CN204155954U - 一种超小超薄高光效侧射型高亮白光led元件 - Google Patents
一种超小超薄高光效侧射型高亮白光led元件 Download PDFInfo
- Publication number
- CN204155954U CN204155954U CN201420345678.9U CN201420345678U CN204155954U CN 204155954 U CN204155954 U CN 204155954U CN 201420345678 U CN201420345678 U CN 201420345678U CN 204155954 U CN204155954 U CN 204155954U
- Authority
- CN
- China
- Prior art keywords
- white light
- electric conductor
- substrate
- shot type
- extra small
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420345678.9U CN204155954U (zh) | 2014-06-25 | 2014-06-25 | 一种超小超薄高光效侧射型高亮白光led元件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420345678.9U CN204155954U (zh) | 2014-06-25 | 2014-06-25 | 一种超小超薄高光效侧射型高亮白光led元件 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204155954U true CN204155954U (zh) | 2015-02-11 |
Family
ID=52514049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201420345678.9U Active CN204155954U (zh) | 2014-06-25 | 2014-06-25 | 一种超小超薄高光效侧射型高亮白光led元件 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN204155954U (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105280797A (zh) * | 2015-05-28 | 2016-01-27 | 江苏欧密格光电科技股份有限公司 | 一种led焊盘转换模组 |
CN108649423A (zh) * | 2018-05-15 | 2018-10-12 | Oppo广东移动通信有限公司 | 激光投射模组、深度相机及电子装置 |
CN108649429A (zh) * | 2018-05-15 | 2018-10-12 | Oppo广东移动通信有限公司 | 发射激光器及光源组件 |
-
2014
- 2014-06-25 CN CN201420345678.9U patent/CN204155954U/zh active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105280797A (zh) * | 2015-05-28 | 2016-01-27 | 江苏欧密格光电科技股份有限公司 | 一种led焊盘转换模组 |
CN108649423A (zh) * | 2018-05-15 | 2018-10-12 | Oppo广东移动通信有限公司 | 激光投射模组、深度相机及电子装置 |
CN108649429A (zh) * | 2018-05-15 | 2018-10-12 | Oppo广东移动通信有限公司 | 发射激光器及光源组件 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN204155931U (zh) | 一种超小超薄高光效侧射型高亮白光多晶led元件 | |
CN105280626A (zh) | 超小超薄高光效侧射型高亮白光led元件 | |
CN105321937A (zh) | 超小超薄高光效侧射型高亮白光多晶led元件 | |
CN201044245Y (zh) | 发光二极管 | |
CN204155954U (zh) | 一种超小超薄高光效侧射型高亮白光led元件 | |
CN201112415Y (zh) | 引脚式大功率led器件 | |
CN103311410A (zh) | 一种高导热高击穿电压集成式led | |
CN104091880A (zh) | 一种超薄高效bt类led灯丝及其制作工艺 | |
CN203351644U (zh) | 覆晶式led支架和表面贴装led | |
CN204088364U (zh) | 超薄超小正发光双色led元件 | |
CN204011481U (zh) | 电热分离并集成led芯片的高反射率电路板 | |
CN203760508U (zh) | 一种全金属结构的led封装支架 | |
CN210467820U (zh) | 一种防断裂的贴片式二极管 | |
CN204271135U (zh) | 光电转换效率高的光源模组 | |
CN102185085A (zh) | 高功率led封装支架 | |
CN104241461B (zh) | 一种led封装模块制作方法 | |
CN202712257U (zh) | 陶瓷基材led光源模组支架 | |
CN202678401U (zh) | 大功率led的封装结构 | |
CN203377250U (zh) | 一种高导热高击穿电压集成式led | |
CN208127233U (zh) | 一种芯片封装结构 | |
CN202268386U (zh) | 一种led封装结构 | |
CN204792772U (zh) | 一种u形引脚整流桥封装结构 | |
CN204792779U (zh) | 一种二极管封装结构 | |
CN204834676U (zh) | 基于镜面铝基板的led光源模块 | |
CN202013884U (zh) | 高功率led封装支架 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Hutang town Wujin District Changzhou city Jiangsu province 213000 minhuang ditch South Industrial Zone Wu Nan Road No. 98 Patentee after: Jiangsu dense grid photoelectric Polytron Technologies Inc. Address before: Hutang town Wujin District Changzhou city Jiangsu province 213000 minhuang ditch South Industrial Zone Wu Nan Road No. 98 Patentee before: Amicc Opto-electronics Technology Co., Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Hutang town Wujin District Changzhou city Jiangsu province 213000 minhuang ditch South Industrial Zone Wu Nan Road No. 98 Patentee after: JIANGSU AMICC OPTOELECTRONICS TECHNOLOGY CO., LTD. Address before: Hutang town Wujin District Changzhou city Jiangsu province 213000 minhuang ditch South Industrial Zone Wu Nan Road No. 98 Patentee before: Amicc Opto-electronics Technology Co., Ltd. |