CN203721405U - Power thick film resistor - Google Patents
Power thick film resistor Download PDFInfo
- Publication number
- CN203721405U CN203721405U CN201320791358.1U CN201320791358U CN203721405U CN 203721405 U CN203721405 U CN 203721405U CN 201320791358 U CN201320791358 U CN 201320791358U CN 203721405 U CN203721405 U CN 203721405U
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- CN
- China
- Prior art keywords
- heat
- resistor
- substrate
- back electrode
- film resistor
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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Abstract
The utility model discloses a power thick film resistor. An inner electrode and a resistor are printed on one surface of the power thick film resistor, and a resistor substrate of a back electrode is printed on the other surface of the power thick film resistor; a heat-conducting plate is arranged on the surface of the back electrode on the resistor substrate in a matched mode; the heat-conducting plate is a ceramic substrate with the inner surface and the outer surface fixedly coated with an inner heat-conducting piece and an outer heat-conducting piece respectively and fixedly; a nickel layer is plated on the surface of the inner heat-conducting piece; the nickel layer and the back electrode on the resistor substrate are fixedly welded in a matched mode in a face-to-face mode. The ceramic substrate with the inner and outer surfaces of which the heat-conducting pieces are welded is welded on the surface of the back electrode on the resistor substrate to serve as a heat-conducting plate, and the heat-conducting pieces on the two surfaces are heated to deform so as to offset, so that the thermal expansion coefficients of the heat-conducting plate and the resistor substrate are basically consistent with each other, and the problem that the resistor substrate is cracked due to inconsistent thermal expansion coefficients when the conventional resistor is in large-size use is solved. Moreover, the resistor power can be higher under the same volume, and the resistor is stable in performance and cannot deform due to heat.
Description
Technical field
The utility model relates to electronic devices and components field, particularly a kind of power thick-film resistor.
Background technology
Power thick-film resistor mainly uses on some specific environments, particular device, in order to improve power, need to be arranged on radiator in use, heat resistance being produced by radiator distributes rapidly, therefore, the speed of resistor heat radiation has determined the size of resistor power.The heat of resistor is passed on radiator fast, reduce resistance temperature rise, can improve resistance and use power and life-span.Existing power thick-film resistor mainly contains following two kinds of structures:
1. traditional thick-film resistor is directly directly installed on porcelain substrate on radiator by heat-conducting silicone grease, because the conductive coefficient of porcelain substrate is 20w/mk, its horizontal heat-transfer rate is slower, and resistance substrate temperature can not pass on radiator quickly and evenly, easily causes substrate cracking when high-power use.
Improved thick-film resistor be on porcelain substrate soldering copper base plate as heating panel, then by heat-conducting silicone grease, be arranged on radiator, because of the conductive coefficient of copper high, be about 400w/mk, its horizontal heat-transfer rate is fast, substrate temperature can pass on radiator by copper soleplate quickly and evenly, and the temperature rise of resistance is declined, thereby has improved the power of resistance.But different because of the thermal coefficient of expansion of porcelain substrate and copper soleplate, when resistance size is larger, conducting strip is heated and understands outside stretcher strain, causes even cracking of porcelain curved substrate distortion, so on the resistor that this structure is only applicable to below power 200W, size is less.
Utility model content
The purpose of this utility model is to provide that a kind of volume is little, power large and the power thick-film resistor of stable performance, solves existing power thick-film resistor heat radiation slow, and volume is large, the problem of unstable properties.
The purpose of this utility model is achieved by the following technical programs, power thick-film resistor, comprise electrode and resistance in one side printing, the resistance substrate of another side printing back electrode, it is characterized in that, the surface engagement of described resistance substrate back electrode arranges a heat-conducting plate, and described heat-conducting plate comprises a porcelain substrate, the inside and outside surface of porcelain substrate fixedly covers respectively interior conducting strip and outer conducting strip, and described interior conducting strip coordinates and is welded and fixed face-to-face with the surface of described resistance substrate back electrode.
Further, the surface of described interior conducting strip is coated with nickel dam, and this nickel dam coordinates and is welded and fixed face-to-face with the back electrode on resistance substrate.
Further, described interior conducting strip and outer conducting strip are copper sheet; Described resistance substrate is alumina plate or nitrogenize aluminium sheet, and described porcelain substrate is alumina plate or nitrogenize aluminium sheet.
Further, the surface of described resistance is also printed with glaze protective layer.
Beneficial effect: in innovative point of the present utility model is to adopt, the porcelain substrate of the two-sided welding conducting strip of outer surface replaces existing individual layer copper soleplate as heat-conducting plate, be welded on the surface of resistance substrate back electrode, interior conducting strip surface is coated with nickel dam, laminating effect with raising with back electrode, because heat-conducting plate is the two-sided welding conducting strip at porcelain substrate, two-sided conducting strip temperature distortion meeting is cancelled each other, make the thermal coefficient of expansion of heat-conducting plate and the thermal coefficient of expansion of resistance substrate basically identical, overcome existing copper base plate and resistance substrate thermal coefficient of expansion is inconsistent, when being used, large scale causes the problem of resistance substrate cracking because thermal coefficient of expansion is inconsistent.It is larger that the utility model can accomplish resistor power under same volume, and stable performance, can temperature distortion, really realize small size, powerful thick-film resistor.
