CN204103246U - A kind of liquid refrigerating type semiconductor laser with anticorrosion structure - Google Patents
A kind of liquid refrigerating type semiconductor laser with anticorrosion structure Download PDFInfo
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- CN204103246U CN204103246U CN201420247817.4U CN201420247817U CN204103246U CN 204103246 U CN204103246 U CN 204103246U CN 201420247817 U CN201420247817 U CN 201420247817U CN 204103246 U CN204103246 U CN 204103246U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 66
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 12
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
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- Semiconductor Lasers (AREA)
Abstract
The utility model provides a kind of liquid refrigerating type semiconductor laser with anticorrosion structure, the liquid refrigerating type semiconductor laser with anti-corrosion structure arranges liquid-in pipe, drain pipe makes the liquid entered in liquid chiller not easily contact with negative pole contiguous block (or positive pole contiguous block), to not easily corrode Electrode connection block like this, thus ensure that metal ion can not enter in the fluid passage of liquid chiller inside, improve the reliability of liquid chiller; In like manner, the utility model sets into fluid cushion block and fluid cushion block, and liquid is not contacted with anode electrode contiguous block (or negative pole contiguous block), and not perishable positive pole contiguous block, improves the reliability of whole semiconductor laser device.
Description
Technical field
The utility model belongs to laser technology field, relates to a kind of semiconductor laser, especially a kind of semiconductor laser with anti-corrosion structure.
Background technology
High-power semiconductor laser has the advantages such as volume is little, lightweight, efficiency is high, the life-span is long, be widely used in laser processing, laser medicine, laser display and field of scientific study, become the core devices that new century development is fast, achievement is many, Subject identity is wide, range of application is large.
Semiconductor laser is very responsive to environment when applying, dust, humidity, the performance and used life of the conditions such as temperature to laser has extreme influence, and in addition, typical temperature is at less than 5 degree Celsius, body surface will condense, and for semiconductor laser, condensation will cause its easy short circuit.Therefore, for playing the performance of semiconductor laser to greatest extent, in the urgent need to a kind of semiconductor laser with anti-corrosion structure.
Chinese patent application publication No. CN 102055132 A, disclose a kind of vacuum seal semiconductor laser, semiconductor laser is sealed in vacuum chamber, vacuum-sealed cavity complex structure used, in addition in use there is the risk of vacuum leak, if vacuum leak, the dust in vacuum chamber not easily removes, moisture also not easily removes, and causes semiconductor laser to condense.
Chinese patent application " outdoor semiconductor laser module " (CN 102237632 A) discloses a kind of semiconductor laser of outdoor, its structure is used in the semiconductor laser of wind-cooling heat dissipating, semiconductor laser for liquid cools type is inapplicable, if simultaneously have steam in this body structure, moisture not easily derives.
Utility model content
The purpose of this utility model is to provide a kind of liquid refrigerating type semiconductor laser with anti-corrosion structure, has etch-proof advantage.
The technical solution of the utility model is as follows:
A kind of liquid refrigerating type semiconductor laser with anticorrosion structure, comprise liquid chiller, semiconductor laser chip, both positive and negative polarity Electrode connection block, liquid chiller upper surface is provided with semiconductor laser chip, positive pole contiguous block is set on liquid chiller top, negative pole contiguous block is set in the bottom of liquid chiller.
Described liquid chiller has liquid-entering hole, fluid hole, passage aperture is 5 mm-5.5 mm.
Described liquid refrigerating type semiconductor laser also comprises liquid-in pipe, drain pipe, enters fluid cushion block, fluid cushion block.
Liquid-in pipe is arranged on positive pole contiguous block (or negative pole contiguous block) and is above connected with the liquid-entering hole of liquid chiller, drain pipe is arranged on that positive pole contiguous block (or negative pole contiguous block) is upper to be obtained fluid hole with liquid chiller and be connected, and enters fluid cushion block and is arranged on negative pole contiguous block (or positive pole contiguous block) for being connected with liquid-entering hole top on liquid chiller; Fluid cushion block is arranged on negative pole contiguous block (or positive pole contiguous block) for being connected with fluid hole top on connecting fluid chiller.
