CN112108481B - Method for dissecting plastic package optocoupler - Google Patents
Method for dissecting plastic package optocoupler Download PDFInfo
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- CN112108481B CN112108481B CN201910540995.3A CN201910540995A CN112108481B CN 112108481 B CN112108481 B CN 112108481B CN 201910540995 A CN201910540995 A CN 201910540995A CN 112108481 B CN112108481 B CN 112108481B
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- optocoupler
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- plastic package
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
Abstract
The invention discloses a method for dissecting a plastic package optocoupler, which comprises the following steps: carrying out internal imaging on the plastic-packaged optocoupler; polishing the plastic package optocoupler until the optocoupler spacer is exposed; dissecting the plastic-packaged optocoupler by adopting mechanical stress; removing the optical coupling spacer; removing residues on the light guide glue and the bonding points on the surface of the chip by adopting a corrosive agent; and cleaning the plastic-packaged optocoupler after dissection by adopting an organic solvent. The invention realizes the dissection of the plastic package optocoupler by a simple, high-efficiency, low-cost and high-success-rate method, ensures that the internal structure of the device is complete, the device cannot be lost, the surface of the chip is clean, ensures that the plastic package optocoupler meets the use conditions in the analysis work of failure analysis, destructive physical analysis and the like, effectively improves the analysis capability of the plastic package optocoupler, and can well meet the test analysis work of failure positioning analysis in the failure analysis and the test analysis work of the inner lead bonding force, the chip shearing force and the like in the destructive physical analysis.
Description
Technical Field
The invention relates to the technical field of component failure analysis and destructive physical analysis, in particular to a method for dissecting a plastic package optocoupler.
Background
The optical coupler is an electric-optical-electric conversion device which takes light as a medium to transmit electric signals, and is widely applied to an isolation circuit, a switch circuit, a digital-to-analog conversion circuit and the like. The plastic-sealed optical coupler has a special packaging form. For example, the model number of HCPL-0631 produced by AVAGO, the light emitting chip and the light receiving chip are located at the upper and lower positions, and the middle is filled with light guide glue difficult to remove. The dissection method of the plastic-packaged optical coupler is not described in detail in GJB 4027A-2006 and GJB 548B-2005.
At present, the dissection of the plastic package optical coupler generally uses acid to directly corrode the plastic package material and the light guide glue. Because the spatial structure of the plastic package optocoupler is corroded by acid, an internal basic frame is seriously damaged, and the three-dimensional optical package optocoupler can appear: the bonding point of the inner lead is dropped; the chip bonding is destroyed and separated from the frame; the light emitting chip is small and easy to lose; due to uneven corrosion, the light guide glue on the surface of the chip cannot be removed completely. Due to the severe damage of the plastic package optocoupler structure, other failure factors are introduced in failure analysis, the failure cannot be accurately positioned, and the failure analysis difficulty is increased; it was not tested for bond strength and shear strength in destructive physical analysis.
Therefore, it is very important to research a proper dissection method of the plastic package optocoupler so as to completely reserve the internal structure (bonding system and bonding system) and the chip, which is very critical to correctly analyzing the failure mechanism of the plastic package optocoupler and giving a correct destructive physical analysis result.
Disclosure of Invention
In order to solve the problems, the invention provides a method for dissecting a plastic-sealed optocoupler, which comprises the following steps:
carrying out internal imaging on the plastic-packaged optocoupler;
polishing the plastic package optocoupler until the optocoupler spacer is exposed;
dissecting the plastic-packaged optocoupler by adopting mechanical stress;
removing the optical coupling spacer;
removing residues on the light guide glue and the bonding points on the surface of the chip by adopting a corrosive agent;
and cleaning the plastic-packaged optocoupler after dissection by adopting an organic solvent.
Preferably, the plastic-packaged optocoupler is internally imaged by adopting X-ray.
Preferably, the polishing process is to polish the plastic package layer from the side of the pins where the light emitting chips are located.
Preferably, the polishing process is to polish the molding layer from the lead side where the light receiving chip is located.
