CN112108481A - Method for dissecting plastic package optocoupler - Google Patents
Method for dissecting plastic package optocoupler Download PDFInfo
- Publication number
- CN112108481A CN112108481A CN201910540995.3A CN201910540995A CN112108481A CN 112108481 A CN112108481 A CN 112108481A CN 201910540995 A CN201910540995 A CN 201910540995A CN 112108481 A CN112108481 A CN 112108481A
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- optocoupler
- plastic
- dissecting
- plastic package
- adopting
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 230000003287 optical effect Effects 0.000 claims abstract description 20
- 125000006850 spacer group Chemical group 0.000 claims abstract description 19
- 238000002224 dissection Methods 0.000 claims abstract description 18
- 238000005498 polishing Methods 0.000 claims abstract description 15
- 238000004140 cleaning Methods 0.000 claims abstract description 14
- 230000008878 coupling Effects 0.000 claims abstract description 11
- 238000010168 coupling process Methods 0.000 claims abstract description 11
- 238000005859 coupling reaction Methods 0.000 claims abstract description 11
- 238000003384 imaging method Methods 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims abstract description 8
- 239000003518 caustics Substances 0.000 claims abstract description 7
- 239000003960 organic solvent Substances 0.000 claims abstract description 6
- 230000007797 corrosion Effects 0.000 claims description 9
- 238000005260 corrosion Methods 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical group O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 238000007517 polishing process Methods 0.000 claims description 4
- 230000001066 destructive effect Effects 0.000 abstract description 8
- 238000010008 shearing Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 239000002253 acid Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000009528 severe injury Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a method for dissecting a plastic package optocoupler, which comprises the following steps: carrying out internal imaging on the plastic-packaged optocoupler; polishing the plastic package optocoupler until the optocoupler spacer is exposed; dissecting the plastic-packaged optocoupler by adopting mechanical stress; removing the optical coupling spacer; removing residues on the light guide glue and the bonding points on the surface of the chip by adopting a corrosive agent; and cleaning the plastic-packaged optocoupler after dissection by adopting an organic solvent. The invention realizes the dissection of the plastic package optocoupler by a simple, high-efficiency, low-cost and high-success-rate method, ensures that the internal structure of the device is complete, the device cannot be lost, the surface of the chip is clean, ensures that the plastic package optocoupler meets the use conditions in the analysis work of failure analysis, destructive physical analysis and the like, effectively improves the analysis capability of the plastic package optocoupler, and can well meet the test analysis work of failure positioning analysis in the failure analysis and the test analysis work of the inner lead bonding force, the chip shearing force and the like in the destructive physical analysis.
Description
Technical Field
The invention relates to the technical field of component failure analysis and destructive physical analysis, in particular to a method for dissecting a plastic package optocoupler.
Background
The optical coupler is an electric-optical-electric conversion device which takes light as a medium to transmit electric signals, and is widely applied to an isolation circuit, a switch circuit, a digital-to-analog conversion circuit and the like. The plastic-sealed optical coupler has a special packaging form. For example, the model number of HCPL-0631 produced by AVAGO, the light emitting chip and the light receiving chip are located at the upper and lower positions, and the middle is filled with light guide glue difficult to remove. The dissection method of the plastic-packaged optical coupler is not described in detail in GJB 4027A-2006 and GJB 548B-2005.
At present, the dissection of the plastic package optical coupler generally uses acid to directly corrode the plastic package material and the light guide glue. Because the spatial structure of the plastic package optocoupler is corroded by acid, an internal basic frame is seriously damaged, and the three-dimensional optical package optocoupler can appear: the bonding point of the inner lead is dropped; the chip bonding is destroyed and separated from the frame; the light emitting chip is small and easy to lose; due to uneven corrosion, the light guide glue on the surface of the chip cannot be removed completely. Due to the severe damage of the plastic package optocoupler structure, other failure factors are introduced in failure analysis, the failure cannot be accurately positioned, and the failure analysis difficulty is increased; it was not tested for bond strength and shear strength in destructive physical analysis.
Therefore, it is very important to research a proper dissection method of the plastic package optocoupler so as to completely reserve the internal structure (bonding system and bonding system) and the chip, which is very critical to correctly analyzing the failure mechanism of the plastic package optocoupler and giving a correct destructive physical analysis result.