In addition, a pair connecting hole can be provided with on positive pole contiguous block (or negative pole contiguous block), for placing liquid-in pipe and drain pipe, described liquid-in pipe is arranged on a connecting hole of positive pole contiguous block (or negative pole contiguous block), for connecting fluid chiller liquid-entering hole; Described drain pipe is arranged on another connecting hole of positive pole contiguous block (or negative pole contiguous block), for connecting fluid chiller fluid hole.
Negative pole contiguous block (or positive pole contiguous block) arranges a pair cushion block deep gouge, for being placed into fluid cushion block and fluid cushion block.
Enter fluid cushion block to be arranged in the upper cushion block deep gouge of negative pole contiguous block (or positive pole contiguous block) for being connected with liquid-entering hole top on liquid chiller; Fluid cushion block is arranged in negative pole contiguous block (or positive pole contiguous block) another cushion block deep gouge upper, for being connected with fluid hole top on connecting fluid chiller.
The utility model sets into fluid cushion block and fluid cushion block, liquid from after liquid-entering hole enters by flowing out from fluid hole after the fluid passage liquid chiller, in this process, liquid can contact negative pole contiguous block (positive pole contiguous block), anticathode contiguous block (positive pole contiguous block) carries out liquid and washes away, after setting into fluid cushion block and fluid cushion block, liquid washes away to entering on fluid cushion block and fluid cushion block, not easily erosion Electrode connection block.
The utility model arranges liquid-in pipe and drain pipe, when liquid passes into, passes into from liquid-in pipe, and when liquid flows out, flow out from drain pipe, liquid will directly not contact with positive pole contiguous block (negative pole contiguous block), thus makes Electrode connection block not easily by liquid erosion.
The material selection corrosion-resistant material of liquid-in pipe and drain pipe, can select plastics, pottery etc.
Enter the material selection corrosion-resistant material of fluid cushion block and fluid cushion block, can plastics, pottery etc. be selected.
Liquid chiller surface arranges diffusion barrier, on diffusion barrier, adhesion layer is set, semiconductor laser chip is welded on adhesion layer by solder, diffusion barrier forms to stop adhesive layer material to diffuse on liquid chiller body the fragile material layer that diffusion is empty or adhesion is poor, finally causes semiconductor laser chip to come off from heat sink material.
Liquid chiller selects metal material, can select metallic copper, metallic copper tungsten etc.
Diffusion barrier Material selec-tion metallic nickel, thickness is 3 μm-6 μm.
Adhesive layer material selects gold, and thickness is 0.5 μm-1 μm.
Liquid chiller inside is provided with fluid passage, and passage aperture is 100 μm-300 μm.
The another kind of liquid refrigerating type semiconductor laser with anticorrosion structure in the utility model, it is formed by stacking for N number of liquid chiller being welded with semiconductor laser chip, N is greater than 1, anode electrode contiguous block is set on top liquid chiller top, negative pole contiguous block is set in lowermost end liquid chiller bottom.
Each liquid chiller is provided with liquid-entering hole and fluid hole, be provided with sealing ring in the liquid-entering hole of liquid chiller connection simultaneously and fluid hole, the diameter of liquid-entering hole and fluid hole is 5.0mm-5.5mm.
Liquid-in pipe is set in lowermost end liquid chiller liquid-entering hole, in fluid hole, drain pipe is set; Be provided with on top liquid chiller liquid-entering hole top into fluid cushion block for connecting positive pole contiguous block, fluid hole top is provided with fluid cushion block for connecting positive pole contiguous block.
