CN101989533A - Chip packaging block de-packaging method and device - Google Patents
Chip packaging block de-packaging method and device Download PDFInfo
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- CN101989533A CN101989533A CN2009100560178A CN200910056017A CN101989533A CN 101989533 A CN101989533 A CN 101989533A CN 2009100560178 A CN2009100560178 A CN 2009100560178A CN 200910056017 A CN200910056017 A CN 200910056017A CN 101989533 A CN101989533 A CN 101989533A
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Abstract
The invention provides a chip packaging block de-packaging method and a chip packaging block de-packaging device. The method comprises the following steps of: placing a chip packaging block on a base; and dripping mixed solution of nitric acid, sulfuric acid and deionized water onto the surface of the chip packaging block and heating the chip packaging block and the base. By the method, the accuracy of failure analysis on the de-packaged chip and a lead is improved.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, the method and the device of the decapsulation of particularly a kind of Chip Packaging piece.
Background technology
Chip Packaging comprises utilizes plastic shaping, seals with epoxy resin then.Fig. 1 is the generalized section of Chip Packaging piece, as shown in Figure 1, has chip 20 in the shell 10 of package blocks and goes between 30.Because therefore the possibility that may there be short circuit in the lead-in wire 30 of package blocks inside or opens circuit when the Chip Packaging piece goes wrong, need test the chip and the lead-in wire thereof of package blocks inside, analyzes its failure reasons.In the failure analysis of semiconductor chip, need carry out decapsulation to the Chip Packaging piece of finishing plastic packaging.One of method of decapsulation is that to adopt volume ratio be that the mixed liquor of the fuming nitric aicd of 1: 3 or 1: 2 and sulfuric acid is cooked corrosive liquid and instiled on the shell 10 of package blocks, shell 10 to the Chip Packaging piece corrodes, remove shell 10, chip 20 and lead-in wire 30 with exposed chip package blocks inside, thereby be convenient to described chip 20 and lead-in wire 30 are observed or tested, seek failure cause.
Be in the United States Patent (USP) of US6395129B1 for example, provided the apparatus and method of a kind of Chip Packaging piece decapsulation in the patent No..
Like this after decapsulation to the chip in the package blocks 20 or go between 30 when carrying out failure analysis, just be not easy to judge failure reasons, the damage that brings in the time of for example can be decapsulation thinks it is to cause failure reasons by mistake, and the problem of bringing like this is to make the inefficacy analysis inaccurate.
In addition, the needed decapsulation time of the method for above-mentioned decapsulation is longer.
Summary of the invention
The method and apparatus that the purpose of this invention is to provide the decapsulation of a kind of Chip Packaging piece has improved the accuracy to chip after the decapsulation and lead-in wire inefficacy analysis.
In order to achieve the above object, the invention provides the method for a kind of Chip Packaging piece decapsulation, comprise step:
The Chip Packaging piece is provided;
Described Chip Packaging piece is positioned on the base station;
Mixed solution to described Chip Packaging piece surface instillation nitric acid, sulfuric acid and deionized water heats described Chip Packaging piece and described base station.
Optionally, described nitric acid is fuming nitric aicd, and described sulfuric acid is the concentrated sulfuric acid.
Optionally, the concentration of described fuming nitric aicd is 98%, and the concentration of the described concentrated sulfuric acid is 98%, and the volume ratio of fuming nitric aicd, the concentrated sulfuric acid and deionized water is 1: 3: 0.5.
Optionally, the temperature that is heated to of described Chip Packaging piece is 100 ℃ to 120 ℃.
Optionally, also comprise step:, utilize acetone or deionized water that described Chip Packaging piece is cleaned behind the mixed solution 20min to 30min of described Chip Packaging piece surface instillation fuming nitric aicd, the concentrated sulfuric acid and deionized water.
Optionally, the described heat utilization Halogen lamp LED that adds.
Optionally, described Halogen lamp LED is positioned at the base station top, towards the irradiation of the Chip Packaging piece position of base station.
