CN115353887B - Plastic package body corrosive liquid and method for uncapping plastic package body by using same - Google Patents
Plastic package body corrosive liquid and method for uncapping plastic package body by using same Download PDFInfo
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- CN115353887B CN115353887B CN202211283884.7A CN202211283884A CN115353887B CN 115353887 B CN115353887 B CN 115353887B CN 202211283884 A CN202211283884 A CN 202211283884A CN 115353887 B CN115353887 B CN 115353887B
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Abstract
The application provides a plastic package body corrosive liquid and a method for uncapping a plastic package body by using the same, wherein the method comprises the following steps: step S1: carrying out laser on the red glue plastic package body to be uncapped; step S2: heating the red rubber plastic package body to a reaction temperature, sucking a reagent A and dropwise adding the reagent A into a cover opening area of the red rubber plastic package body, so that the reagent A and the red rubber plastic package body fully react in the cover opening area; and step S3: absorbing the reagent B and dripping the reagent B into the uncovering area of the red rubber plastic packaging body; and step S4: immersing the red rubber plastic package body in acetone; step S5: and (5) taking out the red rubber plastic package body, and repeating the steps from S2 to S4 until the chip in the uncovering area of the red rubber plastic package body is completely exposed. The application can solve the problems that in the prior art, the uncovering period of the red rubber plastic package body is long and the bonding line is easy to break.
Description
Technical Field
The invention belongs to the technical field of chip failure analysis, and relates to a plastic package body corrosive liquid and a method for uncapping a plastic package body by using the same.
Background
Chip decapping, also known as component decapping, is a destructive detection method commonly used in chip failure analysis. The red glue plastic package body refers to an epoxy resin plastic package body containing more than 80wt.% of red glue. In the prior art, a mixed acid solution is generally adopted for uncovering, namely fuming nitric acid and concentrated sulfuric acid are adopted according to the volume ratio of 2:1, uncovering the red plastic package body by using the prepared mixed solution, and adopting the specific scheme that the red plastic package body after being subjected to laser is placed on an electric hot plate to be heated for 8s, then, a drop of mixed acid solution is dripped into an uncovering area to react for 3 seconds, then, the red plastic package body is washed by acetone, and the operation is repeated until the uncovering is completed; because the plastic package body is thick and the red glue component is more, the uncovering of the red glue plastic package body after laser takes about 20 minutes completely, and the uncovering period is longer, so that the subsequent performance test is easily delayed; and after the cover is completely opened, the bonding wire in the red rubber plastic package body is broken when the cover is observed by using a microscope. Because the bonding wire used by the red glue plastic package body is usually a copper wire, the defect of disconnection of the bonding wire is easy to occur after the cover is opened by using the mixed acid solution.
In summary, the existing uncovering method for the red plastic package body has two technical problems to be solved: firstly, a bonding wire of the red rubber plastic package body is easy to break in the cover opening process; second, the decap process takes a long time.
Disclosure of Invention
In view of this, the application provides a plastic package body corrosive liquid and a method for uncapping a plastic package body by using the same, so as to solve the problems that in the prior art, the uncapping period of a red rubber plastic package body is long, and a bonding line is easy to break.
The application provides a plastic package body uncovering corrosive liquid which comprises a reagent A and a reagent B which are used in a matched mode;
the reagent A comprises the following components in parts by mass:
1.5 The parts of the glacial acetic acid are mixed,
24. part of anhydrous ethanol, and
1.5 30 percent of hydrogen peroxide;
the reagent B comprises the following components in parts by volume:
2. parts of fuming nitric acid;
1. and (4) parts of concentrated sulfuric acid.
Preferably, the cover opening corrosive liquid for the plastic package body, and the reagent A further comprises 0.5 part of a detergent. 0.5 in the scheme
The parts of the detergent refers to 0.5 part by mass of the detergent.