Positive pole contiguous block (or negative pole contiguous block) is provided with a pair connecting hole, and for placing liquid-in pipe and drain pipe, described liquid-in pipe is arranged on a connecting hole of positive pole contiguous block (or negative pole contiguous block), for connecting fluid chiller liquid-entering hole; Described drain pipe is arranged on another connecting hole of positive pole contiguous block (or negative pole contiguous block), for connecting fluid chiller fluid hole.
Negative pole contiguous block (or positive pole contiguous block) arranges a pair cushion block deep gouge, for being placed into fluid cushion block and fluid cushion block.
Enter fluid cushion block to be arranged in negative pole contiguous block (or positive pole contiguous block) cushion block deep gouge for being connected with liquid-entering hole top on liquid chiller; Fluid cushion block is arranged in negative pole contiguous block (or positive pole contiguous block) another cushion block deep gouge upper, for being connected with fluid hole top on connecting fluid chiller.
Described liquid-in pipe, drain pipe, enter the material of fluid cushion block and fluid cushion block material selection non-metal anti-corrosion, select plastics or pottery, also can select fiber glass epoxy, organic toughened glass, epoxy phenol aldehyde glass steel, aluminium oxide ceramics.
The utility model sets into fluid cushion block and fluid cushion block, liquid from after liquid-entering hole enters by flowing out from fluid hole after the fluid passage liquid chiller, in this process, liquid can contact negative pole contiguous block (both positive and negative polarity contiguous block), carry out liquid to both positive and negative polarity contiguous block to wash away, after setting into fluid cushion block and fluid cushion block, liquid is erosion Electrode connection block not easily.
Liquid chiller surface arranges diffusion barrier, on diffusion barrier, arrange adhesion layer, and semiconductor laser chip is welded on adhesion layer by solder.
Liquid chiller inside is provided with fluid passage, and passage aperture is 100 μm-300 μm.
Described Electrode connection block selects high heat-conductivity conducting material, can select silver, copper etc., and arranges diffusion barrier on its surface, and diffusion barrier arranges adhesion layer.
Diffusion barrier selects nickel, thickness to be 3 μm-6 μm.
Adhesion coating selects gold, and thickness is 0.5 μm-1 μm.
Adhesion layer choosing has gold to be for guard electrode articulamentum non-corrosive and is convenient to welding.
Usually for the semiconductor laser of liquid refrigerating, refrigerator and semiconductor laser electrode select metal material, the refrigeration of water for semiconductor laser is passed in refrigerator, the electrode of liquid meeting noise spectra of semiconductor lasers washes away, in the process of washing away, when metal contacts with water, galvanic interaction can be there is, cause the electrochemical corrosion to metal, oxygen on the one hand in water and metallic element generation oxidation reaction, even if the water on the other hand in liquid chiller is deionized water, containing impurity such as carbon in metal, in the environment having water, can galvanic interaction be formed and corrode.Oxygen is main corrosive agent, in water, the content of carbon dioxide and pH value affect extent of corrosion and comparatively there is dissolved gas, metal and salt type oxide in flood, and other organic substance, these numerous impurity make glassware for drinking water conductive, also corrosivity effect is created to metal, finally affect the life and reliability of semiconductor laser.
At present, liquid refrigerating type semiconductor laser of the prior art, be not used alone liquid-in pipe, drain pipe, and just enter path by the liquid-entering hole on liquid chiller and fluid hole as liquid discharge, liquid from after liquid-entering hole enters by flowing out from fluid hole after the fluid passage liquid chiller, in this process, liquid can contact both positive and negative polarity contiguous block, carry out liquid to both positive and negative polarity contiguous block to wash away, on the one hand, its surface of the liquid corrosion contacted with Electrode connection block, causes Electrode connection block superficial layer to come off; On the other hand, liquid comes into contact Electrode connection block surface, there is electrochemical corrosion in Electrode connection block surface, after surface is oxidized, metal ion can enter in the fluid passage of liquid chiller inside, adsorption of metal ions impurity or form comparatively macroparticle after carrying out complexing, causes the fluid passage of liquid chiller inside to block.
