CN203671287U - 包括柔性印刷电路板的灯 - Google Patents

包括柔性印刷电路板的灯 Download PDF

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CN203671287U
CN203671287U CN201320321844.7U CN201320321844U CN203671287U CN 203671287 U CN203671287 U CN 203671287U CN 201320321844 U CN201320321844 U CN 201320321844U CN 203671287 U CN203671287 U CN 203671287U
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lamp
radiator
print circuit
flexible print
lamp according
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V·吉伦
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Signify Holding BV
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • F21V23/009Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing the casing being inside the housing of the lighting device
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/02Globes; Bowls; Cover glasses characterised by the shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • F21V3/0615Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass the material diffusing light, e.g. translucent glass
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/062Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
    • F21V3/0625Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics the material diffusing light, e.g. translucent plastics
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]

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  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

本实用新型涉及一种包括柔性印刷电路板的灯,包括至少两个固态光源(9);包封,包括适于透射来自所述固态光源的光的光可透射表面(3);散热器(4),从所述包封的内部向所述包封的外表面延伸从而将所述包封分成至少两个隔室(16);以及安装有固态光源的柔性印刷电路(7)。所述柔性印刷电路附接于所述散热器,从而所述固态光源在两个隔室内分布。由于装配的组件的数量得以减少,并且焊接(例如布线到电路板)的需求也得以减少,本实用新型的优势在于有助于灯的制造特别是有助于灯的组装。

