CN107302181A - The paster apparatus and method of laser chip - Google Patents
The paster apparatus and method of laser chip Download PDFInfo
- Publication number
- CN107302181A CN107302181A CN201710735399.1A CN201710735399A CN107302181A CN 107302181 A CN107302181 A CN 107302181A CN 201710735399 A CN201710735399 A CN 201710735399A CN 107302181 A CN107302181 A CN 107302181A
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- Prior art keywords
- halogen lamp
- lamp led
- heat
- temperature
- control unit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
Abstract
The invention discloses a kind of paster apparatus of laser chip and method, device includes：Fixed pedestal；The heat-conducting substrate at the top of fixed pedestal is arranged on, laser chip is placed on heat-conducting substrate；At least one Halogen lamp LED below heat-conducting substrate is arranged on, for being heated to heat-conducting substrate；At least one connected Halogen lamp LED control assembly corresponding with least one Halogen lamp LED respectively, each Halogen lamp LED control assembly is used to control corresponding Halogen lamp LED to open and close；Temperature detecting unit, for detecting the Current Temperatures of heat-conducting substrate to generate Current Temperatures detected value；The control unit being respectively connected with least one Halogen lamp LED control assembly and temperature detecting unit, for obtaining scenario earthquake, and at least one Halogen lamp LED control assembly is controlled according to the corresponding current set temperature value of scenario earthquake and Current Temperatures detected value, so that the temperature change of heat-conducting substrate meets scenario earthquake, so that simple in construction, inexpensive, accuracy of temperature control is high, overshoot is low, easy to use.
Description
Technical field
The present invention relates to technical field of semiconductor encapsulation, the paster apparatus and one kind of more particularly to a kind of laser chip swash
The pasting method of optical chip.
Background technology
It is higher to temperature characteristics requirement that semiconductor laser chip is welded to heat sink process, at the same to accuracy of temperature control,
Overshoot also has strict demand.In the related art, the mode of heating of semiconductor laser chip sealed in unit uses resistance mostly
Furnace temperature control mode, i.e., convert electrical energy into heat energy using electric current by electric heating element element.But, what correlation technique was present asks
Topic is, using controllable silicon as executive component, cause that equipment volume is big, accuracy of temperature control is not high, overshoot big, in-convenience in use,
Need the heat dissipation design and system cost of complexity high, reduce the encapsulation yields of laser chip.
The content of the invention
It is contemplated that at least solving one of technical problem in correlation technique to a certain extent.Therefore, the present invention
One purpose is to propose a kind of paster apparatus for the laser chip that simple in construction, inexpensive, accuracy of temperature control is high and overshoot is low.
It is another object of the present invention to propose a kind of pasting method of laser chip.
To reach above-mentioned purpose, the paster apparatus for the laser chip that one aspect of the present invention embodiment is proposed, including：Fixed base
Seat；The heat-conducting substrate at the top of the fixed pedestal is arranged on, wherein, the laser chip is placed on the heat-conducting substrate；If
At least one Halogen lamp LED below the heat-conducting substrate is put, at least one described Halogen lamp LED is used to carry out the heat-conducting substrate
Heating；At least one Halogen lamp LED control assembly, at least one described Halogen lamp LED control assembly respectively with least one described halogen
Lamp correspondence is connected, and each Halogen lamp LED control assembly is used to control corresponding Halogen lamp LED to open and close；Temperature detecting unit, it is described
Temperature detecting unit is used to detect the Current Temperatures of the heat-conducting substrate to generate Current Temperatures detected value；Control unit, it is described
Control unit is respectively connected with least one described Halogen lamp LED control assembly and the temperature detecting unit, and described control unit is used
Examined in acquisition scenario earthquake, and according to the corresponding current set temperature value of the scenario earthquake and the Current Temperatures
At least one described Halogen lamp LED control assembly of measured value control, so that the temperature change of the heat-conducting substrate meets the design temperature
Curve.
The paster apparatus of the laser chip proposed according to embodiments of the present invention, laser chip is placed on heat-conducting substrate,
And heat-conducting substrate is heated by least one Halogen lamp LED, the current of heat-conducting substrate is then detected by temperature detecting unit
Temperature is to generate Current Temperatures detected value, and control unit obtains scenario earthquake, and works as according to scenario earthquake is corresponding
Preceding set temperature value and Current Temperatures detected value control at least one Halogen lamp LED control assembly, so that the temperature change of heat-conducting substrate
Meet scenario earthquake.Thus, the apparatus structure is simple, low cost, accuracy of temperature control is high, overshoot is low, uniformity is good and
It is easy to use.
According to one embodiment of present invention, at least one described Halogen lamp LED is fixed on the inside of the fixed pedestal, and
At least one described Halogen lamp LED is close to the heat-conducting substrate and set.
According to one embodiment of present invention, nitrogen air admission hole, oxygen air admission hole and outlet are provided with the fixed pedestal
Hole, described device also includes：Nitrogen pipeline, the nitrogen pipeline is connected with the nitrogen air admission hole, and the nitrogen pipeline is used for
It is filled with to the inside of the fixed pedestal in nitrogen, the nitrogen pipeline and is provided with the first intake valve；Oxygen pipeline, the oxygen
Pipeline is connected with the oxygen air admission hole, and the oxygen pipeline is used to be filled with oxygen, the oxygen to the inside of the fixed pedestal
The second intake valve is provided with air pipe；Wherein, the nitrogen or oxygen inside the fixed pedestal are discharged by the venthole,
First intake valve and second intake valve are connected with described control unit respectively, described control unit be used for it is described extremely
A few Halogen lamp LED controls first inlet open before being heated to the heat-conducting substrate, and controls institute in cooling
State the second inlet open.
According to one embodiment of present invention, the nitrogen air admission hole and the oxygen air admission hole set the fixed pedestal
First side, the venthole is arranged on the second side of the fixed pedestal, wherein, the first side and described second
Side is oppositely arranged.
According to one embodiment of present invention, described control unit is further used for obtaining PID control model, and according to institute
State difference and the PID control model between current set temperature value and the Current Temperatures detected value and obtain current control
Amount, and current duty cycle is calculated according to the current controlled quentity controlled variable, and believe according to the current duty cycle output PWM controls calculated
Number at least one described Halogen lamp LED control assembly, to be controlled at least one described Halogen lamp LED control assembly.
