CN203349670U - Microchannel heat exchanger - Google Patents
Microchannel heat exchanger Download PDFInfo
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- CN203349670U CN203349670U CN 201320005298 CN201320005298U CN203349670U CN 203349670 U CN203349670 U CN 203349670U CN 201320005298 CN201320005298 CN 201320005298 CN 201320005298 U CN201320005298 U CN 201320005298U CN 203349670 U CN203349670 U CN 203349670U
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Abstract
The utility model discloses a microchannel heat exchanger which is composed of a substrate, a curved channel and heat insulation glass. The curved channel is arranged between the substrate and the heat insulation glass, the curved channel is formed by connecting arcs with different diameters, working media is smooth in flowing, frictional resistance factors are small, the microchannel heat exchanger covers a heating element, heat is transmitted to the curved channel from the substrate, deionized water with an inlet temperature of 293K flows in the curved channel, the working medium water absorbs the heat in the flowing process, the temperature of the contact face of the substrate and a chip of the heat exchanger is lowered, the effect of enhancing the heat exchanging and cooling of the chip is achieved, meanwhile, the deionized water flows and covers the whole heating face of the overall chip, the heat transfer specific area is increased, full heat exchanging is carried out on the heat exchanging face, meanwhile, the heat boundary layer thickness is reduced and controlled, better heat exchanging efficiency is achieved, and the microchannel heat exchanger is simple in structure and strong in practicality, and has strong popularization and application value.
Description
Technical field
The utility model belongs to the microelectron-mechanical refrigerating field, relates in particular to a kind of micro-channel heat exchanger.
Background technology
Along with the extensive use in fields such as electronics, biologies of microelectron-mechanical and nano-device, the thermal design of high integration microelectronic component and super large-scale integration system and thermal control become the key issue of technical development and breakthrough.Although conventional Rectangular Microchannel heat exchanger has compact conformation, specific area is large, the application characteristics such as coefficient of heat transfer height, but due to conventional Rectangular Microchannel heat exchanger fluid working medium when the long straight runner through heating, the absorption of fluids heat makes fluid temperature (F.T.) can raise along flow direction always, simultaneously, due to the formation and development of thermal boundary layer, convection transfer rate also can reduce along flow direction.
Prior art is only carried out design and analysis for conventional structural model, but because its channel design is the rectangular passage, thereby there is larger flow resistance and flow blind angle, causing flow velocity to slow down affects radiating effect, simultaneously conventional Rectangular Microchannel heat exchanger fails to carry out heat exchange with solid wall surface fully, has much room for improvement and strengthens improving the aspects such as heating surface uniform temperature and heat exchange efficiency are lower.
The utility model content
The purpose of this utility model is to provide a kind of micro-channel heat exchanger, be intended to solve prior art and only for conventional structural model, carry out design and analysis, but because its channel design is the rectangular passage, thereby there is larger flow resistance and flow blind angle, causing flow velocity to slow down affects radiating effect, conventional Rectangular Microchannel heat exchanger fails to carry out heat exchange with solid wall surface fully simultaneously, improves the problem that effect is poor, heat exchange efficiency is lower of heating surface uniform temperature.
The utility model is achieved in that a kind of micro-channel heat exchanger, and this micro-channel heat exchanger comprises: substrate, bending channel, heat-intercepting glass;
One side of described substrate is equipped with described bending channel, and a side of described bending channel is provided with described heat-intercepting glass.
Further, the area coverage of this micro-channel heat exchanger is 15.8392x15.8593mm
2, wherein long is 15.8392mm, wide is 15.8593mm.
Further, the material of described substrate is the silicon plate, and the thickness of substrate is 2mm.
Further, a side of described substrate is equipped with 16 bending channels, the deionized water that in bending channel, logical inlet temperature is 293K.
Further, the channel diameter of described bending channel is 0.4mm, and the circular arc that bending channel is 0.4mm and 0.9mm by radius forms, and imports and exports length and is 1mm.
