CN202792678U

CN202792678U - L-shaped mini-type thermoelectric refrigeration machine

Info

Publication number: CN202792678U
Application number: CN 201220325810
Authority: CN
Inventors: 方建军; 吴永庆; 杨梅
Original assignee: Hangzhou Dahe Thermo Magnetics Co Ltd
Current assignee: Hangzhou Dahe Thermo Magnetics Co Ltd
Priority date: 2012-07-05
Filing date: 2012-07-05
Publication date: 2013-03-13
Anticipated expiration: 2022-07-05

Abstract

The utility model discloses an L-shaped mini-type thermoelectric refrigeration machine comprising upper base plates, a lower base plate, galvanic couples, current flow pieces and electrode plates. The upper base plates and the lower plate are of a up-down structure, the galvanic couples are arranged between the upper base plates and the lower base plate and are made of P--shaped semiconductor grains and N-shaped semiconductor grains, the current flow pieces and the electrode plates are connected to the galvanic couples in a welding mode, the lower base plate is L-shaped, the upper base plates are composed of a plurality of small block base plates located in the same plane, and a plurality of independent refrigeration areas are composed of the corresponding area of the small bock base plates and the lower base plate , galvanic couples in the corresponding area of the small bock base plates and the lower base plate, and electricity conducting layers. According to the L-shaped mini-type thermoelectric refrigeration machine, a plurality of the upper base plates which are different in sizes and the single L-shaped lower base plate are combined to form the structure design with the plurality of independent refrigeration areas to enable the size of the whole thermoelectric refrigeration machine to shrink greatly, the special requirements for the shape and the size of the thermoelectric refrigeration machine in the light communication field are met, the using technology difficulty of a user is reduced, and the refrigeration efficiency of the thermoelectric refrigeration machine is improved.

Description

L-type minisize thermoelectric cooler

Technical field

The utility model relates to a kind of thermoelectric cooling device, refers more particularly to the L-type minisize thermoelectric cooler that a kind of product size is little, refrigerating efficiency is high.

Background technology

Fast development along with international optic communication industry, the optical communication industry is also more and more higher for the requirement of device, the volume that comprises the requirement laser generator is done less and less, require simultaneously Energy Intensity Reduction, performance promotes again, as very important part of Laser Devices----thermoelectric cooling device, volume size, energy consumption, structure in whole device the inside all play very important effect for whole Laser Devices size, energy consumption, performance.Production technology and technical capability based on more domestic and international manufacturers, general cooler is all made the structure of comparison rule at present, cuboid commonly on the market, for the use occasion of complicated structure, there is significant limitation for some, can't satisfying the requirement of actual use.

The utility model content

The utility model mainly solves conventional shape thermoelectric cooling device to be existed larger limitation, can't satisfy simultaneously the technical problem of volume, energy consumption and performance for baroque use occasion; Provide that a kind of volume is little, refrigerating efficiency is high and had the L-type minisize thermoelectric cooler in some independent coolings zone.

In order to solve the technical problem of above-mentioned existence, the utility model mainly is to adopt following technical proposals:

A kind of L-type minisize thermoelectric cooler of the present utility model, comprise up-down structure and identical upper substrate and the infrabasal plate of size, be located at the galvanic couple that formed by P-type semiconductor particle and N-type semiconductor particle between the upper and lower base plate to and with flow deflector and the battery lead plate of galvanic couple to welding, described flow deflector is located between galvanic couple pair and the substrate, described infrabasal plate is L-shaped, described upper substrate is comprised of the some fritter substrates that are in the same plane, galvanic couple pair in the infrabasal plate of described fritter substrate and corresponding region and the zone, conductive layer consists of some independently refrigerated areas, refrigerated area is electrically connected the formation series loop and is connected with described battery lead plate, single upper substrate is divided into several fritter substrates, form a plurality of independent and refrigerated areas of connecting again with the respective regions of infrabasal plate, can satisfy the client to the special making requirement of structure and space, cancel simultaneously a plurality of battery lead plates that bring because of discrete cooler combination, the size of refrigerator is dwindled, reduced the technology difficulty of making, for the client has saved valuable space, refrigerating efficiency also is improved.

