CN202839739U

CN202839739U - Large-power light-emitting diode (LED) packaging structure

Info

Publication number: CN202839739U
Application number: CN 201220524441
Authority: CN
Inventors: 杨承兰
Original assignee: Individual
Current assignee: Individual
Priority date: 2012-10-15
Filing date: 2012-10-15
Publication date: 2013-03-27
Anticipated expiration: 2022-10-15

Abstract

The utility model provides a large-power light-emitting diode (LED) packaging structure which comprises an LED lens, an aluminum base and an LED pole. An LED copper base is arranged in a groove arranged on the upper surface of the aluminum base, the LED pole is fixed on the LED copper base, a plastic base is arranged in a groove arranged on the lower surface of the aluminum base and the LED lens is arranged on the top end of the aluminum cover. The large-power LED packaging structure is novel and unique in design, simple and practical in structure and capable of improving power of the LED, prolonging service life of the LED, reducing light scattering, improving uniformity of lighting and reducing consumption of lighting, thereby being an ideal LED packaging structure.

Description

A kind of high-power LED encapsulation structure

Technical field

The utility model relates to lighting apparatus, particularly a kind of high-power LED encapsulation structure.

Background technology

LED be a kind of can be the semiconductor of luminous energy with electric energy conversion, it has changed the principle that the incandescent lamp tungsten filament is luminous and the electricity-saving lamp tricolor powder is luminous, the characteristics of LED are obvious, long, the high and low radiation of light efficiency of life-span and low-power consumption.

LED(Light Emitting Diode), light-emitting diode is a kind of solid-state semiconductor device, it can be electric energy conversion luminous energy directly, and the heart of LED is a semi-conductive wafer, and an end of wafer is attached on the support, it is negative pole, the other end connects the positive pole of power supply, and whole wafer is got up by silica gel packaging, and semiconductor wafer is comprised of two parts, a part is P type semiconductor, occupy an leading position in its hole, the inside, the other end is N type semiconductor, mainly is electronics here.But when these two kinds of semiconductors couple together, just form one " P-N knot " between them, when electric current acts on this wafer by wire, electronics will be pushed to the P district, electronics is with hole-recombination in the P district, then will send energy with the form of photon, and light wavelength determines the color of light, determine by forming P-N knot material.

Yet, the operation principle of LED lamp is so that become very outstanding in high-power LED illumination industry heat dissipation problem, many LED illumination schemes are paid little attention to heat radiation, or technical merit is limited, so at present the high-powered LED lamp ubiquity of volume production is nothing like theoretical value actual life, cost performance is lower than the awkward situation of conventional lamp, in order to improve the useful life of LED light fixture, really accomplish to be fit to business-like volume production, the LED illuminating industry independently or with professional Heat Conduction Material supplier cooperates to step up the development of new Heat Conduction Material.

General LED lamp is in light transmittance, light intensity, useful life, and the deficiency that all shows at the aspects such as dazzling problem of design and high-power illumination especially for meeting the demand in market, is promoted the high-power LED encapsulation technology, and is imperative.

The utility model content

For above problem, the purpose of this utility model designs a kind of high-power LED encapsulation structure, improves power and the life-span of LED, reduces light scattering, improves the illumination uniformity, and reduced simultaneously illumination and consumed,

The utility model provides a kind of high-power LED encapsulation structure, comprise LED lens, aluminium base and LED electrode, described LED copper base places the groove of aluminium base upper surface, described LED electrode is fixed on the LED copper base, described plastic base places the groove of aluminium lid lower surface, and the aluminium lid top arranges the LED lens.

As further improvement of the utility model, the thickness of described LED lens at 5mm between the 15mm.

As further improvement of the utility model, described LED lens are convex lens.

As further improvement of the utility model, described plastic base is shaped as circle or hexagon.

As further improvement of the utility model, described aluminium base profile is cylindrical or round platform, perhaps the polygon cylinder.

The beneficial effects of the utility model are:

1, the aluminium base profile is cylindrical or round platform, perhaps polygon cylinder, and different profiles can produce multiple power, and the light source of various spot shapes is used for applicable different occasions.

2, using the plastic base major function is for fixed L ED electrode more firmly.

3, using the purpose of copper base is for led chip is played fixing, heat conduction, catoptrical effect at support.

Description of drawings

Fig. 1 is the structural representation of utility model high-power illumination illumination level LED encapsulating structure.

Fig. 2 is the copper substrate structure schematic diagram.

Fig. 3 is the plastic base structural representation.

The tabulation of accompanying drawing structural member:

11, aluminium lid;

21, LED lens;

31, plastic base;

41, LED electrode;

51, aluminium base;

61, LED copper base.

Embodiment

Below in conjunction with the drawings and specific embodiments, further illustrate the utility model, should understand following embodiment and only be used for explanation the utility model and be not used in restriction scope of the present utility model.Need to prove, word 'fornt', 'back', " left side ", " right side ", "up" and "down" that use is described below refer to the direction in the accompanying drawing, word " interior " and " outward " refer to respectively towards or away from the direction of particular elements geometric center.

As shown in Figure 1, a kind of high-power LED encapsulation structure, comprise LED lens 21, aluminium base 51 and LED electrode 41, described LED copper base 61 places the groove of aluminium base 51 upper surfaces, described LED electrode 41 is fixed on the LED copper base 61, described plastic base 31 places the groove of aluminium lid 11 lower surfaces, aluminium lid 11 tops are provided with LED lens 21, as shown in Figure 3, plastic base 31 major functions are for fixed L ED electrode more firmly, as shown in Figure 2, using the purpose of copper base is in order to play fixing at support to led chip, heat conduction, catoptrical effect.

As the further improvement of this programme, between the 15mm, LED lens 21 are chosen as convex lens to the thickness of described LED lens 21 at 5mm, and this is for its light transmittance being reached more than 95%, can effectively reduce light loss, thereby guarantee the encapsulating structure steady operation.

As the further improvement of this programme, described aluminium base 51 profiles are cylindrical or round platform, perhaps polygon cylinder, and different profiles can produce multiple power, and the light source of various spot shapes is used for being applicable to different occasions.

The above; it only is preferred embodiment of the present utility model; be not to be the restriction of the utility model being made any other form, and according to any modification or equivalent variations that technical spirit of the present utility model is done, still belong to the utility model scope required for protection.

Claims

1. high-power LED encapsulation structure, comprise LED lens (21), aluminium base (51) and LED electrode (41), described LED copper base (61) places the groove of aluminium base (51) upper surface, it is characterized in that: described LED electrode (41) is fixed on the LED copper base (61), described plastic base (31) places the groove of aluminium lid (11) lower surface, and aluminium lid (11) top arranges LED lens (21).

2. a kind of high-power LED encapsulation structure according to claim 1 is characterized in that: the thickness of described LED lens (21) at 5mm between the 15mm.

3. a kind of high-power LED encapsulation structure according to claim 2, it is characterized in that: described LED lens (21) are convex lens.

4. a kind of high-power LED encapsulation structure according to claim 1, it is characterized in that: described plastic base (31) is shaped as circle or hexagon.

5. a kind of high-power LED encapsulation structure according to claim 1, it is characterized in that: described aluminium base (51) profile is cylindrical or round platform, perhaps the polygon cylinder.