick device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
The utility model provides a kind of semiconductor chip pick device, comprising: pick-up head, and the one side of pick-up head is semiconductor chip adsorption plane; The cavity structure being communicated with semiconductor chip adsorption plane is provided with in described pick-up head; Pick-up head is provided with away from the one side of semiconductor chip adsorption plane the air vent hole be connected with cavity structure, and the shape of cavity structure cross section is X-type.The shape of cross section of semiconductor chip pick device cavity structure is designed to X-type, effectively improve in the process of pickup semiconductor chip, due to the center of semiconductor chip pick device cavity structure in prior art and the contact-making surface of semiconductor chip is distant and the chip that easily causes that is that cause produces the problem of moderate finite deformation, make the center of cavity structure and the contact-making surface of semiconductor chip apart from closer, in pick process, the distortion of each position of semiconductor chip is less and evenly, can not occur because being out of shape excessive and phenomenon of breaking that is that occur.
Description
Technical field
The utility model relates to semiconductor technology apparatus field, particularly relates to a kind of semiconductor chip pick device.
Background technology
Semiconductor chip wafer is cut into institute's sizing manufacture.In order to the semiconductor chip cut off when not making to cut off is messy, the bonding retainer belt with cementability overleaf, cuts off wafer by wafer cutting device etc. from face side.Now, although the retainer belt being bonded in the back side is some by incision, not cut-off, become the state keeping each semiconductor chip.After completing cutting technique, the semiconductor chip be cut needs to take off from the retainer belt with cementability the encapsulation carrying out separately next step.Concrete way is that the pick-up head of the semiconductor chip pick device one with vacsorb function pastes on a semiconductor die, utilizes the pull of vacuum in described pick-up head to take away sticking to the semiconductor chip had on close-burning retainer belt.
Existing described semiconductor chip pick device, as shown in Fig. 1 a to Fig. 1 d, please participate in Fig. 1 a, and Fig. 1 a is the Longitudinal cross section schematic of described semiconductor chip pick device.From Fig. 1 a, described semiconductor chip pick device comprises pick-up head 10, the one side of described pick-up head 10 is semiconductor chip adsorption plane 101, be provided with the cavity structure 11 being communicated with described semiconductor chip adsorption plane 101 in described pick-up head 10, described pick-up head 10 is provided with away from the one side of described semiconductor chip adsorption plane 101 air vent hole 12 be connected with described cavity structure 11; Described pick-up head 10 is provided with a plate 13 away from the one side of described semiconductor chip adsorption plane 101, is provided with the first through hole 14 with the corresponding connection of described air vent hole 12 in described connecting plate 13; Described connecting plate 13 is provided with an axis body 15 away from the one side of described pick-up head 10, be provided with second through hole 16 be connected with described first through hole 14 with described air vent hole 12 in described axis body 15, described axis body 15 to be connected with a vacuum generating device (not shown) away from one end of described connecting plate 13.
But, in existing described semiconductor chip pick device, the cross sectional representation of described pick-up head 10 is as shown in Fig. 1 b to Fig. 1 c, the shape of cross section of described pick-up head 10 and described cavity structure 11 is rectangle, as shown in Figure 1 b), or the shape of cross section of described pick-up head 10 and described cavity structure 11 is oval, as illustrated in figure 1 c.Such structural design, only have structure and the semiconductor chip joint of described pick-up head 10 periphery, can make when using described semiconductor chip pick device pickup semiconductor chip, in described cavity structure 11 after extracting vacuum, semiconductor chip 17 can deform because of the negative pressure of vacuum formed in described cavity structure 11, and the centre annex of described semiconductor chip 17 can produce the distortion larger relative to contact-making surface because distance contact-making surface is comparatively far away, as shown in Figure 1 d, and existing described semiconductor chip 17 is all thinner, larger distortion easily causes breaking of described semiconductor chip 17
Therefore, provide a kind of follow-on semiconductor chip pick device very necessary.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of semiconductor chip pick device, for solving in semiconductor chip pick process, due to the center of semiconductor chip pick device cavity structure in prior art and the contact-making surface of semiconductor chip is distant and the chip that easily causes that is that cause produces moderate finite deformation, and then the problem easily causing semiconductor chip to break.
For achieving the above object and other relevant objects, the utility model provides a kind of semiconductor chip pick device, and described semiconductor chip pick device comprises: pick-up head, and the one side of described pick-up head is semiconductor chip adsorption plane; Be provided with the cavity structure being communicated with described semiconductor chip adsorption plane in described pick-up head, the shape of described cavity structure cross section is X-type; Described pick-up head is provided with away from the one side of described semiconductor chip adsorption plane the air vent hole be connected with described cavity structure.
