CN208589461U - Flip chip type light emitting module - Google Patents
Flip chip type light emitting module Download PDFInfo
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- CN208589461U CN208589461U CN201820946447.1U CN201820946447U CN208589461U CN 208589461 U CN208589461 U CN 208589461U CN 201820946447 U CN201820946447 U CN 201820946447U CN 208589461 U CN208589461 U CN 208589461U
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Abstract
The utility model discloses a flip chip type light emitting module, which comprises a heat dissipation substrate, a packaging assembly and a light emitting wafer. The packaging assembly comprises a frame body surrounding the heat dissipation substrate and a lens unit arranged on the frame body. The frame includes an electrically conductive path. The light emitting chip is arranged on the heat dissipation substrate and comprises a top end conductive contact and a light emitting surface which are positioned on the same side. The top conductive contact is electrically connected to the conductive path through a conductor. The utility model discloses flip chip type light emitting module has the technological effect that the heat dissipation is good and can reduce the volume.
Description
Technical field
The utility model relates to a kind of light emitting modules, more particularly to a kind of crystal-coated light-emitting module.
Background technique
Human lives be unable to do without illumination, and lighting device is gradually taken by other light-emitting components from traditional incandescent lamp
Generation, such as: light emitting diode.It and include driving back because light emitting diode has the advantages of small in size, energy consumption low, low driving voltage
The main circuit board on road, which assembles, to be formed together after module, can be applied to other equipment as light source use.Such module
Be widely used in such as: household wares indicator light, the backlight of display, the lighting module of portable electronic equipment, arrangement for detecting it
The fields such as light source or car light.
Refering to fig. 1, a kind of existing light emitting module 9, comprising a main circuit board 91, a luminescent wafer 92, two conducting wires 93 with
An and package assembling 94.Luminescent wafer 92 is arranged in main circuit board 91, and the conductive junction point for being located at two opposite sides including two
921 and an optical axis L.One end of each conducting wire 93 is electrically connected to corresponding conductive junction point 921, and the other end is then electrically connected to
Main circuit board 91.Package assembling 94 include a bracket 941 that the outside of luminescent wafer 92 is set and a setting bracket 941 simultaneously
The lens 942 of relative luminous chip 92.
Main circuit board 91 is made of using macromolecule, and thermally conductive and heat-sinking capability is bad, if in other no radiator structures
Design, pasting luminescent wafer 92 thereon often can overheat and damage because radiating bad.Furthermore existing packaged type is
It is electrically connected using wire bonding (wire bonding), that is to say, that pre- between luminescent wafer 92 and bracket 941
Enough spaces are stayed, when to avoid assembling bracket 941, is urged to and waits conducting wires 93 and it is made to damage or fall off, likewise, bracket
941 also can not be too short along the reserved space of optical axis L, otherwise the risk equally with the presence of conducting wires 93 such as being urged to, therefore, Ci Zhongfeng
The design of assembling structure is also difficult to further reduce the defect of volume.
Utility model content
The technical problem to be solved by the utility model is to, provide in view of the deficiencies of the prior art a kind of heat dissipation it is good and
The crystal-coated light-emitting module of volume can be reduced.
In order to solve the above technical problems, one of which technical solution used by the utility model is to provide one kind
Crystal-coated light-emitting module a comprising heat-radiating substrate；One package assembling comprising one around the heat-radiating substrate frame body and
One is arranged in the lens unit of the frame body, and the frame body includes a conductive path；And a luminescent wafer, it is arranged described
Heat-radiating substrate, the luminescent wafer include the top conductive junction point and a light-emitting surface positioned at the same side, and the top is conductive
Contact is electrically connected at the conductive path by an electric conductor.
Further, the frame body includes a sidewall portion on the outside of the heat-radiating substrate and one from the side wall
The extending wall that portion extends towards the top conductive junction point, the conductive path include an outer connecting pin and an inner connecting end,
In the sidewall portion, the inner connecting end position passes through the electric conductor electrical property in the extending wall for the outer connecting pin position
It is connected to the top conductive junction point.