Optionally, described Halogen lamp LED is two, and is 30mm to 50mm apart from the base station upper surface.
Optionally, the material on described base station surface is a Heat Conduction Material.
Accordingly, the present invention also provides a kind of device of decapsulation of Chip Packaging piece, comprising:
Base station;
Drop instillator is positioned at described base station top, the mixed solution of be suitable for instiling nitric acid, sulfuric acid and deionized water;
Heater is provided with respect to the Chip Packaging piece on base station and the base station.
Optionally, described heater temperature that the Chip Packaging piece on base station and the base station is heated to is 100 ℃ to 120 ℃.
Optionally, also comprise cleaning device, be suitable for utilizing acetone or deionized water that described Chip Packaging piece is cleaned.
Optionally, described heater is a Halogen lamp LED.
Optionally, the beam projecting direction of described Halogen lamp LED is towards the Chip Packaging piece position of base station.
Optionally, described Halogen lamp LED is two, and is connected on the base station by flexible pipe and fixture.
Optionally, the material on described base station surface is a Heat Conduction Material.
Compare with prior art, the advantage of technique scheme of the present invention is:
Mixed solution by utilizing nitric acid, sulfuric acid and deionized water is as the corrosive liquid of decapsulation, reduced corrosivity to the Chip Packaging piece, and in decapsulation process, base station and Chip Packaging piece are heated, speeded the speed of decapsulation, therefore under the prerequisite of saving the decapsulation time, also alleviated damage, thereby improved accuracy chip after the decapsulation and lead-in wire inefficacy analysis to chip in the package blocks and lead-in wire.
Description of drawings
By the more specifically explanation of the preferred embodiments of the present invention shown in the accompanying drawing, above-mentioned and other purpose, feature and advantage of the present invention will be more clear.Reference numeral identical in whole accompanying drawings is indicated identical part.Painstakingly do not draw accompanying drawing, focus on illustrating purport of the present invention by actual size equal proportion convergent-divergent.
Fig. 1 is the generalized section of Chip Packaging piece;
Fig. 2 is the flow chart of Chip Packaging piece of the present invention decapsulation one embodiment;
Fig. 3 is the schematic diagram of Chip Packaging piece de-encapsulating devices one embodiment of the present invention.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the specific embodiment of the present invention is described in detail below in conjunction with accompanying drawing.
A lot of details have been set forth in the following description so that fully understand the present invention.But the present invention can implement much to be different from alternate manner described here, and those skilled in the art can do similar popularization under the situation of intension of the present invention, so the present invention is not subjected to the restriction of following public embodiment.
Secondly, the present invention utilizes schematic diagram to be described in detail, when the embodiment of the invention is described in detail in detail; for ease of explanation; the profile of expression device architecture can be disobeyed general ratio and be done local the amplification, and described schematic diagram is example, and it should not limit the scope of protection of the invention at this.The three dimensions size that in actual fabrication, should comprise in addition, length, width and the degree of depth.
Need it is encapsulated after chip manufacturing is finished, Chip Packaging mainly is to utilize epoxy resin to carry out plastic shaping, seals then.When the Chip Packaging piece goes wrong, need carry out decapsulation to it, then the inefficacy of analysis chip.
With reference to figure 1, one of method of decapsulation is that to adopt volume ratio be that 1: 3 or 1: 2 fuming nitric aicd and the mixed liquor of sulfuric acid are done corrosive liquid, instillation is on the shell 10 of Chip Packaging piece 5, shell 10 to Chip Packaging piece 5 corrodes, remove shell 10, with the chip 20 and the lead-in wire 30 of exposed chip package blocks 5 inside, thereby be convenient to described chip 20 and lead-in wire 30 are observed or tested, seek failure cause.
But those skilled in the art can not be adjusted into the corrosivity of corrosive liquid more weak corrosivity usually, therefore can make that like this speed of decapsulation is very slow, reduce the efficient of decapsulation greatly.And decapsulation is not thorough easily, remaining encapsulated substance.