The utility model arranges liquid-in pipe, drain pipe makes the liquid entered in liquid chiller not easily contact with negative pole contiguous block (or positive pole contiguous block), to not easily corrode Electrode connection block like this, thus ensure that metal ion can not enter in the fluid passage of liquid chiller inside, improve the reliability of liquid chiller; In like manner, the utility model sets into fluid cushion block and fluid cushion block, and liquid is not contacted with anode electrode contiguous block (or negative pole contiguous block), and not perishable positive pole contiguous block, improves the reliability of whole semiconductor laser device.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of liquid refrigerating type semiconductor laser of the present utility model.
Fig. 2 is the schematic diagram of another kind of liquid refrigerating type semiconductor laser of the present utility model.
Fig. 3 is the schematic diagram that the utility model is provided with the Electrode connection block of cushion block deep gouge.
Drawing reference numeral illustrates: 1 is liquid chiller; 2 is semiconductor laser chip; 3 is positive pole contiguous block; 4 is negative pole contiguous block; 5 is liquid-in pipe; 6 is drain pipe; 7 for entering fluid cushion block; 8 is fluid cushion block; 9 is connecting hole; 10 is cushion block deep gouge, and 11 is liquid-entering hole, and 12 is fluid hole.
Embodiment
Fig. 1 is the schematic diagram of the utility model liquid refrigerating type semiconductor laser, a kind of liquid refrigerating type semiconductor laser with anticorrosion structure, comprise liquid chiller 1, semiconductor laser chip 2, both positive and negative polarity Electrode connection block, liquid chiller 1 upper surface is provided with semiconductor laser chip 2, positive pole contiguous block 3 is set on liquid chiller 1 top, negative pole contiguous block 4 is set in the bottom of liquid chiller.
Described liquid refrigerating type semiconductor laser also comprises liquid-in pipe 5, drain pipe 6, enters fluid cushion block 7, fluid cushion block 8.
Described liquid chiller there is liquid-entering hole 11, fluid hole 12, liquid chiller 1 surface arranges diffusion barrier, on diffusion barrier, adhesion layer is set, semiconductor laser chip 2 is welded on adhesion layer by solder, diffusion barrier forms diffusion cavity or fragile material layer to stop adhesive layer material to diffuse on liquid chiller body, finally causes semiconductor laser chip to come off from heat sink.
Liquid chiller 1 selects metal or metal-base composites, can select metallic copper, copper-tungsten, copper-diamond composite material etc.
Diffusion barrier Material selec-tion metallic nickel, thickness is 3 μm-6 μm.
Adhesive layer material selects gold, and thickness is 0.5 μm-1 μm.
Liquid chiller 1 inside is provided with fluid passage, and passage aperture is 100 μm-300 μm.
At positive pole contiguous block 3(or negative pole contiguous block 4) on be provided with a pair connecting hole 9, for placing liquid-in pipe 5 and drain pipe 6, described liquid-in pipe 5 is arranged on positive pole contiguous block 3(or negative pole contiguous block 4) a connecting hole on, for connecting fluid chiller 1 liquid-entering hole 11; Described drain pipe 6 is arranged on positive pole contiguous block 3(or negative pole contiguous block 4) another connecting hole on, for connecting fluid chiller fluid hole 12.
At negative pole contiguous block 4(or positive pole contiguous block 3) on a pair cushion block deep gouge 10 is set, for being placed into fluid cushion block 7 and fluid cushion block 8.
Enter fluid cushion block 7 and be arranged on negative pole contiguous block 4(or positive pole contiguous block 3) in a upper cushion block deep gouge 10 for being connected with liquid-entering hole 11 top on liquid chiller 1; Fluid cushion block 8 is arranged on negative pole contiguous block 4(or positive pole contiguous block 3) go up in another cushion block deep gouge 10, for being connected with fluid hole 12 top on connecting fluid chiller 1.