According to one embodiment of present invention, described control unit is additionally operable to be more than or equal to the in the current controlled quentity controlled variable
Output duty cycle is 100% pwm control signal during one predetermined threshold value H；Described control unit is additionally operable in the current control
Output duty cycle is when amount is more than the second predetermined threshold value L and is less than the first predetermined threshold value HPWM control
Signal processed, wherein, u (k) is the current controlled quentity controlled variable；Described control unit is additionally operable to be less than or equal in the current controlled quentity controlled variable
Output duty cycle is 0% pwm control signal during the second predetermined threshold value L.
According to one embodiment of present invention, described control unit with host computer by being communicated, to obtain described set
Determine temperature curve.
According to one embodiment of present invention, each Halogen lamp LED control assembly includes：The first switch being connected in parallel
Pipe and second switch pipe；First drive circuit, the input of first drive circuit is connected with described control unit, and described
The output end of one drive circuit is connected with the control end of the first switch pipe, and first drive circuit includes the first high-speed light
Coupling, first drive circuit drives the first switch pipe on or off by first high speed photo coupling；Second driving
Circuit, the input of second drive circuit is connected with described control unit, the output end of second drive circuit and institute
The control end for stating second switch pipe is connected, and second drive circuit includes the second high speed photo coupling, and second drive circuit leads to
Cross second high speed photo coupling and drive the second switch pipe on or off；Wherein, described control unit is described by control
First switch pipe and the conducting of second switch pipe are to control corresponding Halogen lamp LED to open, and described control unit is by controlling described the
One switching tube and second switch pipe turn off to control corresponding Halogen lamp LED to close.
According to one embodiment of present invention, the temperature detecting unit includes：It is fixed on the heat on the heat-conducting substrate
Thermocouple sensor, the thermocouple sensor is used to generate temperature detection signal according to the Current Temperatures of the heat-conducting substrate；Letter
Number modulate circuit, the signal conditioning circuit is connected with the thermocouple sensor and described control unit respectively, the signal
Modulate circuit is used to the temperature detection signal is nursed one's health to generate the Current Temperatures detected value, and the Current Temperatures
Detected value is exported to described control unit.
To reach above-mentioned purpose, another aspect of the present invention embodiment proposes a kind of pasting method of laser chip, bag
Include following steps：The heat-conducting substrate for being placed with laser chip is heated by least one Halogen lamp LED, heat-conducting substrate is detected
Current Temperatures to generate Current Temperatures detected value；Obtain scenario earthquake；Work as according to the scenario earthquake is corresponding
Preceding set temperature value and the Current Temperatures detected value control at least one Halogen lamp LED control assembly with by it is described at least one
Halogen lamp LED control group controls the opening and closing of at least one Halogen lamp LED, so that the temperature change of the heat-conducting substrate meets described
Scenario earthquake.
The pasting method of the laser chip proposed according to embodiments of the present invention, it is sharp to being placed with by least one Halogen lamp LED
The heat-conducting substrate of optical chip is heated, and is detected the Current Temperatures of heat-conducting substrate to generate Current Temperatures detected value, is obtained setting
Temperature curve, and according to the corresponding current set temperature value of the scenario earthquake and the Current Temperatures detected value control to
A few Halogen lamp LED control assembly with controlled by least one described Halogen lamp LED control group at least one Halogen lamp LED unlatching and
Close, so that the temperature change of the heat-conducting substrate meets the scenario earthquake.Thus, this method can make laser chip
The simple in construction, inexpensive of paster apparatus, accuracy of temperature control is high, overshoot is low, uniformity good and easy to use.
Brief description of the drawings
Fig. 1 is the block diagram of the paster apparatus of laser chip according to embodiments of the present invention；
Fig. 2 is the structural representation of the paster apparatus of laser chip according to an embodiment of the invention；
Fig. 3 be laser chip according to an embodiment of the invention paster apparatus in scenario earthquake schematic diagram；
Fig. 4 is the block diagram of the paster apparatus of laser chip according to an embodiment of the invention；
Fig. 5 is the schematic diagram of the control principle of the paster apparatus of laser chip according to an embodiment of the invention；
Fig. 6 is the curve synoptic diagram of temperature jump signal model according to an embodiment of the invention；
Fig. 7 is the block diagram of the paster apparatus of laser chip in accordance with another embodiment of the present invention；And
Fig. 8 is the flow chart of the pasting method of laser chip according to embodiments of the present invention.
Embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning to end
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the present invention, and be not considered as limiting the invention.
Below with reference to the accompanying drawings the paster apparatus of the laser chip of the embodiment of the present invention and the paster side of laser chip are described
Method.
Fig. 1 is the block diagram of the paster apparatus of laser chip according to embodiments of the present invention.As shown in Figure 1-2, should
The paster apparatus of laser chip includes：Fixed pedestal 10, heat-conducting substrate 20, Halogen lamp LED 30, Halogen lamp LED control assembly 40, temperature inspection
Survey unit 50 and control unit 60.
Wherein, heat-conducting substrate 20 is arranged on the top of fixed pedestal 10, and laser chip is placed on heat-conducting substrate 10.Specifically
Ground, laser chip and it is heat sink be positioned over the fixation weld zone A of heat-conducting substrate 20, and fixed by fixture and top cover, make laser
Chip and it is heat sink be brought into close contact heat-conducting substrate 20, wherein, fixture can be metal fixture.More specifically, external mechanical arm can be passed through
Laser chip is positioned over to the fixation weld zone A on heat-conducting substrate 20.
Halogen lamp LED 30 is at least one, and at least one Halogen lamp LED 30 is arranged on the lower section of heat-conducting substrate 20, at least one halogen
Plain lamp 30 is used to heat heat-conducting substrate 20.Specifically, such as four Halogen lamp LEDs 30 of at least one Halogen lamp LED 30 may make up
Array of halogen lamps, can be heated by array of halogen lamps to heat-conducting substrate 20, by laser chip and heat sink welding.In this hair
In a bright specific example, Halogen lamp LED 30 can be high-power Halogen lamp LED, for example, can be 150W/25V Halogen lamp LED.