Disclosure of Invention
In order to solve the problems, the invention provides a method for dissecting a plastic-sealed optocoupler, which comprises the following steps:
carrying out internal imaging on the plastic-packaged optocoupler;
polishing the plastic package optocoupler until the optocoupler spacer is exposed;
dissecting the plastic-packaged optocoupler by adopting mechanical stress;
removing the optical coupling spacer;
removing residues on the light guide glue and the bonding points on the surface of the chip by adopting a corrosive agent;
and cleaning the plastic-packaged optocoupler after dissection by adopting an organic solvent.
Preferably, the plastic-packaged optocoupler is internally imaged by adopting X-ray.
Preferably, the polishing process is to polish the plastic package layer from the side of the pins where the light emitting chips are located.
Preferably, the polishing process is to polish the molding layer from the lead side where the light receiving chip is located.
Preferably, the sanding thickness ranges from 0.4mm to 0.6 mm.
Preferably, the mechanical stresses are of two groups; one group is applied to the lower part of the end part of the optical coupling isolating sheet exposed from the polished side, and the other group is applied to the junction between the upper part of the pin on the non-polished side and the plastic packaging layer.
Preferably, the mechanical stresses are of two groups; one group is applied to the upper part of the end part of the optical coupling isolating sheet exposed from the polished side, and the other group is applied to the junction of the lower part of the pin on the non-polished side and the plastic package layer.
Preferably, the corrosive agent is fuming nitric acid, the corrosion temperature range is 80-90 ℃, and the corrosion time range is 10-30 s.
Preferably, the cleaning of the plastic package optocoupler after dissection by using an organic solvent comprises: and cleaning the plastic-packaged optocoupler after dissection by sequentially adopting acetone and alcohol, wherein the cleaning time range is 5-10 s.
Preferably, the plastic package optocoupler after dissection is cleaned through ultrasonic waves.
The invention provides a method for dissecting a plastic package optocoupler, which comprises the steps of firstly carrying out internal imaging on the plastic package optocoupler; polishing the plastic package optocoupler until the optocoupler spacer is exposed; and dissecting the plastic-packaged optocoupler by adopting mechanical stress, and finally removing residues on the light guide adhesive and the bonding point on the surface of the chip by adopting a corrosive agent and cleaning. The invention realizes the dissection of the plastic package optocoupler by a simple, high-efficiency, low-cost and high-success-rate method, ensures that the internal structure of the device is complete, the device cannot be lost, the surface of the chip is clean, ensures that the plastic package optocoupler meets the use conditions in the analysis work of failure analysis, destructive physical analysis and the like, effectively improves the analysis capability of the plastic package optocoupler, and can well meet the test analysis work of failure positioning analysis in the failure analysis and the test analysis work of the inner lead bonding force, the chip shearing force and the like in the destructive physical analysis.
Drawings
Fig. 1 is a schematic diagram of the internal basic structure of a plastic package optocoupler.
Fig. 2 is a schematic structural diagram of a first embodiment of the anatomical plastic-encapsulated optocoupler.
Fig. 3 is a schematic structural diagram of a second embodiment of the anatomical plastic-encapsulated optocoupler.
Fig. 4 is a flowchart of specific steps of dissecting a plastic-sealed optocoupler.
Wherein the figures include the following reference numerals:
1. an opto-coupler spacer; 2. a light emitting chip; 3. a light receiving chip; 4. a side pin where the light-emitting chip is located; 5. a side pin of the light receiving chip; 6. and (7) plastic packaging layer.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following detailed description of the preferred embodiments of the present invention is provided to make the advantages and features of the present invention easier to be understood by those skilled in the art, so as to make the protection scope of the present invention more clearly and clearly defined. For a person skilled in the art, without inventive effort, further figures can be obtained from these figures.
The invention provides a method for dissecting a plastic package optocoupler, which comprises the following steps:
carrying out internal imaging on the plastic-packaged optocoupler;
polishing the plastic package optocoupler until the optocoupler spacer 1 is exposed;
dissecting the plastic-packaged optocoupler by adopting mechanical stress;
removing the optical coupling spacer 1;
adopting a corrosive to remove residues on the light guide glue and the bonding points on the surfaces of the chips (2 and 3);
and cleaning the plastic-packaged optocoupler after dissection by adopting an organic solvent.
The invention will be further described with reference to the accompanying drawings.