Therefore the invention provides the method for a kind of Chip Packaging piece decapsulation, comprise step:
The Chip Packaging piece is provided;
Described Chip Packaging piece is positioned on the base station;
Mixed solution to described Chip Packaging piece surface instillation nitric acid, sulfuric acid and deionized water heats described Chip Packaging piece and described base station.
Optionally, described nitric acid is fuming nitric aicd, and described sulfuric acid is the concentrated sulfuric acid.
Optionally, the concentration of described fuming nitric aicd is 98%, and the concentration of the described concentrated sulfuric acid is 98%, and the volume ratio of fuming nitric aicd, the concentrated sulfuric acid and deionized water is 1: 3: 0.5.
Optionally, the temperature that is heated to of described Chip Packaging piece is 100 ℃ to 120 ℃.
Optionally, also comprise step:, utilize acetone or deionized water that described Chip Packaging piece is cleaned behind the mixed solution 20min to 30min of described Chip Packaging piece surface instillation fuming nitric aicd, the concentrated sulfuric acid and deionized water.
Optionally, the described heat utilization Halogen lamp LED that adds.
Optionally, described Halogen lamp LED is positioned at the base station top, towards the irradiation of the Chip Packaging piece position of base station.
Optionally, described Halogen lamp LED is two, and is 30mm to 50mm apart from the base station upper surface.
Optionally, the material on described base station surface is a Heat Conduction Material.
Accordingly, the present invention also provides a kind of device of decapsulation of Chip Packaging piece, comprising:
Base station;
Drop instillator is positioned at described base station top, the mixed solution of be suitable for instiling nitric acid, sulfuric acid and deionized water;
Heater is provided with respect to the Chip Packaging piece on base station and the base station.
Optionally, described heater temperature that the Chip Packaging piece on base station and the base station is heated to is 100 ℃ to 120 ℃.
Optionally, also comprise cleaning device, be suitable for utilizing acetone or deionized water that described Chip Packaging piece is cleaned.
Optionally, described heater is a Halogen lamp LED.
Optionally, the beam projecting direction of described Halogen lamp LED is towards the Chip Packaging piece position of base station.
Optionally, described Halogen lamp LED is two, and is connected on the base station by flexible pipe and fixture.
Optionally, the material on described base station surface is a Heat Conduction Material.
Compare with prior art, the mixed solution of the present invention by utilizing nitric acid, sulfuric acid and deionized water is as the corrosive liquid of decapsulation, reduced corrosivity to the Chip Packaging piece, and in decapsulation process, base station and Chip Packaging piece are heated, speeded the speed of decapsulation, therefore under the prerequisite of saving the decapsulation time, also alleviated damage, thereby improved accuracy chip after the decapsulation and lead-in wire inefficacy analysis to chip in the package blocks and lead-in wire.
Fig. 2 is the flow chart of Chip Packaging piece of the present invention decapsulation one embodiment.Fig. 3 is the schematic diagram of Chip Packaging piece de-encapsulating devices one embodiment of the present invention.Below with reference to Fig. 2 and Fig. 3 Chip Packaging piece de-encapsulation method of the present invention is described.
Step S1: the Chip Packaging piece is provided.
In the present embodiment; with reference to figure 1; has chip 20 in the described Chip Packaging piece 5; has the protective layer 20a that palladium (Pd) and tin (Sn) material form on chip 20 surfaces; and aluminium bed of material 20b, on aluminium bed of material 20b, having liner (Pad) 20c, lead-in wire 30 connects liner and chip; lead-in wire 30 is the copper lead-in wire, and width is 1mil (mil).
Above-mentioned being illustrated as of Chip Packaging piece 5 illustrated, certainly except that said structure, the Chip Packaging piece also can be other structures, and materials such as lead-in wire, liner also can be other materials.Therefore because the objective of the invention is decapsulation, all be applicable to the present invention as long as have any Chip Packaging piece of Plastic Package such as epoxy resin.