Halogen lamp LED control assembly 40 be at least one, at least one Halogen lamp LED control assembly 40 respectively with least one halogen
The correspondence of lamp 30 is connected, and each Halogen lamp LED control assembly 40 is used to control corresponding Halogen lamp LED 30 to open and close；Temperature detection list
Member 50 is used to detect the Current Temperatures of heat-conducting substrate 20 to generate Current Temperatures detected value；Control unit 60 and at least one halogen
Lamp control assembly 40 and temperature detecting unit 50 are respectively connected with, and control unit 60 is used to obtain scenario earthquake, and according to setting
Determine the corresponding current set temperature value of temperature curve and Current Temperatures detected value controls at least one Halogen lamp LED control assembly 40, with
The temperature change of heat-conducting substrate 20 is set to meet scenario earthquake.That is, control unit 60 is by controlling Halogen lamp LED 30
Open and close to control the temperature of heat-conducting substrate 20.
It should be noted that scenario earthquake can be temperature-time curve, scenario earthquake may include multiple temperature
Section, each temperature section is respectively provided with corresponding slope.For example, as shown in figure 3, the abscissa of coordinate system is time (s), coordinate
The ordinate of system is temperature (DEG C), and scenario earthquake may include 5 temperature sections, respectively the first warming-up section in the coordinate system
D1, the first temperature hold section D2, the second warming-up section D3, second temperature maintaining segment D4 and temperature descending section D5, wherein, the first warming-up section D1
Slope can be K1 (K1 be more than 0), the first temperature hold section D2 slope can be 0, and the second warming-up section D3 slope can be K2 (K2
More than 0), second temperature maintaining segment D4 slope can be 0, and temperature descending section D5 slope can be K3 (K3 is less than 0).
Specifically, control unit 60 can be obtained after scenario earthquake is got every preset time such as 1s
The corresponding set temperature value of each sampling time point simultaneously stores memory, more specifically, control unit 60 can be according to each temperature
The slope of section calculates the corresponding set temperature value of each sampling time point every preset time.Also, control unit 60 may be used also
The set temperature value storage obtained by SPI interface (Serial Peripheral Interface, Serial Peripheral Interface (SPI)) is outside
In portion's memory such as Flash flash memories.
And then when being welded to laser chip, control unit 60 receives temperature detecting unit 50 in current time k
After the Current Temperatures detected value detected, it may be determined that the corresponding current set temperature values of current time k, and it will currently set temperature
Angle value is compared with Current Temperatures detected value, and halogen is controlled by least one Halogen lamp LED control assembly 40 according to comparative result
The opening and closing of lamp 30, so that the temperature of heat-conducting substrate 20 changes according to scenario earthquake, laser chip and heat sink pass through
Heat-conducting substrate 20 heats according to scenario earthquake and completes to weld.
Thus, the system architecture of the paster apparatus of the laser chip of the embodiment of the present invention is simple, passed through with higher cost
Ji property, by the way that control complexity is transferred into software rather than hardware, thus reduces system hardware cost, heater block passes through
Using high-power Halogen lamp LED, thus with low cost, buying and replacing are convenient.
In one particular embodiment of the present invention, control unit 60 can be set with least one Halogen lamp LED control assembly 40
On same circuit board, at least one Halogen lamp LED control assembly 40 can by insulation cable respectively with 30 pairs of at least one Halogen lamp LED
It should be connected.
According to one embodiment of present invention, as shown in Fig. 2 the paster apparatus of laser chip is in operating desk 200, lead
Hot substrate 20 is in the top of operating desk 200, and the housing side of operating desk 200 is provided with fan 201, and fan 201 is to operating desk 200
It is interior to be radiated, outside the heat derives that the paster apparatus that laser chip is included in operating desk 200 is distributed to operating desk 200.
The paster apparatus that the laser chip of the embodiment of the present invention is further described with reference to Fig. 2, Fig. 4 and Fig. 7 is carried out.
According to one embodiment of present invention, as shown in Fig. 2 at least one Halogen lamp LED 30 is fixed on the interior of fixed pedestal 10
Portion, and at least one Halogen lamp LED 30 is close to heat-conducting substrate 20 and sets.In other words, heat-conducting substrate 20 can be close at least one Halogen lamp LED
30 top insertion fixed pedestal 10.
Specifically, fixed pedestal is settable at least one socket, and at least one Halogen lamp LED 30 can be respectively by corresponding
At least one socket is fixed on fixed pedestal 10.
Further, at least one Halogen lamp LED 30 can be fixed on the side of fixed pedestal 10.Wherein, when Halogen lamp LED 30 is many
When individual, multiple Halogen lamp LEDs 30 can be fixed on the side of fixed pedestal 10 parallel.
More specifically, as shown in Fig. 2 at least one Halogen lamp LED 30 can be 4, two Halogen lamp LEDs 30 therein can be consolidated parallel
The first side of fixed pedestal 10 is scheduled on, two other Halogen lamp LED 30 therein can be fixed on the second side of fixed pedestal 10 parallel
Face, first side is relative with second side, and such as first side and second side can be respectively left surface and right flank.Change speech
It, 4 high-power Halogen lamp LEDs 30 can insert fixed pedestal 10 parallel.
According to one embodiment of present invention, enter as shown in Fig. 2 nitrogen air admission hole, oxygen can be provided with fixed pedestal 10
Stomata and venthole.The first side of fixed pedestal 10 can be set in nitrogen air admission hole and oxygen air admission hole, and venthole is arranged on solid
Determine the second side of pedestal 10, wherein, first side and second side are oppositely arranged, and such as first side can divide with second side
Wei not left surface and right flank.
As shown in Fig. 2, Fig. 4 and Fig. 7, device also includes：Nitrogen pipeline and oxygen pipeline.Wherein, nitrogen pipeline and nitrogen
Air admission hole is connected, and nitrogen pipeline is used to be filled with nitrogen, nitrogen pipeline to the inside of fixed pedestal 10 to be provided with the first intake valve
71；Oxygen pipeline is connected with oxygen air admission hole, and oxygen pipeline is used to be filled with oxygen, oxygen pipeline to the inside of fixed pedestal 10
It is provided with the second intake valve 72.
Nitrogen or oxygen inside fixed pedestal 10 are discharged by venthole, 72 points of the first intake valve 71 and the second intake valve
It is not connected with control unit 60, when control unit 60 is used for before at least one Halogen lamp LED 30 is heated to heat-conducting substrate 20
Control the first intake valve 71 to open, and control the second intake valve 72 to open in cooling.