As a kind of preferred version of semiconductor chip pick device of the present utility model, the middle angle α of described X-type cross section is 100 ° ~ 150 °.
As a kind of preferred version of semiconductor chip pick device of the present utility model, the shape of described pick-up head cross section is rectangle, ellipse, circle.
As a kind of preferred version of semiconductor chip pick device of the present utility model, described air vent hole is positioned at the center of described pick-up head away from the one side of described semiconductor chip adsorption plane.
As a kind of preferred version of semiconductor chip pick device of the present utility model, described air vent hole is connected with the center of described cavity structure.
As a kind of preferred version of semiconductor chip pick device of the present utility model, described semiconductor chip pick device also comprises an axis body, described axis body one end is connected with the one side of described pick-up head away from described semiconductor chip adsorption plane, and the other end is connected with a vacuum generating device; The first through hole of connection corresponding with described air vent hole is provided with in described axis body.
As a kind of preferred version of semiconductor chip pick device of the present utility model, described semiconductor chip pick device also comprises a plate, described connecting plate one end is connected with the one side of described pick-up head away from described semiconductor chip adsorption plane, and the other end is connected with described axis body one end away from described vacuum generating device; The second through hole with described air vent hole, the corresponding connection of described first through hole is provided with in described connecting plate.
As mentioned above, semiconductor chip pick device of the present utility model, there is following beneficial effect: the shape of cross section of semiconductor chip pick device cavity structure is designed to X-type, effectively improve in the process of pickup semiconductor chip, due to the center of semiconductor chip pick device cavity structure in prior art and the contact-making surface of semiconductor chip is distant and the semiconductor chip that easily causes that is that cause produces the problem of moderate finite deformation, make the center of cavity structure and the contact-making surface of semiconductor chip apart from closer, in pick process, the distortion of each position of semiconductor chip is less and even, can not occur because being out of shape excessive and phenomenon of breaking that is that occur.
Accompanying drawing explanation
Fig. 1 a is shown as the Longitudinal cross section schematic of semiconductor chip pick device of the prior art.
Fig. 1 b to Fig. 1 c is shown as the schematic top plan view of pick-up head of the prior art, wherein, in Fig. 1 b, the shape of the cross section of pick-up head and pick-up head internal cavity structure is rectangle, in Fig. 1 c, the shape of the cross section of pick-up head and pick-up head internal cavity structure is ellipse.
Fig. 1 d is shown as the structural representation that in prior art, semiconductor chip deforms under the absorption of semiconductor chip pick device.
Fig. 2 is shown as the Longitudinal cross section schematic of semiconductor chip pick device of the present utility model.
Fig. 3 to Fig. 4 is shown as the schematic top plan view of pick-up head of the present utility model.
Fig. 5 is shown as the structural representation of semiconductor chip pick device of the present utility model absorption semiconductor chip.
Element numbers explanation
10 pick-up heads
101 semiconductor chip adsorption planes
11 cavity structures
12 air vent holes
13 connecting plates
14 first through holes
15 axis bodies
16 second through holes
17 semiconductor chips
20 pick-up heads
201 semiconductor chip adsorption planes
21 cavity structures
22 air vent holes
23 axis bodies
24 first through holes
25 connecting plates
26 second through holes
27 semiconductor chips
Embodiment
By particular specific embodiment, execution mode of the present utility model is described below, person skilled in the art scholar the content disclosed by this specification can understand other advantages of the present utility model and effect easily.
Refer to Fig. 2 to Fig. 5.Notice, this specification is appended illustrates the structure, ratio, size etc. that illustrate, content all only in order to coordinate specification to disclose, understand for person skilled in the art scholar and read, and be not used to limit the enforceable qualifications of the utility model, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the utility model can produce and the object that can reach, still all should drop on technology contents that the utility model discloses and obtain in the scope that can contain.Simultaneously, quote in this specification as " on ", D score, "left", "right", " middle part " and " one " etc. term, also only for ease of understanding of describing, and be not used to limit the enforceable scope of the utility model, the change of its relativeness or adjustment, under changing technology contents without essence, when being also considered as the enforceable category of the utility model.
Refer to Fig. 2, the utility model provides a kind of semiconductor chip pick device, and described semiconductor chip pick device at least comprises: pick-up head 20, and the one side of described pick-up head 20 is semiconductor chip adsorption plane 201; The cavity structure 21 being communicated with described semiconductor chip adsorption plane 201 is provided with in described pick-up head 20; Described pick-up head 20 is provided with away from the one side of described semiconductor chip adsorption plane 201 air vent hole 22 be connected with described cavity structure 21.
