CN106289970B - A kind of chip external force resistance test device and its test method - Google Patents
A kind of chip external force resistance test device and its test method Download PDFInfo
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- CN106289970B CN106289970B CN201610614003.3A CN201610614003A CN106289970B CN 106289970 B CN106289970 B CN 106289970B CN 201610614003 A CN201610614003 A CN 201610614003A CN 106289970 B CN106289970 B CN 106289970B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/003—Generation of the force
- G01N2203/005—Electromagnetic means
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- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The embodiment of the invention discloses a kind of chip external force resistance test devices, comprising: chip fixation member, external force apply component and thrust measurement component；Wherein, the chip is fixed in the chip fixation member, and the external force applies the side that component is located at the chip substrate face, and it is plane that the external force, which applies side of the component towards the chip substrate face, and the plane is parallel with the chip substrate face；The external force applies component and connects the thrust measurement component, the external force applies component and is used to push to when being driven the chip substrate face, and the thrust measurement component, which is used to measure the external force application component, which pushes the chip substrate face to, makes the chip be applied to the thrust size on the external force application component when being damaged fracture.The invention also discloses a kind of chip external force resistance test methods.Chip external force resistance device and method provided in an embodiment of the present invention can test out influence of the chip mill line to chip external force resistance ability, and test data is more accurate.
Description
Technical field
The present invention relates to chip external force resistance field of measuring technique more particularly to a kind of chip external force resistance test device and its surveys
Method for testing.
Background technique
Semiconductor crystal wafer (Wafer) module needs to scratch disk wear down in processing procedure for one single chip one by one, is subtracting
During thin, the texture for generating different depth in chip back (also known as substrate surface) can be made, may result in the anti-physical of chip
External force ability is poor.Traditional mechanical strength test is that point pressure mode is tested, and such method is to apply for chip certain point
Pressure.Traditional presses force test method are as follows: first lies in chip on platform；Certain point applies certain strength above chip
External force, and kept for the regular hour, then remove external force, and check whether chip is damaged, as shown in Figure 1.This point pressure
The shortcomings that measurement method, is: 1, it is to the flatness requirement of platform higher, if platform flatness is inadequate, then the data tested out it is inclined
Difference is larger；If 2, chip area is larger, only put by pressure, the accuracy of test data will be inadequate；3, this method can not be surveyed
Texture is tried out to the influence degree of chip external force resistance ability.Therefore, this traditional method actually can not validity test go out core
Influence degree of the piece back side texture to the anti-physical external force ability of chip.
Summary of the invention
The embodiment of the present invention proposes a kind of chip external force resistance test device and its test method, to solve existing test core
The method of the anti-physical external force ability of piece can not validity test go out chip back texture to the influence journey of the anti-physical external force ability of chip
The problem of spending.
To achieve the above object, the embodiment of the invention provides a kind of chip external force resistance test device, described device includes:
Chip fixation member, external force apply component and thrust measurement component；Wherein,
The chip is fixed in the chip fixation member, and the external force applies component and is located at the chip substrate face
Side, it is plane that the external force, which applies side of the component towards the chip substrate face, and the plane and the chip substrate face
In parallel；
The external force applies component and connects the thrust measurement component, and the external force applies component for pushing away when being driven
To the chip substrate face, the thrust measurement component, which is used to measure the external force application component, which pushes the chip substrate face to, makes
The chip is damaged the thrust size being applied on the external force application component when fracture.
Optionally, wherein the width that the external force applies plane of the component towards the chip substrate face is greater than the core
The width of piece substrate surface, the external force apply plane of the component towards the chip substrate face close to the chip substrate Middle face
One end it is straight.
Optionally, device further include: stepper motor；
The chip substrate face applies the area that component is in contact with the external force and is greater than or equal to the chip substrate face
The one third of area, the external force apply component and push the chip substrate face to until the core by stepper motor driving
The impaired fracture of piece.
Optionally, described device further include: positioning element；
It includes push broach that the external force, which applies component, and the Chip Vertical is fixed in the chip fixation member, described to push away
The lower edge height of knife is defined by the positioning element.
Optionally, wherein the lower edge height of the push broach is less than or equal to 2/3rds of the chip height.
