CN203010551U

CN203010551U - Light emitting diode (LED) aluminum substrate

Info

Publication number: CN203010551U
Application number: CN2012205955829U
Authority: CN
Inventors: 刘浩; 韦鸿佑; 彭海源; 赵空军; 蔡颖识
Original assignee: Dongguan Kechenda Electronic Technology Co Ltd
Current assignee: Dongguan Kechenda Electronic Technology Co Ltd
Priority date: 2012-11-13
Filing date: 2012-11-13
Publication date: 2013-06-19
Anticipated expiration: 2022-11-13

Abstract

The utility model discloses a light emitting diode (LED) aluminum substrate which comprises a bottom substrate, an insulating layer and a conducting layer, wherein the insulating layer and the conducting layer are sequentially stacked on the bottom substrate, a plurality of cavities used for containing LED chips are formed in the bottom substrate in a spaced mode, and the insulating layer and the conducting layer are sequentially arranged on positions, on two sides of the cavities, of the upper surface of the bottom substrate. Therefore, the cavities are formed in the bottom substrate, the LED chips are directly contacted with the bottom substrate, and heat given off by the LED chips can be rapidly diffused through the bottom substrate. Consequently, radiating efficiency of the LED chips is improved, working temperature of the LED chips is reduced, service life of the LED chips is prolonged, and meanwhile lighting effects of an LED lamp are improved.

Description

The LED aluminium base

Technical field

The utility model relates to the lighting field technology, refers in particular to a kind of LED aluminium base that can accelerate the LED chip radiating efficiency.

Background technology

the LED lamp be a kind of can be the semiconductor of visible light with electric energy conversion, it is high that it has efficient, photochromic pure, the light quality is high, energy consumption is little, life-span is long, the advantages such as illuminator points of proximity light source, and operating voltage is low, emission response time is extremely short, operating temperature range is wide, sound construction, the series of characteristics such as stable and reliable for performance, extremely people's favor, and, green illumination is the Eco-Design target that follow in the whole world, LED is as a kind of energy-efficient light source, need not fill mercury, can reduce energy resource consumption and reduce greenhouse gases and other pollutants that discharges in the atmosphere, also LED and solar cell combination can be used, so, it is one of light source of environmental protection, it is the novel green light source of 21 century of generally acknowledging in the world.

traditional LED light fixture has aluminium base and a plurality of LED chips that are arranged on aluminium base, wherein, this aluminium base comprises substrate and the insulating barrier and the conductive layer that are set in turn on substrate, LED chip is installed on conductive layer, there is following defective in this LED lamp bar structure: LED chip directly contacts with conductive layer, the heat that LED chip sends will pass through conductive layer, insulating barrier passes to substrate, thermoelectricity does not separate, radiating effect is poor, cause the LED lamp short service life, and, substrate, the stacked cumulative of insulating barrier and conductive layer raises LED chip, illumination zone is narrow, light efficiency is poor.Therefore, tackle this LED aluminum substrate structure and improve, to avoid defects.

The utility model content

In view of this, the utility model is for the disappearance of prior art existence, and its main purpose is to provide a kind of LED aluminium base, it is by arranging cavity on substrate, LED chip is installed in cavity, and LED chip directly contacts with substrate, rapid heat dissipation, simultaneously, illumination zone is wider, light efficiency good.

For achieving the above object, the utility model adopts following technical scheme:

A kind of LED aluminium base, this LED aluminium base includes substrate and is superimposed on successively insulating barrier and conductive layer on this substrate, be arranged at intervals with a plurality of cavitys be used to holding LED chip on this substrate, above-mentioned insulating barrier and conductive layer are set in turn on the substrate upper surface of cavity both sides.

As a kind of preferred version: the corresponding substrate another side of described cavity institute is concordant with substrate bottom surface maintenance.

As a kind of preferred version: be provided with through hole between described adjacent two cavitys.

As a kind of preferred version: described conductive is Copper Foil.

The utility model compared with prior art has obvious advantage and beneficial effect, particularly, as shown from the above technical solution, by cavity is set on substrate, LED chip directly contacts with substrate, and the heat that LED chip sends can distribute by substrate fast.By this, this LED aluminium base can improve the LED chip radiating efficiency after LED chip is installed, and reduces the LED chip operating temperature, extends the service life of LED chip, simultaneously, improves LED lamp illuminating effect.

For more clearly setting forth architectural feature of the present utility model and effect, be described in detail below in conjunction with accompanying drawing and specific embodiment.

Description of drawings

Fig. 1 is the assembling schematic diagram of the utility model;

Fig. 2 is the A-A place cross-sectional schematic of Fig. 1;

Fig. 3 is the M place enlarged diagram of Fig. 2.

The accompanying drawing identifier declaration:

10, substrate 11, cavity

12, through hole 13, substrate upper surface

14, substrate bottom surface 20, insulating barrier

30, conductive layer 40, LED chip

41, conductive pin.

The specific embodiment

The utility model as shown in Figure 1 to Figure 3, a kind of LED aluminium base includes substrate 10, insulating barrier 20 and as the copper foil layer of conductive layer 30, wherein:

Be arranged at intervals with a plurality of cavitys 11 be used to holding LED chip 40 on this substrate 10, above-mentioned insulating barrier 20 and conductive layer 30 are set in turn on the substrate upper surface 13 of cavity 11 both sides, corresponding substrate 10 another sides of this cavity 11 are concordant with substrate bottom surface 14 maintenances, and are provided with through hole 12 between two adjacent cavitys 11.

When the utility model is installed LED chip, step is as follows: LED chip 40 is placed in cavity 11, and LED chip 40 directly contacts with substrate 10, and on LED chip 40, conductive pin 41 stretches out on the conductive layer 30 that cavity 11 is welded in cavity 11 both sides.

Design focal point of the present utility model is, by cavity is set on substrate, LED chip directly contacts with substrate, and the heat that LED chip sends can distribute by substrate fast.By this, this LED aluminium base can improve the LED chip radiating efficiency after LED chip is installed, and reduces the LED chip operating temperature, extends the service life of LED chip, simultaneously, improves LED lamp illuminating effect.

The above, it is only preferred embodiment of the present utility model, be not that technical scope of the present utility model is imposed any restrictions, therefore all foundations technical spirit of the present utility model all still belongs in the scope of technical solutions of the utility model any trickle modification made for any of the above embodiments, equivalent variations and modification.

Claims

1. LED aluminium base, it is characterized in that: this LED aluminium base includes substrate and is superimposed on successively insulating barrier and conductive layer on this substrate, be arranged at intervals with a plurality of cavitys be used to holding LED chip on this substrate, above-mentioned insulating barrier and conductive layer are set in turn on the substrate upper surface of cavity both sides.

2. LED aluminium base according to claim 1, it is characterized in that: the corresponding substrate another side of described cavity institute is concordant with substrate bottom surface maintenance.

3. LED aluminium base according to claim 1, is characterized in that: be provided with through hole between described adjacent two cavitys.

4. LED aluminium base according to claim 1, it is characterized in that: described conductive is Copper Foil.