It should be appreciated that due to the stability of nitrogen extreme, thus, the heating chamber of fixed pedestal 10 can be prevented in heating
During be oxidized, simultaneously as the thermal conductivity factor very little of nitrogen, so being conducive to insulation, i.e. keeping temperature stable, it is to avoid because
Ambient temperature influences the temperature of heat-conducting substrate 20.
That is, the first side of fixed pedestal 10 is provided with the first intake valve 71 and the second intake valve 72, in heating
Nitrogen can be filled with by the first intake valve 71 before, so that can be (as shown in Figure 3 in bringing-up section and soaking zone by nitrogen
When D1-D4) realize insulation, cooling when, oxygen can be filled with by the second intake valve 72, thus wash away be filled with before be used for protect
The high temperature nitrogen of temperature, realizes cooling.
In other words, gas controls to be used to realize insulation and cool, before welding, and control unit 60 is used to control first to enter
Air valve 71 is opened to be filled with nitrogen, so as to realize insulation, after welding is finished, is cooled, i.e., into the temperature descending section shown in Fig. 3
D5, now controls the second intake valve 72 to open to be filled with oxygen, so as to realize cooling.
According to the specific embodiment of the present invention, as shown in figs. 4 and 7, control unit 60 can pass through the first control group
Part 81 controls the first intake valve 71, and the second intake valve 72 is controlled by the second control assembly 82.Specifically, control unit 60 passes through
The first control assembly 81 is controlled to turn on to control the first intake valve 71 to open, and by controlling the first control assembly 81 to turn off to control
The first intake valve 71 is made to close, and by controlling the second control assembly 82 to turn on to control the second intake valve 72 to open, and lead to
The second control assembly 82 of control is crossed to turn off to control the second intake valve 72 to close.Wherein, the first intake valve 71 and the second intake valve
72 can be magnetic valve, and the first control assembly 81 and the second control assembly 82 may include MOSFET (Metal-Oxide-
Semiconductor Field-Effect Transistor, metal-oxide half field effect transistor).
Further, as shown in Fig. 2 device also includes：Outlet pipe.Wherein, outlet pipe is connected with outlet air admission hole,
Outlet pipe is used to discharge the nitrogen or oxygen that are filled with inside fixed pedestal 10, and air outlet valve 73 is provided with outlet pipe.
That is, control unit 60 can control air outlet valve 73 and open to discharge the gas inside fixed pedestal 10.For example it is being filled with oxygen
During gas, control unit 60 can control the second intake valve 72 and air outlet valve 73 is opened and the first intake valve 71 is closed, with to fixation
The inside of pedestal 10 is filled with oxygen, and the nitrogen being filled with inside fixed pedestal 10 is discharged, that is, says, control unit 60 is in the system of opening
Second intake valve 72 opens the nitrogen that air outlet valve 73 was filled with originally to discharge to be filled with while oxygen, also.Wherein, air outlet valve 73
It can be magnetic valve.
According to one embodiment of present invention, control unit 60 can be connected by insulation cable 101 with the first intake valve 71,
Control unit 60 can be also connected by insulation cable 101 with the second intake valve 72, and control unit 60 can also pass through insulation cable 101
It is connected with air outlet valve 73.
The control flow of control unit 60 is described in detail with reference to Fig. 5.
According to one embodiment of present invention, as shown in figure 5, control unit 60 is further used for obtaining PID control model,
And current controlled quentity controlled variable u is obtained according to the difference e between current set temperature value and Current Temperatures detected value and PID control model
(k) current duty cycle, and according to current controlled quentity controlled variable u (k) is calculated, and according to the current duty cycle output PWM controls calculated
Signal is at least one Halogen lamp LED control assembly 40, to be controlled at least one Halogen lamp LED control assembly 40.
It should be noted that dutycycle can to each cycle opening control signal duration and the cycle total time it
Than for example, pwm control signal exports 1s opening control signal and 1s closing control signal in each cycle, then duty
Than for 1/2.
Specifically, each Halogen lamp LED control assembly 40 can control corresponding halogen according to the pwm control signal received
The opening time of lamp 30 and shut-in time, for example, each Halogen lamp LED control assembly 40 receives the PWM control letters that dutycycle is 1/2
Number when, each Halogen lamp LED control assembly 40 can be in corresponding 30 opening time of the Halogen lamp LED 1s of each periodic Control, and shut-in time
1s。
Specifically, according to one embodiment of present invention, control unit 60 is additionally operable to be more than or equal in current controlled quentity controlled variable
Output duty cycle is 100% pwm control signal during the first predetermined threshold value H；Control unit 60 is additionally operable to big in current controlled quentity controlled variable
In the second predetermined threshold value L and less than the first predetermined threshold value H when output duty cycle bePwm control signal,
Wherein, u (k) is current controlled quentity controlled variable；Control unit 60 is additionally operable to defeated when current controlled quentity controlled variable is less than or equal to the second predetermined threshold value L
Go out the pwm control signal that dutycycle is 0%.Wherein, the first predetermined threshold value H is more than the second predetermined threshold value L.
According to the specific embodiment of the present invention, PID control model can use PID position algorithm formula, can be such as following formula：
Wherein, KpFor proportionality coefficient, KiFor integral coefficient, KdFor differential coefficient,TiFor product
Between timesharing, TdFor derivative time, T is the sampling time, and it is k moment current set temperature value and current temperature for example to take 10ms, e (k)
The difference spent between detected value, e (k-1) is the difference between k-1 moment current set temperature value and Current Temperatures detected value, e
(j) it is the difference between j moment current set temperature value and Current Temperatures detected value, j takes 0 integer for arriving k.
It should be noted that current difference e between set temperature value and Current Temperatures detected value is considered as PID control
The input of model, current controlled quentity controlled variable u (k) is considered as the output of PID control model, and PID control model can be according to current setting
Difference e between temperature value and Current Temperatures detected value calculates the output of PID control model.In other words, current controlled quentity controlled variable u
(k) the temperature voltage value of sample quantization acquisition can be carried out by above-mentioned PID position algorithms formula for the k moment.
