CN112098768B - Method and equipment for testing silicon optical chip - Google Patents
Method and equipment for testing silicon optical chip Download PDFInfo
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- CN112098768B CN112098768B CN201910461940.3A CN201910461940A CN112098768B CN 112098768 B CN112098768 B CN 112098768B CN 201910461940 A CN201910461940 A CN 201910461940A CN 112098768 B CN112098768 B CN 112098768B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
- G01R31/013—Testing passive components
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
Abstract
The invention provides a test method and a test device for a silicon optical chip, wherein the silicon optical wafer is cut after being fixed on a flexible film, the relative position of the silicon optical chip obtained after cutting is not changed, and then the silicon optical chip and the flexible film are integrally moved to the test device for testing without placing the silicon optical chip for many times and aligning the relative position of the silicon optical chip. The method for testing the silicon optical chip omits the steps of placing the silicon optical chip and aligning the silicon optical chip for multiple times before testing, greatly shortens the testing time and greatly improves the testing efficiency.
Description
Technical Field
The invention relates to the field of photoelectric testing, in particular to a testing method and equipment of a silicon optical chip.
Background
In general, silicon photonics chips require light as an input source or an output source to test the optical or optoelectronic performance of an optical device or circuit.
One common method of coupling light into or out of a silicon photonics chip is to use a grating coupler. The top of the silicon optical chip is provided with a grating coupler, the optical fiber is positioned above the silicon optical chip, and light transmitted by the optical fiber is coupled into or out of an optical waveguide of the silicon optical chip through the grating coupler. However, the grating coupler has disadvantages of high optical coupling loss, large wavelength dependence, and the like.
Another common method for coupling light into or out of a silicon optical chip is to use an optical fiber end-face coupler, the optical fiber end-face coupler is disposed on a side surface of the silicon optical chip, an optical fiber is disposed on a side surface of the silicon optical chip, and light transmitted by the optical fiber is coupled into or out of an optical waveguide of the silicon optical chip through the optical fiber end-face coupler. The fiber-optic end-face coupler has very low coupling loss and is insensitive to the wavelength of light, so the fiber-optic end-face coupler is widely applied to silicon optical chips.
When the silicon optical chip is tested, the optical fiber needs to be coupled with the optical fiber end face coupler from the side face of the silicon optical chip, so that the side face of the silicon optical chip, which is provided with the optical fiber end face coupler, cannot be shielded, and the silicon optical chip with the optical fiber end face coupler can only carry out chip level or bar level tests. The disadvantages are that it takes time to pick and place and align each chip or each strip, the testing efficiency is low, and the testing time is long.
Therefore, a new method and apparatus for testing silicon photonics chips are needed to overcome the above-mentioned shortcomings.
Disclosure of Invention
The invention aims to solve the technical problem of providing a method and equipment for testing a silicon optical chip, which can greatly shorten the testing time and greatly improve the testing efficiency.
In order to solve the above problems, the present invention provides a method for testing a silicon optical chip, which comprises the following steps: the silicon optical wafer is fixed on the flexible film and comprises a plurality of silicon optical chip units, and at least one side surface of each silicon optical chip unit is provided with an end surface coupling area for optical fiber coupling; cutting the silicon photonics wafer to form a plurality of silicon photonics chips, wherein the silicon photonics chips are independently arranged on the flexible film, and the end face coupling regions of the silicon photonics chips are exposed; pushing at least one silicon optical chip from the flexible film side to enable the silicon optical chip to move from a first position to a second position, wherein an end face coupling area on the side face of the silicon optical chip is not shielded by other silicon optical chips at the second position; and testing the silicon optical chip.
Further, the step of testing the silicon optical chip comprises the following steps: and optically coupling the optical fiber with the end face coupling area of the silicon optical chip to perform optical test.
Further, the step of testing the second silicon optical chip further comprises the following steps: optically coupling an optical fiber with the end face coupling area of the silicon optical chip; at least one probe or probe card is in electrical contact with the test pads on top of the silicon photonics chip for electrical testing.
Further, the step of testing the silicon optical chip further comprises the following steps: resetting the silicon optical chip, wherein the silicon optical chip moves from the second position to the first position; pushing at least one other silicon optical chip from the flexible film side to move the other silicon optical chip from the first position to the second position, wherein the end face coupling area on the side face of the other silicon optical chip is not shielded by the other silicon optical chip at the second position; and testing the other silicon optical chip.
