CN102522319A - Embedding unpackaging method for plastic packaged device packaged by flip chip bonding process - Google Patents
Embedding unpackaging method for plastic packaged device packaged by flip chip bonding process Download PDFInfo
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- CN102522319A CN102522319A CN2012100018839A CN201210001883A CN102522319A CN 102522319 A CN102522319 A CN 102522319A CN 2012100018839 A CN2012100018839 A CN 2012100018839A CN 201210001883 A CN201210001883 A CN 201210001883A CN 102522319 A CN102522319 A CN 102522319A
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Abstract
The invention discloses an embedding unpackaging method for a plastic packaged device packaged by a flip chip bonding process. The method comprises the following steps of: first longitudinally preparing a sample by adopting embedding sample preparation equipment; then grinding off a chip bonding soldering block in the sample to expose a chip bonding salient point by adopting an automatic/manual grinding system; next unpackaging the front surface or back surface of the sample, namely the surface with a chip circuit by adopting an acid etching method, wherein an opening has a size which is less than or equal to that of a chip, and is deep enough to expose the surface of the chip; and finally, immediately washing the acid-unpackaged sample, drying the sample with air and inspecting the dried sample. By the method, a semiconductor device packaged in a flip chip bonding way or a chip size package (CSP) way is unpackaged in a way of combining a mechanical method and the acid etching method, structures such as a bonding structure and the like in the sample can be integrally reserved after the sample is unpackaged, the electrical properties of the sample also can be maintained after the sample is unpackaged, and the requirement of subsequent inspection such as destructive physical analysis, failure analysis and the like on the integrity of the sample is completely met.
Description
Technical field
The present invention relates to a kind of electronic devices and components and inlay the Kaifeng method, particularly a kind of plastic device of flip chip bonding technology encapsulation is inlayed the Kaifeng method.
Background technology
Some semiconductor device is in order to improve performance and to reduce the encapsulation that volume adopts flip chip bonding form or CSP form at present; This special construction semiconductor device can improve the operating frequency of device greatly and reduce device package volume and weight, so flip chip bonding and these two kinds of packing forms of CSP are in the application in semiconductor packages field more and more widely.Performance index for the checking semiconductor device; Generally all can break a seal to semiconductor device; Present stage flip chip bonding and Kaifeng of CSP packaged device; General adopt single wet chemical to break a seal,, but utilize this Kaifeng method to tend to make device inside chip to receive too much corrosion and damage though the method is simple to operate, efficient is high; The device physics structure also can be destroyed original state that loses, and subsequent surveys such as damaging property physical analysis DPA and failure analysis FA are difficult to proceed.
Summary of the invention
The object of the invention is to provide a kind of plastic device of flip chip bonding technology encapsulation to inlay the Kaifeng method.Solution is adopted wet chemical to tend to make device inside chip to receive too much corrosion and is damaged, and the device physics structure also can be destroyed original state that loses, the problem that physical analysis of damaging property and failure analysis are difficult to proceed.
The concrete steps that a kind of plastic device of flip chip bonding technology encapsulation is inlayed the Kaifeng method are:
The first step is built seal opening device
Seal opening device comprises: inlay sample making apparatus, grinding system, acid etching mail opener, supersonic wave cleaning machine.Wherein inlaying sample making apparatus is the general equipment of metal material metallographic test, and grinding system adopts automatic or manual all can.Sample places in the embedding groove of inlaying sample making apparatus, and the sample of inlaying curing places on the grinding table top of grinding system, and the sample after the grinding places in the acid etching mail opener, and the sample that accomplish in Kaifeng is positioned in the rinse bath of supersonic wave cleaning machine.
Second step inlayed sample making apparatus and prepares sample
Employing is inlayed sample making apparatus sample is longitudinally prepared, sample is placed in the embedding groove of inlaying sample making apparatus, and Kaifeng placements that face down, and sample is fixed on the embedding groove bottom to prevent that in mosaic process sample is floating and to overturn.Should try one's best when cast setting powder or cast setting liquid slowly, must not wash away device.Be placed on the ventilation behind the casting complete and wait for curing.
The 3rd step grinding system polishing sample
Place on the grinding table top of grinding system solidifying the sample of accomplishing, utilize the mill of grinding system to polish off sample interior chip bonding weldering plate, expose the chip bonding salient point.Should use the sand paper of granularity 800 or 1000 when adopting the grinding system polishing,, expose the chip bonding salient point and get final product in order to avoid too fast being difficult to of grinding speed controlled.
The 4th step acid etching mail opener corrosion sample
Adopt the acid etching method to the sample front or the back side, promptly chip circuit place face breaks a seal.Openings of sizes is smaller or equal to die size, and the degree of depth is as the criterion to expose chip surface.Should select 85 ℃ of fuming nitric aicds for use when using etching acid to corrode, etching time is as the criterion to expose chip surface, generally is no more than 15 seconds.The acid etching method adopts the acid etching mail opener to break a seal or break a seal manually.
