CN201134427Y - 一种散热片外露绝缘加强型封装结构 - Google Patents

一种散热片外露绝缘加强型封装结构 Download PDF

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Publication number
CN201134427Y
CN201134427Y CN 200720077478 CN200720077478U CN201134427Y CN 201134427 Y CN201134427 Y CN 201134427Y CN 200720077478 CN200720077478 CN 200720077478 CN 200720077478 U CN200720077478 U CN 200720077478U CN 201134427 Y CN201134427 Y CN 201134427Y
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radiation fin
sealing structure
heat sink
sink assembly
encapsulating structure
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Expired - Lifetime
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CN 200720077478
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Inventor
牛志强
杨云康
徐进寿
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Shanghai Seefull Electronic Co Ltd
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Shanghai Seefull Electronic Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

一种散热片外露绝缘加强型封装结构，芯片背面焊接区焊接或粘接一散热片组件，且散热片组件的面积小于焊接区的面积，散热片组件的金属散热层裸露于封装结构之外，散热片组件是陶瓷片与金属散热片上下平行放置焊接或粘接成一体。本实用新型的优点是解决了全塑封封装器件散热不够充分的问题，并保证其绝缘性；实用性强，散热片组件可做成标准器件与封装框架搭配，成本低。

Description

一种散热片外露绝缘加强型封装结构
技术领域
本实用新型涉及一种全塑封绝缘封装体的封装结构，特别涉及一种散热片外露绝缘加强型封装结构。
背景技术
目前全塑封绝缘封装体由于塑封材料导热性能有限，不能有效地将芯片工作中产生的热导出封装体，因此在应用于大功率芯片时受到限制。为了改进封装的热性能，将封装框架加厚，以达到增强散热的效果，但此种做法对热性能的改善有限，且由于金属表面到外界距离变短，降低了绝缘性；或将陶瓷片连接到封装框架背面，并外露出塑封体，此种做法由于受到陶瓷片厚度的限制，对热性能的改善也有限。
实用新型内容
本实用新型是要提供一种散热充分的、且保证绝缘性的散热片外露绝缘加强型封装结构。
为了解决以上的技术问题，本实用新型提供了一种散热片外露绝缘加强型封装结构，芯片背面焊接区焊接或粘接一散热片组件，且散热片组件的面积小于焊接区的面积，散热片组件的金属散热层裸露于封装结构之外。
所述的散热片组件，是陶瓷片与金属散热片上下平行放置焊接或粘接成一体。
本实用新型的优越功效在于：
1)解决全塑封封装器件散热不够充分的问题，并保证其绝缘性；
2)实用性强，散热片组件可做成标准器件与封装框架搭配，成本低。
附图说明
图1为本实用新型的芯片未焊接散热片组件的结构示意图；
图2为本实用新型的芯片已焊接散热片组件的结构示意图；
图3为图2的右视图；
图中标号说明
1-芯片；    2-引线；
3-引脚；    4-焊接区；
5-塑胶；    6-散热片组件；
61-陶瓷；   62-金属散热片。
具体实施方式
请参阅附图所示，对本实用新型作进一步的描述。
如图1所示，芯片1嵌入在塑胶5中，芯片1通过引线2连接到引脚3上，引脚3伸出塑胶5外。
如图2所示，本实用新型提供了一种散热片外露绝缘加强型封装结构，芯片1背面焊接区4焊接或粘接一散热片组件6，且散热片组件6的面积小于焊接区4的面积，散热片组件6的金属散热层裸露于塑胶5之外与外界直接接触，迅速地将芯片1工作中产生的热导出塑胶5封装体，其余各面均被塑胶包围。
所述的散热片组件6，是陶瓷片61与金属散热片62上下平行放置焊接或粘接成一体。
以上的粘接方式可用硅胶进行粘连。
本实用新型可使用于任何规则的半导体全塑封器件的封装结构。

Claims (2)

1、一种散热片外露绝缘加强型封装结构，其特征在于：
芯片背面焊接区焊接或粘接一散热片组件，且散热片组件的面积小于焊接区的面积，散热片组件的金属散热层裸露于封装结构之外。
2、按权利要求1所述的一种散热片外露绝缘加强型封装结构，其特征在于：
所述的散热片组件，是陶瓷片与金属散热片上下平行放置焊接或粘接成一体。
CN 200720077478 2007-12-27 2007-12-27 一种散热片外露绝缘加强型封装结构 Expired - Lifetime CN201134427Y (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200720077478 CN201134427Y (zh) 2007-12-27 2007-12-27 一种散热片外露绝缘加强型封装结构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200720077478 CN201134427Y (zh) 2007-12-27 2007-12-27 一种散热片外露绝缘加强型封装结构

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CN201134427Y true CN201134427Y (zh) 2008-10-15

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102097317A (zh) * 2010-12-01 2011-06-15 庄玉巧 一种全包封装开关电源三极管的生产方法
CN107546190A (zh) * 2016-06-28 2018-01-05 厦门芯晶亮电子科技有限公司 晶体管封装结构

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102097317A (zh) * 2010-12-01 2011-06-15 庄玉巧 一种全包封装开关电源三极管的生产方法
CN102097317B (zh) * 2010-12-01 2015-04-29 佛山市南海区宏乾电子有限公司 一种全包封装开关电源三极管的生产方法
CN107546190A (zh) * 2016-06-28 2018-01-05 厦门芯晶亮电子科技有限公司 晶体管封装结构

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