Preferably, the sanding thickness ranges from 0.4mm to 0.6 mm.
Preferably, the mechanical stresses are of two groups; one group is applied to the lower part of the end part of the optical coupling isolating sheet exposed from the polished side, and the other group is applied to the junction between the upper part of the pin on the non-polished side and the plastic packaging layer.
Preferably, the mechanical stresses are of two groups; one group is applied to the upper part of the end part of the optical coupling isolating sheet exposed from the polished side, and the other group is applied to the junction of the lower part of the pin on the non-polished side and the plastic package layer.
Preferably, the corrosive agent is fuming nitric acid, the corrosion temperature range is 80-90 ℃, and the corrosion time range is 10-30 s.
Preferably, the cleaning of the plastic package optocoupler after dissection by using an organic solvent comprises: and cleaning the plastic-packaged optocoupler after dissection by sequentially adopting acetone and alcohol, wherein the cleaning time range is 5-10 s.
Preferably, the plastic package optocoupler after dissection is cleaned through ultrasonic waves.
The invention provides a method for dissecting a plastic package optocoupler, which comprises the steps of firstly carrying out internal imaging on the plastic package optocoupler; polishing the plastic package optocoupler until the optocoupler spacer is exposed; and dissecting the plastic-packaged optocoupler by adopting mechanical stress, and finally removing residues on the light guide adhesive and the bonding point on the surface of the chip by adopting a corrosive agent and cleaning. The invention realizes the dissection of the plastic package optocoupler by a simple, high-efficiency, low-cost and high-success-rate method, ensures that the internal structure of the device is complete, the device cannot be lost, the surface of the chip is clean, ensures that the plastic package optocoupler meets the use conditions in the analysis work of failure analysis, destructive physical analysis and the like, effectively improves the analysis capability of the plastic package optocoupler, and can well meet the test analysis work of failure positioning analysis in the failure analysis and the test analysis work of the inner lead bonding force, the chip shearing force and the like in the destructive physical analysis.
Drawings
Fig. 1 is a schematic diagram of the internal basic structure of a plastic package optocoupler.
Fig. 2 is a schematic structural diagram of a first embodiment of the anatomical plastic-encapsulated optocoupler.
Fig. 3 is a schematic structural diagram of a second embodiment of the anatomical plastic-encapsulated optocoupler.
Fig. 4 is a flowchart of specific steps of dissecting a plastic-sealed optocoupler.
Wherein the figures include the following reference numerals:
1. an opto-coupler spacer; 2. a light emitting chip; 3. a light receiving chip; 4. a side pin where the light-emitting chip is located; 5. a side pin of the light receiving chip; 6. and (7) plastic packaging layer.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following detailed description of the preferred embodiments of the present invention is provided to make the advantages and features of the present invention easier to be understood by those skilled in the art, so as to make the protection scope of the present invention more clearly and clearly defined. For a person skilled in the art, without inventive effort, further figures can be obtained from these figures.
The invention provides a method for dissecting a plastic package optocoupler, which comprises the following steps:
carrying out internal imaging on the plastic-packaged optocoupler;
polishing the plastic package optocoupler until the optocoupler spacer 1 is exposed;
dissecting the plastic-packaged optocoupler by adopting mechanical stress;
removing the optical coupling spacer 1;
adopting a corrosive to remove residues on the light guide glue and the bonding points on the surfaces of the chips (2 and 3);
and cleaning the plastic-packaged optocoupler after dissection by adopting an organic solvent.
The invention will be further described with reference to the accompanying drawings.
Referring to fig. 1, a schematic diagram of an internal basic structure of a plastic package optocoupler is shown. The internal imaging of the plastic package optocoupler is carried out through X-ray, and the internal structure of the plastic package optocoupler is judged according to the characteristics of different penetration capacities of the X-ray to different substances and the perspective imaging of the plastic package optocoupler from the front, the back and the side of the plastic package optocoupler, wherein the internal structure comprises a frame structure, pin (4, 5) distribution, chip (2, 3) positions, lead external bonding point positions and the like.