Description

包括柔性印刷电路板的灯
技术领域
本实用新型涉及包括固态光源的灯,例如改装的发光二极管(LED)灯,并且特别地涉及叉指式(interdigitated)类型的LED灯。
背景技术
传统的白炽灯泡类型的灯目前正被更低能耗的可选品所替代,例如LED灯。有关改装LED灯的设计的重要问题在于获取如同白炽灯泡光线分布那样的全向光线分布,并且为LED和驱动电子器件产生的热量提供足够的散热。
WO2010/058325示出了一种具有安装在灯座上的灯泡的灯泡型LED灯。在灯泡内,数个LED安装在连接到冷却装置的印刷电路板(PCB)上。冷却装置从灯泡内部延伸到灯泡的外表面,其中灯泡的外表面由光可透射表面子区域和冷却装置两者形成。子区域和冷却装置优选布置成叉指式(交替的)配置。冷却装置和光可透射表面形成灯泡外表面,从而改善LED的散热和全向光线分布。然而,由于驱动电子器件和PCB之间相互定向所导致的更为复杂的互连,这种灯泡为制造带来了新的挑战。
实用新型内容
本实用新型的目标是提供一种具有改善的光线分布和散热能力的灯。本实用新型的目标还在于提供一种有助于灯的制造的灯设计。
通过独立权利要求中所限定的灯来达成这些和其他目标。优选实施例在从属权利要求中限定。
根据本实用新型,该灯包括:至少两个固态光源;包封,包括适于透射来自固态光源的光的光可透射表面;和散热器(或冷却装置),从包封内部延伸到包封的外表面,从而将包封分成至少两个隔室。所述灯进一步包括安装有固态光源的柔性印刷电路(FPC)。FPC附接到散热器从而固态光源分布于(两个)隔室中。
利用本实用新型,(固态光源和驱动电子器件之间的)互连结构较不复杂,这有助于制造并且为驱动电子器件提供更多空间。
由于FPC的柔性,进一步地有助于该灯的制造(并且降低了制造成本),这是因为降低了碾磨散热器的安装有FPC的表面的需要。在现有技术中,散热器的表面需要非常高的平坦度公差(flatnesstolerance),并且因此必须将该表面碾磨到一定的平坦度来避免安装到该表面的PCB(通常包括陶瓷板)出现裂纹。陶瓷PCB硬且易碎,并且因此如果使用集中应力(例如由螺钉施加)按压在不平坦的表面上,则可能出现裂纹。
本实用新型进一步的优势在于改善了光线分布,因为(在散热器处的)隔室壁处的固态光源和该包封的光可透射表面的布置提供了更为全向的空间光线分布。在常规的LED灯中,期望的全向光线分布被安装有LED的基板(下壁)所阻碍。
进一步的,与常规LED灯相比,本实用新型的优势在于改善了灯的散热能力。散热器到包封的外表面的延伸增加了散热器暴露在环境气氛的表面。另外,FPC的柔性允许它更好地贴合散热器的形状,由此可以具有增加的面积,因为它可以覆盖散热器的不平坦表面。FPC的增加的面积提供了从FPC到散热器的增加的传热表面,这进一步改善了从固态光源的散热。进一步地,FPC的增加的传热表面使得FPC和散热器之间的界面更不关键,从而降低了FPC和散热器之间的热界面材料(TIM)的需要,从而减低制造成本。
本实用新型的进一步优势在于具有固态光源的电路、并且优选为用于将固态光源与驱动电子器件互联的布线,可被集成到具有FPC的一个组装件上。构造FPC的形状并且适配该FPC于灯的内部结构,使得FPC的包括至少一个固态光源的一部分可被附接到隔室中的一个隔室内的散热器,而FPC的包括至少一个固态光源的另一部分可被附接到另一个隔室内的散热器。该FPC的互连这两部分的部分例如可弯过分隔隔室的散热器的壁或部分。由于组装的部件数目减少,并且焊接(例如布线到电路板)的需求减少,因此有助于灯的制造特别是组装。焊接连接的数目减少也减少了焊接缺陷的风险。
本实用新型的进一步优势在于FPC比常规印刷电路类型(例如FP4或IMS)更薄,从而允许固态光源放置地更远离光可透射表面,这有助于在使用不同颜色的固态光源时颜色的混合,并且使得角度内的发光强度更均匀,因为光可透射表面被更加均匀地辐射。
根据本实用新型的实施例,FPC可为单片的FPC,其优势在于灯内的组装件(或部件)的数量减少了。利用本实施例,具有固态光源的电路,并且优选为将固态光源连接到驱动电子器件的布线被集成到单个的FPC中。由于单个的FPC减少了固态光源和驱动电子器件之间的焊接连接的需求,进一步减少了焊接连接的数目。根据可替换的实施例,FPC可以包括两块或更多的FPC。
根据本实用新型的实施例,FPC可包括从FPC的中间部分延伸的管脚部分(或延伸),并且每个管脚部分可被布置在隔室中的一个隔室内。如果灯包括三个隔室,那么FPC可例如包括三个管脚部分,这样每个管脚布置在每一个隔室内。FPC的柔性允许管脚部分向下弯入不同的隔室。中间部分可以形成来自每个管脚的固态光源的布线可汇聚的、管脚部分的联结。本实施例为将FPC装配入不同的隔室内并且使得其能够被单片制造,提供了FPC的便利设计。
根据本实用新型的实施例,FPC包括适于连接到灯的驱动电子器件的互连管脚部分(或互连延伸)。互连管脚部分可形成FPC的一部分(即作为FPC的一部分),并且包括连接固态光源的布线。互连管脚部分的端部可包括可焊接(或以另一方式连接)到驱动电子器件的互连点。本实施例的优势在于其减少了对单独布线的需要,从而减少了将固态光源连接到驱动电子器件的焊接连接的数目。
根据本实用新型的实施例,FPC可覆盖包封内的散热器表面(或散热器隔室壁)的主要部分,例如至少50%、优选地至少80%、甚至更为优选地至少90%,从而增加FPC的传热表面,并且因此增加FPC和散热器之间的传热界面。这样,灯的散热能力得以改善,并且FPC和散热器之间对TIM的需求也进一步降低。
根据本实用新型的实施例,光可透射表面被散热器分成子区域。每个子区域与隔室中的一个隔室相关联。利用本实施例,可以例如经由子区域和相关联的固态光源的子组的定位的设置来调谐灯的光线分布。进一步地,子区域和散热器可被布置成叉指式(或交替式)配置,其优势在于散热器在包封外部表面上展开(优选为连续地),从而进一步提高散热能力。由于其有助于将光可透射表面安装到散热器,叉指式配置还有助于制造。另外,子区域可形成整体式光可透射表面,从而减少的灯部件的数量,这有助于灯的组装。