The application also provides a method for uncapping the plastic package body by using the uncapping corrosive liquid for the plastic package body, which comprises the following steps:
step S1: carrying out laser on the red glue plastic package body to be uncapped;
step S2: heating the red rubber plastic package body to a reaction temperature, sucking a reagent A and dropwise adding the reagent A into a cover opening area of the red rubber plastic package body, so that the reagent A and the red rubber plastic package body fully react in the cover opening area;
and step S3: sucking the reagent B and dripping the reagent B into an uncapping area of the red rubber plastic package body;
and step S4: immersing the red rubber plastic package body in acetone;
step S5: and (5) taking out the red rubber plastic package body, and repeating the steps from S2 to S4 until the chip in the uncovering area of the red rubber plastic package body is completely exposed.
Preferably, the step S2 includes: heating the red rubber plastic package body to 170-190 ℃, sucking the reagent A and dropwise adding the reagent A into a cover opening area of the red rubber plastic package body to enable the reagent A to react with the red rubber plastic package body in the cover opening area for 3-10 s; and step S3 includes: and absorbing the reagent B, and dropwise adding the reagent B into the uncovering area of the red rubber plastic package body to react with the red rubber plastic package body for 2-5 s.
Further, step S2 includes: heating the red rubber plastic package body to 180 ℃, absorbing the reagent A and dropwise adding the reagent A into a cover opening area of the red rubber plastic package body, so that the reagent A reacts with the red rubber plastic package body in the cover opening area for 6s; and step S3 includes: and absorbing the reagent B and dropwise adding the reagent B into the uncovering area of the red rubber plastic package body to enable the reagent B to react with the red rubber plastic package body for 3s in the uncovering area.
Preferably, the step S1 of performing laser processing on the red plastic package body to be uncapped comprises the following steps: and (3) adopting a laser machine to perform unilateral scanning on the red rubber plastic package body.
Preferably, the step S2 of heating the red glue plastic package body comprises: and placing the red rubber plastic package body on an electric heating plate support table for heating.
Preferably, the method for uncapping the plastic package body by using the uncapping corrosive liquid for the plastic package body further comprises the following steps:
ultrasonic cleaning: sequentially immersing the red rubber plastic package body in a beaker filled with concentrated sulfuric acid, water and acetone, respectively carrying out ultrasonic cleaning on the red rubber plastic package body, taking out the red rubber plastic package body, and then washing the red rubber plastic package body by using a washing bottle filled with acetone;
and (3) drying: and drying the red rubber plastic package body treated by the ultrasonic cleaning step under a baking lamp.
Preferably, the method for uncapping the plastic package body by using the uncapping corrosive liquid for the plastic package body further comprises the following steps:
observing the uncovering area of the dried red glue plastic package body by using a microscope and judging whether the surface of the chip is clean or not; and if the red rubber plastic package body is not clean, sequentially immersing the red rubber plastic package body into a beaker filled with concentrated sulfuric acid, water and acetone, and continuing to perform the ultrasonic cleaning step and the drying step.
The invention improves the uncovering mode of the red rubber plastic package body and a reagent used for uncovering, namely the corrosive liquid. The cover opening method of the red plastic package body adopts step-by-step dropwise adding, the used corrosive liquid comprises a reagent A and a reagent B, the reagent B is mixed acid, the reagent A is a mixed liquid of glacial acetic acid, absolute ethyl alcohol, hydrogen peroxide and detergent, the red plastic package body can be completely opened within 10 minutes at the temperature of 180 ℃, and the bonding line is complete.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a flowchart of a method for uncapping a plastic package body by using a plastic package body corrosive liquid in an embodiment of the present application;
fig. 2 is a diagram illustrating an effect of uncapping a plastic package body by using a corrosive liquid for the plastic package body in an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The red glue plastic package body refers to an epoxy resin plastic package body containing more than 80wt.% of red glue. Epoxy resins are saturated resins and have relatively weak intermolecular forces compared to unsaturated acrylic resins, such as red glue. The epoxy resin containing more than 80wt.% of red glue can be removed by corrosion of mixed strong acid, namely, the bonding force of carbon-oxygen bonds of saturated epoxy resin is reduced by utilizing the strong oxidizing property of concentrated strong acid, and molecular chains are broken, so that the plastic package body resin is rapidly aged and degraded, but the unsaturated acrylic resin has high content of red glue, strong bonding force, high thermal stability, long time for completely uncovering, about 20 minutes, long time, easy damage to bonding lines and easy uncovering failure.