The micro-channel heat exchanger that the utility model provides, by substrate, bending channel and heat-intercepting glass form, bending channel is arranged between substrate and heat-intercepting glass, bending channel is connected and composed by the circular arc of different-diameter, Working fluid flow is level and smooth, the frictional resistance factor is less, this micro-channel heat exchanger covers on heater element, heat arrives bending channel by substrate transfer, be connected with the deionized water that inlet temperature is 293K in bending channel, absorb heat in the working-medium water flow process, reduce heat exchanger substrate and chip contact-making surface temperature, reach the effect of strengthening chip heat exchange cooling, deionized water flows and covers whole chip heating face simultaneously, increased the heat exchange specific area, carried out sufficient heat exchange at heat-transfer surface, reduce simultaneously and controlled thermal-boundary-leyer thickness, there is better radiating efficiency, simple in structure, practical, having stronger propagation and employment is worth.
The accompanying drawing explanation
Fig. 1 is the structural representation of the micro-channel heat exchanger that provides of the utility model embodiment;
Fig. 2 is the three-dimensional structure schematic diagram of the micro-channel heat exchanger that provides of the utility model embodiment;
Fig. 3 is the Temperature Distribution spectrogram of the micro-channel heat exchanger that provides of the utility model embodiment;
Fig. 4 is the Temperature Distribution spectrogram of the common heat exchanger that provides of the utility model embodiment;
Fig. 5 is the interior even schematic diagram of Working fluid flow of micro-channel heat exchanger bending channel that the utility model embodiment provides.
In figure: 1, substrate; 2, bending channel; 3, heat-intercepting glass.
The specific embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Fig. 1 shows the structure of the micro-channel heat exchanger that the utility model embodiment provides.For convenience of explanation, only show the part relevant to the utility model embodiment.
This micro-channel heat exchanger comprises: substrate 1, bending channel 2, heat-intercepting glass 3;
One side of substrate 1 is equipped with bending channel 2, and a side of bending channel 2 is provided with heat-intercepting glass 3.
In the utility model embodiment, the area coverage of this micro-channel heat exchanger is 15.8392x15.8593mm
2, wherein long is 15.8392mm, wide is 15.8593mm.
In the utility model embodiment, the material of substrate 1 is the silicon plate, and the thickness of substrate 1 is 2mm.
In the utility model embodiment, a side of substrate 1 is equipped with 16 bending channels 2, the deionized water that the interior logical inlet temperature of bending channel 2 is 293K.
In the utility model embodiment, the channel diameter of bending channel 2 is 0.4mm, and the circular arc that bending channel 2 is 0.4mm and 0.9mm by radius forms, and imports and exports length and is 1mm.
Below in conjunction with drawings and the specific embodiments, application principle of the present utility model is further described.
1. the design of bending channel 2: as shown in Figure 1, this micro-channel heat exchanger area coverage is 15.8392x15.8593mm to structural representation
2(long x is wide), the material of substrate 1 is the silicon plate, the thickness of substrate 1 is 2mm; Heat exchanger inside has 16 bending channels 2, and interior logical working medium is deionized water, and bending channel 2 width are 0.4mm, is highly 0.4mm, and the circular arc that bending channel 2 is 0.4mm and 0.9mm by radius forms, and imports and exports length and is 1mm; This micro-channel heat exchanger covers on euthermic chip, and heat passes to flow working medium by substrate 1 and carries out heat exchange, and bending channel 2 tops cover heat-intercepting glass 3.The tomograph that Fig. 2 is this micro-channel heat exchanger, blue channel represents working-medium water, and green portion represents passage substrate 1, and top is heat-intercepting glass 3.
2. operation principle: this micro-channel heat exchanger covers on heater element, heat is delivered to bending channel 2 by substrate 1, be connected with the deionized water that inlet temperature is 293K in bending channel 2, absorb heat in the working-medium water flow process, reduce this micro-channel heat exchanger substrate 1 and chip contact-making surface temperature, reached the effect of strengthening chip heat exchange cooling.
3. design processing spec: this micro-channel heat exchanger adopts metal photochemistry lithographic method to be processed, the MCA technique that light assisted electrochemical etching is made the silicon substrate microchannel plate is: on silicon chip, with thermal oxidation method, form oxide-film, utilize photoetching technique mask pattern to be transferred to the position of determining bending channel 2 on oxide-film, and utilize wet etching technique to form and induce the hole array, then form ohmic contact layer at silicon chip back side, finally silicon chip is carried out to electrochemical etching in three utmost point electrolytic cells.