As preferably, described infrabasal plate is provided with the galvanic couple flow deflector identical to quantity on some and the infrabasal plate, described upper substrate is by the upper substrate I that is in the same plane, upper substrate II and upper substrate III form, described upper substrate I, upper substrate II and upper substrate III all are rectangle, the upper substrate I, upper substrate II and upper substrate III are provided with the galvanic couple flow deflector identical to quantity on the some and corresponding substrate, the vertical edge of upper substrate I and upper substrate II and infrabasal plate matches, the straight flange of upper substrate III and infrabasal plate matches, the upper substrate I, upper substrate II and upper substrate III respectively with the respective regions of infrabasal plate and zone in galvanic couple to being combined to form three independently refrigeration area I with flow deflector, refrigeration area II and refrigeration area III, the minisize thermoelectric refrigerator that the upper substrate that is made of three little substrates and infrabasal plate form a L-type has satisfied the specific (special) requirements of optical communication field to refrigerator.

As preferably, galvanic couple in described refrigeration area I or refrigeration area II or the refrigeration area III pair is electrically connected the formation series loop with corresponding flow deflector, some galvanic couples that are electrically connected in series pair consist of independently refrigerated area with corresponding upper and lower substrate, satisfy the refrigeration requirement of the zones of different of product.

As preferably, described refrigeration area I is provided with 10 pairs of galvanic couples pair, and described refrigeration area II is provided with 10 pairs of galvanic couples pair, and described refrigeration area III is provided with 20 pairs of galvanic couples pair.

The beneficial effects of the utility model are: adopt the infrabasal plate of the upper substrate of a plurality of different sizes and single L type to be combined to form structural design with some independent coolings zone, the volume that makes whole thermoelectric cooling device compare a plurality of thermoelectric cooling device combinations dwindles greatly, satisfied the specific (special) requirements of optical communication field to thermoelectric cooling device shape and volume, reduced the technology difficulty that the client uses, for the client has saved valuable space and improved the refrigerating efficiency of thermoelectric cooling device.

Description of drawings

Fig. 1 is a kind of contour structures schematic diagram of the present utility model.

Fig. 2 is the schematic top plan view of Fig. 1.

Fig. 3 is the cross-sectional view of Fig. 1.

Fig. 4 is the lower substrate structure schematic diagram among Fig. 1.

Fig. 5 is the upper substrate I structural representation among Fig. 1.

Fig. 6 is the upper substrate II structural representation among Fig. 1.

Fig. 7 is the upper substrate III structural representation among Fig. 1.

1. infrabasal plates among the figure, 2.P type semiconductor grain, 3.N type semiconductor grain, 4. flow deflector, 5. battery lead plate, 6. upper substrate I, 7. upper substrate II, 8. upper substrate III, 9. refrigerated area I, 10. refrigerated area II, 11. refrigerated area III.

The specific embodiment

Below by embodiment, and by reference to the accompanying drawings, the technical solution of the utility model is described in further detail.

Embodiment: a kind of L-type minisize thermoelectric cooler of present embodiment, such as Fig. 1, Fig. 2 and shown in Figure 3, comprise up-down structure and identical upper substrate and the infrabasal plate 1 of size, be located at the galvanic couple that formed by P-type semiconductor particle 2 and N-type semiconductor particle 3 between the upper and lower base plate to and with flow deflector 4 and the battery lead plate 5 of galvanic couple to welding, flow deflector is installed between galvanic couple pair and the substrate, as shown in Figure 4, infrabasal plate is L-shaped, be attached with the galvanic couple flow deflector identical to quantity on some and the infrabasal plate on the infrabasal plate, upper substrate is by the upper substrate I 6 that is in the same plane, upper substrate II 7 and upper substrate III 8 form, such as Fig. 5, Fig. 6 and shown in Figure 7, the upper substrate I, upper substrate II and upper substrate III all are rectangle, the upper substrate I, be attached with the galvanic couple flow deflector identical to quantity on the some and corresponding substrate on upper substrate II and the upper substrate III, the vertical edge of upper substrate I and upper substrate II and infrabasal plate matches, the straight flange of upper substrate III and infrabasal plate matches, the upper substrate I, upper substrate II and upper substrate III respectively with the respective regions of infrabasal plate and zone in galvanic couple to being combined to form three independently refrigeration area I 9 with flow deflector, refrigeration area II 10 and refrigeration area III 11, galvanic couple in refrigeration area I or refrigeration area II or the refrigeration area III pair is electrically connected the formation series loop with corresponding flow deflector, in the refrigeration area I, be designed with 10 pairs of galvanic couples that are electrically connected by flow deflector pair, the refrigeration area II is designed with 10 pairs of galvanic couples that are electrically connected by flow deflector pair, and the refrigeration area III is designed with 20 pairs of galvanic couples that are electrically connected by flow deflector pair.

