CN204036735U - 按压装置 - Google Patents

按压装置 Download PDF

Info

Publication number
CN204036735U
CN204036735U CN201420430514.6U CN201420430514U CN204036735U CN 204036735 U CN204036735 U CN 204036735U CN 201420430514 U CN201420430514 U CN 201420430514U CN 204036735 U CN204036735 U CN 204036735U
Authority
CN
China
Prior art keywords
duplexer
mentioned
distance piece
plate
press device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420430514.6U
Other languages
English (en)
Chinese (zh)
Inventor
北山善彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of CN204036735U publication Critical patent/CN204036735U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/366—Moulds for making articles of definite length, i.e. discrete articles plates pressurized by an actuator, e.g. ram drive, screw, vulcanizing presses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Presses And Accessory Devices Thereof (AREA)
  • Press Drives And Press Lines (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
CN201420430514.6U 2013-07-31 2014-07-31 按压装置 Expired - Fee Related CN204036735U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013159647A JP2015030133A (ja) 2013-07-31 2013-07-31 押圧装置および樹脂シートの硬化方法
JP2013-159647 2013-07-31

Publications (1)

Publication Number Publication Date
CN204036735U true CN204036735U (zh) 2014-12-24

Family

ID=52237441

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201420430514.6U Expired - Fee Related CN204036735U (zh) 2013-07-31 2014-07-31 按压装置
CN201410374446.0A Pending CN104339511A (zh) 2013-07-31 2014-07-31 按压装置和树脂片的固化方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201410374446.0A Pending CN104339511A (zh) 2013-07-31 2014-07-31 按压装置和树脂片的固化方法

Country Status (5)

Country Link
JP (1) JP2015030133A (ja)
KR (1) KR20160036660A (ja)
CN (2) CN204036735U (ja)
TW (1) TW201504022A (ja)
WO (1) WO2015015956A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111149161A (zh) * 2018-03-09 2020-05-12 Hoya株式会社 间隔件、基板的层积体、基板的制造方法和磁盘用基板的制造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI772128B (zh) * 2020-12-30 2022-07-21 盟立自動化股份有限公司 固持裝置
CN114290730B (zh) * 2021-12-30 2023-10-03 国药集团北京华邈药业有限公司 一种中药饮片煨木香的制备设备
KR20240026543A (ko) 2022-08-22 2024-02-29 주식회사 한국카본 복합 시트 제조장치와 제조방법 및 그에 따라 제조된 복합 시트

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0640041B1 (en) * 1992-05-05 1996-10-09 Cedal S.R.L. Process for producing plastic laminates with metal laminae, especially for printed circuits
JPH1058534A (ja) * 1996-08-20 1998-03-03 Mitsubishi Electric Corp 加熱加圧成形装置及びその方法
JP2002001588A (ja) * 2000-06-23 2002-01-08 Meiki Co Ltd 多段プレス装置におけるキャリアプレートの浮上機構
JP2009099850A (ja) * 2007-10-18 2009-05-07 Sony Chemical & Information Device Corp 半導体モジュールの製造方法及び製造装置、半導体モジュール
JP2013131552A (ja) * 2011-12-20 2013-07-04 Tdk Corp 電子回路モジュール部品の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111149161A (zh) * 2018-03-09 2020-05-12 Hoya株式会社 间隔件、基板的层积体、基板的制造方法和磁盘用基板的制造方法
CN111149161B (zh) * 2018-03-09 2021-10-22 Hoya株式会社 间隔件、基板的层积体、基板的制造方法和磁盘用基板的制造方法
US11471993B2 (en) 2018-03-09 2022-10-18 Hoya Corporation Spacer, laminate of substrates, method for manufacturing substrate, and method for manufacturing substrate for magnetic disk
US11839950B2 (en) 2018-03-09 2023-12-12 Hoya Corporation Spacer and laminate

Also Published As

Publication number Publication date
KR20160036660A (ko) 2016-04-04
TW201504022A (zh) 2015-02-01
WO2015015956A1 (ja) 2015-02-05
JP2015030133A (ja) 2015-02-16
CN104339511A (zh) 2015-02-11

Similar Documents

Publication Publication Date Title
CN204036735U (zh) 按压装置
CN103299408B (zh) 电子元器件模块的制造方法及电子元器件模块
KR102214418B1 (ko) 전력 반도체 스위칭 장치 및 이를 포함하는 장치
CN203607405U (zh) 发光装置、发光装置集合体以及带有电极的基板
CN203607404U (zh) 发光装置、发光装置集合体以及带有电极的基板
CN107960139B (zh) 各向异性导电膜和连接结构体
CN103299417B (zh) 树脂密封型模块
CN105472877A (zh) 带有导热且电绝缘的微散热器的印刷电路板及其制备方法
ATE545107T1 (de) Herstellungstechniken für elektrische einrichtung
KR20130095825A (ko) 외부 커넥터를 갖는 전자 카드
CN106068559A (zh) 绝缘基板及半导体装置
CN105451443B (zh) 印刷电路板
CN106465546B (zh) 用于生产嵌入了传感器晶片的印刷电路板的方法，以及印刷电路板
CN103165794B (zh) 光学半导体装置用基台、其制造方法以及光学半导体装置
US8779561B2 (en) LED backlight unit without printed circuit board and method of manufacturing the same
CN105144358B (zh) 半导体装置的制造方法
US20060061327A1 (en) Battery with embedded circuits
CN102740598A (zh) 三层防伪标签pcb板及其制备工艺
EP3174088B1 (en) Method of manufacturing a plastic packaged smd diode
CN103531695B (zh) 发光装置用封装成形体及采用了其的发光装置
CN209419983U (zh) 电子装置及其印刷电路板
CN204183800U (zh) 粘贴夹具
CN209546011U (zh) 电子装置及其印刷电路板
CN203104949U (zh) 一种双面pcb板
CN205542871U (zh) 框构件

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141224

Termination date: 20170731

CF01 Termination of patent right due to non-payment of annual fee