In view of the above technical problems, the present invention starts from the chemical properties of red glue, the red glue belongs to unsaturated acrylic resin, and is soluble in organic solvents such as ethyl acetate and toluene in terms of solubility, but in view of the requirements of safety and environmental protection, the present invention starts from ethyl acetate, and simultaneously uses glacial acetic acid, absolute ethyl alcohol, hydrogen peroxide and detergent to mix to prepare reagent a, wherein glacial acetic acid and absolute ethyl alcohol play a role in solubility of ethyl acetate after being mixed, and wherein the absolute ethyl alcohol is 24 parts, and the glacial acetic acid is only 1.5 parts, because the absolute ethyl alcohol is neutral, and the excessive absolute ethyl alcohol has no influence on the bonding wire. In addition, 1.5 parts of 30% hydrogen peroxide is selected from the reagent A, and the strong oxidizing property and the reducing effect are mainly considered, so that the bonding wire can be protected and the dissolution can be promoted, wherein 30% refers to the mass concentration of the hydrogen peroxide; and 0.5 part of detergent serving as a surfactant and capable of accelerating surface degradation of the red glue resin. The technical scheme of the invention needs to combine the reagent B during operation, the reagent B is mixed acid, namely fuming nitric acid and concentrated sulfuric acid are 2 parts and 1 part according to the volume ratio, and the mixed acid is a main corrosive agent. In the operation, the cover opening area is firstly subjected to laser, and the subsequent operation is carried out after heating is needed; at first will uncap regional heating for 8 seconds, then dropwise add reagent A in uncap the region, uncap regional surface bubble-free production after reacting about 6 seconds, dropwise add reagent B in uncap the region again, react 3 seconds, later with acetone quick rinse the region of uncapping, so circulation operation, can uncap totally to the red glue plastic packaging body in 10 minutes, the regional exposed chip of uncapping is complete and does not destroy the bonding wire copper line in microscope observation.
The technical solutions provided by the embodiments of the present application are described in detail below with reference to the accompanying drawings.
The application provides a plastic package body uncovering corrosive liquid which comprises a reagent A and a reagent B which are used in a matched mode;
the reagent A comprises the following components in parts by mass:
1.5 The parts of the glacial acetic acid are mixed,
24. part of anhydrous ethanol, and
1.5 30 percent of hydrogen peroxide;
the reagent B comprises the following components in parts by volume:
2. parts of fuming nitric acid;
1. and (4) parts of concentrated sulfuric acid.
Preferably, the mold opening corrosive liquid for the plastic package body, the reagent a, further comprises 0.5 parts by mass of a detergent, namely: the reagent A comprises the following components in parts by mass: 1.5 Glacial acetic acid, 24 parts of absolute ethyl alcohol, 1.5 parts of 30% hydrogen peroxide and 0.5 part of detergent; the plastic package body cover opening corrosion liquid containing the detergent is the preferred scheme of the invention; it should be noted that, when the reagent a contains a detergent in the etching solution for opening the cover of the plastic package body, the reagent a is specifically prepared as follows: 0.5ml of liquid detergent, 1.5ml of 30% hydrogen peroxide, 1.5ml of glacial acetic acid and 24ml of absolute ethyl alcohol are respectively sucked by a disposable plastic suction tube with the specification of 3ml in sequence in a beaker with the specification of 50ml, and stirred by a glass rod for 1min. The reagent B is specifically prepared by using a disposable plastic suction tube with the specification of 3ml, respectively sucking 20ml of fuming nitric acid and 10ml of concentrated sulfuric acid in a beaker with the specification of 50ml in sequence, and stirring for 1min by using a glass rod.
The uncovering corrosive liquid for the plastic package body is mainly used for uncovering a red glue plastic package body, and in one embodiment of the uncovering corrosive liquid for the plastic package body, a reagent A comprises: glacial acetic acid, absolute ethyl alcohol, hydrogen peroxide and liquid detergent; the glacial acetic acid and the absolute ethyl alcohol are mixed to generate ethyl acetate, so that the effect of dissolving the red glue in the red glue plastic package is achieved, the hydrogen peroxide has strong oxidizing property and reducing effect, the bonding wire can be protected, the dissolution of the red glue can be promoted, and the detergent can be used as a surfactant and can accelerate the surface degradation of the red glue.
