CN103137274A - High-power chip resistor - Google Patents
High-power chip resistor Download PDFInfo
- Publication number
- CN103137274A CN103137274A CN2013100691043A CN201310069104A CN103137274A CN 103137274 A CN103137274 A CN 103137274A CN 2013100691043 A CN2013100691043 A CN 2013100691043A CN 201310069104 A CN201310069104 A CN 201310069104A CN 103137274 A CN103137274 A CN 103137274A
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- power chip
- resistor
- end cap
- resistance
- pcb
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Abstract
The invention discloses a high-power chip resistor which comprises a resistor body and also comprises end caps and a bracket, wherein the end caps are arranged at two ends of the resistor body and are connected with outgoing ends of the resistor body, the bracket is fixed at the bottoms of the end caps. According to the high-power chip resistor, the end caps are connected with the outgoing ends of the resistor body and are supported by the bracket and are connected with a PCB (Printed Circuit Board) through the bracket, thus the lead connection of the conventional resistor is avoided, the welding efficiency of the chip resistor is increased, and the working hour is saved; and meanwhile, after the resistor floats, the heat radiating space is enlarged, a good heat radiating property is achieved, heat can not be transmitted to the PCB to ensure that the PCB is easily demonstrated by safety requirements, and the space of the PCB is saved. In addition, after the resistor floats, a reflow soldering process can be used, and is stable in welding, and thus the yield of products is increased.
Description
Technical field
The present invention relates to a kind of high-power Chip-R, belong to the resistive technologies field.
Background technology
Resistance is widely used in electric equipment as a kind of important electronic component.Present resistance great majority comprise resistive element and lead-in wire, and the exit that lead-in wire is connected to resistive element consists of resistance.This resistance can be satisfied the demand to a certain extent, but its shortcoming is: during resistance welded, need manual pegging graft, expend time in, and when floating high request is arranged, be difficult to realize automation; When resistance was close to pcb board, pcb board easily heated up, and was difficult for testing by safety; Resistance welded needs wave soldering, welds unstablely, and the product fraction defective is high.
Summary of the invention
The deficiency that the present invention exists in order to overcome prior art provides a kind of simple in structure, high-power Chip-R that thermal diffusivity is good.
The present invention can be achieved by taking following technical scheme: a kind of high-power Chip-R, comprise the resistance body, this high-power Chip-R also comprises end cap and support, described end cap is arranged on the two ends of resistance body and is connected with the exit of resistance body, and described support is fixed on the bottom of end cap.
On the basis of the above, end cap of the present invention is the open circles tubbiness, and the two ends of described resistance body embed in end cap respectively.
Support of the present invention is L-shaped, and along vertically being symmetric of resistance body, but make the resistance firm welded on pcb board.
The foot of support of the present invention has groove, facilitates resistance and PCB welding.
Support height of the present invention is 0～20mm, after the floating height of resistance, and good heat dissipation effect, and the heat that resistance produces can not be delivered to pcb board, determines that pcb board can be by safety check.
Through hole is offered at the middle part of support of the present invention, is conducive to the resistance heat radiation.
Of the present invention top of the trellis has deep-slotted chip breaker, and described end cap is arranged on deep-slotted chip breaker, facilitates end cap to be fixed on support.
The radius of deep-slotted chip breaker of the present invention equates with the radius of end cap.
Compared with prior art, the invention has the beneficial effects as follows: high-power Chip-R of the present invention is connected with the exit of resistance body by end cap and by stent support, be connected with pcb board by support, avoided the lead-in wire of traditional resistor to connect, improve the welding efficiency of Chip-R, saved man-hour; Simultaneously, after the floating height of resistance, heat-dissipating space strengthens, and has good heat dispersion, and heat can not be delivered on pcb board, and pcb board is easily proved by security regulations, and saves the space of pcb board; In addition, can use reflow soldering process after the floating height of resistance, welding is stable, has improved the yields of product.
Description of drawings
Fig. 1 is the overall structure schematic diagram of high-power Chip-R of the present invention.
Embodiment
Below in conjunction with accompanying drawing, preferred forms of the present invention is described in detail.
as shown in Figure 1, high-power Chip-R of the present invention comprises resistance body 1, left end cap 2, right-hand member cap 3, left socle 4 and right support 5, left end cap 2 is arranged on the left end of resistance body 1 and is connected with the exit at left end place, right-hand member cap 3 is arranged on the right-hand member of resistance body 1 and is connected with the exit at right-hand member place, left socle 4 is fixed on the bottom of left end cap 2, right support 5 is fixed on the bottom of right-hand member cap 3, by left end cap 2, right-hand member cap 3 is connected with the exit of resistance body 1 and by left socle 4, right support 5 supports, are connected with right support by left socle 4 and are connected with pcb board, avoided the lead-in wire of traditional resistor to connect, improved the welding efficiency of Chip-R, save man-hour, wherein, left end cap 2 and right-hand member cap 3 all are the open circles tubbiness, the two ends of resistance body 1 embed respectively in left end cap 2 and right-hand member cap 3, described left socle 4 and right support 5 be L-shaped and vertically being symmetric along resistance body 1 all, its top has the deep-slotted chip breaker 6,7 that radius equates with the radius of end cap, left end cap 2 and right-hand member cap 3 are separately fixed in deep-slotted chip breaker 6,7, and the foot of left socle 4 and right support 5 has groove 8,9, facilitates the welding between resistance and pcb board.