The 5th step supersonic wave cleaning machine cleans sample
Immediately sample is cleaned up behind the Kaifeng, adopt acetone 1-2 time, each scavenging period 1-2 minute; Cleaned 1-2 minute with isopropyl alcohol again, then use washed with de-ionized water 1-2 minute, air-dry in air at last.
So far accomplish flip chip bonding technology encapsulation plastic device inlay Kaifeng.
The mode that this method employing mechanical means and acid etching method combine breaks a seal to the semiconductor samples of the encapsulation of flip chip bonding form or CSP form; Structures such as the inner bonding of keeping sample that can be complete behind the Kaifeng; Guarantee that sample can also keep its electrical property behind Kaifeng, satisfy of the requirement of subsequent surveys such as Destructive Physical Analysis and failure analysis fully the sample integrity.
Embodiment
The concrete steps that a kind of plastic device of flip chip bonding technology encapsulation is inlayed the Kaifeng method are:
The first step is built seal opening device
Seal opening device comprises: inlay sample making apparatus, grinding system, acid etching mail opener, supersonic wave cleaning machine.Wherein inlaying sample making apparatus is the general equipment of metal material metallographic test, and grinding system adopts automatic or manual all can.Sample places in the embedding groove of inlaying sample making apparatus, and the sample of inlaying curing places on the grinding table top of grinding system, and the sample after the grinding places in the acid etching mail opener, and the sample that accomplish in Kaifeng is positioned in the rinse bath of supersonic wave cleaning machine.
Second step inlayed sample making apparatus and prepares sample
Employing is inlayed sample making apparatus sample is longitudinally prepared, sample is placed in the embedding groove of inlaying sample making apparatus, and Kaifeng placements that face down, and sample is fixed on the embedding groove bottom to prevent that in mosaic process sample is floating and to overturn.Should try one's best during the cast setting powder slowly, must not wash away device.Be placed on the ventilation behind the casting complete and wait for curing.
The 3rd step grinding system polishing sample
Place on the grinding table top of grinding system solidifying the sample of accomplishing, utilize the mill of grinding system to polish off sample interior chip bonding weldering plate, expose the chip bonding salient point.Should use the sand paper of granularity 1000 when adopting the grinding system polishing,, expose the chip bonding salient point and get final product in order to avoid too fast being difficult to of grinding speed controlled.
The 4th step acid etching mail opener corrosion sample
Adopt the acid etching method to the sample front or the back side, promptly chip circuit place face breaks a seal.Openings of sizes is less than die size, and the degree of depth is as the criterion to expose chip surface.Should select 85 ℃ of fuming nitric aicds for use when using etching acid to corrode, etching time is as the criterion to expose chip surface, generally is no more than 15 seconds.The acid etching method adopts the acid etching mail opener to break a seal or break a seal manually.
The 5th step supersonic wave cleaning machine cleans sample
Immediately sample is cleaned up behind the Kaifeng, adopt acetone 2 times, each scavenging period 2 minutes; Cleaned 2 minutes with isopropyl alcohol again, then used washed with de-ionized water 2 minutes, air-dry in air at last.
So far accomplish flip chip bonding technology encapsulation plastic device inlay Kaifeng.
Claims (1)
1. the plastic device of a flip chip bonding technology encapsulation is inlayed the Kaifeng method, it is characterized in that the concrete steps of this method are:
The first step is built seal opening device
Seal opening device comprises: inlay sample making apparatus, grinding system, acid etching mail opener, supersonic wave cleaning machine; Wherein inlaying sample making apparatus is the general equipment of metal material metallographic test, and grinding system adopts automatic or manual all can; Sample places in the embedding groove of inlaying sample making apparatus, and the sample of inlaying curing places on the grinding table top of grinding system, and the sample after the grinding places in the acid etching mail opener, and the sample that accomplish in Kaifeng is positioned in the rinse bath of supersonic wave cleaning machine;
Second step inlayed sample making apparatus and prepares sample