The embodiment of the invention also provides a kind of chip external force resistance test methods, which comprises
The chip is fixed in chip fixation member；
In chip substrate face side, setting external force applies component, and the external force applies component towards the chip substrate
The side in face is plane, keeps the plane parallel with the chip substrate face；
External force application component is connected to thrust measurement component, so that the external force is applied component and pushes the chip lining to
Bottom surface is until the impaired fracture of the chip；
It is big by the thrust for being applied to the external force application component when chip fracture described in the thrust measurement component retrieval
It is small.
Optionally, wherein the external force is set and applies the width of plane of the component towards the chip substrate face greater than institute
The width for stating chip substrate face is arranged the external force application component and serves as a contrast towards the plane in the chip substrate face close to the chip
One end in the middle part of bottom surface is straight.
Optionally, wherein so that the chip substrate face is applied the area that component is in contact with the external force and be greater than or equal to
The one third of chip substrate face area drives the external force to apply component and pushes the chip substrate to using stepper motor
Face is until the impaired fracture of the chip.
Optionally, wherein it includes push broach that the external force, which applies component, and the Chip Vertical is fixed on chip fixture apparatus
On, the height of the lower edge of the push broach is limited by the positioning element.
Optionally, wherein by the lower edge of push broach height be set smaller than or equal to the chip height three/
Two.
Chip external force resistance test device and its test method provided in an embodiment of the present invention can test out chip mill line to core
The influence of piece external force resistance ability, and test data is more accurate.
Detailed description of the invention
Fig. 1 is that the chip of the prior art presses force test method schematic diagram；
Fig. 2 is the chip external force resistance test device front schematic view of the embodiment of the present invention one；
Fig. 3 is the left view schematic diagram of the test device of embodiment one；
Fig. 4 is the chip external force resistance test device front schematic view of the embodiment of the present invention two；
Fig. 5 is the left view schematic diagram of the test device of embodiment two；
Fig. 6 is the chip external force resistance test device front schematic view of the embodiment of the present invention three；
Fig. 7 is the left view schematic diagram of the test device of embodiment three；
Fig. 8 is the fixed correlation figure with pushing mechanism of chip of example IV；
Fig. 9 is the method flow schematic diagram of the embodiment of the present invention.
Label declaration: 1 --- chip fixation member；2 --- external force applies the positioning element of component (such as push broach)；3——
The substrate surface of chip.
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific embodiment
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
Technical solution of the present invention is described in detail below in conjunction with accompanying drawings and embodiments.
It should be noted that each feature in the embodiment of the present invention and embodiment can be tied mutually if do not conflicted
It closes, it is within the scope of the present invention.In addition, though logical order is shown in flow charts, but in certain situations
Under, it can be with the steps shown or described are performed in an order that is different from the one herein.
Description realizes that the chip external force resistance of each embodiment of the present invention surveys formula device with reference to the drawings.It is retouched subsequent
In stating, be conducive to of the invention say using the suffix for indicating such as " module ", " component " or " unit " of element
Bright, there is no specific meanings for itself.Therefore, " module " can be used mixedly with " component ".
The embodiment of the invention provides a kind of chip external force resistance test device, described device includes: chip fixation member, outer
Power applies component and thrust measurement component；Wherein,
The chip is fixed in the chip fixation member, and the external force applies component and is located at the chip substrate face
Side, it is plane that the external force, which applies side of the component towards the chip substrate face, and the plane and the chip substrate face
In parallel；
The external force applies component and connects the thrust measurement component, and the external force applies component for pushing away when being driven
To the chip substrate face, the thrust measurement component, which is used to measure the external force application component, which pushes the chip substrate face to, makes
The chip is damaged the thrust size being applied on the external force application component when fracture.
Optionally, wherein the width that the external force applies plane of the component towards the chip substrate face is greater than the core
The width of piece substrate surface, the external force apply plane of the component towards the chip substrate face close to the chip substrate Middle face
One end it is straight.
Optionally, described device further include: stepper motor；The chip substrate face applies component with the external force and is in contact
Area be greater than or equal to the one third of chip substrate face area, the external force applies component and is driven by the stepper motor
It is dynamic to push the chip substrate face to until the impaired fracture of the chip.
Optionally, described device further include: positioning element；It includes push broach that the external force, which applies component, the Chip Vertical
It is fixed in the chip fixation member, the top of the chip fixation member is arranged in the positioning element, the push broach
Lower edge height is defined by the positioning element.
Optionally, wherein, the lower edge height of the push broach is less than or equal to 2/3rds of the chip height.