Concrete, the center of described cavity structure 21 and the center of described pick-up head 20 coincide, described air vent hole 22 is positioned at the center of described pick-up head 20 away from the one side of described semiconductor chip adsorption plane 201, and described air vent hole 22 is connected with the center of described cavity structure 21.
Concrete, described chip pickup apparatus also comprises an axis body 23, and one end of described axis body 23 is connected with the one side of described pick-up head 20 away from described semiconductor chip adsorption plane 201, and the other end is connected with a vacuum generating device (not shown); One first through hole 24 is provided with in described axis body 23, the size of described first through hole 24 can be different from the size of described air vent hole 22, also can measure-alike with described air vent hole 22, preferably, in the present embodiment, the described size of the first through hole 24 and the measure-alike of described air vent hole 22, and described first through hole 24 is corresponding with described air vent hole about 22.The size of described axis body 23 can be less than or equal to the size of described pick-up head 20, and preferably, in the present embodiment, the size of described axis body 23 can be less than the size of described pick-up head 20.
Concrete, described semiconductor chip pick device also comprises a plate 25, described connecting plate 25 one end is connected with the one side of described pick-up head 20 away from described semiconductor chip adsorption plane 201, and the other end is connected with described axis body 23 one end away from described vacuum generating device; One second through hole 26 is provided with in described connecting plate 25, the size of described second through hole 26 can be different from the size of described air vent hole 22, described first through hole 24, also can with described air vent hole 22, described first through hole 24 measure-alike, preferably, in the present embodiment, the size of described second through hole 26 and described air vent hole 22, described first through hole 24 measure-alike, and described second through hole 26 and described air vent hole 22, described first through hole about 24 are corresponding.
Concrete, the chi of described connecting plate 25 is less than or equal to the size of described pick-up head 20, and preferably, in the present embodiment, the chi of described connecting plate 25 equals the size of described pick-up head 20.
Please participate in Fig. 3 to Fig. 4, the shape of described pick-up head 20 cross section can be rectangle (as shown in Figure 3), oval (as shown in Figure 4) or circle, and the shape of described cavity structure 21 cross section is X-type.
Concrete, the middle angle α of described X-type cross section can be unspecified angle in 0 ° to 180 °, and preferably, in the present embodiment, the middle angle α of described X-type cross section is 100 ° ~ 150 °
The shape of cross section of semiconductor chip pick device cavity structure is designed to X-type, effectively improve in the process of pickup semiconductor chip, due to the center of semiconductor chip pick device cavity structure 21 in prior art and the contact-making surface of semiconductor chip is distant and the semiconductor chip that easily causes that is that cause produces the problem of moderate finite deformation, make the described center of cavity structure 21 and the contact-making surface of semiconductor chip apart from closer, in pick process, the distortion of each position of semiconductor chip is less and even, can not occur because being out of shape excessive and phenomenon of breaking that is that occur.
Refer to Fig. 5, the structural representation of semiconductor chip pick device absorption semiconductor chip.As shown in Figure 5, when using described semiconductor chip pick device absorption semiconductor chip 27, described semiconductor chip 27 can tightly be attached on the semiconductor chip adsorption plane 201 of described pick-up head 20, the center of described cavity structure 21 and the contact-making surface of semiconductor chip 27 are apart from closer, the distortion of described each position of semiconductor chip 27 is less and evenly, can not occur because being out of shape excessive and phenomenon of breaking that is that occur.
In sum, the utility model provides a kind of semiconductor chip pick device, the shape of cross section of semiconductor chip pick device cavity structure is designed to X-type, effectively improve in the process of pickup semiconductor chip, due to the center of semiconductor chip pick device cavity structure in prior art and the contact-making surface of semiconductor chip is distant and the chip that easily causes that is that cause produces the problem of moderate finite deformation, make the center of cavity structure and the contact-making surface of semiconductor chip apart from closer, in pick process, the distortion of each position of semiconductor chip is less and even, can not occur because being out of shape excessive and phenomenon of breaking that is that occur.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all without prejudice under spirit of the present utility model and category, can modify above-described embodiment or changes.Therefore, such as have in art and usually know that the knowledgeable modifies or changes not departing from all equivalences completed under the spirit and technological thought that the utility model discloses, must be contained by claim of the present utility model.
