CN203521451U - 一种倒装led芯片的焊接保护结构及倒装led芯片 - Google Patents
一种倒装led芯片的焊接保护结构及倒装led芯片 Download PDFInfo
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015184774A1 (zh) * | 2014-06-06 | 2015-12-10 | 厦门市三安光电科技有限公司 | 一种倒装发光二极管结构及其制作方法 |
CN106159075A (zh) * | 2016-09-05 | 2016-11-23 | 江苏新广联半导体有限公司 | 一种具有低热阻绝缘层结构的倒装led芯片及制作方法 |
CN109755359A (zh) * | 2019-01-15 | 2019-05-14 | 江西兆驰半导体有限公司 | 一种发光二极管芯片的制造方法 |
CN111725362A (zh) * | 2020-05-27 | 2020-09-29 | 南京中电熊猫平板显示科技有限公司 | 一种微型发光二极管的制造方法 |
CN112404634A (zh) * | 2020-10-27 | 2021-02-26 | 吴彦君 | 一种倒装led芯片焊接保护结构 |
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2013
- 2013-09-05 CN CN201320550918.4U patent/CN203521451U/zh not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015184774A1 (zh) * | 2014-06-06 | 2015-12-10 | 厦门市三安光电科技有限公司 | 一种倒装发光二极管结构及其制作方法 |
CN106159075A (zh) * | 2016-09-05 | 2016-11-23 | 江苏新广联半导体有限公司 | 一种具有低热阻绝缘层结构的倒装led芯片及制作方法 |
CN109755359A (zh) * | 2019-01-15 | 2019-05-14 | 江西兆驰半导体有限公司 | 一种发光二极管芯片的制造方法 |
CN111725362A (zh) * | 2020-05-27 | 2020-09-29 | 南京中电熊猫平板显示科技有限公司 | 一种微型发光二极管的制造方法 |
CN112404634A (zh) * | 2020-10-27 | 2021-02-26 | 吴彦君 | 一种倒装led芯片焊接保护结构 |
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Owner name: SHANDONG JINGTAIXING PHOTOELECTRIC TECHNOLOGY CO., Free format text: FORMER OWNER: SHENZHEN ZHIXUNDA PHOTOELECTRIC TECHNOLOGY CO., LTD. Effective date: 20141015 |
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Free format text: CORRECT: ADDRESS; FROM: 518057 SHENZHEN, GUANGDONG PROVINCE TO: 271208 TAIAN, SHANDONG PROVINCE |
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Effective date of registration: 20141015 Address after: 271208 Xintai Economic Development Zone, Shandong, Tai'an Patentee after: SHENZHEN WISDOW REACHES INDUSTRY CO., LTD. Address before: 518057 B, B404-406 building, Shenzhen Research Institute, Shenzhen District, Nanshan District hi tech Zone, Guangdong, China Patentee before: Shenzhen Zhixunda Photoelectric Technology Co., Ltd. |