Fig. 2 is the schematic diagram of another kind of liquid refrigerating type semiconductor laser of the present utility model, there is the liquid refrigerating type semiconductor laser of anticorrosion structure, it is formed by stacking for multiple liquid chiller 1 being welded with semiconductor laser chip 2, on top liquid chiller 1 top, positive pole contiguous block 3(or negative pole contiguous block 4 are set), negative pole contiguous block 4(or positive pole contiguous block 3 are set in lowermost end liquid chiller 1 bottom).
Sealing ring is provided with in the liquid-entering hole 11 that each liquid chiller 1 connects and fluid hole 12.
Liquid-in pipe 5 is set in the liquid-entering hole 11 of lowermost end liquid chiller 1, drain pipe 6 is set in fluid hole 12; Be provided with into fluid cushion block 7 for connecting positive pole contiguous block 3(or negative pole contiguous block 4 on liquid-entering hole 11 top of top liquid chiller 1), fluid hole 12 top is provided with fluid cushion block 8 for connecting positive pole contiguous block 3(or negative pole contiguous block 4).
At positive pole contiguous block 3(or negative pole contiguous block 4) on be provided with a pair connecting hole 9, for placing liquid-in pipe 5 and drain pipe 6, described liquid-in pipe 3 is arranged on positive pole contiguous block 3(or negative pole contiguous block 4) a connecting hole 8 on, for the liquid-entering hole 11 of connecting fluid chiller 1; Described drain pipe 6 is arranged on positive pole contiguous block 3(or negative pole contiguous block 4) another connecting hole 9 on, for connecting fluid chiller 1 fluid hole 12.
At negative pole contiguous block 4(or positive pole contiguous block 3) on a pair cushion block deep gouge 10 is set, for being placed into fluid cushion block 7 and fluid cushion block 8.
Enter fluid cushion block 7 and be arranged on negative pole contiguous block 4(or positive pole contiguous block 3) in a cushion block deep gouge 10 for being connected with liquid-entering hole 11 top on liquid chiller 1; Fluid cushion block 8 is arranged on negative pole contiguous block 4(or positive pole contiguous block 3) go up in another cushion block deep gouge 10, for being connected with fluid hole 12 top on connecting fluid chiller 1.
Described liquid chiller 1 has liquid-entering hole 11, fluid hole 12, liquid chiller 1 surface arranges diffusion barrier, on diffusion barrier, arrange adhesion layer, and semiconductor laser chip 2 is welded on adhesion layer by solder.
Liquid chiller 1 inside is provided with fluid passage, and passage aperture is Φ 5.0mm-Φ 5.5mm.
Described liquid-in pipe 5, drain pipe 6, enter the material of fluid cushion block 7 and fluid cushion block 8 material selection non-metal anti-corrosion, select plastics or pottery, also can select fiber glass epoxy, organic toughened glass, epoxy phenol aldehyde glass steel, aluminium oxide ceramics.
Described liquid chiller 1 selects high heat-conductivity conducting material, can select silver, copper etc., and arranges diffusion barrier on its surface, and diffusion barrier arranges adhesion layer, and diffusion barrier selects nickel, thickness to be 3 μm-6 μm.
Adhesion coating selects gold, and thickness is 0.5 μm-1 μm.
Adhesion layer choosing has gold to be for guard electrode articulamentum non-corrosive and is convenient to welding.
