CN203839349U - Reworking auxiliary tool - Google Patents
Reworking auxiliary tool Download PDFInfo
- Publication number
- CN203839349U CN203839349U CN201420216437.4U CN201420216437U CN203839349U CN 203839349 U CN203839349 U CN 203839349U CN 201420216437 U CN201420216437 U CN 201420216437U CN 203839349 U CN203839349 U CN 203839349U
- Authority
- CN
- China
- Prior art keywords
- heavy industry
- rack body
- pcba plate
- auxiliary fixture
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Provided is a reworking auxiliary tool which is applied to the reworking of a BGA packaging chip. The BGA packaging chip is correspondingly welded on the right-side panel of a PCBA board. The PCBA board further includes a back-side panel. The heavy industry auxiliary tool includes a support main body, a support rod, and a support column, the PCBA board is correspondingly arranged in the support main body, the support rod is connected with the support main body, the support rod is used for supporting the PCBA board, the support column is arranged on the support rod, and the support column is correspondingly contacted with the back-side panel of the PCBA board. The reworking auxiliary tool arranges the PCBA board into the support main body correspondingly and makes the PCBA board connect with the support main body through a fastener, and then takes the BGA packaging chip at a high temperature. Because of the supporting of the support rod, the local deformation of the PCBA board due to heating can be prevented. The reworking auxiliary tool provided can prevent the PCBA board from local heating deformation.
Description
Technical field
The utility model relates to a kind of heavy industry auxiliary fixture, particularly relates to a kind of heavy industry auxiliary fixture that is applied to ultra-large type chip bga.
Background technology
The full name of BGA is the PCB of Ball Grid Array(ball grid array structure), it is a kind of package method that integrated circuit adopts organic support plate.It has: 1. package area reduces the features such as 2. function strengthens, and when number of pins increases the 3. molten weldering of pcb board, energy oneself is placed in the middle, and Yi Shangxi is 5. good electrical property of reliability height 4., and holistic cost is low.Have the general aperture of pcb board of BGA more, under most of client BGA, Via Design is finished hole diameter 8 ~ 12mil, and the distance that surface, BGA place is attached to hole take specification as example as 31.5mil, is generally not less than 10.5mil.Under BGA, via hole needs consent, and BGA pad does not allow curing ink, on BGA pad, does not hole.The I/O terminal of BGA encapsulation is distributed in below encapsulation by array format with circle or column solder joint, has increased although the advantage of BGA technology is I/O number of pins, and pin-pitch does not reduce to have increased on the contrary, thereby has improved assembly yield; Although its power consumption increases, BGA can weld by control collapsed chip method, thereby can improve its electric heating property; Thickness and weight all encapsulation technology than before reduce to some extent; Parasitic parameter reduces, and signal transmission delay is little, and frequency of utilization improves greatly; Assemble available coplanar welding, reliability is high.
But; in the maintain and replace of chip bga; PCBA is in localized heating state; the size of chip bga is larger; heating surface area is larger; the component heat capacity that fin is larger is just higher; uniform temperature is more subject to the impact of assembly material, surrounding enviroment; reach molten tin and need to obtain more heat, localized heating needs to give more heat, and temperature increase is higher; more easily cause distortion; even exceed the specifications of chip, protection plank is only considered in traditional tool design, but does not consider plank local deformation.
In view of this, be necessary to provide a kind of heavy industry auxiliary fixture, this heavy industry auxiliary fixture can solve the problem of the PCBA plate local deformation existing in above-mentioned technology in fact.
Summary of the invention
Therefore, the purpose of this utility model is to provide a kind of heavy industry auxiliary fixture, and this heavy industry auxiliary fixture can solve the problem of above-mentioned PCBA plate local deformation.
To achieve the above object, heavy industry auxiliary fixture of the present utility model, it is applied in chip bga heavy industry, and this chip bga correspondence is welded in the front plate of a PCBA plate, and this PCBA plate also comprises a back panel, and this heavy industry auxiliary fixture comprises:
Rack body, described PCBA plate correspondence is positioned in this rack body;
Support bar, this support bar is connected with described rack body, and this support bar is used for supporting described PCBA plate; And
Support column, this support column is placed on described support bar, corresponding corresponding the contacting of back panel with described PCBA plate of this support column.