Step S2: described Chip Packaging piece 5 is positioned on the base station.
In traditional de-encapsulation method, base station is not provided usually, directly corrosive liquid is instiled on the plastic casing of Chip Packaging piece.And in the present embodiment,, provide a base station 310 with reference to figure 3, preferably the material on these base station 310 surfaces is a thermal conductivity material preferably, the metal material of for example anti-strong acid corrosion.Chip Packaging piece 5 is positioned on the upper surface of base station 310 central authorities.Since base station 310 adopted thermal conductivity preferably material make, therefore can be by to base station 310 heating, thus to 5 heating of Chip Packaging piece.Speed the speed of decapsulation like this, saved the time.
Step S3:, and described Chip Packaging piece 5 and described base station 310 heated to the mixed solution of described Chip Packaging piece 5 surperficial instillation nitric acid, sulfuric acid and deionized water.
The corrosivity of corrosive liquid is stronger in traditional decapsulation, for example utilizing concentration is that 98% fuming nitric aicd is done corrosive liquid, perhaps utilizing concentration is that 98% fuming nitric aicd and concentration are that the mixed solution of 98% sulfuric acid is done corrosive liquid, like this in decapsulation, can and go between to the chip 20 in the Chip Packaging piece 5 and 30 cause damage.Utilize the mixed solution of nitric acid, sulfuric acid and deionized water among the present invention, the concentration of wherein said nitric acid and sulfuric acid is in the concentration range that can corrode encapsulating material well known to those skilled in the art.For example concrete, be that 98% fuming nitric aicd and concentration are to increase deionized water again in the mixed solution of 98% sulfuric acid in concentration, and concentration is that 98% fuming nitric aicd, concentration are the volume ratio 1: 3: 0.5 of 98% sulfuric acid and ionized water.Because increased deionized water, therefore the corrosivity that makes corrosive liquid among the present invention compare the corrosive liquid in traditional decapsulation technology weakens, corrosive liquid corrosivity weakens when having reduced decapsulation corrosive liquid to the damage of chip and lead-in wire among the present invention, can make the speed of decapsulation slack-off because corrosivity weakens, therefore those skilled in the art can not utilize the method usually.But in an embodiment, during decapsulation, also Chip Packaging piece 5 and base station 310 are heated, like this with regard to having overcome that corrosivity weakens and speed slack-off, the inefficient problem of the decapsulation that causes, so both guaranteed the corrosivity of chip and lead-in wire is reduced, guaranteed again that the efficient of decapsulation did not reduce.
One preferred embodiment in, the mode of described heating is: on the one hand directly to 5 heating of Chip Packaging piece, on the other hand to base station 310 heating, because the thermal conductivity of base station 310 is good, and Chip Packaging piece 5 is positioned at base station 310 surfaces, therefore indirectly Chip Packaging piece 5 is heated again after base station 310 is heated, thereby speeded reaction speed, improved the speed of decapsulation.
Above-mentioned concentration is that 98% fuming nitric aicd, concentration are that the volume ratio 1: 3: 0.5 of 98% sulfuric acid and deionized water is only for illustrating; certainly in addition those skilled in the art can also adjust its ratio according to general knowledge; for example the ratio with deionized water increases; the ratio that perhaps with 98% fuming nitric aicd, concentration is 98% sulfuric acid is adjusted into 1: 2 or the like, therefore can simply shift the scope that draws onto all within protection scope of the present invention from the foregoing description.
