CN203536425U - 一种用于固定散热铜片的新型结构 - Google Patents

一种用于固定散热铜片的新型结构 Download PDF

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CN203536425U
CN203536425U CN201320564112.0U CN201320564112U CN203536425U CN 203536425 U CN203536425 U CN 203536425U CN 201320564112 U CN201320564112 U CN 201320564112U CN 203536425 U CN203536425 U CN 203536425U
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copper sheet
radiating copper
lead frame
heat radiation
radiation copper
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曹周
黄源炜
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Great Team Backend Foundry Dongguan Co Ltd
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Abstract

本实用新型提供一种用于固定散热铜片的新型结构，包括引线框架、芯片、散热铜片，所述引线框架、芯片、散热铜片两两间通过结合材连接，所述引线框架上设有一限位结构，所述散热铜片的一侧连接于所述限位结构。本实用新型提供的一种用于固定散热铜片的新型结构，解决了现有的在半导体焊接散热铜片时容易偏离预设位置的缺陷，提高了散热铜片的焊接质量，从而增强了散热铜片与引线框架之间的牢固性。

Description

一种用于固定散热铜片的新型结构
技术领域
本实用新型涉及半导体的封装，具体涉及一种用于固定散热铜片的新型结构。
背景技术
封装是一门新兴的交叉学科，涉及到设计、环境、测试、材料、制造和可靠性等多科学领域，其操作方法为将微元件组合及再加工构成微系统及工作环境的制造技术；中国正在成为世界电子制造的大国，要成为电子制造的强国，需要更多创新型、国际化的专业人才，电子封装技术专业期望为我国电子信息产业的发展做出巨大的贡献。
半导体封装为电子封装中的一种，现有的半导体封装技术中，半导体在焊接散热铜片时由于结合材的流动性会使得散热铜片偏离预设置的位置，无法达到设计要求，影响散热铜片与引线框架的连接性。
申请号为200610059022.0的中国专利公开了名称为“具有散热片的半导体封装结构及其制造方法”的发明专利，其半导体封装结构包括一导线架、一半导体芯片、一散热片、一封胶体及一绝缘层，封胶体包封半导体芯片、导线架与散热片，其缺点为封胶体为可流动性物质，故散热片在连接所述导线架时会存在位置偏移，无法达到预设定的位置要求，影响散热片与导线架的连接性。
实用新型内容
本实用新型提供一种用于固定散热铜片的新型结构，提高了散热铜片的焊接质量，从而增强了散热铜片与引线框架之间的牢固性。
本实用新型提供的一种用于固定散热铜片的新型结构，包括引线框架、芯片、散热铜片，所述引线框架、芯片、散热铜片两两间通过结合材连接，本实用新型的改进之处在于，所述引线框架上设有一限位结构，所述散热铜片的一侧连接于所述限位结构。
作为一种实施方式，所述限位结构为一矩形框。
作为一种实施方式，所述限位结构为一斜槽。
作为一种实施方式，所述限位结构为一限位墙。
进一步的，所述限位墙包括凸起的矩形挡块框，所述散热铜片的一侧插接于所述矩形挡块框中。
本实用新型提供一种用于固定散热铜片的新型结构，解决了现有的在半导体焊接散热铜片时容易偏离预设位置的缺陷，提高了散热铜片的焊接质量，从而增强了散热铜片与引线框架之间的牢固性。
附图说明
为了更清楚地说明本实用新型实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本实施例一的平面结构示意图；
图2为本实施例一的侧视结构示意图；
图3为本实施例二的侧视结构示意图；
图4为本实施例三的侧视结构示意图。
具体实施方式
下面将结合本实用新型中的附图，对本实用新型中的技术方案进行清楚、完整地描述，显然，所描述的仅仅是本实用新型一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有作出创造性劳动的前提下所获得的所有其他实施例，都属于本实用新型保护的范围。
实施例一
参见图1、图2分别为本实施例一的平面结构示意图及本实施例一的侧视结构示意图；本实用新型提供的一种用于固定散热铜片的新型结构，包括引线框架1、芯片3、散热铜片4，所述引线框架1、芯片3、散热铜片4两两间通过结合材2连接，所述引线框架1上设有一限位结构，所述散热铜片4的一侧连接于所述限位结构，所述限位结构为一矩形框5，准确的将散热铜片固定于所述引线框架上，增强了散热铜片与引线框架之间的牢固性，解决了现有的在半导体焊接散热铜片时容易偏离预设位置的缺陷，提高了散热铜片的焊接质量。
实施例二
参见图3，为本实施例二的侧视结构示意图；本实用新型提供的一种用于固定散热铜片的新型结构，包括引线框架1、芯片3、散热铜片4，所述引线框架1、芯片3、散热铜片4两两间通过结合材2连接，所述引线框架1上设有一限位结构，所述散热铜片4的一侧连接于所述限位结构，限位结构为一斜槽51，准确的将散热铜片固定于所述引线框架上，增强了散热铜片与引线框架之间的牢固性，解决了现有的在半导体焊接散热铜片时容易偏离预设位置的缺陷，提高了散热铜片的焊接质量。
实施例三
参见图4，为本实施例三的侧视结构示意图；本实用新型提供的一种用于固定散热铜片的新型结构，包括引线框架1、芯片3、散热铜片4，所述引线框架1、芯片3、散热铜片4两两间通过结合材2连接，所述引线框架1上设有一限位结构，所述散热铜片4的一侧连接于所述限位结构，所述限位结构为一限位墙，所述限位墙包括凸起的矩形挡块框52，所述散热铜片的一侧插接于所述矩形挡块框52中，准确的将散热铜片固定于所述引线框架上，增强了散热铜片与引线框架之间的牢固性，解决了现有的在半导体焊接散热铜片时容易偏离预设位置的缺陷，提高了散热铜片的焊接质量。
通过以上描述可知，本实用新型提供一种用于固定散热铜片的新型结构，解决了现有的在半导体焊接散热铜片时容易偏离预设位置的缺陷，提高了散热铜片的焊接质量，从而增强了散热铜片与引线框架之间的牢固性。
以上内容是结合具体的优选实施方式对本实用新型所作的进一步详细说明，不能认定本实用新型的具体实施只局限于这些说明。对于本实用新型所属技术领域的普通技术人员来说，在不脱离本实用新型构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本实用新型的保护范围。