Referring to fig. 1, a schematic diagram of an internal basic structure of a plastic package optocoupler is shown. The internal imaging of the plastic package optocoupler is carried out through X-ray, and the internal structure of the plastic package optocoupler is judged according to the characteristics of different penetration capacities of the X-ray to different substances and the perspective imaging of the plastic package optocoupler from the front, the back and the side of the plastic package optocoupler, wherein the internal structure comprises a frame structure, pin (4, 5) distribution, chip (2, 3) positions, lead external bonding point positions and the like.
When polishing the plastic package optocoupler, the plastic package layer 6 can be polished from the side of the pin 4 where the light emitting chip 2 is located, and the plastic package layer 6 can also be polished from the side of the pin 5 where the light receiving chip 3 is located until the optocoupler spacer 1 is exposed, wherein the polishing thickness range is 0.4 mm-0.6 mm.
The mechanical stress of the dissecting plastic package optical coupler is divided into two groups. When polishing the plastic package layer 6 from the side of the pin 4 where the light emitting chip 2 is located, one group of the application is applied to the lower part of the end part of the optical coupling spacer 1 exposed at the polishing side, and the other group of the application is applied to the junction between the upper part of the pin 5 at the non-polishing side and the plastic package layer 6, as shown in fig. 2. When the plastic package layer 6 is polished from the side of the pin 5 where the light receiving chip 3 is located, one group of the polishing liquid is applied above the end portion of the optical coupling spacer 1 exposed from the polished side, and the other group of the polishing liquid is applied at the junction of the part below the non-polished side pin 4 and the plastic package layer 6, as shown in fig. 3.
The corrosive agent adopts fuming nitric acid, the corrosion temperature of the fuming nitric acid is 80-90 ℃, and the corrosion time is 10-30 s.
According to the invention, the plastic-packaged optocoupler after dissection is cleaned by sequentially adopting acetone and alcohol, and the cleaning time range is 5-10 s. And cleaning the plastic package optocoupler after dissection by ultrasonic waves.
Fig. 4 is a flow chart showing the specific steps of the present invention. A method for dissecting a plastic package optocoupler comprises the following specific steps:
s01, carrying out internal imaging on the plastic-packaged optocoupler by adopting X-ray, and determining a frame structure, pin (4, 5) distribution, chip (2, 3) positions, lead external bonding point positions and the like;
step S02, polish the plastic envelope opto-coupler, until exposing opto-coupler spacer 1, concrete process includes: polishing a plastic package layer 6 from the side of a pin 4 where a light-emitting chip 2 is located according to the positions of pins (4, 5) and chips (2, 3) in the plastic package optocoupler until an optocoupler spacer 1 is exposed, wherein the polishing thickness range is 0.4 mm-0.6 mm;
step S03, dissecting the plastic package optocoupler by adopting mechanical stress, wherein the specific process comprises the following steps: flattening a side pin 5 where a light receiving chip 3 of the plastic package optocoupler is located, applying a group of the flattened pins to the lower part of the end part of the optocoupler spacer 1 exposed at the polished side, applying another group of the flattened pins to the junction of the upper part of the side pin 5 where the light receiving chip 3 is located and the plastic package layer 6, and applying two groups of mechanical stresses simultaneously until the plastic package optocoupler is unsealed.
Step S04, removing the optical coupling spacer 1 by using an instrument;
step S05, removing the light guide glue on the surfaces of the chips (2, 3) and the plastic packaging material remained on the bonding points by fuming nitric acid, wherein the corrosion temperature range is 80-90 ℃, and the corrosion time range is 10-30S;
and step S06, sequentially placing the dissected plastic package optocoupler in acetone and alcohol for ultrasonic cleaning within 5-10S, confirming whether unsealing of the plastic package optocoupler meets the requirement, and if so, successfully implementing dissection.
In step S03, a water jet pliers may be used as a mechanical stress applying tool, in step S04, a tweezers may be used to remove the optical coupler spacer 1, and in step S06, it is determined whether the optical coupler spacer meets the requirements under an optical microscope of 10-30 times.
The dissecting plastic package optocoupler is simple and quick in operation, low in cost and high in dissecting success rate, does not damage the internal structure of the plastic package optocoupler, can completely show the internal chip layout, bonding and bonding process of the plastic package optocoupler, and has important significance on failure analysis and destructive physical analysis of the plastic package optocoupler.