In the present embodiment, also preferably utilize heater 320, just Halogen lamp LED is to Chip Packaging piece 5 and base station 310 heating, concrete, Halogen lamp LED is two, and is connected with base station 310 with fixture 340 by flexible pipe 330, therefore can regulate apart from the height of base station 310.When to Chip Packaging piece 5 and base station 310 heating, it is the position of 30mm to 50mm that Halogen lamp LED is adjusted to apart from the base station upper surface, for example 35mm, 40mm, 45mm, and Halogen lamp LED is positioned at the base station top, towards the irradiation of Chip Packaging piece 5 positions of base station 310, base station 310 is heated to 100 ℃ to 120 ℃, for example 105 ℃, 110 ℃, 115 ℃.This heating steps can just begin before the mixed solution of described Chip Packaging piece 5 surperficial instillation fuming nitric aicds, the concentrated sulfuric acid and deionized water, also can after the mixed solution of described Chip Packaging piece 5 surperficial instillation fuming nitric aicds, the concentrated sulfuric acid and deionized water, just begin, perhaps get simultaneously and begin at mixed solution to described Chip Packaging piece 5 surperficial instillation fuming nitric aicds, the concentrated sulfuric acid and deionized water.
Then, behind the mixed solution 20min to 30min of instillation fuming nitric aicd, the concentrated sulfuric acid and deionized water, for example behind 24min, 26min or the 28min, utilize acetone (Acetone) or deionized water to wash.Concrete, the time of corrosive liquid corrosion is followed the temperature correlation of heating, and can obtain according to simple experiment, for example in the present embodiment, if the temperature that is heated to is 120 ℃, then etching time is 20min, if the temperature that is heated to is 100 ℃, then etching time is 30min.And the time of above-mentioned corrosion is also relevant with the ratio of each component in the corrosive liquid; but all can obtain by simple experiment; therefore the time of above-mentioned corrosion and temperature are only for illustrating; scope of the present invention is not limited, the scope that any those skilled in the art can obtain by simple experiment is all within protection scope of the present invention.
Because added deionized water in the corrosive liquid with decapsulation in the present invention, its corrosivity is weakened, speed the speed of decapsulation on the other hand by heating, therefore promptly reduced damage like this to chip and lead-in wire in the Chip Packaging piece, guaranteed the efficient of decapsulation again, made decapsulation more thorough.Thereby improved accuracy to chip after the decapsulation and lead-in wire inefficacy analysis.
The present invention also provides the device of a kind of Chip Packaging piece decapsulation in addition, with reference to figure 3, comprising: base station;
Drop instillator is positioned at described base station top, the mixed solution of be suitable for instiling nitric acid, sulfuric acid and deionized water;
Heater is provided with respect to the Chip Packaging piece on base station and the base station.
One preferred embodiment in, described heater 320 is a Halogen lamp LED.The beam projecting direction of described Halogen lamp LED is towards the Chip Packaging piece position of base station 310.And described Halogen lamp LED is two, and be connected on the base station 310 by flexible pipe 330 and fixture 340, therefore Halogen lamp LED is to connect by flexible pipe, therefore its height apart from base station 310 can be regulated, when beginning to heat, Halogen lamp LED can be adjusted to the position nearer apart from base station 310,20mm to 50mm for example, the temperature that the Chip Packaging piece on base station 310 and the base station 310 is heated to is 100 ℃ to 120 ℃ then.
One preferred embodiment in, also comprise cleaning device 360, be used to utilize acetone or deionized water that described Chip Packaging piece is cleaned.
One preferred embodiment in, the material on described base station 310 surfaces is a Heat Conduction Material, can more effectively heat be conducted to the Chip Packaging piece like this, indirect realization is to the heating of Chip Packaging piece.
The above only is preferred embodiment of the present invention, though the present invention with the preferred embodiment disclosure as above, yet is not in order to limit the present invention.Any those of ordinary skill in the art, do not breaking away under the technical solution of the present invention scope situation, all can utilize the method and the technology contents of above-mentioned announcement that technical solution of the present invention is made many possible changes and modification, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical solution of the present invention, all still belongs in the scope of technical solution of the present invention protection any simple modification, equivalent variations and modification that above embodiment did according to technical spirit of the present invention.