The reagent B is mixed acid, namely fuming nitric acid and concentrated sulfuric acid are 2 parts and 1 part according to the volume ratio, and the mixed acid is a main corrosive agent. And the reagent B is used for corroding the epoxy resin in the red rubber plastic package body.
As shown in fig. 1, the present application further provides a method for uncapping a plastic package body by using the above-mentioned uncapping corrosive liquid for a plastic package body, comprising:
step S1: carrying out laser on the red glue plastic package body to be uncapped;
wherein, treat in step S1 that the red glue plastic packaging body of uncapping carries out radium-shine, include: and (3) adopting a laser machine to perform unilateral scanning on the red rubber plastic package body.
Step S2: heating the red rubber plastic package body to a reaction temperature, sucking a reagent A and dropwise adding the reagent A into a cover opening area of the red rubber plastic package body, so that the reagent A and the red rubber plastic package body fully react in the cover opening area;
it should be noted that, heating the red plastic package to the reaction temperature includes: and placing the red rubber plastic package body on an electric heating plate support table for heating. The reaction temperature is suitable for the reagents A and B to react with the red rubber plastic package respectively, the characteristics of the red rubber plastic package and the convenience of manual uncovering operation of the red rubber plastic package are considered, the reaction temperature is generally 170-190 ℃, and the reagents A react in an uncovering area until the surface of the red rubber plastic package does not foam any more, and the reagents A are considered to react fully; when the reaction temperature is 180 ℃, the reaction time of the reagent A in the uncapped area until the red rubber plastic package body does not bubble is 6s. Because the time required for dripping the reagent B in the step S3 and immersing the red rubber plastic package in the step S4 is taken, and the bonding line of the red rubber plastic package is easy to break, the reaction temperature of 170-190 ℃ is generally adopted.
And heating the red rubber plastic package body to 170-190 ℃, sucking the reagent A and dropwise adding the reagent A into a cover opening area of the red rubber plastic package body to enable the reagent A to react with the red rubber plastic package body in the cover opening area for 3-10 s.
Specifically, when the reaction temperature is 170 ℃, the reagent A is absorbed and dripped into the cap opening area of the red rubber plastic package body, so that the reagent A reacts with the red rubber plastic package body for 10s in the cap opening area. And when the reaction temperature is 180 ℃, absorbing the reagent A and dropwise adding the reagent A into the cover opening area of the red rubber plastic package body to enable the reagent A to react with the red rubber plastic package body for 6s in the cover opening area. And when the reaction temperature is 190 ℃, absorbing the reagent A and dropwise adding the reagent A into the cover opening area of the red rubber plastic package body to enable the reagent A to react with the red rubber plastic package body for 3s in the cover opening area.
And step S3: sucking the reagent B and dripping the reagent B into an uncapping area of the red rubber plastic package body;
when the reaction temperature is 170-190 ℃, the reagent B is absorbed and dripped into the uncovering area of the red plastic package body to react with the red plastic package body for 2-5 s. Specifically, when the reaction temperature is 170 ℃, absorbing the reagent B, and dropwise adding the reagent B into the uncovering area of the red rubber plastic package body to react with the red rubber plastic package body for 5s; when the reaction temperature is 180 ℃, absorbing the reagent B, and dropwise adding the reagent B into the uncovering area of the red rubber plastic package body to react with the red rubber plastic package body for 3s; when the reaction temperature is 190 ℃, absorbing the reagent B, and dropwise adding the reagent B into the uncovering area of the red rubber plastic package body to react with the red rubber plastic package body for 2s; if the reaction temperature is higher than 190 ℃, the reaction time of the reagent B is shortened, and the operation is inconvenient.
And step S4: immersing the red rubber plastic package body in acetone;
in this step, the red plastic package body needs to be quickly immersed in acetone. Generally, the immersion time of the red plastic package body is 2s when the cover opening operation is performed.
Step S5: and (5) taking out the red rubber plastic package body, and repeating the steps from S2 to S4 until the chip in the uncovering area of the red rubber plastic package body is completely exposed.