4. performance evaluation: micro-channel heat exchanger and conventional Rectangular Microchannel heat exchanger are contrasted, and setting microchannel flow working medium inlet temperature is 293K, and the heat flow density of heat dissipation of electronic chip is 500000W/m
2, the fluid intake mass flow is 0.006kg/m
3.
As shown in Figure 3, obtaining micro-channel heat exchanger substrate 1 wall maximum temperature by analytical calculation is 316.2659K, and minimum temperature is 310.504K.
As shown in Figure 4, and to obtain the wall maximum temperature by numerical simulation be 317.0921K to the conventional microchannel of rectangle, and minimum temperature is 309.0741K.
Visible micro-channel heat exchanger heat exchange maximum temperature, lower than conventional Rectangular Microchannel heat exchanger, illustrates that the micro-channel heat exchanger performance is better than conventional Rectangular Microchannel heat exchanger.
As shown in Figure 5, the Working fluid flow in the micro-channel heat exchanger passage is even, at the channel wall Flow Structure Nearby, without dead band, flow effect is preferably arranged.
The structural design of micro-channel heat exchanger, bending channel 2 is connected and composed by the circular arc of different-diameter, with other heat exchangers, compares, and the interior Working fluid flow of bending channel 2 is level and smooth, and the frictional resistance factor is less.
Under identical heat dissipation capacity, micro-channel heat exchanger is compared with conventional Rectangular Microchannel heat exchanger, and the temperature of micro-channel heat exchanger substrate 1 is lower, and heat transfer effect is better; Micro-channel heat exchanger is less than other new type heat exchanger flow resistances.
Available other related process methods are carried out processing and manufacturing to micro-channel heat exchanger, spark machined as thin as the spy, Laser Processing, the techniques such as line cutting.
The heat exchanger channel diameter that the present invention studies employing is 0.4mm, can carry out correlative study to the heat exchanger of other equivalent diameters later.
The micro-channel heat exchanger that the utility model embodiment provides, by substrate 1, bending channel 2 and heat-intercepting glass 3 form, bending channel 2 is arranged between substrate 1 and heat-intercepting glass 3, bending channel 2 is connected and composed by the circular arc of different-diameter, Working fluid flow is level and smooth, the frictional resistance factor is less, this micro-channel heat exchanger covers on heater element, heat is delivered to bending channel 2 by substrate 1, be connected with the deionized water that inlet temperature is 293K in bending channel 2, absorb heat in the working-medium water flow process, reduce heat exchanger substrate 1 and chip contact-making surface temperature, reach the effect of strengthening chip heat exchange cooling, deionized water flows and covers whole chip heating face simultaneously, increased the heat exchange specific area, carried out sufficient heat exchange at heat-transfer surface, reduce simultaneously and controlled thermal-boundary-leyer thickness, there is better radiating efficiency, simple in structure, practical, having stronger propagation and employment is worth.
These are only preferred embodiment of the present utility model, not in order to limit the utility model, all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection domain of the present utility model.
Claims (5)
1. a micro-channel heat exchanger, is characterized in that, this micro-channel heat exchanger comprises: substrate, bending channel, heat-intercepting glass;
One side of described substrate is equipped with described bending channel, and a side of described bending channel is provided with described heat-intercepting glass.
2. micro-channel heat exchanger as claimed in claim 1, is characterized in that, the area coverage of this micro-channel heat exchanger is 15.8392x15.8593mm
2, wherein long is 15.8392mm, wide is 15.8593mm.
3. micro-channel heat exchanger as claimed in claim 1, is characterized in that, the material of described substrate is the silicon plate, and the thickness of substrate is 2mm.
4. micro-channel heat exchanger as claimed in claim 1, is characterized in that, a side of described substrate is equipped with 16 bending channels, the deionized water that in bending channel, logical inlet temperature is 293K.