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be made by those skilled in the art without inventive work within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.
Claims (10)
1. A method of dissecting a plastic encapsulated optocoupler, the method comprising:
carrying out internal imaging on the plastic-packaged optocoupler;
polishing the plastic package optocoupler until the optocoupler spacer is exposed;
dissecting the plastic-packaged optocoupler by adopting mechanical stress;
removing the optical coupling spacer;
removing residues on the light guide glue and the bonding points on the surface of the chip by adopting a corrosive agent;
and cleaning the plastic-packaged optocoupler after dissection by adopting an organic solvent.
2. The method of dissecting a plastic encapsulated optocoupler according to claim 1, characterized by: and carrying out internal imaging on the plastic-packaged optocoupler by adopting X-ray.
3. The method of dissecting a plastic encapsulated optocoupler according to claim 1, characterized by: the polishing process is to polish the plastic package layer from the side of the pins where the light-emitting chips are located.
4. The method of dissecting a plastic encapsulated optocoupler according to claim 1, characterized by: the polishing process is to polish the plastic package layer from the side of the pin where the light receiving chip is located.
5. The method of dissecting a plastic encapsulated optocoupler according to claim 3 or 4, characterized in that: the polishing thickness range is 0.4 mm-0.6 mm.
6. The method of dissecting a plastic encapsulated optocoupler according to claim 3, characterized by: the mechanical stress is divided into two groups; one group is applied to the lower part of the end part of the optical coupling isolating sheet exposed from the polished side, and the other group is applied to the junction between the upper part of the pin on the non-polished side and the plastic packaging layer.
7. The method of dissecting a plastic encapsulated optocoupler according to claim 4, characterized by: the mechanical stress is divided into two groups; one group is applied to the upper part of the end part of the optical coupling isolating sheet exposed from the polished side, and the other group is applied to the junction of the lower part of the pin on the non-polished side and the plastic package layer.
8. The method of dissecting a plastic encapsulated optocoupler according to claim 1, characterized by: the corrosive agent is fuming nitric acid, the corrosion temperature range is 80-90 ℃, and the corrosion time range is 10-30 s.
9. The method of dissecting a plastic encapsulated optocoupler according to claim 1, characterized by: the method for cleaning the plastic package optocoupler after dissection by adopting the organic solvent comprises the following steps: and cleaning the plastic-packaged optocoupler after dissection by sequentially adopting acetone and alcohol, wherein the cleaning time range is 5-10 s.
10. The method of dissecting a plastic encapsulated optocoupler according to claim 9, characterized by: and cleaning the plastic package optocoupler after dissection by ultrasonic waves.
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| CN201910540995.3A CN112108481B (en) | 2019-06-21 | 2019-06-21 | Method for dissecting plastic package optocoupler |
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| CN201910540995.3A CN112108481B (en) | 2019-06-21 | 2019-06-21 | Method for dissecting plastic package optocoupler |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114914174A (en) * | 2022-04-26 | 2022-08-16 | 苏试宜特(深圳)检测技术有限公司 | Cover opening method for gallium arsenide crystal grain of optical coupler chip |
| CN115353887A (en) * | 2022-10-20 | 2022-11-18 | 上海聚跃检测技术有限公司 | Plastic package body corrosive liquid and method for opening cover of plastic package body by using same |
| CN117810219A (en) * | 2024-01-09 | 2024-04-02 | 深圳市奥伦德元器件有限公司 | High-voltage-resistant insulating photoelectric coupler and preparation method thereof |
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2019
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114914174A (en) * | 2022-04-26 | 2022-08-16 | 苏试宜特(深圳)检测技术有限公司 | Cover opening method for gallium arsenide crystal grain of optical coupler chip |
| CN115353887A (en) * | 2022-10-20 | 2022-11-18 | 上海聚跃检测技术有限公司 | Plastic package body corrosive liquid and method for opening cover of plastic package body by using same |
| CN115353887B (en) * | 2022-10-20 | 2023-02-03 | 上海聚跃检测技术有限公司 | Plastic package body corrosive liquid and method for uncapping plastic package body by using same |
| CN117810219A (en) * | 2024-01-09 | 2024-04-02 | 深圳市奥伦德元器件有限公司 | High-voltage-resistant insulating photoelectric coupler and preparation method thereof |
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