Further, the step of testing the silicon optical chip further comprises the following steps: and taking down the silicon optical chip qualified in the test from the flexible film.
Further, the distance between the first position and the second position is greater than 100 microns.
The invention also provides a test device for realizing the test method, which comprises the following steps: the pushing device can move along a first direction to drive the silicon optical chip to move between a first position and a second position; and the testing device is used for testing the silicon optical chip.
Further, the pushing device can also move along a second direction and/or a third direction, so that the pushing device is positioned below the silicon optical chip.
Furthermore, the test equipment also comprises a carrying platform, the flexible film bearing the silicon optical chip is placed on the carrying platform, the middle part of the carrying platform is communicated, and the pushing device can penetrate through the middle part of the carrying platform and act on the silicon optical chip.
Further, the testing device further comprises a fixing device, and the fixing device can fix the edge of the flexible membrane.
Furthermore, the test equipment also comprises an optical test device, wherein the optical test device comprises at least one optical fiber, and the optical fiber is optically coupled with the end face coupling area of the silicon optical chip.
Further, the test equipment also comprises an electrical test device, wherein the electrical test device comprises at least one probe or a probe card, and the probe or the probe card is positioned above the silicon optical chip and can be electrically contacted with a test pad on the top of the silicon optical chip.
The method for testing the silicon optical chip has the advantages that the silicon optical wafer is cut after being fixed on the flexible film, so that the relative position of the silicon optical chip obtained after cutting is not changed, and then the silicon optical chip and the flexible film are integrally moved to the testing equipment for testing without placing the silicon optical chip for many times and aligning the relative position of the silicon optical chip. Compared with the existing testing method, the testing method of the silicon optical chip omits the steps of placing the silicon optical chip and aligning the silicon optical chip for multiple times before testing, greatly shortens the testing time and greatly improves the testing efficiency.
Drawings
FIG. 1 is a schematic step diagram of one embodiment of a method for testing a silicon optical chip according to the present invention;
FIGS. 2A-2H are process flow diagrams of embodiments of a method for testing the silicon photonics chip shown in FIG. 1;
FIG. 3 is a schematic diagram of the test apparatus of the present invention during testing.
Detailed Description
The following describes in detail a specific embodiment of the method and apparatus for testing a silicon optical chip according to the present invention with reference to the accompanying drawings.
Fig. 1 is a schematic step diagram of a method for testing a silicon optical chip according to an embodiment of the present invention, and referring to fig. 1, the method for testing a silicon optical chip includes the following steps: step S10, fixing a silicon optical wafer on a flexible film, wherein the silicon optical wafer comprises a plurality of silicon optical chip units, and at least one side surface of each silicon optical chip unit is provided with an end face coupling area for optical fiber coupling; step S11, cutting the silicon optical wafer to form a plurality of silicon optical chips, wherein the silicon optical chips are independently arranged on the flexible film, and the end face coupling areas of the silicon optical chips are exposed; step S12, pushing at least one silicon optical chip from the flexible film side to move the silicon optical chip from a first position to a second position, wherein the end face coupling area on the side face of the silicon optical chip is not shielded by other silicon optical chips at the second position; step S13, testing the silicon optical chip; step S14, resetting the silicon optical chip, wherein the silicon optical chip moves from the second position to the first position; step S15, pushing at least one other silicon optical chip from the flexible film side to move the other silicon optical chip from the first position to the second position, where the end-face coupling area on the side of the other silicon optical chip is not blocked by other silicon optical chips; and step S16, testing the other silicon optical chip.
Fig. 2A to 2H are process flow diagrams of embodiments of the method for testing the silicon optical chip shown in fig. 1.
Please refer to step S10, fig. 2A and fig. 2B, wherein fig. 2B is a cross-sectional view taken along a line a-a of fig. 2A. The silicon photonics wafer 200 is mounted on a flexible film 210.
The silicon photonics wafer 200 includes a plurality of silicon photonics chip units 201, and the plurality of silicon photonics chip units 201 are disposed on the same plane. At least one side surface of the silicon optical chip unit 201 is provided with an end face coupling area 201A for optical fiber coupling. In this embodiment, one side of the silicon optical chip unit 201 has an end-face coupling area 201A for optical fiber coupling, and in other embodiments of the present invention, two opposite sides of the silicon optical chip unit 201 both have end-face coupling areas 201A for optical fiber coupling. In this embodiment, a trench 202 is formed between adjacent silicon microchip units 201, the trench 202 is disposed adjacent to the end-coupling region 201A of the silicon microchip unit 201, and the end-coupling region 201A is exposed to the trench 202.
