CN115011419A - Solution for removing chip packaging fixing glue and coring method - Google Patents
Solution for removing chip packaging fixing glue and coring method Download PDFInfo
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- CN115011419A CN115011419A CN202210782374.8A CN202210782374A CN115011419A CN 115011419 A CN115011419 A CN 115011419A CN 202210782374 A CN202210782374 A CN 202210782374A CN 115011419 A CN115011419 A CN 115011419A
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- chip
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- fixing glue
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/007—Heating the liquid
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
The invention discloses a solution for removing chip packaging fixing glue and a coring method. By adopting the mode, the softening solvent and the dissolving solvent are adopted to soften and dissolve the fixing glue for packaging the chip, so that the chip automatically falls off, the method is easy to operate, the risks of edge breakage, fragmentation, scratch, surface corrosion and high-temperature thermal damage of the chip can be effectively reduced, and the physical structure and the electrical property of the taken-out chip can be completely reserved.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a solution for removing chip packaging fixing glue and a coring method.
Background
Semiconductor packages provide both system electrical connections, allowing the chip to be integrated into an electronic system, and environmental protection and heat dissipation. Taking out the chip from the semiconductor package is a prerequisite for chip failure analysis, reverse analysis and device repair. Resin adhesive doped with gold powder or silver powder is mostly adopted as an adhesive in the semiconductor chip mounting technology.
The existing core-taking sheet method for removing the chip packaging fixing glue mostly adopts a heating softening method and an acid liquor corrosion method, wherein the heating softening method is to heat the chip packaging to the vitrification temperature of an adhesive, and extract the chip from the packaging under the high elastic state of the adhesive; the acid etching method is to open the cap and put it into hot concentrated sulfuric acid, and the adhesive is etched by acid. However, in practical operation, it is difficult to avoid edge chipping, scratching, surface corrosion and high temperature thermal damage, and in most analysis experiments, the number of sample chips is very small, so it is very important to reduce the risk of chip damage during the chip de-packaging process.
Disclosure of Invention
The invention mainly solves the technical problem of providing a solution for removing chip packaging fixing glue and a coring method, so that a chip can fall off automatically, and the problems of easy edge breakage, fragmentation, scratching and high-temperature heat loss of the chip are solved.
In order to solve the technical problems, the invention adopts a technical scheme that: the solution for removing the chip packaging fixing glue comprises a softening solvent and a dissolving solvent, wherein the softening solvent is N-methyl pyrrolidone; the dissolving solvent consists of ethylene glycol butyl ether and ethanolamine, wherein the volume ratio of the ethylene glycol butyl ether to the ethanolamine is 1:1-1.3: 0.7.
In order to solve the technical problem, the invention adopts another technical scheme that: the method for removing the core sheet of the chip packaging fixing glue is provided, the softening solvent and the dissolving solvent are adopted in the method according to claim 1, and the method specifically comprises the following steps:
a. loading a sample, namely packaging a chip, uncovering the chip and then loading the chip into a glass beaker;
b. injecting a softening solvent, adding the softening solvent into the glass beaker, completely immersing the chip package into the softening solvent, and covering the glass beaker by a glass cover to ensure that the chip package is soaked in the softening solvent for a certain time;
c. cleaning and drying for the first time, opening the glass cover, taking out the chip package by using a tool, and cleaning and drying the chip package;
d. injecting a dissolving solvent, packaging the cleaned and dried chip into another glass beaker, and adding the dissolving solvent into the glass beaker;
e. performing constant-temperature water bath, covering the glass beaker with a glass cover, and performing water bath heating treatment by using a temperature control heating table until the fixing glue on the chip package is completely dissolved;
f. and (4) cleaning and drying for the second time, wherein after the fixing glue on the chip package is dissolved, the chip automatically falls off from the package, and the chip is taken out by adopting a tool to clean and dry the chip.
In a preferred embodiment of the present invention, the chip package is soaked in the softening solvent for 1-3 h.
In a preferred embodiment of the present invention, the method of cleaning and drying in the primary cleaning and drying and the secondary cleaning and drying comprises:
cleaning by adopting absolute ethyl alcohol ultrasound, wherein the power of the absolute ethyl alcohol ultrasound is 50-80W;
drying was carried out by irradiation with an incandescent lamp, the power of which was 100W.
In a preferred embodiment of the invention, the time for cleaning the absolute ethyl alcohol by ultrasonic is 2-5 min.