Claims (16)
1. the method for Chip Packaging piece decapsulation is characterized in that, comprises step:
The Chip Packaging piece is provided;
Described Chip Packaging piece is positioned on the base station;
Mixed solution to described Chip Packaging piece surface instillation nitric acid, sulfuric acid and deionized water heats described Chip Packaging piece and described base station.
2. the method for Chip Packaging piece according to claim 1 decapsulation is characterized in that, described nitric acid is fuming nitric aicd, and described sulfuric acid is the concentrated sulfuric acid.
3. the method for Chip Packaging piece according to claim 2 decapsulation, it is characterized in that, the concentration of described fuming nitric aicd is 98%, and the concentration of the described concentrated sulfuric acid is 98%, and the volume ratio of fuming nitric aicd, the concentrated sulfuric acid and deionized water is 1: 3: 0.5 in the described mixed solution.
4. the method for Chip Packaging piece according to claim 3 decapsulation is characterized in that, the temperature that described Chip Packaging piece is heated to is 100 ℃ to 120 ℃.
5. the method for Chip Packaging piece according to claim 4 decapsulation, it is characterized in that, also comprise step:, utilize acetone or deionized water that described Chip Packaging piece is cleaned behind the mixed solution 20min to 30min of described Chip Packaging piece surface instillation fuming nitric aicd, the concentrated sulfuric acid and deionized water.
6. the method for Chip Packaging piece according to claim 5 decapsulation is characterized in that, the described heat utilization Halogen lamp LED that adds.
7. the method for Chip Packaging piece according to claim 6 decapsulation is characterized in that, described Halogen lamp LED is positioned at the base station top, towards the irradiation of the Chip Packaging piece position of base station.
8. the method for Chip Packaging piece according to claim 7 decapsulation is characterized in that, described Halogen lamp LED is two, and is 30mm to 50mm apart from the base station upper surface.
9. the method for Chip Packaging piece according to claim 8 decapsulation is characterized in that, the material on described base station surface is a Heat Conduction Material.
10. the device of the decapsulation of a Chip Packaging piece is characterized in that, comprising:
Base station;
Drop instillator is positioned at described base station top, the mixed solution of be suitable for instiling nitric acid, sulfuric acid and deionized water;
Heater is provided with respect to the Chip Packaging piece on base station and the base station.
11. the device of Chip Packaging piece according to claim 10 decapsulation is characterized in that, the temperature that described heater is heated to the Chip Packaging piece on base station and the base station is 100 ℃ to 120 ℃.
12. the device of Chip Packaging piece according to claim 11 decapsulation is characterized in that, also comprises cleaning device, is suitable for utilizing acetone or deionized water that described Chip Packaging piece is cleaned.
13. the device of Chip Packaging piece according to claim 12 decapsulation is characterized in that, described heater is a Halogen lamp LED.
14. the device of Chip Packaging piece according to claim 13 decapsulation is characterized in that, the beam projecting direction of described Halogen lamp LED is towards the Chip Packaging piece position of base station.
15. the device of Chip Packaging piece according to claim 13 decapsulation is characterized in that, described Halogen lamp LED is two, and is connected on the base station by flexible pipe and fixture.
