CN102214772B - High-power LED (light-emitting diode) support - Google Patents
High-power LED (light-emitting diode) support Download PDFInfo
- Publication number
- CN102214772B CN102214772B CN2010101639705A CN201010163970A CN102214772B CN 102214772 B CN102214772 B CN 102214772B CN 2010101639705 A CN2010101639705 A CN 2010101639705A CN 201010163970 A CN201010163970 A CN 201010163970A CN 102214772 B CN102214772 B CN 102214772B
- Authority
- CN
- China
- Prior art keywords
- insulating body
- power led
- conducting
- high power
- rear surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Led Device Packages (AREA)
Abstract
The invention discloses a high-power LED (light-emitting diode) support, comprising an insulator, at least three radiating bases and at least three groups of conducting elements, wherein the insulator is provided with one upper-end surface and one lower-end surface, and the upper-end surface is provided with a concave functional zone; the at least three radiating bases are respectively arranged in the insulator and separated mutually; each radiating base is provided with a first surface which is exposed in the functional zone and a second surface which is exposed out of the lower-end surface of the insulator; and the at least three groups of conducting elements are arranged in the insulator, adjacent to the radiating bases and separated mutually; each group of conducting elements comprises two conducting supports; and one end, close to each radiating base, of each conducting support is exposed in the functional zone of the insulator partially so as to form an electrical contact. Therefore, the radiating bases can bear light-emitting chips independently; and the light-emitting chips can be electrically connected with one group of conducting elements respectively, thus each light-emitting chip can be driven respectively.
Description
Technical field
The present invention relates to the High Power LED support, refer to especially a kind ofly in order to carrying a plurality of luminescence chips, and each luminescence chip is able to the High Power LED support of drive.
Background technology
The application of light-emitting diode is quite ripe, from the light-emitting diode of early stage Lamp form, is developed to the light-emitting diode of nearest SMD form.Especially now in illumination market, gradually replace conventional bulb by light-emitting diode, because light-emitting diode has the advantages such as power consumption is little, volume is little, so the application of light-emitting diode is taken seriously gradually.
But, utilize light-emitting diode to replace conventional bulb, the problem that need overcome is that light-emitting diode in running, can produce quite high heat energy, if these heat energy can't be derived rapidly, will cause the damage of light-emitting diode.
Therefore, the now on the market application of existing High Power LED, so-called High Power LED mainly is provided with a radiating block exactly in light-emitting diode, so that luminescence chip is arranged on the radiating block, the heat energy that luminescence chip is discharged is seen through radiating block and is outwards derived fast.
As shown in Figure 1, be the schematic diagram of an existing LED support.As shown in the figure, this LED support includes an insulating body A, a cooling base B and a plurality of conducting bracket C.Wherein, this cooling base B and this a plurality of conducting bracket C are arranged among the insulating body A, and a plurality of conducting bracket C be centered around cooling base B around, and those a plurality of conducting bracket C have extended to form electrical pin D outside insulating body A.
Among the figure, the outside, the both sides of insulating body A is formed with respectively three electrical pin D, and a side is as positive pole, and opposite side then is provided with a plurality of luminescence chip E then as negative pole on the cooling base B, make its a plurality of luminescence chip E and a plurality of conducting bracket C carry out electrically connect.
But these forms when carrying a plurality of luminescence chip E on the cooling base B, link because a plurality of luminescence chip E simultaneously carries out circuit with a plurality of conducting bracket C, so each luminescence chip E drive respectively, only can drive simultaneously.
In addition, because the positive-negative polarity of each luminescence chip E is not identical, therefore on using, the luminescence chip E of opposed polarity can't be carried on the same cooling base B, cause light-emitting diode restriction in the use.
Summary of the invention
Main purpose of the present invention, be to provide a kind of can be in order to carrying a plurality of luminescence chips, and each luminescence chip can be in this LED support drive.