When polishing the plastic package optocoupler, the plastic package layer 6 can be polished from the side of the pin 4 where the light emitting chip 2 is located, and the plastic package layer 6 can also be polished from the side of the pin 5 where the light receiving chip 3 is located until the optocoupler spacer 1 is exposed, wherein the polishing thickness range is 0.4 mm-0.6 mm.
The mechanical stress of the dissecting plastic package optical coupler is divided into two groups. When polishing the plastic package layer 6 from the side of the pin 4 where the light emitting chip 2 is located, one group of the application is applied to the lower part of the end part of the optical coupling spacer 1 exposed at the polishing side, and the other group of the application is applied to the junction between the upper part of the pin 5 at the non-polishing side and the plastic package layer 6, as shown in fig. 2. When the plastic package layer 6 is polished from the side of the pin 5 where the light receiving chip 3 is located, one group of the polishing liquid is applied above the end portion of the optical coupling spacer 1 exposed from the polished side, and the other group of the polishing liquid is applied at the junction of the part below the non-polished side pin 4 and the plastic package layer 6, as shown in fig. 3.
The corrosive agent adopts fuming nitric acid, the corrosion temperature of the fuming nitric acid is 80-90 ℃, and the corrosion time is 10-30 s.
According to the invention, the plastic-packaged optocoupler after dissection is cleaned by sequentially adopting acetone and alcohol, and the cleaning time range is 5-10 s. And cleaning the plastic package optocoupler after dissection by ultrasonic waves.
Fig. 4 is a flow chart showing the specific steps of the present invention. A method for dissecting a plastic package optocoupler comprises the following specific steps:
s01, carrying out internal imaging on the plastic-packaged optocoupler by adopting X-ray, and determining a frame structure, pin (4, 5) distribution, chip (2, 3) positions, lead external bonding point positions and the like;
step S02, polish the plastic envelope opto-coupler, until exposing opto-coupler spacer 1, concrete process includes: polishing a plastic package layer 6 from the side of a pin 4 where a light-emitting chip 2 is located according to the positions of pins (4, 5) and chips (2, 3) in the plastic package optocoupler until an optocoupler spacer 1 is exposed, wherein the polishing thickness range is 0.4 mm-0.6 mm;
step S03, dissecting the plastic package optocoupler by adopting mechanical stress, wherein the specific process comprises the following steps: flattening a side pin 5 where a light receiving chip 3 of the plastic package optocoupler is located, applying a group of the flattened pins to the lower part of the end part of the optocoupler spacer 1 exposed at the polished side, applying another group of the flattened pins to the junction of the upper part of the side pin 5 where the light receiving chip 3 is located and the plastic package layer 6, and applying two groups of mechanical stresses simultaneously until the plastic package optocoupler is unsealed.
Step S04, removing the optical coupling spacer 1 by using an instrument;
step S05, removing the light guide glue on the surfaces of the chips (2, 3) and the plastic packaging material remained on the bonding points by fuming nitric acid, wherein the corrosion temperature range is 80-90 ℃, and the corrosion time range is 10-30S;
and step S06, sequentially placing the dissected plastic package optocoupler in acetone and alcohol for ultrasonic cleaning within 5-10S, confirming whether unsealing of the plastic package optocoupler meets the requirement, and if so, successfully implementing dissection.
In step S03, a water jet pliers may be used as a mechanical stress applying tool, in step S04, a tweezers may be used to remove the optical coupler spacer 1, and in step S06, it is determined whether the optical coupler spacer meets the requirements under an optical microscope of 10 to 30 times.
The dissecting plastic package optocoupler disclosed by the invention is simple and quick to operate, low in cost and high in dissecting success rate, does not damage the internal structure of the plastic package optocoupler, can completely show the internal chip layout, bonding and bonding process of the plastic package optocoupler, and has important significance on failure analysis and destructive physical analysis of the plastic package optocoupler.
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be made by those skilled in the art without inventive work within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.