The flexible membrane 210 is deformable under the action of external force to facilitate the subsequent measurement steps. The flexible film 210 includes, but is not limited to, a polyethylene film (PO film), a pyrolytic film, or a UV film. In the present embodiment, the surface of the flexible film 210 has viscosity, and the silicon photonics wafer 200 may be directly adhered to the flexible film 210. In other embodiments of the present invention, the silicon photonics wafer 200 may be adhered to the flexible film 210 by using an adhesive or the like.
Referring to step S11 and fig. 2C, the silicon photonics wafer 200 is diced, the silicon photonics units 201 form a plurality of silicon photonics chips 203, and the silicon photonics chips 203 are independently disposed on the flexible film 210.
In this step, when dicing is performed, only the silicon photonics wafer 200 is diced, and the flexible film 210 is not diced, and after dicing, the silicon photonics chips 203 are independent from each other, but all the silicon photonics chips 203 are stuck on the flexible film 210. The relative positions of all the silicon photonics chips 203 do not change. In this embodiment, when performing the dicing, the dicing street passes through the trench 202, so that the end-face coupling region 203A on the side surface of each of the silicon optical chips 203 is not shielded by the structure of the silicon optical chip 203 itself.
Please refer to step S12 and fig. 2D, at least one silicon optical chip 203 is pushed from the flexible film 210 side, so that the silicon optical chip 203 moves from a first position to a second position, where the end coupling area 203A on the side surface of the silicon optical chip 203 is not shielded by other silicon optical chips. In this step, a pushing device 250 is used to push at least one silicon optical chip 203 from the flexible film 210 side to ascend from the first position to the second position.
The first position is an initial position of the silicon optical chip 203, and the second position is a position where the silicon optical chip 203 needs to be tested. In this embodiment, the first position a is the position of the upper surface of the silicon optical chip 203 before the silicon optical chip 230 moves, and the second position B is the position of the upper surface of the silicon optical chip 203 after the silicon optical chip is pushed, with the upper surface of the silicon optical chip 203 as a reference, where the silicon optical chip 203 can be tested. When the silicon optical chip 203 moves to the second position B, the end-face coupling region 203A on the side of the silicon optical chip 203 is not shielded by other silicon optical chips, that is, the end-face coupling region 203A on the side of the silicon optical chip 203 is exposed.
In this step, when the silicon optical chip 203 is pushed, the flexible film 210 may deform along with the silicon optical chip 203, so that the silicon optical chip 203 remains adhered to the flexible film 210. When the silicon photonics 203 reaches the second position B, the silicon photonics 230 are not separated from the flexible film 210.
In this step, multiple silicon photonics chips 203 may be pushed simultaneously. The distance between adjacent pushed silicon photonics 203 is such that the optical fiber can couple with the end-face coupling region 203A on the side of the silicon photonics 203. In this embodiment, only one silicon photo chip 203 is schematically shown to be pushed.
Referring to step S13 and fig. 2E, the silicon photo chip 203 is tested.
The tests include optical tests and electrical tests. The optical test method comprises the following steps: and optically coupling the optical fiber 220 with the end face coupling area 203A of the silicon optical chip 203, and further performing optical test through a controller. The electrical test includes, but is not limited to, a direct current test and a radio frequency electronic test. The method for electrical testing comprises the following steps: an optical fiber 220 is optically coupled to the endface coupling region 203A of the silicon photonics chip 203 and at least one probe or probe card 230 is in electrical contact with a test pad on top of the silicon photonics chip 203 for electrical testing by a controller. In this embodiment, if one side surface of the silicon optical chip unit 201 has the end-face coupling region 201A for optical fiber coupling, the optical fiber 220 is disposed only on the side surface, and in other embodiments of the present invention, if a plurality of side surfaces of the silicon optical chip 201 have the end-face coupling regions 201A for optical fiber coupling, the optical fibers may be disposed on the plurality of side surfaces of the silicon optical chip. Further, the testing method is a cyclic testing method, that is, after the silicon optical chip 203 is tested, at least another silicon optical chip can be tested. The concrete description is as follows:
referring to step S14 and fig. 2F, the silicon photo chip 203 is reset, and the silicon photo chip 203 moves from the second position B to the first position a. In this step, the device for pushing the silicon optical chip 203 to rise is lowered, the silicon optical chip 203 is lowered from the second position B to the first position a, and the flexible film 210 is restored to the original state.