Claims (5)

1.一种用于固定散热铜片的新型结构，包括引线框架、芯片、散热铜片，所述引线框架、芯片、散热铜片两两间通过结合材连接，其特征在于，所述引线框架上设有一限位结构，所述散热铜片的一侧连接于所述限位结构。
2.根据权利要求1所述的一种用于固定散热铜片的新型结构，其特征在于，所述限位结构为一矩形框。
3.根据权利要求1所述的一种用于固定散热铜片的新型结构，其特征在于，所述限位结构为一斜槽。
4.根据权利要求1所述的一种用于固定散热铜片的新型结构，其特征在于，所述限位结构为一限位墙。
5.根据权利要求4所述的一种用于固定散热铜片的新型结构，其特征在于，所述限位墙包括凸起的矩形挡块框，所述散热铜片的一侧插接于所述矩形挡块框中。
CN201320564112.0U 2013-09-11 2013-09-11 一种用于固定散热铜片的新型结构 Expired - Fee Related CN203536425U (zh)

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CN104409430A (zh) * 2014-12-08 2015-03-11 杰群电子科技（东莞）有限公司 一种半导体器件及其封装方法

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* Cited by examiner, † Cited by third party
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CN104409430A (zh) * 2014-12-08 2015-03-11 杰群电子科技（东莞）有限公司 一种半导体器件及其封装方法
CN104409430B (zh) * 2014-12-08 2018-01-16 杰群电子科技（东莞）有限公司 一种半导体器件及其封装方法

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