Employing is inlayed sample making apparatus sample is longitudinally prepared, sample is placed in the embedding groove of inlaying sample making apparatus, and Kaifeng placements that face down, and sample is fixed on the embedding groove bottom to prevent that in mosaic process sample is floating and to overturn; Should try one's best when cast setting powder or cast setting liquid slowly, must not wash away device; Be placed on the ventilation behind the casting complete and wait for curing;
The 3rd step grinding system polishing sample
Place on the grinding table top of grinding system solidifying the sample of accomplishing, utilize the mill of grinding system to polish off sample interior chip bonding weldering plate, expose the chip bonding salient point; Should use the sand paper of granularity 800 or 1000 when adopting the grinding system polishing,, expose the chip bonding salient point and get final product in order to avoid too fast being difficult to of grinding speed controlled;
The 4th step acid etching mail opener corrosion sample
Adopt the acid etching method to the sample front or the back side, promptly chip circuit place face breaks a seal; Openings of sizes is smaller or equal to die size, and the degree of depth is as the criterion to expose chip surface; Should select 85 ℃ of fuming nitric aicds for use when using etching acid to corrode, etching time is as the criterion to expose chip surface, generally is no more than 15 seconds; The acid etching method adopts the acid etching mail opener to break a seal or break a seal manually;
The 5th step supersonic wave cleaning machine cleans sample
Immediately sample is cleaned up behind the Kaifeng, adopt acetone 1-2 time, each scavenging period 1-2 minute; Cleaned 1-2 minute with isopropyl alcohol again, then use washed with de-ionized water 1-2 minute, air-dry in air at last;
So far accomplish flip chip bonding technology encapsulation plastic device inlay Kaifeng.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100018839A CN102522319A (en) | 2012-01-05 | 2012-01-05 | Embedding unpackaging method for plastic packaged device packaged by flip chip bonding process |
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| CN2012100018839A CN102522319A (en) | 2012-01-05 | 2012-01-05 | Embedding unpackaging method for plastic packaged device packaged by flip chip bonding process |
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| CN102522319A true CN102522319A (en) | 2012-06-27 |
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| CN2012100018839A Pending CN102522319A (en) | 2012-01-05 | 2012-01-05 | Embedding unpackaging method for plastic packaged device packaged by flip chip bonding process |
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103839771A (en) * | 2012-11-23 | 2014-06-04 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor device failure analysis sample production method and analysis method |
| CN103969569A (en) * | 2013-01-25 | 2014-08-06 | 上海华虹宏力半导体制造有限公司 | Preparation method and analytical method for back optical failure positioning sample of integrated circuit |
| CN104008956A (en) * | 2014-06-06 | 2014-08-27 | 航天科工防御技术研究试验中心 | Unsealing method for flip chip device |
| CN104422606A (en) * | 2013-08-27 | 2015-03-18 | 中芯国际集成电路制造(上海)有限公司 | Preparation method of chip failure analysis sample |
| CN104658881A (en) * | 2013-11-21 | 2015-05-27 | 上海华虹宏力半导体制造有限公司 | Fast nondestructive full de-encapsulation method of contact-type IC card |
| CN104658879A (en) * | 2013-11-22 | 2015-05-27 | 中芯国际集成电路制造(上海)有限公司 | Opening method of chip packages |
| CN104810243A (en) * | 2014-01-24 | 2015-07-29 | 北大方正集团有限公司 | Method for decapsulating encapsulated device |
| CN104867809A (en) * | 2014-02-21 | 2015-08-26 | 北大方正集团有限公司 | Fixed-point grinding method of packaging device |
| CN105092326A (en) * | 2015-07-21 | 2015-11-25 | 中国工程物理研究院计量测试中心 | Unsealing method for flip-chip packaging device |
| CN105206546A (en) * | 2015-09-10 | 2015-12-30 | 宜特(上海)检测技术有限公司 | Flip chip failure analysis method and preparation method of detection sample in electric property positioning |
| CN105428499A (en) * | 2015-11-20 | 2016-03-23 | 聚灿光电科技股份有限公司 | Unpacking method for LED packaging structure |
| WO2016065728A1 (en) * | 2014-10-31 | 2016-05-06 | 山东华芯半导体有限公司 | Method for detecting welding strength of chip bonding wire |
| CN106098571A (en) * | 2016-08-08 | 2016-11-09 | 湖北三江航天红峰控制有限公司 | A kind of pre-opening method of plastic-packaged electronic component |
| CN106531668A (en) * | 2016-12-16 | 2017-03-22 | 贵州航天计量测试技术研究所 | Unpackaging device and method for unpackaging plastic packaging device by employing acid dropping method |