Preferably, described rack body is provided with some securing members, and this securing member is connected described rack body with described PCBA plate.
Preferably, described securing member is fastener.
Preferably, described rack body is provided with a preset clearance, and this preset clearance is 0.5MM.
Preferably, described rack body one side is provided with some boss, and when the element on PCBA plate arranges when intensive, this boss is for increasing convection current.
Preferably, the spacing of described adjacent supports bar is 6MM, or the spacing of adjacent described support bar is 8MM.
Preferably, the spacing of described adjacent supports post is greater than or equal to 10MM.
Compared to prior art, heavy industry auxiliary fixture of the present utility model, by a rack body is set, in this rack body, be provided with some support bars, this support bar is provided with some support columns, PCBA plate correspondence is placed in described rack body, and PCBA plate is connected with described rack body with securing member, then, start at high temperature to get the chip of BGA encapsulation, owing to there being support bar to support mutually, can prevent that PCBA plate is because of the local deformation of being heated, this heavy industry auxiliary fixture can prevent the distortion of PCBA plate local heating.
[brief description of the drawings]
Fig. 1 illustrates the three-dimensional structure diagram of the utility model heavy industry auxiliary fixture.
Fig. 2 illustrates the structural representation of the utility model heavy industry auxiliary fixture in the time of chip heavy industry.
[embodiment]
Refer to Fig. 1 and Fig. 2, it is respectively three-dimensional structure diagram and the structural representation of the utility model heavy industry auxiliary fixture in the time of chip heavy industry of the utility model heavy industry auxiliary fixture.
Heavy industry auxiliary fixture of the present utility model, it is applied in chip bga 10 heavy industrys, and these chip bga 10 correspondences are welded in the front plate 11 of a PCBA plate 1, this PCBA plate 1 also comprises a back panel (not shown), in the present embodiment, refer to Fig. 1, this heavy industry auxiliary fixture comprises:
Rack body 2, described PCBA plate 1 correspondence is positioned in this rack body 2;
Support bar 3, this support bar 3 is connected with described rack body 2, and this support bar 3 is for supporting described PCBA plate 1, and in the present embodiment, the spacing of adjacent supports bar 3 is 6MM, or the spacing of adjacent described support bar 3 is 8MM; And
Support column 4, this support column 4 is placed on described support bar 3, corresponding corresponding the contacting of back panel with described PCBA plate 1 of this support column 4, in the present embodiment, the spacing of adjacent supports post 4 is greater than or equal to 10MM.
In the present embodiment, refer to Fig. 1, described rack body 2 is provided with some securing members, and this securing member is connected described rack body 2 with described PCBA plate 1, in the present embodiment, this securing member is fastener 5, and in addition, described rack body 2 is provided with a preset clearance 6, this preset clearance 6 is 0.5MM, and described rack body 2 one sides are provided with some boss 7, when the element on PCBA plate 1 arranges when intensive, this boss 7 will be for increasing convection current.
In the present embodiment, in the time that the chip of BGA encapsulation needs rework, PCBA plate 1 correspondence is placed in described rack body 2, wherein the support bar 3 of the chip below of BGA encapsulation is chiasma type, thereby in ensureing enough support forces, reduce the distribution density of support bar 3, reduce the convection current impact of PCBA plate 1 Base Heat air simultaneously, thereby the efficiency that increase PCBA plate 1 absorbs heat is to reduce the temperature difference of PCBA plate 1, in addition, support column 4 correspondences of support bar 3 surrounding settings are connected with PCBA plate 1, part arch when thereby restriction PCBA plate 1 is heated, then, adjust fastener 5, so that PCBA plate 1 and described fastening being connected of rack body 2, then the pin heating to chip bga 10, after tin cream dissolves, take out chip bga 10, in the process of being heated, because rack body 2 surroundings are provided with preset clearance 6, again, this rack body 2 is connected with some support bars 3, in the time of PCBA plate 1 expanded by heating, can be because not having expansion space to be out of shape, in addition, because the material of rack body 2 is aluminium alloy, therefore heat absorption and rapid heat dissipation, affected by the heating and cooling of thermal process thereby reduced on PCBA plate 1.
Compared to prior art, heavy industry auxiliary fixture of the present utility model can prevent that PCBA plate 1 is because of the local deformation of being heated.