根据本实用新型的实施例,散热器可包括向灯的纵轴延伸的凹槽(即向内地朝向灯的中部)。将理解的是,灯的纵轴(或光学轴)穿过灯的灯座(或基座或下部)的中心端和包封的中心末端延伸。本实施例的优势在于散热器的外表面面积得以增加,这改善了从散热器的散热。可替换的,散热器可为实心的即没有凹槽,这有助于散热器的制造(机械加工和铸造)。
根据本实用新型的实施例,FPC可包括反射性阻焊剂,其优势在于随着反射性阻焊剂然后将来自固态光源的光反射出灯外,它增加了从灯的光输出。利用本实施例,减少了单独的反射器部件的需求,这降低了灯的成本和复杂性。
根据本实用新型的实施例,FPC可通过粘合剂附接于散热器。例如,粘合剂层可涂覆在FPC和/或散热器上用来将FPC附接到散热器。本实施例的优势在于其降低了用于将FPC附接到散热器的螺钉的需要,从而有助于组装。
值得注意的是,本实用新型涉及权利要求书记载的特征的所有可能组合。在研究下面的详细公开内容时,本实用新型进一步的目标、特征和优势将会更为明显。本领域技术人员意识到本实用新型的不同特征可组合以创造出与下述描述的实施例不同的实施例。
附图说明
现在将参考示出本实用新型实施例的附图,更加详细地描述本实用新型的上述和其他方面。
图1示出了根据本实用新型的实施例的灯。
图2示出了图1所示的灯的散热器和FPC。
图3示出了图2的平面、未折叠状态的FPC。
图4示出了根据本实用新型的实施例的具有反射器的灯。
所有图均为示意性,并不必定按比例,并且为了阐述发明一般仅示出必需的部分,其中其他部件可能省略或者仅仅暗示。
具体实施方式
参考图1-4描述根据本实用新型的实施例的灯1。首先参考图1,灯1包括灯泡2,其中布置LED9(图1未示出,但图2和3中示出)或其他类型的固态光源,并且灯座6适于安装灯配件。灯座6安装到灯泡2从而灯1的纵轴10(或光学轴)穿过灯座6的中心端和灯泡2的中心末端延伸。灯1进一步包括光可透射(或透光)表面3,其形成灯泡2的一部分,并且适于透射来自LED9的光。光可透射表面3可由例如玻璃(或任意其他陶瓷)或塑料的透明或半透明材料制成,并且可以优选为漫射的(磨砂的)以便减少LED9的眩光风险并且改善混色(如果使用不同颜色的LED)、光的均匀度和光的角分布(IoA)。在所描述的实施例中,包封为灯泡形状并因此也称为灯泡。然而,本实用新型并没有限制为灯泡形状的包封,每个具有所需功能的包封均落入本实用新型范围之内。
为了冷却LED9和驱动电子器件(未示出),灯1包括从灯泡2的内部延伸到灯泡2的外表面的散热器4,从而将灯泡2分成数个隔室16(如图2所示)。相应地,隔室16所限定空间的壁由散热器4的表面和光可透射表面3形成。散热器4,特别是散热器4壁的外边缘,将光可透射表面3分成子区域17,子区域17优选可为整体并且形成单片材料。子区域17可从光可透射表面3的中间部分(位于灯泡2的顶部的中间部分)延伸。如图1所示,子区域17和散热器4可布置成为叉指式(或叉式)配置,其中子区域17和散热器4(或散热器4的外边缘)交替布置。散热器4和光可透射表面3一同形成灯泡2的外表面。
为了增加散热器4的暴露于环境气氛的散热面积,散热器4可包括向灯1的纵轴10延伸的凹槽8,该凹槽的纵向方向基本上与纵轴10平行。因此,凹槽8可形成具有灯泡2(的外表面)中的凹陷形状的槽。
灯1可进一步包括底部散热器5,其优选可由如同灯泡2的散热器4的同一片材料形成,从而减少灯1的部件数量,并且增加从灯泡到底部散热器5的热传递。可替换的,底部散热器5和灯泡2的散热器4可做成分离的部件。散热器4和底部散热器5优选由热导率为70-200W/mK的金属(例如镁或铝)或其他具有至少20W/mK的热导率的材料制成。
灯1特别是关于散热器4(或冷却装置)、光可透射表面3、灯泡2和灯座6的设计可根据WO2010/058325的公开内容、特别是根据WO2010/058325的图2A-3B和说明书的相应部分来制作,其公开通过引用并入本文。
现参见图2和3,灯1进一步包括附接有LED9(例如,通过焊接)的FPC(柔性印刷电路)。在图2中,FPC7应用于灯1的散热器4,而在图3中,示出FPC7为平面、未折叠并且未应用的状态,或者换句话说,为展开状态。FPC7包括在其处应用电气组件的、包括例如PET(聚对苯二甲酸乙二醇酯)、PEN(聚萘二甲酸乙二醇酯)或PI(聚酰亚胺)的柔性基底,该电气组件包括如图2所示的布线14(或铜迹线)和LED9。布线14适于将LED9连接到驱动电子器件。优选地,FPC包括厚度约为35-100μm、优选约为70μm的铜涂层18(如图3所示)以便增强FPC的散热。为了增加从LED9射出灯1的光的反射,FPC可包括反射性(例如白色)阻焊剂。
FPC7可优选地由包括管脚部分12和从FPC7的中间部分11(或联结部分)延伸的互连管脚部分13的单片形成。LED9安装在管脚部分12并且布线14从LED9经由中间部分11延伸到互连管脚部分13。在互连管脚部分13的端部,布置有用于将FPC7连接到驱动电子器件的互连点或垫15。
FPC优选地通过粘合剂附接于散热器4,从而每个管脚部分12布置在隔室16之一内。因此,每个管脚部分12弯过散热器4的上边缘,并且互连管脚部分13向下弯折进入散热器4的隔室内部(中部)中,该隔室内布置有驱动电子器件。FPC7可覆盖灯泡2内的散热器表面的主要部分例如至少80%,并且优选地,每个管脚部分12可具有与它所附接的(如图2所示)对应的散热器隔室壁(或表面)大约相同的尺寸(面积)以便提供最大可能的传热表面。
根据实施例,灯1可包括至少一个(单独的)布置在至少一个隔室内的反射器20,优选地使得该反射器覆盖FPC7(带有用于固态光源9的开口),如图4所示。因此,FPC7可布置在散热器4和反射器20之间。本实施例的优势在于FPC7比常规的PCB类型(例如FR4或IMS)薄,并且因此在反射器和散热器之间所需的空间更少。进一步地,现有技术中使用常规PCB,焊接到PCB的布线吸收光线并且因此必须由反射器覆盖,这从而向光学室内凸出。凸出的反射器的劣势在于其更加直接地由固态光源照射(由于其临近固态光源)。然而,所期望的是仅从漫射的光可透射表面散射回的光才应当被反射器反射。利用本实施例,则这种反射器内的凸出并非必需,因为FPC7比常规的PCB的解决方案更薄和更平。因此,减少了对反射器20的直接照射,这样的优势在于降低了反射损耗。
本领域技术人员意识到本实用新型绝不被上述的优选实施例所限制。相反,在所附的权利要求书的范围内可能有许多修改和变化。