In a preferred embodiment of the invention, the temperature of the water bath is maintained at 60 ℃.
The invention has the beneficial effects that: according to the solution for removing the chip packaging fixing glue and the coring method, the softening solvent and the dissolving solvent are adopted for softening and dissolving the fixing glue for chip packaging, so that the chip is automatically fallen off, the method is easy to operate, the risks of edge breakage, fragmentation, scratching, surface corrosion and high-temperature thermal damage of the chip can be effectively reduced, and the physical structure and the electrical property of the taken-out chip can be completely reserved.
Drawings
FIG. 1 is a flow chart of a core removing method for chip package mounting adhesive according to a preferred embodiment of the present invention.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention.
A solution for removing chip packaging fixing glue comprises a softening solvent and a dissolving solvent, wherein the softening solvent is N-methyl pyrrolidone; the dissolving solvent consists of ethylene glycol butyl ether and ethanolamine, wherein the volume ratio of the ethylene glycol butyl ether to the ethanolamine is 1:1-1.3: 0.7.
Referring to fig. 1, a method for removing a core sheet from a chip package fixing adhesive mainly includes sample loading, injection of a softening solvent, primary cleaning and drying, injection of a dissolving reagent, constant temperature water bath, and secondary cleaning and drying. The articles used in the process include: the chip packaging device comprises a chip packaging sample, a softening solvent, a dissolving solvent, a temperature control heating table, an ultrasonic cleaning machine, a glass beaker with a cover scale, a culture dish with the outer diameter larger than that of the glass beaker, water, absolute ethyl alcohol and an incandescent lamp. The key point of the invention is that the chip has no corrosion in the whole process, the maintained temperature is lower, and no tool is contacted with the surface of the chip.
The method comprises the following specific steps:
a. loading a sample, namely opening a cover of a chip package and then loading the chip package into a glass beaker, (in order to ensure that the chip is fully contacted with the solvent, the surface of the chip is upward or the chip is loaded into the glass beaker in an inclined way, and the size of the glass beaker is required to be capable of completely placing the chip package inside);
b. injecting a softening solvent, adding the softening solvent into the glass beaker, completely immersing the chip package into the softening solvent, covering the glass beaker by a glass cover to soak the chip package in the softening solvent for 1-3h (in order to fully soften the fixing glue of the chip package, the softening solvent is enabled to exceed 20-30mm of the highest position of the chip package as much as possible);
c. cleaning and drying for the first time, opening the glass cover, taking out the chip package by using a tool, and cleaning and drying the chip package;
d. injecting a dissolving solvent, packaging the cleaned and dried chip into another glass beaker, and adding the dissolving solvent into the glass beaker, (in order to ensure that the chip is fully contacted with the dissolving solvent, the surface of the chip is upward or obliquely arranged in the glass beaker, the size of the glass beaker is required to be satisfied that the chip can be completely placed in the glass beaker;
e. performing constant-temperature water bath, covering the glass beaker with a glass cover, and performing water bath heating treatment by using a temperature control heating table, wherein the temperature during the water bath heating treatment is kept at 60 ℃ until the fixing glue on the chip package is completely dissolved;
f. and (4) cleaning and drying for the second time, wherein after the fixing glue on the chip package is dissolved, the chip automatically falls off from the package, and the chip is taken out by adopting a tool to clean and dry the chip.
In the above, the method of the cleaning and drying treatment in the primary cleaning and drying and the secondary cleaning and drying comprises:
adding absolute ethyl alcohol into an ultrasonic cleaning machine, and cleaning by adopting absolute ethyl alcohol ultrasonic for 2-5min, wherein the power of the absolute ethyl alcohol ultrasonic is 50-80W;
drying was carried out by irradiation with an incandescent lamp, the power of which was 100W.
