CN203631599U - LED packaging support sheet body - Google Patents
LED packaging support sheet body Download PDFInfo
- Publication number
- CN203631599U CN203631599U CN201320799019.8U CN201320799019U CN203631599U CN 203631599 U CN203631599 U CN 203631599U CN 201320799019 U CN201320799019 U CN 201320799019U CN 203631599 U CN203631599 U CN 203631599U
- Authority
- CN
- China
- Prior art keywords
- negative
- shaped extension
- conductor frame
- positive
- material strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 3
- 239000000463 material Substances 0.000 claims abstract description 41
- 239000004020 conductor Substances 0.000 claims description 56
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000178 monomer Substances 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 230000004907 flux Effects 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 7
- 239000004033 plastic Substances 0.000 abstract description 7
- 229920003023 plastic Polymers 0.000 abstract description 7
- 238000009413 insulation Methods 0.000 abstract 2
- 238000004020 luminiscence type Methods 0.000 abstract 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract 2
- 230000007774 longterm Effects 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 7
- 230000007423 decrease Effects 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- VYMDGNCVAMGZFE-UHFFFAOYSA-N phenylbutazonum Chemical compound O=C1C(CCCC)C(=O)N(C=2C=CC=CC=2)N1C1=CC=CC=C1 VYMDGNCVAMGZFE-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Images
Abstract
An LED packaging support sheet body relates to the LED package technical field; inner edges of an upper material belt and a lower material belt are respectively provided with a positive lead frame and a negative lead frame; a positive strip-shaped extension portion and a negative strip-shaped extension portion are respectively arranged on one side of one end of the positive lead frame and the negative lead frame; the upper material belt, the positive lead frame and the positive strip-shaped extension portion are in one-body structure; the lower material belt, the negative lead frame and the negative strip-shaped extension portion are in one-body structure; a positive external connecting portion and the negative external connecting portion are respectively arranged on the other end of the positive lead frame and the negative lead frame; an insulation pedestal wraps the positive strip-shaped extension portion and the negative strip-shaped extension portion, wherein an end portion of the negative strip-shaped extension portion is exposed outside the insulation pedestal, and the end portion of the negative strip-shaped extension portion is provided with a negative inner connecting end electrically connected with an LED chip. No plastic reflection cup structure is needed; a luminous flux reduction speed is slow in a long term application process of the packaged LED device, the luminous flux is more stable, and a luminescence angle is 180 degrees, thereby satisfying bigger luminescence angle needs.
Description
Technical field:
The utility model relates to LED encapsulation technology field, is specifically related to a kind of LED package support lamellar body.
Background technology:
LED light source device, owing to having the features such as luminous efficiency is high, volume is little, pollution-free, is just being widely used in the fields such as TV is backlight, graphic display screen, decorative lighting.Along with the reduction of the raw material prices such as chip, encapsulation glue, support, the improving constantly of chip light emitting efficiency, LED light source device has started to enter the room lighting such as commercial lighting, lighting of home field.The structure of the LED package support of main flow is the plastic packaging reflector structure of plastics and metal combination in the market, LED device is in prolonged application process, plastic section branch variable color gradually in package support, thereby accelerate the decline of LED device luminous flux, simultaneously reflector structural limitations the lighting angle of LED device, can not meet the needs of larger lighting angle.
Utility model content:
The purpose of this utility model is to provide LED package support lamellar body, it does not have plastic reflective cup structure, and the LED device of encapsulation luminous flux decrease speed in prolonged application process is slow, and luminous flux is more stable, and lighting angle is 180 degree, can meet larger lighting angle demand.
In order to solve the existing problem of background technology, the utility model is by the following technical solutions: it comprises material strip 1, lower material strip 2, positive conductor frame 3, negative conductor frame 4, positive bar shaped extension 5, negative bar shaped extension 6, insulating base 7, just outer connecting portion 8, negative outer connecting portion 9, link 10 in negative, the interior edge of upper material strip 1 and lower material strip 2 is provided with positive conductor frame 3 and negative conductor frame 4 separately, and a side of positive conductor frame 3 and negative conductor frame 4 one end is provided with positive bar shaped extension 5 and negative bar shaped extension 6 separately, and upper material strip 1, positive conductor frame 3 and positive bar shaped extension 5 are integral type structure, lower material strip 2, negative conductor frame 4 and negative bar shaped extension 6 are integral type structure, the other end of positive conductor frame 3 and negative conductor frame 4 is provided with the just outer connecting portion 8 and the negative outer connecting portion 9 that are electrically connected with outside separately, insulating base 7 is bundled together positive bar shaped extension 5 and negative bar shaped extension 6, wherein the end of negative bar shaped extension 6 is exposed to outside insulating base 7, the end of negative bar shaped extension 6 be provided with LED chip electrical connection negative in link 10, the centre position on positive conductor frame 3 surfaces is die bond region.