The height of left socle 4 of the present invention and right support 5 is 0～20mm, after the floating height of resistance, and good heat dissipation effect, and the heat that resistance produces can not be delivered to pcb board, determines that pcb board can be by safety check; Through hole 10,11 is offered at the middle part of described left socle 4 and right support 5, is conducive to the resistance heat radiation.
The above person of thought, only for the present invention's preferred embodiment, certainly can not limit with this scope of the invention process, the content of namely generally putting down in writing according to claim of the present invention and description of the invention has been done simple equivalence and has been changed and modify, within all still belonging to claim of the present invention institute covering scope.In addition, summary part and title are only the use of auxiliary patent document search, are not the interest field that limits the present invention.
Claims (9)
1. a high-power Chip-R, comprise the resistance body, characterized by further comprising end cap and support, and described end cap is arranged on the two ends of resistance body and is connected with the exit of resistance body, and described support is fixed on the bottom of end cap.
2. high-power Chip-R according to claim 1, is characterized in that described end cap is the open circles tubbiness, and the two ends of described resistance body embed in end cap respectively.
3. high-power Chip-R according to claim 1, is characterized in that described support is L-shaped.
4. high-power Chip-R according to claim 1, is characterized in that described support vertically being symmetric along the resistance body.
5. high-power Chip-R according to claim 1, is characterized in that the foot of described support has groove.
6. high-power Chip-R according to claim 1, is characterized in that described support height is 0～20mm.
7. high-power Chip-R according to claim 1, is characterized in that through hole is offered at the middle part of described support.
8. the described high-power Chip-R of any one according to claim 1 to 7, is characterized in that described top of the trellis has deep-slotted chip breaker, and described end cap is arranged on deep-slotted chip breaker.
9. high-power Chip-R according to claim 8, is characterized in that the radius of described deep-slotted chip breaker equates with the radius of end cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100691043A CN103137274A (en) | 2013-03-05 | 2013-03-05 | High-power chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100691043A CN103137274A (en) | 2013-03-05 | 2013-03-05 | High-power chip resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103137274A true CN103137274A (en) | 2013-06-05 |
Family
ID=48496965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013100691043A Pending CN103137274A (en) | 2013-03-05 | 2013-03-05 | High-power chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103137274A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106128665A (en) * | 2016-09-05 | 2016-11-16 | 东莞市晴远电子有限公司 | A kind of wire resistor and manufacturing process thereof |
| CN108257748A (en) * | 2018-02-06 | 2018-07-06 | 东莞市晴远电子有限公司 | A kind of novel patch resistance |
| CN108711477A (en) * | 2018-05-24 | 2018-10-26 | 苏州惠琪特电子科技有限公司 | A kind of structure of high power precise chip resistor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2901145Y (en) * | 2006-01-12 | 2007-05-16 | 美的集团有限公司 | Mounting bracket for high-power semiconductor component of frequency converter |
| CN201315205Y (en) * | 2008-11-26 | 2009-09-23 | 永济新时速电机电器有限责任公司 | Open precharge high-power resistor |
| CN202217559U (en) * | 2011-09-28 | 2012-05-09 | 上海拓及轨道交通设备有限公司 | High-power ceramic resistor used in DC switch cabinet |
| CN203288373U (en) * | 2013-03-05 | 2013-11-13 | 东莞市晴远电子有限公司 | High-power chip resistor |
-
2013
- 2013-03-05 CN CN2013100691043A patent/CN103137274A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2901145Y (en) * | 2006-01-12 | 2007-05-16 | 美的集团有限公司 | Mounting bracket for high-power semiconductor component of frequency converter |
| CN201315205Y (en) * | 2008-11-26 | 2009-09-23 | 永济新时速电机电器有限责任公司 | Open precharge high-power resistor |
| CN202217559U (en) * | 2011-09-28 | 2012-05-09 | 上海拓及轨道交通设备有限公司 | High-power ceramic resistor used in DC switch cabinet |
| CN203288373U (en) * | 2013-03-05 | 2013-11-13 | 东莞市晴远电子有限公司 | High-power chip resistor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106128665A (en) * | 2016-09-05 | 2016-11-16 | 东莞市晴远电子有限公司 | A kind of wire resistor and manufacturing process thereof |
| CN108257748A (en) * | 2018-02-06 | 2018-07-06 | 东莞市晴远电子有限公司 | A kind of novel patch resistance |
| CN108711477A (en) * | 2018-05-24 | 2018-10-26 | 苏州惠琪特电子科技有限公司 | A kind of structure of high power precise chip resistor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130605 |