Referring to step S15 and fig. 2G, at least one other silicon photo chip 204 is pushed from the flexible film 210 side, so that the other silicon photo chip 204 moves from the first position a to the second position B. At the second position B, the end-coupling region 204A on the side of the other silicon microchip 204 is not shielded by the other silicon microchip. The actuation process of the other silicon optical chip 204 is the same as that of the silicon optical chip 203. In this embodiment, a plurality of silicon optical chips may also be pushed simultaneously, and the distance between adjacent pushed silicon optical chips is required to satisfy the requirement that the optical fiber can be coupled with the end face coupling region on the side face of the silicon optical chip.
Referring to step S16 and fig. 2H, another silicon photo chip 204 is tested. This step is the same as step S13 and will not be described again.
Further, after the test is finished, the method also comprises the step of taking the silicon optical chip qualified in the test from the flexible film. The control system can monitor the test result of the silicon optical chip, and for the silicon optical chip which is qualified in the test, the control system can control the pick-and-place device to take the qualified silicon optical chip down for subsequent processes, such as packaging.
According to the testing method of the silicon optical chip, the silicon optical wafer is fixed on the flexible film and then cut, the relative position of the silicon optical chip obtained after cutting is not changed, and then the silicon optical chip and the flexible film are integrally moved to the testing equipment for testing without placing the silicon optical chip for many times and aligning the relative position of the silicon optical chip. In the conventional testing method, the silicon wafer is cut to form a plurality of silicon optical chips, one or more cut silicon optical chips are placed on a carrier and aligned, and then the silicon optical chips and the carrier are moved to a testing device for testing. Compared with the existing testing method, the testing method of the silicon optical chip of the invention is equivalent to the simultaneous placement of all the silicon optical chips without alignment, thereby omitting the steps of placing the silicon optical chip and aligning the silicon optical chip for many times before testing, greatly shortening the testing time and greatly improving the testing efficiency.
The invention also provides a specific implementation mode of the test equipment for realizing the test method. FIG. 3 is a schematic diagram of the testing apparatus of the present invention during testing. Referring to fig. 3, the testing apparatus includes a pushing device 300 and a testing device 310.
The pushing device 300 can move along a first direction to drive the silicon optical chip 203 to move between a first position a and a second position B. In this embodiment, the first direction is a Z direction, i.e. the pushing device 300 can be raised or lowered in the Z direction.
Further, the pushing device 300 can also move along a second direction and a third direction, or the pushing device 300 can move along the second direction or the third direction, so that the pushing device 300 is located below the silicon optical chip 203. In this embodiment, the second direction is an X direction, and the third direction is a Y direction (not shown in the drawings), wherein the Y direction is perpendicular to a plane formed by the X direction and the Z direction. The pushing device 300 can also move along the X direction and the Y direction, or the pushing device 300 can move along the X direction or the Y direction, so that the pushing device 300 is located below the silicon microchip. In other embodiments of the present invention, the silicon optical chip 203 can also be moved above the pushing device 300 by moving the flexible film 210 carrying the silicon optical chip 203.
The testing device 310 is used for testing the silicon optical chip 203. In this embodiment, the testing device 310 includes an optical testing device and an electrical testing device. The optical testing device includes at least one optical fiber 311. When the silicon optical chip 203 needs to be optically tested, the optical fiber 311 is optically coupled with the end face coupling region of the silicon optical chip 203, so as to couple light into the silicon optical chip 203 or out of the silicon optical chip 203. The electrical testing apparatus includes at least one probe or probe card 312, wherein the probe or probe card 312 is located above the silicon photonics chip 203. When the silicon optical chip 203 needs to be electrically tested, the optical fiber 311 is optically coupled to the end face coupling region of the silicon optical chip 203, and the probe or probe card 312 is electrically contacted to the test pad on the top of the silicon optical chip 203, so as to perform an electrical test.