Chip external force resistance device provided in an embodiment of the present invention can test out chip mill line to the shadow of chip external force resistance ability
It rings, and test data is more accurate.
Below by several specific embodiments, the present invention will be described in detail.
Embodiment one,
The present invention can be realized by push broach.As shown in Figure 2,3, Chip Vertical to be measured is fixed on chip fixation member 1
On, which can be chip fixed platform, chip fixation kit etc., as long as can be by Chip Vertical fixation
It can.
In the present embodiment, for purposes of illustration only, as shown in Fig. 2, vertically towards reader, push broach is located in the front of fixed chip
The back side 3 (substrate surface) of chip, the width of push broach are greater than the width of chip；It is positioned by highly controlling ruler or altitude location component 2
The height of push broach.
Preferably, in the fixed chip fixation member of one third of chip height to be measured or so, by highly controlling
Ruler, by under push broach along High definition in 2/3rds or so of chip height, when the substrate surface of chip is pushed in such push broach to, push broach
The area to contact with each other with chip substrate face is approximately equal to the one third of chip substrate face area.
Push broach connects thrust measurement component (not shown), is gradually pushed away push broach by stepper motor (not shown)
To the substrate surface (i.e. texture face) of the chip, until the impaired fracture of the chip, obtains the thrust for being applied to push broach at this time, i.e.,
It can get the ability of the chip substrate face texture external force resistance.
Embodiment two,
As the alternative of embodiment one, as shown in Figure 4,5, push broach could alternatively be other shapes of external force and apply
Component, as long as the side of object chip substrate surface 3 is plane, the lower edge of the plane is straight, should by the positioning of altitude location component 2
The height of external force application component lower edge.Chip, which is still, to be vertically fixed in chip fixation member 1, similar to embodiment one.
Embodiment three,
Fig. 6,7 show another positioning external force apply component (or push broach) height positioning element 2 set-up mode,
It is other identical as embodiment one, two, it no longer applies and states.
Example IV,
The pushing direction that Fig. 8 shows the mode of another fixed chip and external force applies component (or push broach) is illustrated
Figure.Unlike the embodiments above, chip can also be horizontally fixed in chip fixation member, and chip substrate face is deeply fixed
Component part accounts for about the one third of the area in chip substrate face, and external force applies component or push broach, can push institute to from top to bottom
Chip is stated, it is plane that external force, which applies component or push broach and the chip contacting portion, and area accounts for about the area in chip substrate face
One third.Under the driving of stepper motor, external force applies the substrate surface that chip is gradually pushed in component or push broach to, until chip by
Damage fracture, measurement are applied to the active force that external force applies component or push broach at this time, can equally obtain the substrate surface texture of chip
The ability of external force resistance.
Correspondingly, it the present invention also provides a kind of chip external force resistance test method, the described method comprises the following steps:
Step 10: the chip is fixed on chip fixture apparatus；
Step 11: in chip substrate face side, setting external force applies component, and the external force applies component towards described
The side in chip substrate face is plane, keeps the plane parallel with the chip substrate face；
Step 12: external force application component being connected to thrust measurement component, so that the external force is applied component and pushes institute to
Chip substrate face is stated until the impaired fracture of the chip；
Step 13: being applied to the external force applying unit when fracture impaired by chip described in the thrust measurement component retrieval
The thrust size of part.
Optionally, the width that the external force applies plane of the component towards the chip substrate face is set in above-mentioned steps 12
Degree is greater than the width in the chip substrate face, and the external force is arranged and applies plane of the component towards the chip substrate face close to institute
The one end for stating chip substrate Middle face is straight.
Optionally, 12 in above-mentioned steps, the chip substrate face is made to apply the area that component is in contact with the external force
More than or equal to the one third of chip substrate face area, drives the external force to apply component using stepper motor and push institute to
Chip substrate face is stated until the impaired fracture of the chip.
Optionally, it includes push broach that the external force, which applies component, and the step 10 includes: that the Chip Vertical is fixed on core
On the fixed device of piece, the height of the lower edge of the push broach is limited by positioning element.
Optionally, the lower edge height of the push broach is set smaller than or equal to 2/3rds of the chip height.
Chip external force resistance test method provided in an embodiment of the present invention can test out chip mill line to chip external force resistance ability
Influence, and test data is more accurate.