At present, liquid refrigerating type semiconductor laser of the prior art, be not used alone liquid-in pipe, drain pipe, and just enter path by the liquid-entering hole on liquid chiller and fluid hole as liquid discharge, liquid from after liquid-entering hole enters by flowing out from fluid hole after the fluid passage liquid chiller, in this process, liquid can contact both positive and negative polarity contiguous block, carry out liquid to both positive and negative polarity contiguous block to wash away, on the one hand, its surface of the liquid corrosion contacted with Electrode connection block, causes Electrode connection block superficial layer to come off; On the other hand, liquid comes into contact Electrode connection block surface, there is electrochemical corrosion in Electrode connection block surface, after surface is oxidized, metal ion can enter in the fluid passage of liquid chiller inside, adsorption of metal ions impurity or form comparatively macroparticle after carrying out complexing, causes the fluid passage of liquid chiller inside to block.
The utility model arranges liquid-in pipe, drain pipe makes the liquid entered in liquid chiller not easily contact with negative pole contiguous block, so not easily anticathode contiguous block of inciting somebody to action corrode, thus ensure that metal ion can not enter in the fluid passage of liquid chiller inside, improve the reliability of liquid chiller; In like manner, the utility model sets into fluid cushion block and fluid cushion block, and liquid is not contacted with anode electrode contiguous block, and not perishable positive pole contiguous block, improves the reliability of whole semiconductor laser device.
Claims (7)
1. one kind has the liquid refrigerating type semiconductor laser of anticorrosion structure, comprise liquid chiller, semiconductor laser chip, both positive and negative polarity Electrode connection block, liquid chiller upper surface is provided with semiconductor laser chip, on liquid chiller top, positive pole contiguous block is set, in the bottom of liquid chiller, negative pole contiguous block is set, liquid chiller is provided with liquid-entering hole and fluid hole, it is characterized in that: also comprise liquid-in pipe, drain pipe, enter fluid cushion block, fluid cushion block, described liquid-in pipe is arranged on positive pole contiguous block and is connected with liquid-entering hole, drain pipe is arranged on positive pole contiguous block and is connected with fluid hole, enter fluid cushion block to be arranged on negative pole contiguous block for being connected with liquid-entering hole top on liquid chiller, fluid cushion block is arranged on negative pole contiguous block for being connected with fluid hole top on connecting fluid chiller.
2. the liquid refrigerating type semiconductor laser with anticorrosion structure according to claim 1, it is characterized in that: described positive pole contiguous block is provided with a pair connecting hole, for placing liquid-in pipe and drain pipe, described liquid-in pipe is arranged on a connecting hole of positive pole contiguous block, for connecting fluid chiller liquid-entering hole; Described drain pipe is arranged on another connecting hole of positive pole contiguous block, for connecting fluid chiller fluid hole.
3. the liquid refrigerating type semiconductor laser with anticorrosion structure according to claim 1 and 2, it is characterized in that: liquid-in pipe, drain pipe, the material entering fluid cushion block and fluid cushion block are fiber glass epoxy, or organic toughened glass, or epoxy phenol aldehyde glass steel, or aluminium oxide ceramics.
4. the liquid refrigerating type semiconductor laser with anticorrosion structure according to claim 1, it is characterized in that: liquid chiller surface arranges diffusion barrier, on diffusion barrier surface, adhesion layer is set, semiconductor laser chip is welded on adhesion layer by solder, diffusion blocking layer material is metallic nickel, thickness is 3 μm-6 μm, adhesive layer material is gold, thickness is 0.5 μm-1 μm, liquid chiller inside is provided with fluid passage, and passage aperture is 100 μm-300 μm.
5. one kind has the liquid refrigerating type semiconductor laser of anticorrosion structure, it is formed by stacking for N number of liquid chiller being welded with semiconductor laser chip, N is greater than 1, on top liquid chiller top, positive pole contiguous block is set, in lowermost end liquid chiller bottom, negative pole contiguous block is set, liquid chiller is provided with liquid-entering hole and fluid hole, it is characterized in that: also comprise liquid-in pipe, drain pipe, enter fluid cushion block, fluid cushion block, described liquid-in pipe is arranged on positive pole contiguous block and is connected with the liquid-entering hole on bottoms liquid refrigerator, described drain pipe is arranged on positive pole contiguous block and is connected with the fluid hole on bottoms liquid refrigerator, the described fluid cushion block that enters is arranged on negative pole contiguous block for being connected with liquid-entering hole top on the liquid chiller of top, described fluid cushion block is arranged on negative pole contiguous block for being connected with liquid-entering hole top on the liquid chiller of top.