In the step, the red rubber plastic package body is immersed in acetone for 2S and then taken out quickly, and the steps S2 to S4 are repeated until the chip in the uncovering area of the red rubber plastic package body is completely exposed.
After the chip in the uncovering area of the red rubber plastic package body is completely exposed, the red rubber plastic package body needs to be subjected to the treatment of an ultrasonic cleaning step and the treatment of a drying step. The ultrasonic cleaning step comprises: sequentially immersing the red rubber plastic package body in a beaker filled with concentrated sulfuric acid, water and acetone, respectively carrying out ultrasonic cleaning on the red rubber plastic package body, taking out the red rubber plastic package body, and then washing the red rubber plastic package body by using a washing bottle filled with acetone;
the drying step comprises: and drying the red rubber plastic package body treated by the ultrasonic cleaning step under a baking lamp.
After the red rubber plastic package body is dried, observing the uncovering area of the dried red rubber plastic package body by using a microscope and judging whether the surface of the chip is clean or not; and if the red glue plastic package body is not clean, sequentially immersing the red glue plastic package body in a beaker filled with concentrated sulfuric acid, water and acetone, and continuing to perform the ultrasonic cleaning step and the drying step.
As shown in fig. 2, the effect of the red plastic package body after being completely uncapped is shown in fig. 2, the square area in the figure is an uncapped area of the red plastic package body, and the chip in the uncapped area in the figure is completely exposed and comprises a chip 1, a chip 2 and a chip 3 in the figure.
In an embodiment of the present invention, before step S1, the electric heating plate may be turned on, the temperature is raised to 180 ℃, the support is fixed on one side of the electric heating plate, and a red plastic package is prepared for use. Preparing a washing bottle filled with acetone, a beaker with the specification of 50ml and filled with 20ml of acetone, putting 30ml of concentrated sulfuric acid, water and acetone in three beakers with the specification of 50ml respectively, opening an ultrasonic machine, and setting the normal-temperature washing time for 3 seconds.
Reagent A and reagent B were prepared and stirred for 15 seconds each. The reagent A is specifically prepared by using a disposable plastic suction tube with the specification of 3ml, respectively sucking 0.5ml of liquid detergent, 1.5ml of 30% hydrogen peroxide, 1.5ml of glacial acetic acid and 24ml of absolute ethyl alcohol in a beaker with the specification of 50ml in sequence, stirring for 1min by using a glass rod, and standing for later use. The reagent B is specifically prepared by using a disposable plastic suction tube with 3ml specification, respectively sucking 20ml of fuming nitric acid and 10ml of concentrated sulfuric acid in sequence in a beaker with 50ml specification, stirring for 1min by a glass rod, and standing for later use.
And opening the laser machine, selecting a laser area, setting the laser power to be 50w, adopting unilateral scanning with the scanning frequency of 13, and taking out the laser red rubber plastic package body for later use.
Placing the red rubber plastic package body on an electric heating plate support table, heating for 8s until the temperature of the electric heating plate rises to 180 ℃, then sucking a reagent A by using a rubber head glass suction pipe, dropwise adding the reagent A into an uncovering area to enable the reagent A to react with the red rubber plastic package body in the uncovering area for 6s, dropwise adding a reagent B into the uncovering area to enable the reagent B to react with the red rubber plastic package body in the uncovering area for 3s, finally rapidly immersing the red rubber plastic package body in acetone for 2s, rapidly taking out the red rubber plastic package body, repeating the steps until the chip in the uncovering area is completely exposed, and consuming 10min in the process.
And in the cleaning stage, the red rubber plastic package body is sequentially immersed in a beaker filled with concentrated sulfuric acid, water and acetone, ultrasonic cleaning is respectively carried out for 3s, then the red rubber plastic package body is taken out, a washing bottle filled with acetone is used for washing the red rubber plastic package body once, and finally the red rubber plastic package body is placed under a baking lamp for drying for 1min. Observing whether the chip surface of the uncovering area of the dried red rubber plastic packaging body is clean or not by using a microscope, and if not, repeating the ultrasonic cleaning steps: and sequentially immersing the red rubber plastic package body in a beaker filled with concentrated sulfuric acid, water and acetone, carrying out ultrasonic cleaning for 3s respectively, then taking out the red rubber plastic package body, washing the red rubber plastic package body once by using a washing bottle filled with acetone, and finally drying the red rubber plastic package body for 1min under a baking lamp. And then observing whether the chip surface of the uncovering area of the dried red glue plastic packaging body is clean or not by using a microscope, and if not, continuously repeating the ultrasonic cleaning step.