In order to achieve the above object, the present invention is characterized in to include an insulating body, have a upper end face and a rear surface, and have recessed functional areas on this upper end face; At least three cooling bases are located at respectively in this insulating body and are mutually separated, and each cooling base has one and is exposed to the second surface that first surface and in these functional areas is exposed to the rear surface of this insulating body; And at least three group conducting element, be located at adjacent with those cooling bases in this insulating body and mutually separate, each group conducting element includes two conducting brackets, and the end that those conducting brackets are adjacent with each cooling base is that part is exposed in the functional areas of this insulating body, forms electrical contact.
In this way, those cooling bases can be respectively in order to independent bearing one luminescence chip, and those luminescence chips can be respectively and one group of conducting element electrically connect, makes each luminescence chip be able to drive.
Description of drawings
Fig. 1 is the schematic diagram of an existing LED support;
Fig. 2 is schematic diagram of the present invention;
Fig. 3 is generalized section of the present invention;
Fig. 4 is the schematic diagram that RGB three-colour light-emitting chip is carried in the present invention;
Fig. 5 is the generalized section of second embodiment of the invention;
Fig. 6 is the schematic diagram of third embodiment of the invention.
[main element symbol description]
Existing component symbol
The A insulating body
The B cooling base
The C conducting bracket
The electrical pin of D
The E luminescence chip
Component symbol of the present invention
10 insulating bodies
11 upper end faces
12 rear surfaces
13 functional areas
20 cooling bases
21 first surfaces
22 second surfaces
30 conducting elements
31 conducting brackets
32 electrical contacts
33 electrical pins
34,34 ' contact-making surface
40 luminescence chips
Embodiment
Below will cooperate graphic and embodiment describes embodiments of the present invention in detail, by this to the present invention how the application technology means implementation procedure that solves technical problem and reach the technology effect can fully understand and implement according to this.
See also Fig. 2 and shown in Figure 3, be High Power LED support of the present invention, it includes an insulating body 10, at least three cooling bases 20 and at least three group conducting elements 30.Wherein, an insulating body 10, it has a upper end face 11 and a rear surface 12, and the central position of this upper end face 11 has recessed functional areas 13, and is formed with reflecting surface 14 in these functional areas, and this reflecting surface 14 has an angle of inclination.
At least three cooling bases 20, each cooling base 20 is located at respectively in this insulating body 10 and is mutually separated, and each cooling base 20 has a first surface 21 and a second surface 22, its first surface 21 is exposed in the functional areas 13 of this insulating body 10, and second surface 22 is exposed to the rear surface 12 of insulating body 10; In the present embodiment, the second surface 22 of each cooling base 20 and rear surface 12 coplines of insulating body 10, in practical application, the second surface 22 of each cooling base 20 also can be lower than the rear surface 12 of insulating body 10.
At least three group conducting elements 30, also be located at respectively in the insulating body 10 and adjacent with cooling base 20 and mutually separate, and each group conducting element 30 is made of two conducting brackets 31, each conducting bracket 31 and cooling base 20 adjacent ends are that part is exposed in the functional areas 13 of insulating body 10 and forms electrical contact 32, the side that the other end then extends to insulating body 10 forms electrical pin 33, and a contact-making surface 34 is formed on the bottom of each electrical pin 33.In the present embodiment, rear surface 12 coplines of each contact-making surface 34 and insulating body 10; But in practical application, each contact-making surface 34 also can be lower than the rear surface 12 of insulating body 10.
In this way, each cooling base 20 can be respectively in order to independent bearing one luminescence chip (expression in graphic), and each luminescence chip can carry out electrically connect with one group of conducting element 20 respectively, makes each luminescence chip be able to drive.
See also shown in Figure 4ly, carry the schematic diagram of RGB three-colour light-emitting chip for the present invention.As shown in the figure, on three cooling bases 20 among the present invention respectively independent bearing the luminescence chip 40 of one RGB, three looks is arranged, because each cooling base 20 is adjacent one group of conducting element 30 is arranged, and each group conducting element 30 is formed by two conducting brackets 31, therefore the luminescence chip 40 of RGB three looks can independently respectively carry out electrically connect with each two conducting bracket 31 of organizing in conducting element 30; In the present embodiment, two conducting brackets 31 of each group conducting element 30 are respectively in order to be electrically connected an anodal and negative power supply, make each luminescence chip 40 be seen through each and organize conducting element 30 and independently driven.