Accompanying drawing explanation
Fig. 1 is the STRUCTURE DECOMPOSITION schematic diagram of the utility model embodiment 1;
Fig. 2 is the STRUCTURE DECOMPOSITION schematic diagram of the utility model embodiment 2.
Embodiment
Embodiment 1
As shown in Figure 1, product adopts alumina plate or nitrogenize aluminium sheet as resistance substrate 6, adopt thick film silk-screen printing technique, electrode 5 and resistance 4 in the upper surface silk screen printing of resistance substrate 6, the surface printing of resistance 4 has glaze protective layer 3, the lower surface of resistance substrate 6 is printed back electrode 7, interior electrode 52 is drawn and is connected to external cabling post 1 by going between, the surface soldered of resistance substrate back electrode 7 is fixed a heat-conducting plate, heat-conducting plate comprises a porcelain substrate 10(alumina plate or nitrogenize aluminium sheet), in porcelain substrate 10, outer surface welds respectively interior conducting strip 9 and outer conducting strip 11, the surface of interior conducting strip 9 is coated with nickel dam 8, back electrode 7 and nickel dam 8 coordinate and are welded and fixed face-to-face, interior conducting strip 9 and outer conducting strip 11 are selected copper sheet, the surface of outer conducting strip 11 is coated with nickel dam 12 to prevent outer conducting strip 11 oxidations.When this resistor is arranged on and uses on radiator, the outer conducting strip of heat-conducting plate directly contacts with radiator, because heat-conducting plate adopts double-sided copper-clad, heat conduction is fast, thermal diffusivity is good, and the thermal coefficient of expansion of double-sided copper-clad heat-conducting plate and resistance substrate basically identical, the phenomenon of having stopped resistance substrate cracking occurs.
Embodiment 2
As shown in Figure 2, comprise the entire infrastructure of embodiment 1, in order further to improve heat conduction velocity, between the nickel dam 8 of resistance substrate back electrode 7 and heat-conducting plate, add one deck conducting strip 13, conducting strip 13 is selected copper sheet.
The above, be only preferred embodiment of the present utility model, not the utility model done to any pro forma restriction; Any those of ordinary skill in the art, do not departing from technical solutions of the utility model scope situation, all can utilize method and the technology contents of above-mentioned announcement to make many possible changes and modification to technical solutions of the utility model, or be revised as the equivalent embodiment of equivalent variations.Therefore; every content that does not depart from technical solutions of the utility model; according to technical spirit of the present utility model to any simple modification made for any of the above embodiments, be equal to replacements, equivalence changes and modify, all still belong in the scope that technical solutions of the utility model protect.
Claims (5)
1. power thick-film resistor, comprise electrode and resistance in one side printing, the resistance substrate of another side printing back electrode, it is characterized in that, the surface engagement of described resistance substrate back electrode arranges a heat-conducting plate, described heat-conducting plate comprises a porcelain substrate, and the inside and outside surface of porcelain substrate fixedly covers respectively interior conducting strip and outer conducting strip, and described interior conducting strip coordinates and is welded and fixed face-to-face with the surface of described resistance substrate back electrode.
2. power thick-film resistor according to claim 1, is characterized in that, the surface of described interior conducting strip is coated with nickel dam, and this nickel dam coordinates and is welded and fixed face-to-face with the back electrode on resistance substrate.
3. power thick-film resistor according to claim 1 and 2, is characterized in that, described interior conducting strip and outer conducting strip are copper sheet.
4. power thick-film resistor according to claim 1 and 2, is characterized in that, described resistance substrate is alumina plate or nitrogenize aluminium sheet, and described porcelain substrate is alumina plate or nitrogenize aluminium sheet.
5. power thick-film resistor according to claim 1 and 2, is characterized in that, the surface of described resistance is also printed with glaze protective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320791358.1U CN203721405U (en) | 2013-12-05 | 2013-12-05 | Power thick film resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320791358.1U CN203721405U (en) | 2013-12-05 | 2013-12-05 | Power thick film resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203721405U true CN203721405U (en) | 2014-07-16 |
Family
ID=51160543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320791358.1U Withdrawn - After Issue CN203721405U (en) | 2013-12-05 | 2013-12-05 | Power thick film resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203721405U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103632779A (en) * | 2013-12-05 | 2014-03-12 | 蚌埠市德瑞特电阻技术有限公司 | Power thick-film resistor |
-
2013
- 2013-12-05 CN CN201320791358.1U patent/CN203721405U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103632779A (en) * | 2013-12-05 | 2014-03-12 | 蚌埠市德瑞特电阻技术有限公司 | Power thick-film resistor |
| CN103632779B (en) * | 2013-12-05 | 2016-04-06 | 蚌埠市德瑞特电阻技术有限公司 | Power thick-film resistor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140716 Effective date of abandoning: 20160406 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |