CN103456866B - 一种全方位发光的倒装led芯片 - Google Patents
一种全方位发光的倒装led芯片 Download PDFInfo
- Publication number
- CN103456866B CN103456866B CN201310399111.XA CN201310399111A CN103456866B CN 103456866 B CN103456866 B CN 103456866B CN 201310399111 A CN201310399111 A CN 201310399111A CN 103456866 B CN103456866 B CN 103456866B
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- welding electrode
- type welding
- reflecting layer
- light
- directionally
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310399111.XA CN103456866B (zh) | 2013-09-05 | 2013-09-05 | 一种全方位发光的倒装led芯片 |
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CN201310399111.XA CN103456866B (zh) | 2013-09-05 | 2013-09-05 | 一种全方位发光的倒装led芯片 |
Publications (2)
Publication Number | Publication Date |
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CN103456866A CN103456866A (zh) | 2013-12-18 |
CN103456866B true CN103456866B (zh) | 2017-05-17 |
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CN201310399111.XA Active CN103456866B (zh) | 2013-09-05 | 2013-09-05 | 一种全方位发光的倒装led芯片 |
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CN (1) | CN103456866B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107819061A (zh) * | 2017-10-23 | 2018-03-20 | 山东晶泰星光电科技有限公司 | 一种带有六面发光led倒装芯片的光源器件 |
CN108695421A (zh) * | 2018-07-04 | 2018-10-23 | 天津中环电子照明科技有限公司 | 反射隔热式量子点led封装器件及灯具 |
CN114038952A (zh) * | 2021-09-09 | 2022-02-11 | 重庆康佳光电技术研究院有限公司 | 发光二极管芯片及其制备方法、显示装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102208512A (zh) * | 2010-03-24 | 2011-10-05 | 日立电线株式会社 | 发光二极管 |
CN102299243A (zh) * | 2011-09-14 | 2011-12-28 | 青岛理工大学 | 一种薄膜倒装光子晶体led芯片及其制造方法 |
CN103078049A (zh) * | 2013-02-07 | 2013-05-01 | 张刚维 | Cob封装led光源及其制作方法 |
CN103165799A (zh) * | 2011-12-16 | 2013-06-19 | 新世纪光电股份有限公司 | 半导体封装结构 |
CN203521458U (zh) * | 2013-09-05 | 2014-04-02 | 深圳市智讯达光电科技有限公司 | 一种全方位发光的倒装led芯片 |
-
2013
- 2013-09-05 CN CN201310399111.XA patent/CN103456866B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102208512A (zh) * | 2010-03-24 | 2011-10-05 | 日立电线株式会社 | 发光二极管 |
CN102299243A (zh) * | 2011-09-14 | 2011-12-28 | 青岛理工大学 | 一种薄膜倒装光子晶体led芯片及其制造方法 |
CN103165799A (zh) * | 2011-12-16 | 2013-06-19 | 新世纪光电股份有限公司 | 半导体封装结构 |
CN103078049A (zh) * | 2013-02-07 | 2013-05-01 | 张刚维 | Cob封装led光源及其制作方法 |
CN203521458U (zh) * | 2013-09-05 | 2014-04-02 | 深圳市智讯达光电科技有限公司 | 一种全方位发光的倒装led芯片 |
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Publication number | Publication date |
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CN103456866A (zh) | 2013-12-18 |
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Owner name: SHANDONG JINGTAIXING PHOTOELECTRIC TECHNOLOGY CO., Free format text: FORMER OWNER: SHENZHEN ZHIXUNDA PHOTOELECTRIC TECHNOLOGY CO., LTD. Effective date: 20141010 |
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Effective date of registration: 20141010 Address after: 271208 Xintai Economic Development Zone, Shandong, Tai'an Applicant after: SHANDONG PROSPEROUS STAR OPTOELECTRONICS Co.,Ltd. Address before: 518057 B, B404-406 building, Shenzhen Research Institute, Shenzhen District, Nanshan District hi tech Zone, Guangdong, China Applicant before: SHENZHEN WISDOW REACHES INDUSTRY Co.,Ltd. |
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Effective date of registration: 20230713 Address after: 518000 501-510, building 3, nantaiyun chuanggu, Tangwei community, Fenghuang street, Guangming District, Shenzhen, Guangdong Province Patentee after: Shenzhen Lixiang Wenchuang Photoelectric Technology Co.,Ltd. Address before: 271208 Xintai Economic Development Zone, Tai'an City, Shandong Province Patentee before: SHANDONG PROSPEROUS STAR OPTOELECTRONICS Co.,Ltd. |
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