Further, the testing apparatus further includes a stage 330, and the flexible film 210 carrying the silicon optical chip 203 is placed on the stage 330. The middle of the carrier 330 penetrates through the middle of the carrier 330, and the pushing device 300 can pass through the middle of the carrier 330 and act on the silicon optical chip 203. Further, the testing apparatus further includes a fixing device 320, and the fixing device 320 can fix the edge of the flexible film 210. The fixing device 320 includes, but is not limited to, a fixing frame capable of clamping the edge of the flexible film 210 to prevent the flexible film 210 carrying the silicon microchip from moving during testing. In this embodiment, the fixing device 320 is disposed at the edge of the carrier 330, and fixes the flexible film 210 at the edge of the carrier 330.
Furthermore, each device of the test equipment is connected with a processor to realize the test method.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A test method of a silicon optical chip is characterized by comprising the following steps:
the silicon optical wafer is fixed on the flexible film and comprises a plurality of silicon optical chip units, and at least one side surface of each silicon optical chip unit is provided with an end surface coupling area for optical fiber coupling;
cutting the silicon photonics wafer to form a plurality of silicon photonics chips, wherein the flexible film is not cut, the silicon photonics chips are independently fixed on the flexible film, the end face coupling areas of the silicon photonics chips are exposed, and the relative positions of the silicon photonics chips are not changed;
pushing at least one silicon optical chip from the flexible film side to enable the silicon optical chip to move from a first position to a second position, wherein an end face coupling area on the side face of the silicon optical chip is not shielded by other silicon optical chips at the second position;
testing the silicon optical chip;
resetting the silicon optical chip, wherein the silicon optical chip moves from the second position to the first position;
pushing at least one other silicon optical chip from the flexible film side to move the other silicon optical chip from the first position to the second position, wherein the end face coupling area on the side face of the other silicon optical chip is not shielded by the other silicon optical chip at the second position;
and testing the other silicon optical chip.
2. The method of claim 1, wherein the step of testing the silicon optical chip comprises the steps of: and optically coupling the optical fiber with the end face coupling area of the silicon optical chip to perform optical test.
3. The method of claim 1, wherein the step of testing the silicon photonics chip further comprises the steps of:
optically coupling an optical fiber with the end face coupling area of the silicon optical chip;
at least one probe or probe card is in electrical contact with the test pads on top of the silicon photonics chip for electrical testing.
4. The method for testing a silicon optical chip according to any one of claims 1 to 3, wherein the step of testing the silicon optical chip further comprises the following steps: and taking down the silicon optical chip qualified in the test from the flexible film.
5. A test apparatus for implementing the test method according to any one of claims 1 to 4, comprising:
the pushing device can move along a first direction to drive the silicon optical chip to move between a first position and a second position;
and the testing device is used for testing the silicon optical chip.
6. Test device according to claim 5, characterized in that the push means are also able to and ≤ in the second direction
Or a third direction so that the pushing device is positioned below the silicon optical chip.
7. The test equipment according to claim 5, wherein the test equipment further comprises a stage on which the flexible film carrying the silicon optical chip is placed, the stage being through at a middle portion thereof, the pushing device being capable of acting on the silicon optical chip through the middle portion of the stage.
8. The test apparatus of claim 7, further comprising a fixture capable of securing an edge of the flexible membrane.
9. The test apparatus of claim 5, further comprising an optical test device comprising at least one optical fiber optically coupled to the end-face coupling region of the silicon photonics chip.
10. The test apparatus of claim 5, further comprising an electrical test device comprising at least one probe or probe card positioned above the silicon chiplet and capable of making electrical contact with test pads on top of the silicon chiplet.
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| CN201910461940.3A CN112098768B (en) | 2019-05-30 | 2019-05-30 | Method and equipment for testing silicon optical chip |
| PCT/CN2019/090065 WO2020237708A1 (en) | 2019-05-30 | 2019-06-05 | Testing method and device for silicon optical chip |
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| CN201910461940.3A CN112098768B (en) | 2019-05-30 | 2019-05-30 | Method and equipment for testing silicon optical chip |
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| CN117191358B (en) * | 2023-09-21 | 2024-02-13 | 苏州猎奇智能设备有限公司 | Silicon optical chip testing device and testing method thereof |
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| CN105823759A (en) * | 2016-06-15 | 2016-08-03 | 中国工程物理研究院材料研究所 | Surface plasma resonance sensor based on silicon optical waveguides on insulator |
| CN107942450A (en) * | 2017-11-28 | 2018-04-20 | 中南大学 | A kind of coupling package silicon photon chip |
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| WO2020237708A1 (en) | 2020-12-03 |
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