CN202855741U - 晶圆与晶圆、晶圆与芯片、芯片与芯片键合的结构 - Google Patents
晶圆与晶圆、晶圆与芯片、芯片与芯片键合的结构 Download PDFInfo
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- CN202855741U CN202855741U CN2012202286372U CN201220228637U CN202855741U CN 202855741 U CN202855741 U CN 202855741U CN 2012202286372 U CN2012202286372 U CN 2012202286372U CN 201220228637 U CN201220228637 U CN 201220228637U CN 202855741 U CN202855741 U CN 202855741U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/8012—Aligning
- H01L2224/80136—Aligning involving guiding structures, e.g. spacers or supporting members
- H01L2224/80138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
- H01L2224/80141—Guiding structures both on and outside the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/8034—Bonding interfaces of the bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/8034—Bonding interfaces of the bonding area
- H01L2224/80359—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/80986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
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Priority Applications (1)
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CN2012202286372U CN202855741U (zh) | 2012-05-18 | 2012-05-18 | 晶圆与晶圆、晶圆与芯片、芯片与芯片键合的结构 |
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CN2012202286372U CN202855741U (zh) | 2012-05-18 | 2012-05-18 | 晶圆与晶圆、晶圆与芯片、芯片与芯片键合的结构 |
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CN202855741U true CN202855741U (zh) | 2013-04-03 |
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CN2012202286372U Expired - Lifetime CN202855741U (zh) | 2012-05-18 | 2012-05-18 | 晶圆与晶圆、晶圆与芯片、芯片与芯片键合的结构 |
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Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103426732A (zh) * | 2012-05-18 | 2013-12-04 | 上海丽恒光微电子科技有限公司 | 低温晶圆键合的方法及通过该方法形成的结构 |
CN103794522A (zh) * | 2014-01-24 | 2014-05-14 | 清华大学 | 晶圆-晶圆、芯片-晶圆和芯片-芯片键合方法 |
CN104241147A (zh) * | 2013-06-14 | 2014-12-24 | 无锡华润上华半导体有限公司 | 一种基于铝锗共晶的低温键合方法 |
CN105006440A (zh) * | 2015-06-24 | 2015-10-28 | 武汉新芯集成电路制造有限公司 | 一种真空键合大气加压混合键合方法 |
CN103794522B (zh) * | 2014-01-24 | 2016-11-30 | 清华大学 | 晶圆‑晶圆、芯片‑晶圆和芯片‑芯片键合方法 |
CN107257938A (zh) * | 2015-02-16 | 2017-10-17 | 苹果公司 | 衍射光学元件叠层的低温气密密封 |
CN107764439A (zh) * | 2016-08-19 | 2018-03-06 | 上海丽恒光微电子科技有限公司 | 压力传感器的制备方法 |
CN106340524B (zh) * | 2015-07-15 | 2018-10-16 | 上海微电子装备(集团)股份有限公司 | 一种晶圆键合方法 |
CN109755142A (zh) * | 2019-01-02 | 2019-05-14 | 长江存储科技有限责任公司 | 键合结构及其形成方法 |
CN113410223A (zh) * | 2021-06-15 | 2021-09-17 | 上海壁仞智能科技有限公司 | 芯片组及其制造方法 |
CN113809043A (zh) * | 2020-06-12 | 2021-12-17 | 豪威科技股份有限公司 | 图像传感器中使用混合接合的金属布线 |
WO2023138120A1 (zh) * | 2022-01-20 | 2023-07-27 | 长鑫存储技术有限公司 | 一种半导体封装结构及其形成方法 |
-
2012
- 2012-05-18 CN CN2012202286372U patent/CN202855741U/zh not_active Expired - Lifetime
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103426732A (zh) * | 2012-05-18 | 2013-12-04 | 上海丽恒光微电子科技有限公司 | 低温晶圆键合的方法及通过该方法形成的结构 |
CN103426732B (zh) * | 2012-05-18 | 2015-12-02 | 上海丽恒光微电子科技有限公司 | 低温晶圆键合的方法及通过该方法形成的结构 |
CN104241147A (zh) * | 2013-06-14 | 2014-12-24 | 无锡华润上华半导体有限公司 | 一种基于铝锗共晶的低温键合方法 |
CN103794522B (zh) * | 2014-01-24 | 2016-11-30 | 清华大学 | 晶圆‑晶圆、芯片‑晶圆和芯片‑芯片键合方法 |
CN103794522A (zh) * | 2014-01-24 | 2014-05-14 | 清华大学 | 晶圆-晶圆、芯片-晶圆和芯片-芯片键合方法 |
US10732428B2 (en) | 2015-02-16 | 2020-08-04 | Apple Inc. | Low-temperature hermetic sealing for diffractive optical element stacks |
CN107257938A (zh) * | 2015-02-16 | 2017-10-17 | 苹果公司 | 衍射光学元件叠层的低温气密密封 |
CN107257938B (zh) * | 2015-02-16 | 2020-07-28 | 苹果公司 | 光学装置以及制造光学装置的方法 |
CN105006440B (zh) * | 2015-06-24 | 2018-01-09 | 武汉新芯集成电路制造有限公司 | 一种真空键合大气加压混合键合方法 |
CN105006440A (zh) * | 2015-06-24 | 2015-10-28 | 武汉新芯集成电路制造有限公司 | 一种真空键合大气加压混合键合方法 |
CN106340524B (zh) * | 2015-07-15 | 2018-10-16 | 上海微电子装备(集团)股份有限公司 | 一种晶圆键合方法 |
CN107764439A (zh) * | 2016-08-19 | 2018-03-06 | 上海丽恒光微电子科技有限公司 | 压力传感器的制备方法 |
CN109755142A (zh) * | 2019-01-02 | 2019-05-14 | 长江存储科技有限责任公司 | 键合结构及其形成方法 |
CN113809043A (zh) * | 2020-06-12 | 2021-12-17 | 豪威科技股份有限公司 | 图像传感器中使用混合接合的金属布线 |
CN113410223A (zh) * | 2021-06-15 | 2021-09-17 | 上海壁仞智能科技有限公司 | 芯片组及其制造方法 |
WO2023138120A1 (zh) * | 2022-01-20 | 2023-07-27 | 长鑫存储技术有限公司 | 一种半导体封装结构及其形成方法 |
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Effective date of registration: 20160418 Address after: 710075, arc building, No. 60, West Avenue, new industrial park, hi tech Zone, Shaanxi, Xi'an, 204 Patentee after: Xi'an Yisheng Photoelectric Technology Co., Ltd. Address before: 201203 Shanghai City, Pudong New Area Zhangjiang hi tech park long East Road No. 3000 Building No. 5 room 501B Patentee before: Shanghai Lexvu Opto Mircoelectrics Technology Co., Ltd. |
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Effective date of registration: 20200507 Address after: 315803 3 buildings, 4 buildings and 5 buildings, 335 Anju Road, Xiaogang street, Beilun District, Ningbo, Zhejiang. Patentee after: China core integrated circuit (Ningbo) Co., Ltd Address before: 710075, arc building, No. 60, West Avenue, new industrial park, hi tech Zone, Shaanxi, Xi'an, 204 Patentee before: Xi'an Yisheng Photoelectric Technology Co., Ltd. |
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