The time consumption is the reaction time when the reaction temperature is 180 ℃, namely the temperature of the electric heating plate after being heated is 180 ℃, the steps of sucking the reagent A and adding one drop of the reagent A to react in the uncovering area for 6s and adding one drop of the reagent B to react in the uncovering area for 3s are the reaction time of the reagent A and the reagent B in the uncovering area respectively when the reaction temperature is 180 ℃.
Reaction time of reagent A and reagent B in the open lid region when the reaction temperature is different
As shown in the following table:
reaction temperature (. Degree.C.) | Reagent A reaction time(s) | Reagent B reaction time(s) |
170 | 10 | 5 |
180 | 6 | 3 |
190 | 3 | 2 |
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (9)
1. A cover opening corrosive liquid for a plastic package body is characterized by comprising a reagent A and a reagent B which are used in a matched mode;
the reagent A comprises the following components in parts by mass:
1.5 The parts of the glacial acetic acid are mixed,
24. part of anhydrous ethanol, and
1.5 parts of 30% hydrogen peroxide;
the reagent B comprises the following components in parts by volume:
2. part of fuming nitric acid, and
1. and (4) parts of concentrated sulfuric acid.
2. The cover opening corrosive liquid for plastic package bodies as claimed in claim 1, wherein the reagent A further comprises 0.5 part of a detergent.
3. A method for decapping a plastic package using the corrosive solution for decapping a plastic package according to claim 1 or 2, comprising:
step S1: carrying out laser on the red glue plastic package body to be uncapped;
step S2: heating the red rubber plastic package body to a reaction temperature, absorbing the reagent A and dropwise adding the reagent A into a cover opening area of the red rubber plastic package body to enable the reagent A to fully react with the red rubber plastic package body in the cover opening area;
and step S3: absorbing the reagent B and dripping the reagent B into the uncovering area of the red rubber plastic packaging body;
and step S4: immersing the red rubber plastic package body in acetone;
step S5: and (5) taking out the red rubber plastic package body, and repeating the steps from S2 to S4 until the chip in the uncovering area of the red rubber plastic package body is completely exposed.
4. The method for uncapping a plastic package body by using the corrosive liquid for uncapping a plastic package body according to claim 3, wherein the step S2 comprises: heating the red rubber plastic package body to 170-190 ℃, sucking the reagent A and dropwise adding the reagent A into a cover opening area of the red rubber plastic package body to enable the reagent A to react with the red rubber plastic package body in the cover opening area for 3-10 s; and step S3 includes: and absorbing the reagent B, and dropwise adding the reagent B into the uncovering area of the red rubber plastic package body to react with the red rubber plastic package body for 2-5 s.
5. The method for uncapping a plastic package by using the plastic package uncapping corrosive liquid according to claim 4, wherein the step S2 comprises the following steps: heating the red rubber plastic package body to 180 ℃, absorbing the reagent A and dropwise adding the reagent A into a cover opening area of the red rubber plastic package body, so that the reagent A reacts with the red rubber plastic package body in the cover opening area for 6s; and step S3 includes: and absorbing the reagent B and dropwise adding the reagent B into the uncovering area of the red rubber plastic package body to enable the reagent B to react with the red rubber plastic package body for 3s in the uncovering area.
6. The method for uncovering the plastic package body by using the corrosive liquid for uncovering the plastic package body according to claim 3, wherein the step S1 of performing laser on the red rubber plastic package body to be uncovered comprises the following steps: and (3) adopting a laser machine to perform unilateral scanning on the red rubber plastic package body.