Claims (10)

1.一种灯,其特征在于,包括: 
至少两个固态光源(9); 
包封(2),包括适于透射来自所述固态光源的光的光可透射表面(3); 
散热器(4),从所述包封的内部向所述包封的外表面延伸从而将所述包封分成至少两个隔室(16);以及 
安装有所述固态光源的柔性印刷电路(7); 
其中所述柔性印刷电路附接于所述散热器,从而所述固态光源在所述隔室内分布。 
2.根据权利要求1所述的灯,其特征在于,所述柔性印刷电路为单片柔性印刷电路。 
3.根据权利要求1所述的灯,其特征在于,所述柔性印刷电路包括从所述柔性印刷电路的中间部分(11)延伸的管脚部分(12),并且其中每个管脚部分布置在所述隔室中的一个隔室内。 
4.根据权利要求1所述的灯,其特征在于,所述柔性印刷电路包括适于连接到所述灯的驱动电子器件的互连管脚部分(13)。 
5.根据权利要求1所述的灯,其特征在于,所述柔性印刷电路覆盖所述包封内的所述散热器表面的大部分。 
6.根据权利要求1所述的灯,其特征在于,所述光可透射表面由所述散热器分成子区域(17)。 
7.根据权利要求6所述的灯,其特征在于,所述子区域和所述散热器布置为叉指式配置。 
8.根据权利要求1所述的灯,其特征在于,所述散热器包括向所述灯的纵轴(10)延伸的凹槽(8)。 
9.根据权利要求1所述的灯,其特征在于,所述柔性印刷电路包括反射性阻焊剂以便增加从所述光源射出所述灯的反射。 
10.根据权利要求1所述的灯,其特征在于,所述柔性印刷电路 通过粘合剂附接于所述散热器。 
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