CN203521472U - 一种倒装led芯片的焊接电极结构及倒装led芯片 - Google Patents
一种倒装led芯片的焊接电极结构及倒装led芯片 Download PDFInfo
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- CN203521472U CN203521472U CN201320549532.1U CN201320549532U CN203521472U CN 203521472 U CN203521472 U CN 203521472U CN 201320549532 U CN201320549532 U CN 201320549532U CN 203521472 U CN203521472 U CN 203521472U
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- 239000004065 semiconductor Substances 0.000 claims description 12
- 229910052594 sapphire Inorganic materials 0.000 claims description 6
- 239000010980 sapphire Substances 0.000 claims description 6
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
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- 238000010276 construction Methods 0.000 description 3
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
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CN201320549532.1U CN203521472U (zh) | 2013-09-05 | 2013-09-05 | 一种倒装led芯片的焊接电极结构及倒装led芯片 |
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CN201320549532.1U CN203521472U (zh) | 2013-09-05 | 2013-09-05 | 一种倒装led芯片的焊接电极结构及倒装led芯片 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105914281A (zh) * | 2015-02-19 | 2016-08-31 | 晶元光电股份有限公司 | 具有高效率反射结构的发光元件 |
CN106449930A (zh) * | 2016-09-06 | 2017-02-22 | 华灿光电(浙江)有限公司 | 一种发光二极管及其制造方法 |
CN108581126A (zh) * | 2018-06-20 | 2018-09-28 | 大冶特殊钢股份有限公司 | 倒装led芯片导向装置与回流焊机以及led芯片焊接方法 |
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2013
- 2013-09-05 CN CN201320549532.1U patent/CN203521472U/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105914281A (zh) * | 2015-02-19 | 2016-08-31 | 晶元光电股份有限公司 | 具有高效率反射结构的发光元件 |
CN106449930A (zh) * | 2016-09-06 | 2017-02-22 | 华灿光电(浙江)有限公司 | 一种发光二极管及其制造方法 |
CN108581126A (zh) * | 2018-06-20 | 2018-09-28 | 大冶特殊钢股份有限公司 | 倒装led芯片导向装置与回流焊机以及led芯片焊接方法 |
CN108581126B (zh) * | 2018-06-20 | 2023-09-15 | 大冶特殊钢有限公司 | 倒装led芯片导向装置与回流焊机以及led芯片焊接方法 |
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Owner name: SHANDONG JINGTAIXING PHOTOELECTRIC TECHNOLOGY CO., Free format text: FORMER OWNER: SHENZHEN ZHIXUNDA PHOTOELECTRIC TECHNOLOGY CO., LTD. Effective date: 20141027 |
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Effective date of registration: 20141027 Address after: 271208 Xintai Economic Development Zone, Shandong, Tai'an Patentee after: SHANDONG PROSPEROUS STAR OPTOELECTRONICS Co.,Ltd. Address before: 518057 B, B404-406 building, Shenzhen Research Institute, Shenzhen District, Nanshan District hi tech Zone, Guangdong, China Patentee before: SHENZHEN WISDOW REACHES INDUSTRY Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20140402 |