16. the device of Chip Packaging piece according to claim 13 decapsulation is characterized in that, the material on described base station surface is a Heat Conduction Material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910056017 CN101989533B (en) | 2009-08-06 | 2009-08-06 | Chip packaging block de-packaging method and device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910056017 CN101989533B (en) | 2009-08-06 | 2009-08-06 | Chip packaging block de-packaging method and device |
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| CN101989533A true CN101989533A (en) | 2011-03-23 |
| CN101989533B CN101989533B (en) | 2013-01-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200910056017 Expired - Fee Related CN101989533B (en) | 2009-08-06 | 2009-08-06 | Chip packaging block de-packaging method and device |
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Cited By (11)
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| CN102779727A (en) * | 2011-05-12 | 2012-11-14 | 南亚科技股份有限公司 | Method for decapsulating integrated circuit package |
| CN103834497A (en) * | 2014-03-24 | 2014-06-04 | 成都先进功率半导体股份有限公司 | Epoxy resin corrodent and application of epoxy resin corrodent in removal of semiconductor packaging material |
| CN104607411A (en) * | 2014-12-31 | 2015-05-13 | 广州兴森快捷电路科技有限公司 | Removal method of EMC molding compound |
| CN104810240A (en) * | 2014-01-23 | 2015-07-29 | 北大方正集团有限公司 | De-encapsulation method of TO-type encapsulation device |
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| CN107302181A (en) * | 2017-08-24 | 2017-10-27 | 京东方科技集团股份有限公司 | The paster apparatus and method of laser chip |
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| CN110146503A (en) * | 2019-05-28 | 2019-08-20 | 青岛歌尔微电子研究院有限公司 | Interface metal is total to the coverage rate detection method of compound |
| CN113945442A (en) * | 2021-10-15 | 2022-01-18 | 上海季丰电子股份有限公司 | Method for taking crystal grain in gallium arsenide chip packaging structure and application |
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| CN111693852B (en) * | 2020-06-23 | 2023-12-22 | 宏茂微电子(上海)有限公司 | Plastic packaging component unsealing method and unsealing device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6395129B1 (en) * | 2000-11-27 | 2002-05-28 | Advanced Micro Devices, Inc. | Process to decapsulate a FBGA package |
| US6908045B2 (en) * | 2003-01-28 | 2005-06-21 | Casio Computer Co., Ltd. | Solution spray apparatus and solution spray method |
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2009
- 2009-08-06 CN CN 200910056017 patent/CN101989533B/en not_active Expired - Fee Related
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| CN102779727A (en) * | 2011-05-12 | 2012-11-14 | 南亚科技股份有限公司 | Method for decapsulating integrated circuit package |
| CN104810240A (en) * | 2014-01-23 | 2015-07-29 | 北大方正集团有限公司 | De-encapsulation method of TO-type encapsulation device |
| CN104810240B (en) * | 2014-01-23 | 2017-08-25 | 北大方正集团有限公司 | A kind of solution encapsulation method of TO types packaging |
| CN103834497A (en) * | 2014-03-24 | 2014-06-04 | 成都先进功率半导体股份有限公司 | Epoxy resin corrodent and application of epoxy resin corrodent in removal of semiconductor packaging material |
| CN105575764A (en) * | 2014-10-16 | 2016-05-11 | 北大方正集团有限公司 | Semiconductor device deblocking method |
| CN104607411A (en) * | 2014-12-31 | 2015-05-13 | 广州兴森快捷电路科技有限公司 | Removal method of EMC molding compound |
| CN107302181A (en) * | 2017-08-24 | 2017-10-27 | 京东方科技集团股份有限公司 | The paster apparatus and method of laser chip |
| CN108987290A (en) * | 2018-06-25 | 2018-12-11 | 南京矽邦半导体有限公司 | A kind of lossless ends-opening method of QFN product |
| CN110146503A (en) * | 2019-05-28 | 2019-08-20 | 青岛歌尔微电子研究院有限公司 | Interface metal is total to the coverage rate detection method of compound |
| CN110146503B (en) * | 2019-05-28 | 2022-02-25 | 青岛歌尔微电子研究院有限公司 | Method for detecting coverage rate of interface metal codified material |
| CN113945442A (en) * | 2021-10-15 | 2022-01-18 | 上海季丰电子股份有限公司 | Method for taking crystal grain in gallium arsenide chip packaging structure and application |
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| CN114062240A (en) * | 2021-11-26 | 2022-02-18 | 苏州日月新半导体有限公司 | Integrated circuit crater experimental method |
| CN115078406A (en) * | 2022-07-25 | 2022-09-20 | 合肥晶合集成电路股份有限公司 | Analysis method of failure chip |
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| CN101989533B (en) | 2013-01-02 |
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