According to the specific example of the present invention, the first predetermined threshold value H can be such as 20 DEG C corresponding controls of the first temperature difference
Amount processed, the second predetermined threshold value L can be the poor such as 0.4 DEG C corresponding controlled quentity controlled variable of second temperature.For example, H could be arranged to：If
Temperature error between constant temperature angle value and temperature detection value is 20 DEG C and only considers the output of pid control module during proportional component
Value, i.e. Kp* corresponding controlled quentity controlled variable at 20 DEG C), L could be arranged to：Temperature error between set temperature value and temperature detection value
Consider for 0.4 DEG C and only the output valve of pid control module during proportional component, i.e. Kp* corresponding controlled quentity controlled variable at 0.4 DEG C.
Specifically, control unit 60 can set dutycycle according to the following formula：
Work as L<u(k)<During H,Wherein, dutycycle is 50% time control Halogen lamp LED 30
Switch time respectively accounts for half；
As u (k) >=H, dutycycle=100% controls Halogen lamp LED 30 persistently to open；
As u (k)≤L, dutycycle=0% controls Halogen lamp LED 30 continuously off.
That is, control unit 60 can determine the current controlled quentity controlled variable and PWM of the output of PID control model using above-mentioned formula
Relation between the dutycycle of control signal.Wherein, when the temperature error between set temperature value and temperature detection value is higher than the
Such as 20 DEG C time control Halogen lamp LEDs 30 of one temperature difference are continuously powered, so that Halogen lamp LED 30 persistently opens (dutycycle is 100%), when
Temperature error between set temperature value and temperature detection value is that the first temperature difference is controlled when poor such as 0.4 DEG C less than second temperature
Halogen lamp LED 30 is continuously powered off, i.e., so that Halogen lamp LED 30 is continuously off (dutycycle is 0%).
After starting normally to weld laser chip, what control unit 60 can be exported according to PID control model works as
The Current Temperatures detected value of relation and heat-conducting substrate 20 between preceding controlled quentity controlled variable and the dutycycle of pwm control signal with it is corresponding
Difference between set temperature value dynamically adjusts the dutycycle of pwm control signal, so as to control the bright of at least one Halogen lamp LED 30
Go out percentage of time, and then the temperature of heat-conducting substrate 20 changes according to scenario earthquake, laser chip and heat sink passes through heat conduction
The heating of substrate 20 completes welding.
Thus, actual temperature curve (curve that the temperature detection value of the continuous acquisition of temperature detecting unit 50 is constituted) can be achieved
With the ripple of scenario earthquake less than 0.4 degree Celsius, the overshoot of actual temperature curve less than 1%, actual temperature curve
Regression time is less than the heating temperature profile of 0.5 second, and the ideal temperature for completing to weld laser chip 10 is characteristic accurate
Reproduction.Wherein, ripple can refer to temperature difference when actual temperature curve is fitted with scenario earthquake；Overshoot can refer in perseverance
Warm heating period, the maximum of actual temperature curve subtracts the percentage after steady temperature value again with the ratio between steady temperature value；Return
Return the time to refer to actual temperature curve to deviate after scenario earthquake, revert to the time used in scenario earthquake.
Further, according to one embodiment of present invention, control unit 60 can determine PID control model by self calibration
In proportionality coefficient, the time of integration and derivative time.
Specifically, the beginning is established by cable on paster apparatus in use, control unit 60 first can control paster apparatus to work in school
Quasi-mode, i.e., first carry out self calibration, then, after calibration is finished, and control unit 60 can start to leading according to scenario earthquake
Hot substrate 20 is heated.
In the calibration mode, paster apparatus carries out open loop preheating (now without laser chip on heat-conducting substrate 10), control
Unit 60 can be in adjust automatically PID control model proportionality coefficient, the time of integration and derivative time, and pass through after each adjustment
The temperature of the detection heat-conducting substrate 20 of temperature detecting unit 50 is to calculate the actual temperature curve of heat-conducting substrate 20, and by actual temperature
Curve (is compared, if meeting preparatory condition such as actual temperature curve and target temperature profile with target temperature profile
Ripple is less than 0.5 second less than 0.4 DEG C, regression time, then stops calibration；Otherwise, pre-add thermal calibration is would be repeated for, until meeting
Foregoing preparatory condition.Wherein, target temperature profile can be regarded as the scenario earthquake that uses during calibration, and in preceding embodiment
Scenario earthquake used can for example use the temperature jump signal model shown in Fig. 6 with different during welding.
More specifically, calibration is to determine in Fig. 5 in PID control model proportionality coefficient, the time of integration and derivative time in fact
Three parameters.Parameter adjustment can according to first ratio, rear integration, again differential adjust step.As shown in fig. 6, using temperature jump
Signal model is tested three parameters, and proportional parts is adjusted first, and it is temperature jump signal mode to obtain target temperature profile
Type, by Proportional coefficient KpChange from small to big, in each Proportional coefficient Kp, the temperature of heat-conducting substrate 20 is detected to record corresponding temperature
Response curve, until obtaining the response curve that reaction is fast, overshoot is small, keeps in the scale parameter；Then time of integration T is adjustedi, obtain
Target temperature profile i.e. temperature jump signal model (monotone increasing section) is taken, by time of integration TiBecome according to descending mode
Change, in each time of integration Ti, the temperature of heat-conducting substrate 20 is detected to record corresponding temperature response curve, up to obtaining being
Blanket insurance holds response curve of the static error less than 0.4 DEG C in the case of good dynamic characteristics, when keeping in the proportionality coefficient and integration
Between；Finally adjust derivative time Td, in the case where adjusting proportionality coefficient and the time of integration, derivative time is incrementally increased, is detected
The temperature of heat-conducting substrate 20 is intended with recording corresponding temperature response curve until obtaining temperature response curve with temperature jump curve
Response curve of the regression time of conjunction within 0.5 second.Thus, adjust and finish, three parameters can be stored in flash memory
In.
It should be appreciated that when self calibration can not be met desired ratio coefficient, the time of integration and derivative time,
Three parameters can also be manually entered.
Thus, the device of the embodiment of the present invention controls high-power Halogen lamp LED to be heated using PWM+PID control mode,
Compared to the resistance furnace mode of heating in correlation technique, accuracy of temperature control height (error is not higher than positive and negative 0.4 DEG C), overshoot be not small (high
In 1%).And self calibration mode make it that device work is not influenceed by factors such as temperature drift and device agings.
Illustrated with reference to Fig. 7 modes for obtaining scenario earthquake to control unit 60.