5. micro-channel heat exchanger as claimed in claim 4, is characterized in that, the channel diameter of described bending channel is 0.4mm, and the circular arc that bending channel is 0.4mm and 0.9mm by radius forms, and imports and exports length and be 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320005298 CN203349670U (en) | 2013-07-08 | 2013-07-08 | Microchannel heat exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320005298 CN203349670U (en) | 2013-07-08 | 2013-07-08 | Microchannel heat exchanger |
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| Publication Number | Publication Date |
|---|---|
| CN203349670U true CN203349670U (en) | 2013-12-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320005298 Expired - Fee Related CN203349670U (en) | 2013-07-08 | 2013-07-08 | Microchannel heat exchanger |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104154798A (en) * | 2014-04-24 | 2014-11-19 | 中国科学院广州能源研究所 | Novel plane micro-channel heat exchanger |
| CN104465562A (en) * | 2014-12-24 | 2015-03-25 | 西安电子科技大学 | Chain type staggered micro-channel structure |
| WO2016065988A1 (en) * | 2014-10-31 | 2016-05-06 | 丹佛斯微通道换热器（嘉兴）有限公司 | Heat exchanger |
| CN106895608A (en) * | 2015-12-21 | 2017-06-27 | 杭州三花家电热管理系统有限公司 | Micro-channel heat exchanger and its flat tube |
| CN107449294A (en) * | 2016-05-31 | 2017-12-08 | 杭州三花家电热管理系统有限公司 | Micro-channel heat exchanger |
| CN110538621A (en) * | 2019-09-02 | 2019-12-06 | 南京工业大学东海先进硅基材料研究院 | Preparation method of quartz glass micro-channel core plate |
| CN111243868A (en) * | 2020-03-20 | 2020-06-05 | 湖南联诚轨道装备有限公司 | Super capacitor thermal management system |
| CN115791244A (en) * | 2023-02-06 | 2023-03-14 | 中国核动力研究设计院 | Modular microchannel compact heat exchange experiment body, method, equipment and medium |
| CN116272741A (en) * | 2023-03-29 | 2023-06-23 | 深圳智微通科技有限公司 | Three-dimensional snakelike split recombination micro-reaction channel |
-
2013
- 2013-07-08 CN CN 201320005298 patent/CN203349670U/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104154798A (en) * | 2014-04-24 | 2014-11-19 | 中国科学院广州能源研究所 | Novel plane micro-channel heat exchanger |
| CN104154798B (en) * | 2014-04-24 | 2016-01-20 | 中国科学院广州能源研究所 | A kind of novel planar micro-channel heat exchanger |
| WO2016065988A1 (en) * | 2014-10-31 | 2016-05-06 | 丹佛斯微通道换热器（嘉兴）有限公司 | Heat exchanger |
| CN104465562A (en) * | 2014-12-24 | 2015-03-25 | 西安电子科技大学 | Chain type staggered micro-channel structure |
| CN104465562B (en) * | 2014-12-24 | 2017-11-24 | 西安电子科技大学 | A kind of staggered MCA of chain type |
| CN106895608A (en) * | 2015-12-21 | 2017-06-27 | 杭州三花家电热管理系统有限公司 | Micro-channel heat exchanger and its flat tube |
| CN107449294A (en) * | 2016-05-31 | 2017-12-08 | 杭州三花家电热管理系统有限公司 | Micro-channel heat exchanger |
| CN110538621A (en) * | 2019-09-02 | 2019-12-06 | 南京工业大学东海先进硅基材料研究院 | Preparation method of quartz glass micro-channel core plate |
| CN111243868A (en) * | 2020-03-20 | 2020-06-05 | 湖南联诚轨道装备有限公司 | Super capacitor thermal management system |
| CN115791244A (en) * | 2023-02-06 | 2023-03-14 | 中国核动力研究设计院 | Modular microchannel compact heat exchange experiment body, method, equipment and medium |
| CN116272741A (en) * | 2023-03-29 | 2023-06-23 | 深圳智微通科技有限公司 | Three-dimensional snakelike split recombination micro-reaction channel |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131218 Termination date: 20150708 |
|
| EXPY | Termination of patent right or utility model |