Claims (7)
1. a heavy industry auxiliary fixture, it is applied in chip bga heavy industry, and this chip bga correspondence is welded in the front plate of a PCBA plate, and this PCBA plate also comprises a back panel, it is characterized in that, and this heavy industry auxiliary fixture comprises:
Rack body, described PCBA plate correspondence is positioned in this rack body;
Support bar, this support bar is connected with described rack body, and this support bar is used for supporting described PCBA plate; And
Support column, this support column is placed on described support bar, corresponding corresponding the contacting of back panel with described PCBA plate of this support column.
2. heavy industry auxiliary fixture according to claim 1, is characterized in that, described rack body is provided with some securing members, and this securing member is connected described rack body with described PCBA plate.
3. heavy industry auxiliary fixture according to claim 2, is characterized in that, described securing member is fastener.
4. heavy industry auxiliary fixture according to claim 1, is characterized in that, described rack body is provided with a preset clearance, and this preset clearance is 0.5MM.
5. heavy industry auxiliary fixture according to claim 1, is characterized in that, described rack body one side is provided with some boss, and when the element on PCBA plate arranges when intensive, this boss is for increasing convection current.
6. heavy industry auxiliary fixture according to claim 1, is characterized in that, the spacing of described adjacent supports bar is 6MM, or the spacing of adjacent described support bar is 8MM.
7. heavy industry auxiliary fixture according to claim 1, is characterized in that, the spacing of described adjacent supports post is greater than or equal to 10MM.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420216437.4U CN203839349U (en) | 2014-04-29 | 2014-04-29 | Reworking auxiliary tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420216437.4U CN203839349U (en) | 2014-04-29 | 2014-04-29 | Reworking auxiliary tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203839349U true CN203839349U (en) | 2014-09-17 |
Family
ID=51517155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420216437.4U Expired - Fee Related CN203839349U (en) | 2014-04-29 | 2014-04-29 | Reworking auxiliary tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203839349U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018165816A1 (en) * | 2017-03-13 | 2018-09-20 | 深圳修远电子科技有限公司 | Chip fanning out circuit and method |
-
2014
- 2014-04-29 CN CN201420216437.4U patent/CN203839349U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018165816A1 (en) * | 2017-03-13 | 2018-09-20 | 深圳修远电子科技有限公司 | Chip fanning out circuit and method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102097416B (en) | High-power module with novel packaging structure | |
| CN103997878B (en) | Phase change heat dissipation device and manufacturing method thereof | |
| US20180331021A1 (en) | Die package component with jumper structure and manufacturing method thereof | |
| CN106298713A (en) | The pin that a kind of power model connected vertically and stacking thereof connect | |
| CN203839349U (en) | Reworking auxiliary tool | |
| CN204157160U (en) | The radiator structure of pcb board | |
| CN106982544A (en) | A kind of radiator structure of high power density Switching Power Supply | |
| CN204834594U (en) | Power semiconductor | |
| CN203761733U (en) | Novel micro heat pipe heat dissipation module of airborne electronic device | |
| CN203523173U (en) | Communication module supporting OpenVPX standard and electronic device using communication module | |
| CN202110956U (en) | Glue pouring heat conducting and fixing device for cylindrical electrolytic capacitor | |
| CN204088624U (en) | Binding post and connecting terminal components | |
| US20140360750A1 (en) | Busbar | |
| CN203233636U (en) | Novel power radiating fin structure, and connection structure of MOS Transistor and PCB | |
| CN207255422U (en) | A kind of welding fixture | |
| CN204968336U (en) | Saddle heat radiation structure | |
| CN106975897A (en) | A kind of liquid cooling heat radiator and its processing and assembly method | |
| CN203288373U (en) | High-power chip resistor | |
| CN201985082U (en) | Tinning device for chips | |
| CN204167284U (en) | There is the thermistor that lies low of foot rest | |
| CN107671478B (en) | Die structure convenient for assembling electrode | |
| CN220798671U (en) | Tool for low-temperature-resistant device in hot air reflow soldering process | |
| CN203708192U (en) | Photovoltaic junction box | |
| CN211429917U (en) | SMT paster packaging hardware | |
| CN203853728U (en) | Positioning tool for welding conductive posts onto aluminum-substrate printed circuit boards |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140917 Termination date: 20160429 |