6. the liquid refrigerating type semiconductor laser with anticorrosion structure according to claim 5, it is formed by stacking for N number of liquid chiller being welded with semiconductor laser chip, N is greater than 1, on top liquid chiller top, anode electrode contiguous block is set, in lowermost end liquid chiller bottom, negative pole contiguous block is set, it is characterized in that: described positive pole contiguous block is provided with a pair connecting hole, described liquid-in pipe is arranged on a connecting hole of positive pole contiguous block, for connecting fluid chiller liquid-entering hole; Described drain pipe is arranged on another connecting hole of positive pole contiguous block, for connecting fluid chiller fluid hole; Described negative pole contiguous block is arranged a pair cushion block deep gouge, the described fluid cushion block that enters is arranged in negative pole contiguous block cushion block deep gouge for being connected with liquid-entering hole top on liquid chiller; Fluid cushion block is arranged on negative pole contiguous block in another cushion block deep gouge, for being connected with fluid hole top on connecting fluid chiller.
7. the liquid refrigerating type semiconductor laser with anticorrosion structure according to claim 5 or 6, it is characterized in that: liquid-in pipe, drain pipe, the material entering fluid cushion block and fluid cushion block are fiber glass epoxy, or organic toughened glass, or epoxy phenol aldehyde glass steel, or aluminium oxide ceramics.
8. the liquid refrigerating type semiconductor laser with anticorrosion structure according to claim 5, it is characterized in that: described liquid chiller surface arranges diffusion barrier, on diffusion barrier, adhesion layer is set, semiconductor laser chip is welded on adhesion layer by solder, diffusion blocking layer material is metallic nickel, thickness is 3 μm-6 μm, adhesive layer material is gold, thickness is 0.5 μm-1 μm, liquid chiller inside is provided with fluid passage, and passage aperture is 100 μm-300 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420247817.4U CN204103246U (en) | 2014-05-15 | 2014-05-15 | A kind of liquid refrigerating type semiconductor laser with anticorrosion structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420247817.4U CN204103246U (en) | 2014-05-15 | 2014-05-15 | A kind of liquid refrigerating type semiconductor laser with anticorrosion structure |
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| Publication Number | Publication Date |
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| CN204103246U true CN204103246U (en) | 2015-01-14 |
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| CN201420247817.4U Expired - Lifetime CN204103246U (en) | 2014-05-15 | 2014-05-15 | A kind of liquid refrigerating type semiconductor laser with anticorrosion structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103956649A (en) * | 2014-05-15 | 2014-07-30 | 西安炬光科技有限公司 | Liquid refrigeration type semiconductor laser device with anti-corrosion structure |
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2014
- 2014-05-15 CN CN201420247817.4U patent/CN204103246U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103956649A (en) * | 2014-05-15 | 2014-07-30 | 西安炬光科技有限公司 | Liquid refrigeration type semiconductor laser device with anti-corrosion structure |
| CN103956649B (en) * | 2014-05-15 | 2017-01-25 | 西安炬光科技股份有限公司 | Liquid refrigeration type semiconductor laser device with anti-corrosion structure |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
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Address after: 710077 Xi'an province hi tech Zone, Shaanxi Zhang Road No. 86, No. 56 Patentee after: Focuslight Technologies Inc. Address before: 710119 high tech Zone, Shaanxi, Xi'an new industrial park information Avenue, building 17, building three, floor 10 Patentee before: XI'AN FOCUSLIGHT TECHNOLOGIES Co.,Ltd. |
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| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20150114 |