According to one embodiment of present invention, as shown in fig. 7, control unit 60 with host computer 100 by being communicated, with
Obtain scenario earthquake.Specifically, control unit 60 can be communicated by serial ports such as UART with host computer 100.
Specifically, host computer 100 can provide graphic user interface, and receive user and pass through setting that graphic user interface is inputted
Determine temperature curve, and scenario earthquake is sent to control unit 60.Wherein, VC++ design drawings can be used in host computer 100
Shape user interface.In addition, host computer 100 can also by graphic user interface receive user input control instruction for example calibrate and
Welding instruction etc..Working state control, the curve of paster apparatus are set that is, user can be realized by graphic user interface
The function such as put.
Specifically, can be by obtaining initial temperature, end temp and the temperature of each temperature section in scenario earthquake
The section time is to obtain scenario earthquake.That is, user can open graphic user interface in host computer 10, in graphical user
The temperature-controlled parameter part at interface sets laser chip to weld required scenario earthquake, and (wherein, laser chip welding, which is used, sets
It is usually fixed slope to determine temperature curve), initial temperature, end temp and the temperature section time of each temperature section are set, set
Put after end, the scenario earthquake that graphic user interface sets user is intactly showed.Afterwards, host computer 100 exists
After the confirmation instruction for receiving user, scenario earthquake is sent to control unit 60.
In addition, according to one embodiment of present invention, control unit 60 was additionally operable to the temperature detection value of acquisition and time
Parameter is sent to host computer 100 by serial ports in real time, so that host computer 100 is generated and shown according to temperature detection value and time parameter
Show actual temperature curve.So, user can contrast the difference between scenario earthquake and actual temperature curve in host computer, inspection
Look into device accuracy of temperature control.
Thus, temperature control curve i.e. scenario earthquake can arbitrarily be set by host computer, better adaptability is adapted to various
The semiconductor laser chip of different capacity, changes (0~450 DEG C), the patch of the embodiment of the present invention from temperature control curve to temperature range
Sheet devices can set and realize according to certain chip product specification well.
Temperature detecting unit 50 and the specific knot of Halogen lamp LED control assembly 40 are obtained to temperature detecting unit with reference to Fig. 7
Structure is illustrated.
According to one embodiment of present invention, as shown in figs. 2 and 7, temperature detecting unit 50 includes：Thermocouple sensor 51
With signal conditioning circuit 52.
Wherein, thermocouple sensor 51 is fixed on heat-conducting substrate 20, and thermocouple sensor 51 is used for according to heat-conducting substrate
Current Temperatures generation temperature detection signal；Signal conditioning circuit 52 respectively with thermocouple sensor 51 and the phase of control unit 60
Even, signal conditioning circuit 52 is used to nurse one's health temperature detection signal to generate Current Temperatures detected value, and Current Temperatures are examined
Measured value is exported to control unit 60.
Specifically, temperature detecting unit 50 completes temperature to the conversion of voltage, wherein, thermocouple sensor 51 completes temperature
The accurate transformation of electric current is spent, due to electric current very little, therefore, electric current (including voltage follow, is put by signal conditioning circuit 52
Big and filtering) handle, signal conditioning circuit 52 converts the current into after voltage the ADC conversions being input to again in control unit 60
Device, to carry out analog-to-digital conversion by ADC converters.
According to the specific example of the present invention, thermocouple sensor 51 can be three-wire system PT100 thermocouple sensors, should
Sensor accuracy is high.
According to one embodiment of present invention, as shown in fig. 7, each Halogen lamp LED control assembly 40 includes：First switch pipe
Q1 and second switch pipe Q2 and the first drive circuit 41 and the second drive circuit 42.
Wherein, first switch pipe Q1 and second switch pipe Q2 are connected in parallel；The input of first drive circuit 41 and control
Unit 60 is connected, and the output end of the first drive circuit 41 is connected with first switch pipe Q1 control end, and the first drive circuit 41 is wrapped
The first high speed photo coupling U1 is included, the first drive circuit 41 drives first switch pipe Q1 on or off by the first high speed photo coupling U1；
The input of second drive circuit 42 is connected with control unit 60, and the output end of the second drive circuit 42 is with second switch pipe Q2's
Control end is connected, and the second drive circuit 42 includes the second high speed photo coupling U2, and the second drive circuit 42 passes through the second high speed photo coupling U2
Drive second switch pipe Q2 on or off；Wherein, control unit 60 is by controlling first switch pipe Q1 and second switch pipe Q2
Conducting is to control corresponding Halogen lamp LED 30 to open, and control unit 60 is by controlling first switch pipe Q1 and second switch pipe Q2 to close
Break to control corresponding Halogen lamp LED 30 to close.Wherein, first switch pipe Q1 and second switch pipe Q2 can be MOSFET.
That is, Halogen lamp LED control assembly 40 completes the accurate control of heating-up temperature, i.e. control unit passes through timer
Export adjustable duty cycle pwm control signal give each Halogen lamp LED control assembly 40, with control each Halogen lamp LED 30 energization or
Power-off, so as to control the heat of each output of Halogen lamp LED 30 and the temperature of heat-conducting substrate 20.
It should be appreciated that by high speed photo coupling high-power circuit can be avoided to produce influence to digital baseband circuit；Adopt
Thermal losses can be reduced as far as possible with the MOSFET of high-power, Low ESR, two-in-parallel, it is to avoid the complicated cooling system of design is for example air-cooled
Or water cooling etc., improve power output.
Thus, compared to the resistance furnace mode of heating in correlation technique, the device of this hair inventive embodiments is using high-power, low
Impedance, the MOSFET of two-in-parallel and PWM count control control mode, computer heating control part generation heat are few, without complicated radiating
Design, such as air-cooled or water cooling, reduce further assembly of devices sheet, extend device service life.
It should be noted that, control unit 60 completes analog-to-digital conversion, the heating of temperature detection as the control core of device
Control, parametric calibration, the function such as interact with host computer, it is contemplated that the analog-to-digital conversion and temperature control circuit data of temperature detection are related to
The computings such as floating multiplication is removed, iteration, and accuracy of temperature control and real-time performance require higher, and control unit 60 can use band DSP and FPU
STM32F401.