Claims (7)
1. a semiconductor chip pick device, is characterized in that, described semiconductor chip pick device comprises: pick-up head, and the one side of described pick-up head is semiconductor chip adsorption plane; Be provided with the cavity structure being communicated with described semiconductor chip adsorption plane in described pick-up head, the shape of described cavity structure cross section is X-type; Described pick-up head is provided with away from the one side of described semiconductor chip adsorption plane the air vent hole be connected with described cavity structure.
2. semiconductor chip pick device according to claim 1, is characterized in that: the middle angle α of described X-type cross section is 100 ° ~ 150 °.
3. semiconductor chip pick device according to claim 1, is characterized in that: the shape of described pick-up head cross section is rectangle, ellipse, circle.
4. semiconductor chip pick device according to claim 1, is characterized in that: described air vent hole is positioned at the center of described pick-up head away from the one side of described semiconductor chip adsorption plane.
5. semiconductor chip pick device according to claim 1, is characterized in that: described air vent hole is connected with the center of described cavity structure.
6. semiconductor chip pick device according to claim 1, it is characterized in that: described semiconductor chip pick device also comprises an axis body, described axis body one end is connected with the one side of described pick-up head away from described semiconductor chip adsorption plane, and the other end is connected with a vacuum generating device; The first through hole of connection corresponding with described air vent hole is provided with in described axis body.
7. semiconductor chip pick device according to claim 6, it is characterized in that: described semiconductor chip pick device also comprises a plate, described connecting plate one end is connected with the one side of described pick-up head away from described semiconductor chip adsorption plane, and the other end is connected with described axis body one end away from described vacuum generating device; The second through hole with described air vent hole, the corresponding connection of described first through hole is provided with in described connecting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420699159.2U CN204204826U (en) | 2014-11-19 | 2014-11-19 | Semiconductor chip pick device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420699159.2U CN204204826U (en) | 2014-11-19 | 2014-11-19 | Semiconductor chip pick device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204204826U true CN204204826U (en) | 2015-03-11 |
Family
ID=52662752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420699159.2U Expired - Fee Related CN204204826U (en) | 2014-11-19 | 2014-11-19 | Semiconductor chip pick device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204204826U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107611076A (en) * | 2017-09-05 | 2018-01-19 | 苏州威格尔纳米科技有限公司 | A kind of substrate absorption platform |
-
2014
- 2014-11-19 CN CN201420699159.2U patent/CN204204826U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107611076A (en) * | 2017-09-05 | 2018-01-19 | 苏州威格尔纳米科技有限公司 | A kind of substrate absorption platform |
| CN107611076B (en) * | 2017-09-05 | 2019-11-15 | 苏州威格尔纳米科技有限公司 | A kind of substrate absorption platform |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204204826U (en) | Semiconductor chip pick device | |
| CN205128783U (en) | Chip fin school shape frock | |
| CN203565661U (en) | Forming die of double-row flat packaging chip pins | |
| CN203401778U (en) | Laminating tool capable of accurately aligning | |
| CN103728067B (en) | Resistance strain gauge for stress analysis | |
| CN202153516U (en) | Dual enhanced integrated circuit lead frame plate | |
| CN203774284U (en) | Dicing saw for semiconductor packaging | |
| CN201829490U (en) | Chip area punching integrated circuit lead frame | |
| CN102244039B (en) | Splitting method of semiconductor wafer | |
| CN203377096U (en) | Paper ring adhesive cushion block template | |
| CN203839407U (en) | Paster type diode | |
| CN203466170U (en) | Die bonding ejector pin cap for die bonder | |
| CN204720426U (en) | A kind of thimble cap | |
| CN203793707U (en) | Device for pasting packaging film on surface of product | |
| CN203617153U (en) | Capacitor chipless riveting device | |
| CN203787414U (en) | Small-power paster lead frame member | |
| CN204451058U (en) | A kind of paster rectifier bridge injection mold | |
| CN203553143U (en) | Leading-wire frame | |
| CN203061685U (en) | Automobile die upper clamping plate | |
| CN203061692U (en) | Upper clamping plate for automobile die | |
| CN203555990U (en) | Connecting structure of infusion mouth tube and breaking valve of peritoneal dialysis solution bag | |
| CN208827051U (en) | It is used for transmission the transmission belt that thickness is less than 0.8mm optical sheet | |
| CN210668355U (en) | Shared jumper wire structure suitable for MOS tube encapsulation | |
| CN202781910U (en) | Press slide | |
| CN203171649U (en) | Double-arm robot |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150311 Termination date: 20191119 |