It should be noted that, in this document, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that the process, method, article or the device that include a series of elements not only include those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or device institute it is intrinsic
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including being somebody's turn to do
There is also other identical elements in the process, method of element, article or device.
The serial number of the above embodiments of the invention is only for description, does not represent the advantages or disadvantages of the embodiments.
The above is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (6)
1. a kind of semiconductor crystal wafer chip external force resistance test device, which is characterized in that described device include: chip fixation member,
External force applies component, thrust measurement component and positioning element；Wherein,
One end of the chip is vertically fixed in the chip fixation member, and the other end of the chip is not fixed to the core
In piece fixation member, the external force applies the side that component is located at the chip substrate face, and the external force applies component towards institute
The side for stating chip substrate face is plane, and the plane is parallel with the chip substrate face；The chip substrate face and described outer
Power applies the one third that the area that component is in contact is greater than or equal to chip substrate face area；
The external force applies component and connects the thrust measurement component, and the external force application component is used for the level when being driven and pushes away
To the chip substrate face, the thrust measurement component, which is used to measure the external force application component, which pushes the chip substrate face to, makes
The chip is damaged the thrust size being applied on the external force application component when fracture；
It includes push broach that the external force, which applies component, and the lower edge height of the push broach is defined by the positioning element；
Wherein, the width that the external force applies plane of the component towards the chip substrate face is greater than the width in the chip substrate face
Degree, it is straight close to one end of the chip substrate Middle face that the external force applies plane of the component towards the chip substrate face.
2. device as described in claim 1, which is characterized in that further include: stepper motor；
The external force applies component and pushes the chip substrate face to until the impaired fracture of the chip by stepper motor driving.
3. device as described in claim 1, which is characterized in that wherein,
The lower edge height of the push broach is less than or equal to 2/3rds of the chip height.
4. a kind of semiconductor crystal wafer chip external force resistance test method, which is characterized in that the described method includes:
One end of the chip is vertically fixed in chip fixation member, the other end of the chip is not fixed to the chip
In fixation member；
In chip substrate face side, setting external force applies component, and the external force applies component towards the chip substrate face
Side is plane, keeps the plane parallel with the chip substrate face；The chip substrate face and the external force apply component
The area being in contact is greater than or equal to the one third of chip substrate face area；
External force application component is connected to thrust measurement component, so that the external force is applied component and pushes horizontally toward the chip lining
Bottom surface is until the impaired fracture of the chip；
Apply the thrust size of component by being applied to the external force when chip fracture described in the thrust measurement component retrieval；
It includes push broach that the external force, which applies component, and the height of the lower edge of the push broach is limited by positioning element；
Wherein, the external force is set and applies the width of plane of the component towards the chip substrate face greater than the chip substrate face
Width, the external force is set and applies plane of the component towards the chip substrate face close to the one of the chip substrate Middle face
Hold level with both hands straight.
5. method as claimed in claim 4, which is characterized in that wherein,
It drives the external force to apply component using stepper motor and pushes the chip substrate face to until the impaired fracture of the chip.
6. method as claimed in claim 4, which is characterized in that wherein,
The lower edge height of the push broach is set smaller than or equal to 2/3rds of the chip height.
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| CN111426554B (en) * | 2020-03-23 | 2021-10-08 | 天津大学 | Semiconductor chip high temperature shear test anchor clamps |
| CN114034540B (en) * | 2021-06-21 | 2024-05-17 | 重庆康佳光电科技有限公司 | Chip performance testing method and device |
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Effective date of registration: 20200731 Address after: 2505 COFCO Plaza, No.2, nanmenwai street, Nankai District, Tianjin Patentee after: Xin Xin finance leasing (Tianjin) Co.,Ltd. Address before: 100094 No. 6 Yongjia North Road, Beijing, Haidian District Co-patentee before: DATANG SEMICONDUCTOR DESIGN Co.,Ltd. Patentee before: DATANG MICROELECTRONICS TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20211027 Address after: 100094 No. 6 Yongjia North Road, Beijing, Haidian District Patentee after: DATANG MICROELECTRONICS TECHNOLOGY Co.,Ltd. Patentee after: DATANG SEMICONDUCTOR DESIGN Co.,Ltd. Address before: 300110 2505 COFCO Plaza, No. 2, nanmenwai street, Nankai District, Tianjin Patentee before: Xin Xin finance leasing (Tianjin) Co.,Ltd. |