In this way, the luminescence chip 40 of RGB three looks can be carried on respectively on each cooling base 20, and see through each cooling base 20 and cooperate one group of conducting element 30 to reach the effect of luminescence chip 40 drive of RGB three looks, with the usefulness for the luminescence chip of RGB three looks, supply with different power supplys, make the luminescence chip 40 of RGB three looks be brought into play best usefulness running.
See also shown in Figure 5ly, be the generalized section of second embodiment of the invention.As shown in the figure, each conducting bracket 30 and each cooling base 20 adjacent ends expose in the functional areas 13 of insulating body 10, with each cooling base 20 away from the end rear surface 12 that then can be exposed to insulating body 10 be formed with a contact-making surface 34 '.In the present embodiment, rear surface 12 coplines of each contact-making surface 34 ' and insulating body 10; But in practical application, each contact-making surface 34 ' also can be a little less than the rear surface 12 of insulating body 10.
See also shown in Figure 6ly, be the schematic diagram of third embodiment of the invention.As shown in the figure, the present invention includes an insulating body 10, four cooling bases 20 and four groups of conducting elements 30.Wherein, four cooling bases 20 and four groups of conducting elements 30 are located at respectively in the insulating body 10 and are also mutually separated, and in the functional areas that are exposed to insulating body 10 13 of part, wherein four groups of conducting elements 30 include respectively two conducting brackets 31, each conducting bracket 31 extends to insulating body 10 outsides and is formed with electrical pin 33, its four cooling bases 20 can be distinguished independent bearing one luminescence chip 40, and each electrical pin 33 can be in series or in parallel with each other.In the present embodiment, each luminescence chip 40 is the luminescence chip 40 of identical polar, therefore when practical operation, the conducting bracket 31 of the conducting bracket 31 of two groups of adjacent conducting elements 30 and relative two groups of conducting elements 30 can be connected simultaneously with in parallel, also can drive simultaneously each luminescence chip 40.
Although the present invention discloses as above with aforesaid embodiment; so it is not to limit the present invention; anyly have the knack of alike skill person; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, therefore scope of patent protection of the present invention must be looked the appended claim person of defining of this specification and is as the criterion.
Claims (8)
1. High Power LED support is characterized in that including:
One insulating body has a upper end face and a rear surface, and has recessed functional areas on this upper end face, also has a reflecting surface in these functional areas, and this reflecting surface has an angle of inclination;
At least three cooling bases are located at respectively to change in the insulating body and mutually and are separated, and each cooling base has one and is exposed to the second surface that first surface and in these functional areas is exposed to the rear surface of this insulating body; And
At least three group conductive components, be located at adjacent with described a plurality of cooling bases in this insulating body and mutually separate, each group conductive component includes two conducting brackets, and the end that described a plurality of conducting bracket is adjacent with each cooling base is that part is exposed in the functional areas of this insulating body, forms electrical contact.
2. High Power LED support as claimed in claim 1 is characterized in that, the rear surface copline of the second surface of described a plurality of cooling bases and this insulating body.
3. High Power LED support as claimed in claim 1 is characterized in that, the second surface of described a plurality of cooling bases is lower than the rear surface of this insulating body.
4. High Power LED support as claimed in claim 1, it is characterized in that, described a plurality of conducting bracket then extends to the side formation one electrical pin of insulating body away from an end of this insulating base, and the bottom of described a plurality of electrical pins is formed with a contact-making surface.
5. High Power LED support as claimed in claim 4 is characterized in that, the rear surface copline of the contact-making surface of described a plurality of electrical pins and this insulating body.
6. High Power LED support as claimed in claim 4 is characterized in that, the contact-making surface of described a plurality of electrical pins is lower than the rear surface of this insulating body.
7. High Power LED support as claimed in claim 1 is characterized in that, described a plurality of conducting brackets and each cooling base away from an end be exposed to the rear surface of insulating body, and be formed with a contact-making surface.