Example 1:
a method for removing a core sheet of a packaging patch adhesive by a solution comprises the following steps:
(1) packaging and uncapping a chip with the volume of 10mm multiplied by 2mm to ensure that the chip is completely exposed, and putting the chip into a glass beaker with the outer diameter of 45mm and the measuring range of 50mL in a mode that the front surface of the chip is upwards and horizontally placed;
(2) adding 30mL of N-methyl pyrrolidone organic solvent into the glass beaker, completely immersing the chip package into the solvent, covering the glass beaker with a glass cover, and soaking for 2 hours;
(3) taking out the chip by using a tool holder, packaging, cleaning and drying the chip, wherein the cleaning and drying steps are carried out according to the following sequence, namely, absolute ethyl alcohol is ultrasonically cleaned for 3min, and the power is 80W; placing the mixture under an incandescent lamp to irradiate and dry for 3 min;
(4) horizontally placing the cleaned and dried chip package with the right side facing upwards into another glass beaker with the outer diameter of 45mm and the measuring range of 50mL, adding an organic solvent with the volume ratio of ethylene glycol monobutyl ether to ethanolamine =1:1 into the glass beaker, and completely immersing the chip package into the solvent;
(5) covering the glass beaker with a glass cover, heating in water bath by using a temperature control heating table, controlling the temperature of the water bath heating to be 60 ℃, and taking 24 hours until the fixing glue on the chip package is completely dissolved;
(6) the chip automatically falls off from the package, the chip is taken out by adopting a tool clamp and cleaned and dried, and the cleaning and drying steps are carried out according to the following sequence, namely, the anhydrous ethanol is ultrasonically cleaned for 3min, and the power is 80W; ② placing under an incandescent lamp to irradiate and dry for 3 min.
Example 2
(1) Uncovering the chip package with the volume of 50mm multiplied by 40mm multiplied by 3mm to ensure that the chip package is completely exposed, and putting the chip package into a glass beaker with the outer diameter of 70mm and the measuring range of 200mL in a mode that the front surface of the chip is upwards and horizontally placed;
(2) adding 40mL of N-methylpyrrolidone organic solvent into the glass beaker, completely immersing the chip package into the solvent, covering the glass beaker with a glass cover, and soaking for 3 hours;
(3) taking out the chip by using a tool holder, packaging, cleaning and drying the chip, wherein the cleaning and drying steps are carried out according to the following sequence, namely, absolute ethyl alcohol is ultrasonically cleaned for 5min, and the power is 80W; placing the mixture under an incandescent lamp to irradiate and dry for 5 min;
(4) flatly placing the chip with the right side facing upwards into another glass beaker with the outer diameter of 70mm and the measuring range of 200mL, adding an organic solvent of ethylene glycol monobutyl ether and ethanolamine with the volume ratio of =1.3:0.7 into the glass beaker, and completely immersing the chip in the solvent for packaging;
(5) covering the glass beaker with a glass cover, heating in water bath by using a temperature control heating table, controlling the temperature of the water bath heating to be 60 ℃, and taking the solution for 36 hours until the fixing glue on the chip package is completely dissolved;
(6) the chip automatically falls off from the package, the chip is taken out by adopting a tool clamp and cleaned and dried, and the cleaning and drying steps are carried out according to the following sequence, namely, absolute ethyl alcohol is ultrasonically cleaned for 5min, and the power is 80W; ② drying the mixture by radiation under an incandescent lamp for 5 min.
Compared with the prior coring method, the invention has the beneficial effects that:
(1) the chip in the package is taken out by adopting the method of softening and dissolving the chip package fixing glue by adopting the softening solvent and the dissolving solvent, the method is easy to operate, the risks of edge breakage, fragmentation, scratch, surface corrosion and high-temperature thermal damage of the chip can be effectively reduced, and the physical structure and the electrical property of the taken-out chip can be completely reserved;
(2) the core taking process has no hard contact with the chip, and the edge breakage, the fragmentation and the scratch of the chip can be effectively prevented;
(3) the used softening solvent, dissolving solvent and absolute ethyl alcohol have no corrosiveness to the chip, and can effectively avoid the corrosion damage to the aluminum bonding pad of the chip and the metal wiring on the lower layer of the aluminum bonding pad of the chip;
(4) the temperature kept during water bath heating is lower than the process temperature of the chip, so that the high-temperature thermal damage of the chip caused by the temperature can be completely avoided;
(5) the using temperature of the softening solvent and the dissolving solvent is far lower than the volatilization temperature (the boiling range of the solvent is 170-202 ℃), the solvent volatilization is less, the used solvent is cheap and can be reused, and the environmental pollution can be reduced.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (6)
1. The solution for removing the chip packaging fixing glue is characterized by comprising a softening solvent and a dissolving solvent, wherein the softening solvent is N-methyl pyrrolidone; the dissolving solvent consists of ethylene glycol butyl ether and ethanolamine, wherein the volume ratio of the ethylene glycol butyl ether to the ethanolamine is 1:1-1.3: 0.7.