7. The method for uncapping a plastic package body by using the corrosive liquid for uncapping a plastic package body according to claim 3, wherein the step of heating the red plastic package body in the step S2 comprises the following steps: and placing the red rubber plastic package body on an electric heating plate support table for heating.
8. The method for uncapping a plastic package body by using the corrosive liquid for uncapping a plastic package body according to claim 3, further comprising:
ultrasonic cleaning: sequentially immersing the red rubber plastic package body in a beaker filled with concentrated sulfuric acid, water and acetone, respectively carrying out ultrasonic cleaning on the red rubber plastic package body, taking out the red rubber plastic package body, and then washing the red rubber plastic package body by using a washing bottle filled with acetone;
and (3) drying: and drying the red rubber plastic package body treated by the ultrasonic cleaning step under a baking lamp.
9. The method for uncapping a plastic package body by using the corrosive liquid for uncapping a plastic package body according to claim 8, further comprising the steps of: observing the uncovering area of the dried red rubber plastic package body by using a microscope and judging whether the surface of the chip is clean or not; and if the red rubber plastic package body is not clean, sequentially immersing the red rubber plastic package body into a beaker filled with concentrated sulfuric acid, water and acetone, and continuing to perform the ultrasonic cleaning step and the drying step.
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Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102263140A (en) * | 2011-08-10 | 2011-11-30 | 山东沂光电子股份有限公司 | Plastic package power diode and manufacturing technology thereof |
CN102339732A (en) * | 2011-08-11 | 2012-02-01 | 上海华碧检测技术有限公司 | Method for quickly unsealing small component |
CN102456538A (en) * | 2010-11-02 | 2012-05-16 | 航天科工防御技术研究试验中心 | Method for unsealing plastically-packaged apparatus containing un-passivated metal layer structure |
CN104451153A (en) * | 2014-11-11 | 2015-03-25 | 广东工业大学 | Recycling method for separating metals out of waste plastic packaged ICs and extracting gold from metals |
CN104599981A (en) * | 2015-01-07 | 2015-05-06 | 航天科工防御技术研究试验中心 | Plastic package device opening method |
CN105092326A (en) * | 2015-07-21 | 2015-11-25 | 中国工程物理研究院计量测试中心 | Unsealing method for flip-chip packaging device |
CN105598589A (en) * | 2016-01-07 | 2016-05-25 | 航天科工防御技术研究试验中心 | Laser unsealing method |
CN107001821A (en) * | 2014-12-23 | 2017-08-01 | 录象射流技术公司 | Thermal inkjet ink composite with additive |
CN107655903A (en) * | 2017-09-04 | 2018-02-02 | 西安微电子技术研究所 | A kind of plastic packaging optocoupler anatomic method |
CN107680919A (en) * | 2017-09-15 | 2018-02-09 | 西安微电子技术研究所 | A kind of plastic packaging copper bonding wire integrated circuit opening method |
CN109187537A (en) * | 2018-08-17 | 2019-01-11 | 新华三技术有限公司 | The opening method and failure analysis method of component sealing lysate and component |
CN109270349A (en) * | 2018-08-30 | 2019-01-25 | 新华三技术有限公司 | The opening method and failure analysis method of thick-film resistor protective layer lysate and thick-film resistor |
CN110940666A (en) * | 2019-12-10 | 2020-03-31 | 江苏海德半导体有限公司 | Chip packaging cap opening process |
CN111180361A (en) * | 2019-12-13 | 2020-05-19 | 贵州航天计量测试技术研究所 | Wet unsealing method for plastic package device |
CN111948001A (en) * | 2019-05-17 | 2020-11-17 | 北京振兴计量测试研究所 | Mold pressing solid tantalum capacitor unsealing method |