Claims (5)
1. A method of dissecting a plastic encapsulated optocoupler, the method comprising:
carrying out internal imaging on the plastic-packaged optocoupler;
polishing the plastic package optocoupler until the optocoupler spacer is exposed;
dissecting the plastic-packaged optocoupler by adopting mechanical stress;
removing the optical coupling spacer;
removing residues on the light guide glue and the bonding points on the surface of the chip by adopting a corrosive agent;
cleaning the plastic-packaged optocoupler after dissection by using an organic solvent;
the polishing process is to polish the plastic package layer from the pin side where the light-emitting chip is located, or the polishing process is to polish the plastic package layer from the pin side where the light-receiving chip is located;
the polishing thickness range is 0.4 mm-0.6 mm;
in the polishing process, under the condition that the plastic package layer is polished from the lead side where the light-emitting chip is located, the mechanical stresses are divided into two groups; one group is applied below the end part of the optical coupling isolating sheet exposed from the polished side, and the other group is applied above the pin on the non-polished side and at the junction of the pin and the plastic packaging layer;
in the polishing process, under the condition that the plastic package layer is polished from the lead side where the light receiving chip is located, the mechanical stresses are divided into two groups; one group is applied to the upper part of the end part of the optical coupling isolating sheet exposed from the polished side, and the other group is applied to the junction of the lower part of the pin on the non-polished side and the plastic package layer.
2. The method of dissecting a plastic encapsulated optocoupler according to claim 1, characterized by: and carrying out internal imaging on the plastic-packaged optocoupler by adopting X-ray.
3. The method of dissecting a plastic encapsulated optocoupler according to claim 1, characterized by: the corrosive agent is fuming nitric acid, the corrosion temperature range is 80-90 ℃, and the corrosion time range is 10-30 s.
4. The method of dissecting a plastic encapsulated optocoupler according to claim 1, characterized by: the method for cleaning the plastic package optocoupler after dissection by adopting the organic solvent comprises the following steps: and cleaning the plastic-packaged optocoupler after dissection by sequentially adopting acetone and alcohol, wherein the cleaning time range is 5-10 s.
5. The method of dissecting a plastic encapsulated optocoupler according to claim 4, characterized by: and cleaning the plastic package optocoupler after dissection by ultrasonic waves.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910540995.3A CN112108481B (en) | 2019-06-21 | 2019-06-21 | Method for dissecting plastic package optocoupler |
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| CN201910540995.3A CN112108481B (en) | 2019-06-21 | 2019-06-21 | Method for dissecting plastic package optocoupler |
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| CN115353887B (en) * | 2022-10-20 | 2023-02-03 | 上海聚跃检测技术有限公司 | Plastic package body corrosive liquid and method for uncapping plastic package body by using same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1289009A2 (en) * | 2001-08-25 | 2003-03-05 | Schott Glas | Mechanical structuring of cover materials for use in electrical component assemblies |
| CN102456538A (en) * | 2010-11-02 | 2012-05-16 | 航天科工防御技术研究试验中心 | Method for unsealing plastically-packaged apparatus containing un-passivated metal layer structure |
| CN102522319A (en) * | 2012-01-05 | 2012-06-27 | 航天科工防御技术研究试验中心 | Embedding unpackaging method for plastic packaged device packaged by flip chip bonding process |
| CN107655903A (en) * | 2017-09-04 | 2018-02-02 | 西安微电子技术研究所 | A kind of plastic packaging optocoupler anatomic method |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1289009A2 (en) * | 2001-08-25 | 2003-03-05 | Schott Glas | Mechanical structuring of cover materials for use in electrical component assemblies |
| CN102456538A (en) * | 2010-11-02 | 2012-05-16 | 航天科工防御技术研究试验中心 | Method for unsealing plastically-packaged apparatus containing un-passivated metal layer structure |
| CN102522319A (en) * | 2012-01-05 | 2012-06-27 | 航天科工防御技术研究试验中心 | Embedding unpackaging method for plastic packaged device packaged by flip chip bonding process |
| CN107655903A (en) * | 2017-09-04 | 2018-02-02 | 西安微电子技术研究所 | A kind of plastic packaging optocoupler anatomic method |
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