| CN106771949A (en) * | 2016-12-19 | 2017-05-31 | 广东威创视讯科技股份有限公司 | A kind of LED charactrons Kaifeng technique |
| CN109632791A (en) * | 2018-11-12 | 2019-04-16 | 航天科工防御技术研究试验中心 | A kind of bonding quality assessment method of semiconductor devices bonding wire |
| CN110018187A (en) * | 2019-04-12 | 2019-07-16 | 西安太乙电子有限公司 | A kind of anatomic method of 3D module |
| CN112108481A (en) * | 2019-06-21 | 2020-12-22 | 北京振兴计量测试研究所 | Method for dissecting plastic package optocoupler |
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Cited By (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103839771A (en) * | 2012-11-23 | 2014-06-04 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor device failure analysis sample production method and analysis method |
| CN103969569A (en) * | 2013-01-25 | 2014-08-06 | 上海华虹宏力半导体制造有限公司 | Preparation method and analytical method for back optical failure positioning sample of integrated circuit |
| CN104422606B (en) * | 2013-08-27 | 2017-03-29 | 中芯国际集成电路制造(上海)有限公司 | A kind of chip failure analyzes the preparation method of sample |
| CN104422606A (en) * | 2013-08-27 | 2015-03-18 | 中芯国际集成电路制造(上海)有限公司 | Preparation method of chip failure analysis sample |
| CN104658881A (en) * | 2013-11-21 | 2015-05-27 | 上海华虹宏力半导体制造有限公司 | Fast nondestructive full de-encapsulation method of contact-type IC card |
| CN104658881B (en) * | 2013-11-21 | 2017-12-05 | 上海华虹宏力半导体制造有限公司 | A kind of quick nondestructive standard-sized sheet encapsulation method of Contact Type Ic Card |
| CN104658879B (en) * | 2013-11-22 | 2018-06-08 | 中芯国际集成电路制造(上海)有限公司 | The opening method of chip packing-body |
| CN104658879A (en) * | 2013-11-22 | 2015-05-27 | 中芯国际集成电路制造(上海)有限公司 | Opening method of chip packages |
| CN104810243A (en) * | 2014-01-24 | 2015-07-29 | 北大方正集团有限公司 | Method for decapsulating encapsulated device |
| CN104867809A (en) * | 2014-02-21 | 2015-08-26 | 北大方正集团有限公司 | Fixed-point grinding method of packaging device |
| CN104867809B (en) * | 2014-02-21 | 2017-09-05 | 北大方正集团有限公司 | The fixed point Ginding process of packaging |
| CN104008956B (en) * | 2014-06-06 | 2017-12-29 | 航天科工防御技术研究试验中心 | Opening method for flip chip devices |
| CN104008956A (en) * | 2014-06-06 | 2014-08-27 | 航天科工防御技术研究试验中心 | Unsealing method for flip chip device |
| WO2016065728A1 (en) * | 2014-10-31 | 2016-05-06 | 山东华芯半导体有限公司 | Method for detecting welding strength of chip bonding wire |
| CN105092326A (en) * | 2015-07-21 | 2015-11-25 | 中国工程物理研究院计量测试中心 | Unsealing method for flip-chip packaging device |
| CN105206546A (en) * | 2015-09-10 | 2015-12-30 | 宜特(上海)检测技术有限公司 | Flip chip failure analysis method and preparation method of detection sample in electric property positioning |
| CN105206546B (en) * | 2015-09-10 | 2017-11-21 | 宜特(上海)检测技术有限公司 | The preparation method of sample is detected in crystal covered chip failure analysis method and electrically positioning |
| CN105428499A (en) * | 2015-11-20 | 2016-03-23 | 聚灿光电科技股份有限公司 | Unpacking method for LED packaging structure |
| CN105428499B (en) * | 2015-11-20 | 2018-05-15 | 聚灿光电科技股份有限公司 | A kind of opening method of LED encapsulation structure |
| CN106098571A (en) * | 2016-08-08 | 2016-11-09 | 湖北三江航天红峰控制有限公司 | A kind of pre-opening method of plastic-packaged electronic component |
| CN106098571B (en) * | 2016-08-08 | 2018-12-28 | 湖北三江航天红峰控制有限公司 | A kind of pre- opening method of plastic-packaged electronic component |
| CN106531668A (en) * | 2016-12-16 | 2017-03-22 | 贵州航天计量测试技术研究所 | Unpackaging device and method for unpackaging plastic packaging device by employing acid dropping method |
| CN106771949A (en) * | 2016-12-19 | 2017-05-31 | 广东威创视讯科技股份有限公司 | A kind of LED charactrons Kaifeng technique |
| CN106771949B (en) * | 2016-12-19 | 2019-06-14 | 广东威创视讯科技股份有限公司 | A kind of LED charactrons Kaifeng technique |
| CN109632791A (en) * | 2018-11-12 | 2019-04-16 | 航天科工防御技术研究试验中心 | A kind of bonding quality assessment method of semiconductor devices bonding wire |
| CN109632791B (en) * | 2018-11-12 | 2022-03-25 | 航天科工防御技术研究试验中心 | Method for evaluating bonding quality of semiconductor device bonding wire |
| CN110018187A (en) * | 2019-04-12 | 2019-07-16 | 西安太乙电子有限公司 | A kind of anatomic method of 3D module |
| CN112108481A (en) * | 2019-06-21 | 2020-12-22 | 北京振兴计量测试研究所 | Method for dissecting plastic package optocoupler |
| CN112108481B (en) * | 2019-06-21 | 2022-05-13 | 北京振兴计量测试研究所 | Method for dissecting plastic package optocoupler |
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Application publication date: 20120627 |