Paster apparatus with the laser chip that above-mentioned several embodiments are provided is corresponding, and a kind of embodiment of the invention is also carried
For a kind of pasting method of laser chip, due to pasting method and the above-mentioned several realities of laser chip provided in an embodiment of the present invention
The paster apparatus for applying the laser chip of example offer is corresponding, therefore the embodiment of the paster apparatus of aforementioned laser chip is also suitable
The pasting method of the laser chip provided in the present embodiment, is not described in detail in the present embodiment.
Fig. 8 is the flow chart of the pasting method of laser chip according to embodiments of the present invention.As shown in figure 8, laser chip
Pasting method, comprise the following steps：
S1：The heat-conducting substrate for being placed with laser chip is heated by least one Halogen lamp LED；
S2：The Current Temperatures of heat-conducting substrate are detected to generate Current Temperatures detected value；
S3：Obtain scenario earthquake；
S4：At least one halogen is controlled according to the corresponding current set temperature value of scenario earthquake and Current Temperatures detected value
Plain lamp control assembly is to control the opening and closing of at least one Halogen lamp LED by least one Halogen lamp LED control group, so that heat conduction
The temperature change of substrate meets scenario earthquake.
The pasting method of the laser chip proposed according to embodiments of the present invention, it is sharp to being placed with by least one Halogen lamp LED
The heat-conducting substrate of optical chip is heated, and is detected the Current Temperatures of heat-conducting substrate to generate Current Temperatures detected value, is obtained setting
Temperature curve, and according to the corresponding current set temperature value of the scenario earthquake and the Current Temperatures detected value control to
A few Halogen lamp LED control assembly with controlled by least one described Halogen lamp LED control group at least one Halogen lamp LED unlatching and
Close, so that the temperature change of the heat-conducting substrate meets the scenario earthquake.Thus, this method can make laser chip
The simple in construction, inexpensive of paster apparatus, accuracy of temperature control is high, overshoot is low, uniformity good and easy to use.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise ", " axial direction ", " radial direction ", " circumference " be based on orientation shown in the drawings or
Position relationship, is for only for ease of the description present invention and simplifies description, rather than indicate or imply that the device or element of meaning must
There must be specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that indicating or implying relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include at least one this feature.In the description of the invention, " multiple " are meant that at least two, such as two, three
It is individual etc., unless otherwise specifically defined.
In the present invention, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " fixation " etc.
Term should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally；Can be that machinery connects
Connect or electrically connect；Can be joined directly together, can also be indirectly connected to by intermediary, can be in two elements
The connection in portion or the interaction relationship of two elements, unless otherwise clear and definite restriction.For one of ordinary skill in the art
For, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature
It is that the first and second features are directly contacted, or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature are directly over second feature or oblique upper, or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward, or is merely representative of fisrt feature level height less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means to combine specific features, structure, material or the spy that the embodiment or example are described
Point is contained at least one embodiment of the present invention or example.In this manual, to the schematic representation of above-mentioned term not
Identical embodiment or example must be directed to.Moreover, specific features, structure, material or the feature of description can be with office
Combined in an appropriate manner in one or more embodiments or example.In addition, in the case of not conflicting, the skill of this area
Art personnel can be tied the not be the same as Example or the feature of example and non-be the same as Example or example described in this specification
Close and combine.
Any process described otherwise above or method description are construed as in flow chart or herein, represent to include
Module, fragment or the portion of the code of one or more executable instructions for the step of realizing custom logic function or process
Point, and the scope of the preferred embodiment of the present invention includes other realization, wherein can not be by shown or discussion suitable
Sequence, including according to involved function by it is basic simultaneously in the way of or in the opposite order, carry out perform function, this should be of the invention
Embodiment person of ordinary skill in the field understood.
Represent in flow charts or logic and/or step described otherwise above herein, for example, being considered use
In the order list for the executable instruction for realizing logic function, it may be embodied in any computer-readable medium, for
Instruction execution system, device or equipment (such as computer based system including the system of processor or other can be held from instruction
The system of row system, device or equipment instruction fetch and execute instruction) use, or combine these instruction execution systems, device or set
It is standby and use.For the purpose of this specification, " computer-readable medium " can any can be included, store, communicate, propagate or pass
Defeated program is for instruction execution system, device or equipment or the dress for combining these instruction execution systems, device or equipment and using
Put.The more specifically example (non-exhaustive list) of computer-readable medium includes following：Electricity with one or more wirings
Connecting portion (electronic installation), portable computer diskette box (magnetic device), random access memory (RAM), read-only storage
(ROM), erasable edit read-only storage (EPROM or flash memory), fiber device, and portable optic disk is read-only deposits
Reservoir (CDROM).In addition, can even is that can be in the paper of printing described program thereon or other are suitable for computer-readable medium
Medium, because can then enter edlin, interpretation or if necessary with it for example by carrying out optical scanner to paper or other media
His suitable method is handled electronically to obtain described program, is then stored in computer storage.
It should be appreciated that each several part of the present invention can be realized with hardware, software, firmware or combinations thereof.Above-mentioned
In embodiment, the software that multiple steps or method can in memory and by suitable instruction execution system be performed with storage
Or firmware is realized.Such as, if realized with hardware with another embodiment, following skill well known in the art can be used
Any one of art or their combination are realized：With the logic gates for realizing logic function to data-signal from
Scattered logic circuit, the application specific integrated circuit with suitable combinational logic gate circuit, programmable gate array (PGA), scene can be compiled
Journey gate array (FPGA) etc..
Those skilled in the art are appreciated that to realize all or part of step that above-described embodiment method is carried
Rapid to can be by program to instruct the hardware of correlation to complete, described program can be stored in a kind of computer-readable storage medium
In matter, the program upon execution, including one or a combination set of the step of embodiment of the method.
In addition, each functional unit in each embodiment of the invention can be integrated in a processing module, can also
That unit is individually physically present, can also two or more units be integrated in a module.Above-mentioned integrated mould
Block can both be realized in the form of hardware, it would however also be possible to employ the form of software function module is realized.The integrated module is such as
Fruit is realized using in the form of software function module and as independent production marketing or in use, can also be stored in a computer
In read/write memory medium.
Storage medium mentioned above can be read-only storage, disk or CD etc..Although having been shown and retouching above
Embodiments of the invention are stated, it is to be understood that above-described embodiment is exemplary, it is impossible to be interpreted as the limit to the present invention
System, one of ordinary skill in the art can be changed to above-described embodiment, change, replace and become within the scope of the invention
Type.