With reference to Fig. 5, described die bond intra-zone is provided with LED wafer 11.
Described positive conductor frame 3 and negative conductor frame 4 are made up of copper or copper alloy.
Described positive conductor frame 3 and negative conductor frame 4 surfaces are provided with silver coating, and described silver coating can play the effect that increases positive and negative lead frame surface reflection rate.
Described positive conductor frame 3 and negative conductor frame 4 are laminar, and thickness is 0～1 millimeter, and width is 0～3 millimeter.
Described insulating base 7 is made up of PPA material.
The beneficial effects of the utility model: it does not have plastic reflective cup structure, the LED device of encapsulation luminous flux decrease speed in prolonged application process is slow, and luminous flux is more stable, and lighting angle is 180 degree, can meet larger lighting angle demand.
Accompanying drawing explanation:
Fig. 1 is the utility model embodiment one structural representation.
Fig. 2 is the utility model embodiment two structural representations.
Fig. 3 is the utility model embodiment three structural representations.
Fig. 4 is the local enlarged diagram that the insulating base in the utility model wraps up the bar shaped extension on positive and negative lead frame.
Fig. 5 is that the utility model execution mode one is installed the structural representation after LED wafer.
Embodiment:
Embodiment one: referring to Fig. 1 and Fig. 4, this embodiment is by the following technical solutions: it comprises material strip 1, lower material strip 2, positive conductor frame 3, negative conductor frame 4, positive bar shaped extension 5, negative bar shaped extension 6, insulating base 7, just outer connecting portion 8, negative outer connecting portion 9, link 10 in negative, the interior edge of upper material strip 1 and lower material strip 2 is provided with positive conductor frame 3 and negative conductor frame 4 separately, and a side of positive conductor frame 3 and negative conductor frame 4 one end is provided with positive bar shaped extension 5 and negative bar shaped extension 6 separately, and upper material strip 1, positive conductor frame 3 and positive bar shaped extension 5 are integral type structure, lower material strip 2, negative conductor frame 4 and negative bar shaped extension 6 are integral type structure, the other end of positive conductor frame 3 and negative conductor frame 4 is provided with the just outer connecting portion 8 and the negative outer connecting portion 9 that are electrically connected with outside separately, insulating base 7 is bundled together positive bar shaped extension 5 and negative bar shaped extension 6, wherein the end of negative bar shaped extension 6 is exposed to outside insulating base 7, the end of negative bar shaped extension 6 be provided with LED chip electrical connection negative in link 10, the centre position on positive conductor frame 3 surfaces is die bond region.
With reference to Fig. 5, described die bond intra-zone is provided with LED wafer 11.
Described positive conductor frame 3 and negative conductor frame 4 are made up of copper or copper alloy.
Described positive conductor frame 3 and negative conductor frame 4 surfaces are provided with silver coating, and described silver coating can play the effect that increases positive and negative lead frame surface reflection rate.
Described positive conductor frame 3 and negative conductor frame 4 are laminar, and thickness is 0～1 millimeter, and width is 0～3 millimeter.
Described insulating base 7 is made up of PPA material.
The beneficial effects of the utility model: it does not have plastic reflective cup structure, the LED device of encapsulation luminous flux decrease speed in prolonged application process is slow, and luminous flux is more stable, and lighting angle is 180 degree, can meet larger lighting angle demand.
Embodiment two: referring to Fig. 2, this embodiment is with the difference of embodiment one: on described upper material strip 1 and lower material strip 2, be provided with separately several through holes 12, in encapsulation procedure, can LED package support lamellar body fixed described through hole 12 and relevant tool, mould cooperation.Between upper material strip 1 and lower material strip 2, be provided with strutting piece 13, and strutting piece 13 runs through all positive conductor framves 3 along LED package support monomer array direction, positive conductor frame 3 can be considered as being extended to both sides by strutting piece 13, and the quantity of described strutting piece 13 is more than or equal to 1.Other building blocks are identical with embodiment one with annexation.