During assembling during cooler, 10 flow deflectors are attached to upper substrate I surface, 10 flow deflectors are attached to upper substrate II surface, 20 flow deflectors are attached to upper substrate III surface, 40 flow deflectors are attached to the infrabasal plate surface, below infrabasal plate is placed on, 40 pairs of galvanic couples that are comprised of P-type semiconductor particle and N-type semiconductor particle are installed on the infrabasal plate the position correspondence of pressing the substrate surface flow deflector, between semiconductor grain and flow deflector, be coated with high temperature scolding tin, again with the upper substrate I, above upper substrate II and upper substrate III correspondence cover, utilize the special fixture clamping and send into heating in the heating furnace, after high-temperature soldering, form L-type minisize thermoelectric cooler, during use, the device that needs are cooled off places on the corresponding substrate of cooler, electric current is imported by battery lead plate can reach refrigeration in the cooler or heat effect.

More than explanation is not that the utility model has been done restriction; the utility model also is not limited only to giving an example of above-mentioned explanation; the variation that those skilled in the art make in essential scope of the present utility model, retrofit, increase or replace, all should be considered as protection domain of the present utility model.

Claims

1. L-type minisize thermoelectric cooler, it is characterized in that: comprise up-down structure and identical upper substrate and the infrabasal plate (1) of size, be located at the galvanic couple that formed by P-type semiconductor particle (2) and N-type semiconductor particle (3) between the upper and lower base plate to and with flow deflector (4) and the battery lead plate (5) of galvanic couple to welding, described flow deflector is located between galvanic couple pair and the substrate, described infrabasal plate is L-shaped, described upper substrate is comprised of the some fritter substrates that are in the same plane, galvanic couple pair in the infrabasal plate of described fritter substrate and corresponding region and the zone, flow deflector consists of some independently refrigerated areas, and described refrigerated area is electrically connected the formation series loop and is connected with described battery lead plate.

2. L-type minisize thermoelectric cooler according to claim 1, it is characterized in that: described infrabasal plate is provided with the galvanic couple flow deflector (4) identical to quantity on some and the infrabasal plate, described upper substrate is by the upper substrate I (6) that is in the same plane, upper substrate II (7) and upper substrate III (8) form, described upper substrate I, upper substrate II and upper substrate III all are rectangle, the upper substrate I, upper substrate II and upper substrate III are provided with the galvanic couple flow deflector identical to quantity on the some and corresponding substrate, the vertical edge of upper substrate I and upper substrate II and infrabasal plate matches, the straight flange of upper substrate III and infrabasal plate matches, the upper substrate I, upper substrate II and upper substrate III respectively with the respective regions of infrabasal plate and zone in galvanic couple to being combined to form three independently refrigeration area I (9) with flow deflector, refrigeration area II (10) and refrigeration area III (11).

3. L-type minisize thermoelectric cooler according to claim 2 is characterized in that: the galvanic couple in described refrigeration area I (9) or refrigeration area II (10) or the refrigeration area III (11) pair is electrically connected the formation series loop with corresponding flow deflector (4).

4. according to claim 2 or 3 described L-type minisize thermoelectric coolers, it is characterized in that: described refrigeration area I (9) is provided with 10 pairs of galvanic couples pair, and described refrigeration area II (10) is provided with 10 pairs of galvanic couples pair, and described refrigeration area III (11) is provided with 20 pairs of galvanic couples pair.