Claims (10)
1. a kind of paster apparatus of laser chip, it is characterised in that including：
Fixed pedestal；
The heat-conducting substrate at the top of the fixed pedestal is arranged on, wherein, the laser chip is placed on the heat-conducting substrate；
At least one Halogen lamp LED below the heat-conducting substrate is arranged on, at least one described Halogen lamp LED is used for the heat conduction base
Plate is heated；
At least one Halogen lamp LED control assembly, at least one described Halogen lamp LED control assembly respectively with least one described Halogen lamp LED
Correspondence is connected, and each Halogen lamp LED control assembly is used to control corresponding Halogen lamp LED to open and close；
Temperature detecting unit, the temperature detecting unit is used to detect the Current Temperatures of the heat-conducting substrate to generate Current Temperatures
Detected value；
Control unit, described control unit and at least one described Halogen lamp LED control assembly and temperature detecting unit difference phase
Even, described control unit is used to obtain scenario earthquake, and according to the corresponding current design temperature of the scenario earthquake
Value and at least one described Halogen lamp LED control assembly of Current Temperatures detected value control, so that the temperature of the heat-conducting substrate becomes
Change meets the scenario earthquake.
2. the paster apparatus of laser chip according to claim 1, it is characterised in that at least one described Halogen lamp LED is fixed
In the inside of the fixed pedestal, and at least one described Halogen lamp LED is close to the heat-conducting substrate setting.
3. the paster apparatus of laser chip according to claim 1, it is characterised in that be provided with nitrogen on the fixed pedestal
Air admission hole, oxygen air admission hole and venthole, described device also include：
Nitrogen pipeline, the nitrogen pipeline is connected with the nitrogen air admission hole, and the nitrogen pipeline is used for the fixed pedestal
Inside be filled with nitrogen, the nitrogen pipeline and be provided with the first intake valve；
Oxygen pipeline, the oxygen pipeline is connected with the oxygen air admission hole, and the oxygen pipeline is used for the fixed pedestal
Inside be filled with oxygen, the oxygen pipeline and be provided with the second intake valve；
Wherein, the nitrogen or oxygen inside the fixed pedestal are discharged by the venthole, first intake valve and described
Second intake valve is connected with described control unit respectively, and described control unit is used to lead to described at least one described Halogen lamp LED
Hot substrate controls first inlet open before being heated, and controls second inlet open in cooling.
4. the paster apparatus of laser chip according to claim 3, it is characterised in that the nitrogen air admission hole and the oxygen
Gas air admission hole sets the first side of the fixed pedestal, and the venthole is arranged on the second side of the fixed pedestal, its
In, the first side and the second side are oppositely arranged.
5. the paster apparatus of laser chip according to claim 1, it is characterised in that described control unit is further used for
PID control model is obtained, and according to the difference between the current set temperature value and the Current Temperatures detected value and institute
State PID control model and obtain current controlled quentity controlled variable, and current duty cycle is calculated according to the current controlled quentity controlled variable, and according to calculating
Current duty cycle export pwm control signal at least one described Halogen lamp LED control assembly, with least one described halogen
Lamp control assembly is controlled.
6. the paster apparatus of laser chip according to claim 5, it is characterised in that
Described control unit is additionally operable to the output duty cycle when the current controlled quentity controlled variable is more than or equal to the first predetermined threshold value H
100% pwm control signal；
Described control unit is additionally operable to be more than the second predetermined threshold value L and less than first predetermined threshold value in the current controlled quentity controlled variable
Output duty cycle is during HPwm control signal, wherein, u (k) be the current controlled quentity controlled variable；
Described control unit is additionally operable to the output duty cycle when the current controlled quentity controlled variable is less than or equal to the second predetermined threshold value L
For 0% pwm control signal.
7. the paster apparatus of laser chip according to claim 1, it is characterised in that described control unit by with it is upper
Machine is communicated, to obtain the scenario earthquake.
8. the paster apparatus of laser chip according to claim 1, it is characterised in that each Halogen lamp LED control assembly
Including：
The first switch pipe and second switch pipe being connected in parallel；
First drive circuit, the input of first drive circuit is connected with described control unit, first drive circuit
Output end be connected with the control end of the first switch pipe, first drive circuit includes the first high speed photo coupling, described the
One drive circuit drives the first switch pipe on or off by first high speed photo coupling；
Second drive circuit, the input of second drive circuit is connected with described control unit, second drive circuit
Output end be connected with the control end of the second switch pipe, second drive circuit includes the second high speed photo coupling, described the
Two drive circuits drive the second switch pipe on or off by second high speed photo coupling；
Wherein, described control unit is by controlling the first switch pipe and second switch pipe to turn on to control corresponding Halogen lamp LED
Open, and described control unit is by controlling the first switch pipe and second switch pipe to turn off to control corresponding Halogen lamp LED to close
Close.
9. the paster apparatus of laser chip according to claim 1, it is characterised in that the temperature detecting unit includes：
The thermocouple sensor on the heat-conducting substrate is fixed on, the thermocouple sensor is used for according to the heat-conducting substrate
Current Temperatures generate temperature detection signal；
Signal conditioning circuit, the signal conditioning circuit is connected with the thermocouple sensor and described control unit respectively, institute
Stating signal conditioning circuit is used to nurse one's health the temperature detection signal to generate the Current Temperatures detected value, and it is described ought
Preceding temperature detection value is exported to described control unit.
10. a kind of pasting method of laser chip, it is characterised in that comprise the following steps：
The heat-conducting substrate for being placed with laser chip is heated by least one Halogen lamp LED；
The Current Temperatures of heat-conducting substrate are detected to generate Current Temperatures detected value；
Obtain scenario earthquake；
At least one is controlled according to the corresponding current set temperature value of the scenario earthquake and the Current Temperatures detected value
Halogen lamp LED control assembly to control the opening and closing of at least one Halogen lamp LED by least one described Halogen lamp LED control group, with
The temperature change of the heat-conducting substrate is set to meet the scenario earthquake.
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|---|---|---|---|
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111802921A (en) * | 2020-06-30 | 2020-10-23 | 九阳股份有限公司 | Illumination control method of cooking appliance and cooking appliance |
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