8. High Power LED support as claimed in claim 7 is characterized in that, the rear surface copline of described a plurality of contact-making surfaces and this insulating body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101639705A CN102214772B (en) | 2010-04-12 | 2010-04-12 | High-power LED (light-emitting diode) support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101639705A CN102214772B (en) | 2010-04-12 | 2010-04-12 | High-power LED (light-emitting diode) support |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102214772A CN102214772A (en) | 2011-10-12 |
| CN102214772B true CN102214772B (en) | 2013-04-24 |
Family
ID=44745985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101639705A Expired - Fee Related CN102214772B (en) | 2010-04-12 | 2010-04-12 | High-power LED (light-emitting diode) support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102214772B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102315376A (en) * | 2010-06-30 | 2012-01-11 | 一诠精密电子工业(中国)有限公司 | Method for making electric-heat separated light emitting diode support structure |
| CN105070810B (en) * | 2015-07-22 | 2018-02-09 | 厦门市信达光电科技有限公司 | A kind of polycrystalline LED package supports, three core LED packages and four core LED packages |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1656860A (en) * | 2002-03-21 | 2005-08-17 | 通用电气公司 | Flexible interconnect structures for electrical devices and light sources incorporating the same |
| CN2800486Y (en) * | 2005-06-03 | 2006-07-26 | 光颉科技股份有限公司 | Improvement of high power LED heat radiation module structure |
| CN201204205Y (en) * | 2008-06-04 | 2009-03-04 | 徐泓 | High-power LED encapsulation structure |
-
2010
- 2010-04-12 CN CN2010101639705A patent/CN102214772B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1656860A (en) * | 2002-03-21 | 2005-08-17 | 通用电气公司 | Flexible interconnect structures for electrical devices and light sources incorporating the same |
| CN2800486Y (en) * | 2005-06-03 | 2006-07-26 | 光颉科技股份有限公司 | Improvement of high power LED heat radiation module structure |
| CN201204205Y (en) * | 2008-06-04 | 2009-03-04 | 徐泓 | High-power LED encapsulation structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102214772A (en) | 2011-10-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2011181925A (en) | Semiconductor light emitting device including multi-cell array, light emitting module, and lighting system | |
| CN102231378A (en) | Light-emitting diode (LED) packaging structure and preparation method thereof | |
| WO2008078880A1 (en) | A luminous element having a plurality of cells | |
| CN103545337A (en) | Three-dimensional light-emitting device formed by inverted light-emitting unit array and manufacturing method of three-dimensional light-emitting device | |
| CN102214772B (en) | High-power LED (light-emitting diode) support | |
| JP2014107369A (en) | Semiconductor light-emitting device | |
| CN208589461U (en) | Flip chip type light emitting module | |
| CN102255012B (en) | Manufacturing method and structure of high-voltage direct-current light-emitting diode chip | |
| US9484493B2 (en) | Rectifying unit, a light emitting diode device, and the combination thereof | |
| CN202712178U (en) | Stereoscopic light-emitting device composed of upside-down mounted light-emitting unit arrays | |
| CN104534302A (en) | LED lamp | |
| CN201944618U (en) | Light-emitting device | |
| CN203010551U (en) | Light emitting diode (LED) aluminum substrate | |
| CN201680214U (en) | Light-emitting device using alternating current | |
| CN201866558U (en) | Led integrated module | |
| CN101986009A (en) | Adaptive alternating current light-emitting diode filament and illuminating lamp | |
| CN101645441B (en) | Multi-cell connected high-power photoelectric device with single-cell failure self-protecting function | |
| CN103307470A (en) | Light emitting device | |
| CN103997808A (en) | Compact LED drive power source | |
| CN103280518A (en) | Vertically suspended type LED | |
| TWI769932B (en) | Light source module | |
| CN207458944U (en) | Super-high-power LED chip and super-high-power LED device | |
| CN203481249U (en) | Ultrahigh power photoelectric device capable of improving heat distribution concentration | |
| CN201877427U (en) | Integrated high-power LED (light-emitting diode) | |
| CN218939723U (en) | High-brightness COB packaging structure and LED lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130424 Termination date: 20180412 |