CN112108481A (en) * | 2019-06-21 | 2020-12-22 | 北京振兴计量测试研究所 | Method for dissecting plastic package optocoupler |
CN112670350A (en) * | 2020-12-14 | 2021-04-16 | 山东融创电子科技有限公司 | Manufacturing method of high-stability open-junction plastic-packaged silicon rectifier diode |
CN114325303A (en) * | 2021-11-24 | 2022-04-12 | 北京智芯微电子科技有限公司 | Gallium arsenide chip unsealing method |
CN114368726A (en) * | 2021-12-24 | 2022-04-19 | 江苏普诺威电子股份有限公司 | MEMS built-in chip packaging carrier plate and manufacturing process thereof |
CN114814542A (en) * | 2022-04-21 | 2022-07-29 | 北京京瀚禹电子工程技术有限公司西安分公司 | Unsealing method of plastic package copper bonding lead semiconductor device |
CN115011419A (en) * | 2022-07-05 | 2022-09-06 | 苏州芯联成软件有限公司 | Solution for removing chip packaging fixing glue and coring method |
-
2022
- 2022-10-20 CN CN202211283884.7A patent/CN115353887B/en active Active
Patent Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102456538A (en) * | 2010-11-02 | 2012-05-16 | 航天科工防御技术研究试验中心 | Method for unsealing plastically-packaged apparatus containing un-passivated metal layer structure |
CN102263140A (en) * | 2011-08-10 | 2011-11-30 | 山东沂光电子股份有限公司 | Plastic package power diode and manufacturing technology thereof |
CN102339732A (en) * | 2011-08-11 | 2012-02-01 | 上海华碧检测技术有限公司 | Method for quickly unsealing small component |
CN104451153A (en) * | 2014-11-11 | 2015-03-25 | 广东工业大学 | Recycling method for separating metals out of waste plastic packaged ICs and extracting gold from metals |
CN107001821A (en) * | 2014-12-23 | 2017-08-01 | 录象射流技术公司 | Thermal inkjet ink composite with additive |
CN104599981A (en) * | 2015-01-07 | 2015-05-06 | 航天科工防御技术研究试验中心 | Plastic package device opening method |
CN105092326A (en) * | 2015-07-21 | 2015-11-25 | 中国工程物理研究院计量测试中心 | Unsealing method for flip-chip packaging device |
CN105598589A (en) * | 2016-01-07 | 2016-05-25 | 航天科工防御技术研究试验中心 | Laser unsealing method |
CN107655903A (en) * | 2017-09-04 | 2018-02-02 | 西安微电子技术研究所 | A kind of plastic packaging optocoupler anatomic method |
CN107680919A (en) * | 2017-09-15 | 2018-02-09 | 西安微电子技术研究所 | A kind of plastic packaging copper bonding wire integrated circuit opening method |
CN109187537A (en) * | 2018-08-17 | 2019-01-11 | 新华三技术有限公司 | The opening method and failure analysis method of component sealing lysate and component |
CN109270349A (en) * | 2018-08-30 | 2019-01-25 | 新华三技术有限公司 | The opening method and failure analysis method of thick-film resistor protective layer lysate and thick-film resistor |
CN111948001A (en) * | 2019-05-17 | 2020-11-17 | 北京振兴计量测试研究所 | Mold pressing solid tantalum capacitor unsealing method |
CN112108481A (en) * | 2019-06-21 | 2020-12-22 | 北京振兴计量测试研究所 | Method for dissecting plastic package optocoupler |
CN110940666A (en) * | 2019-12-10 | 2020-03-31 | 江苏海德半导体有限公司 | Chip packaging cap opening process |
CN111180361A (en) * | 2019-12-13 | 2020-05-19 | 贵州航天计量测试技术研究所 | Wet unsealing method for plastic package device |
CN112670350A (en) * | 2020-12-14 | 2021-04-16 | 山东融创电子科技有限公司 | Manufacturing method of high-stability open-junction plastic-packaged silicon rectifier diode |
CN114325303A (en) * | 2021-11-24 | 2022-04-12 | 北京智芯微电子科技有限公司 | Gallium arsenide chip unsealing method |
CN114368726A (en) * | 2021-12-24 | 2022-04-19 | 江苏普诺威电子股份有限公司 | MEMS built-in chip packaging carrier plate and manufacturing process thereof |
CN114814542A (en) * | 2022-04-21 | 2022-07-29 | 北京京瀚禹电子工程技术有限公司西安分公司 | Unsealing method of plastic package copper bonding lead semiconductor device |
CN115011419A (en) * | 2022-07-05 | 2022-09-06 | 苏州芯联成软件有限公司 | Solution for removing chip packaging fixing glue and coring method |
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