Embodiment three: referring to Fig. 3, this embodiment is with the difference of embodiment one: on described upper material strip 1 and lower material strip 2, be provided with separately several through holes 12, in encapsulation procedure, can LED package support lamellar body fixed described through hole 12 and relevant tool, mould cooperation.The connector 14 passing through between upper material strip 1 and lower material strip 2 connects, and connector 14 is arranged in the gap between LED package support monomer.Other building blocks are identical with embodiment one with annexation.
Claims (9)
1.LED package support lamellar body, it is characterized in that it comprises material strip (1), lower material strip (2), positive conductor frame (3), negative conductor frame (4), positive bar shaped extension (5), negative bar shaped extension (6), insulating base (7), just outer connecting portion (8), negative outer connecting portion (9), link (10) in negative, the interior edge of upper material strip (1) and lower material strip (2) is provided with positive conductor frame (3) and negative conductor frame (4) separately, one side of positive conductor frame (3) and negative conductor frame (4) one end is provided with positive bar shaped extension (5) and negative bar shaped extension (6) separately, and upper material strip (1), positive conductor frame (3) and positive bar shaped extension (5) are integral type structure, lower material strip (2), negative conductor frame (4) and negative bar shaped extension (6) are integral type structure, the other end of positive conductor frame (3) and negative conductor frame (4) is provided with the just outer connecting portion (8) and the negative outer connecting portion (9) that are electrically connected with outside separately, insulating base (7) is bundled together positive bar shaped extension (5) and negative bar shaped extension (6), wherein the end of negative bar shaped extension (6) is exposed to outside insulating base (7), the end of negative bar shaped extension (6) be provided with LED chip electrical connection negative in link (10), the centre position on positive conductor frame (3) surface is die bond region.
2. LED package support lamellar body according to claim 1, is characterized in that being provided with separately several through holes (12) on described upper material strip (1) and lower material strip (2).
3. LED package support lamellar body according to claim 1, it is characterized in that being provided with strutting piece (13) between described upper material strip (1) and lower material strip (2), and strutting piece (13) runs through all positive conductor framves (3) along LED package support monomer array direction.
4. LED package support lamellar body according to claim 1, it is characterized in that connecting by connector (14) between described upper material strip (1) and lower material strip (2), and connector (14) is arranged in the gap between LED package support monomer.
5. LED package support lamellar body according to claim 1, is characterized in that described positive conductor frame (3) and negative conductor frame (4) surface are provided with silver coating.
6. LED package support lamellar body according to claim 1, is characterized in that described positive conductor frame (3) and negative conductor frame (4) are for laminar, and thickness is 0～1 millimeter, and width is 0～3 millimeter.
7. LED package support lamellar body according to claim 1, is characterized in that described positive conductor frame (3) and the material of negative conductor frame (4) are copper.
8. LED package support lamellar body according to claim 1, is characterized in that described positive conductor frame (3) and the material of negative conductor frame (4) are that copper is replaced with to copper alloy.
9. LED package support lamellar body according to claim 1, is characterized in that the material of described insulating base (7) is PPA.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320799019.8U CN203631599U (en) | 2013-12-05 | 2013-12-05 | LED packaging support sheet body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320799019.8U CN203631599U (en) | 2013-12-05 | 2013-12-05 | LED packaging support sheet body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203631599U true CN203631599U (en) | 2014-06-04 |
Family
ID=50818048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320799019.8U Expired - Lifetime CN203631599U (en) | 2013-12-05 | 2013-12-05 | LED packaging support sheet body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203631599U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105240696A (en) * | 2015-10-27 | 2016-01-13 | 林家英 | Substrate with side-face light emitting function and front-face-and-back-face heat dissipation function and manufacturing method thereof |
-
2013
- 2013-12-05 CN CN201320799019.8U patent/CN203631599U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105240696A (en) * | 2015-10-27 | 2016-01-13 | 林家英 | Substrate with side-face light emitting function and front-face-and-back-face heat dissipation function and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Baoan District Shiyan street Shenzhen city Guangdong province 518000 White Pine Road in Yuntai technology industrial plant building 6, 8, 9 floor, building nine floor of Building 1 Patentee after: SHENZHEN SMART SEMICONDUCTOR Ltd. Address before: Baoan District Shiyan street Shenzhen city Guangdong province 518000 White Pine Road in Yuntai technology industrial plant building 6, 8, 9 floor, building nine floor of Building 1 Patentee before: SHENZHEN SMALITE OPTOELECTRONICS Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20140604 |
|
| CX01 | Expiry of patent term |