2. A method for removing a core plate of a chip packaging fixing adhesive is characterized in that the softening solvent and the dissolving solvent are adopted according to claim 1, and the method specifically comprises the following steps:
a. loading a sample, namely packaging a chip, uncovering the chip and then loading the chip into a glass beaker;
b. injecting a softening solvent, adding the softening solvent into the glass beaker, completely immersing the chip package into the softening solvent, and covering the glass beaker by a glass cover to ensure that the chip package is soaked in the softening solvent for a certain time;
c. cleaning and drying for the first time, opening the glass cover, taking out the chip package by using a tool, and cleaning and drying the chip package;
d. injecting a dissolving solvent, packaging the cleaned and dried chip into another glass beaker, and adding the dissolving solvent into the glass beaker;
e. performing constant-temperature water bath, covering the glass beaker by using a glass cover, and performing water bath heating treatment by using a temperature control heating table until the fixing glue on the chip package is completely dissolved;
f. and (4) cleaning and drying for the second time, wherein after the fixing glue on the chip package is dissolved, the chip automatically falls off from the package, and the chip is taken out by adopting a tool to clean and dry the chip.
3. The method for removing the core-taking sheet of the chip package fixing glue as claimed in claim 2, wherein the chip package is soaked in the softening solvent for 1-3 h.
4. The method for removing the core plate of the chip packaging fixing glue according to claim 2, wherein the method of cleaning and drying in the primary cleaning and drying and the secondary cleaning and drying comprises the following steps:
cleaning by adopting absolute ethyl alcohol ultrasound, wherein the power of the absolute ethyl alcohol ultrasound is 50-80W;
drying was carried out by irradiation with an incandescent lamp, the power of which was 100W.
5. The method for removing the core-taking sheet of the chip packaging fixing glue as claimed in claim 4, wherein the time for cleaning by absolute ethyl alcohol ultrasound is 2-5 min.
6. The method for removing the core plate of chip package fixing adhesive as claimed in claim 2, wherein the temperature of the water bath heating treatment is maintained at 60 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210782374.8A CN115011419A (en) | 2022-07-05 | 2022-07-05 | Solution for removing chip packaging fixing glue and coring method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210782374.8A CN115011419A (en) | 2022-07-05 | 2022-07-05 | Solution for removing chip packaging fixing glue and coring method |
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| Publication Number | Publication Date |
|---|---|
| CN115011419A true CN115011419A (en) | 2022-09-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210782374.8A Pending CN115011419A (en) | 2022-07-05 | 2022-07-05 | Solution for removing chip packaging fixing glue and coring method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115353887A (en) * | 2022-10-20 | 2022-11-18 | 上海聚跃检测技术有限公司 | Plastic package body corrosive liquid and method for opening cover of plastic package body by using same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5879468A (en) * | 1996-05-02 | 1999-03-09 | The United States Of America As Represented By The Secretary Of The Army | Method for the removal of thermoset potting compound from the electronics package of a munitions item |
| JP2002166236A (en) * | 2000-11-29 | 2002-06-11 | Masahiro Miki | Device for surface treatment |
| JP2022018459A (en) * | 2020-07-15 | 2022-01-27 | Ａｇｃ株式会社 | Method for cleaning articles |
| CN114437885A (en) * | 2021-12-29 | 2022-05-06 | 南通华达微电子集团股份有限公司 | Chip plastic package material flash softening agent |
-
2022
- 2022-07-05 CN CN202210782374.8A patent/CN115011419A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5879468A (en) * | 1996-05-02 | 1999-03-09 | The United States Of America As Represented By The Secretary Of The Army | Method for the removal of thermoset potting compound from the electronics package of a munitions item |
| JP2002166236A (en) * | 2000-11-29 | 2002-06-11 | Masahiro Miki | Device for surface treatment |
| JP2022018459A (en) * | 2020-07-15 | 2022-01-27 | Ａｇｃ株式会社 | Method for cleaning articles |
| CN114437885A (en) * | 2021-12-29 | 2022-05-06 | 南通华达微电子集团股份有限公司 | Chip plastic package material flash softening agent |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115353887A (en) * | 2022-10-20 | 2022-11-18 | 上海聚跃检测技术有限公司 | Plastic package body corrosive liquid and method for opening cover of plastic package body by using same |
| CN115353887B (en) * | 2022-10-20 | 2023-02-03 | 上海聚跃检测技术有限公司 | Plastic package body corrosive liquid and method for uncapping plastic package body by using same |
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