Further, the conductive path further includes one extending between the outer connecting pin and the inner connecting end
Path ontology, one of them of described this position of path in the inner surface of the frame body, outer surface and inside.
Further, the heat-radiating substrate uses metal plate, and the luminescent wafer further includes one and the heat-radiating substrate
The bottom end conductive junction point of electric connection.
Further, the luminescent wafer further includes another top conductive junction point, and the package assembling further includes another
Conductive path, the crystal-coated light-emitting module further include another electric conductor, and another electric conductor is conductive by another top
Contact is respectively and electrically connected to another conductive path.
Further, the heat-radiating substrate is made of multiple plates separately, and the plate is metal plate, two-phase
The adjacent plate defines a heat dissipation channel jointly, and the luminescent wafer further includes multiple bottom end conductive junction points, the bottom end
Conductive junction point is electrically connected with the plate respectively.
Further, the luminescent wafer further includes one from the outwardly extending optical axis of the light-emitting surface, the lens list
Member further includes a bracket that the frame body is arranged in and a lens, and the bracket and the frame body are jointly around optical axis circle
An optical channel is made, the lens are installed in the bracket and position in the optical channel.
Further, the bracket is to be fabricated in one piece with the frame body.
Further, the package assembling further includes a filling being filled between the frame body and the heat-radiating substrate
Glue-line.
Further, the frame body of the package assembling is made of that the luminescent wafer, which is selected from, to shine using ceramic material
Diode, resonator light emitting diode or plane radial type laser chip, the electric conductor are solder sphere, and the conductive path is to lead
Line.
The beneficial effects of the utility model are that luminescent wafer is bonded with heat-radiating substrate, can effectively improve heat dissipation effect.
In addition, pass through the conductive path on frame body and cooperate electric conductor, luminescent wafer can the mode of flip pass through package assembling
It is electrically connected to external (such as main main circuit board), reserved space is not necessary to and carries out lead, crystal-coated light-emitting module can be effectively reduced
Volume, facilitate be applied to micromation product.Further, since the mode of flip can be used without carrying out in luminescent wafer
Lead, so the electronic product using luminescent wafer can be switched fast without having the problem of signal is procrastinateed luminescent wafer
Occur.
For the enabled feature and technology contents for being further understood that the utility model, please refer to below in connection with the utility model
Detailed description and accompanying drawings, however provided attached drawing is merely provided for reference and description, is not used to add the utility model
With limitation.
Detailed description of the invention
Fig. 1 is diagrammatic side-view cross-sectional schematic diagram, illustrates existing light emitting module.
Fig. 2 is the diagrammatic side-view cross-sectional schematic diagram of the utility model first embodiment.
Fig. 3 is side view partial cutaway view schematic, illustrates that the conductive path of first embodiment is formed in the outer surface of frame body.
Fig. 4 is side view partial cutaway view schematic, illustrates that the conductive path of first embodiment is formed in the inside of frame body.
Fig. 5 is diagrammatic side-view cross-sectional schematic diagram, illustrates another variation pattern of first embodiment.
Fig. 6 is diagrammatic side-view cross-sectional schematic diagram, illustrates another variation pattern of first embodiment.
Fig. 7 is the diagrammatic side-view cross-sectional schematic diagram of the utility model second embodiment.
Fig. 8 is the diagrammatic side-view cross-sectional schematic diagram of the utility model 3rd embodiment.
Fig. 9 is the diagrammatic side-view cross-sectional schematic diagram of the utility model fourth embodiment.
Specific embodiment
It is the tool illustrated by specific specific example in relation to crystal-coated light-emitting module disclosed in the utility model below
The advantages of body embodiment, those skilled in the art can understand the utility model by content disclosed in this specification and effect.
The utility model can be implemented or be applied by other different specific embodiments, and the various details in this specification can also base
In different viewpoints and application, carry out various modifications and change under the design for not departing from the utility model.In addition, the utility model
Attached drawing be only it is simple schematically illustrate, not according to the description of actual size, state in advance.Specific embodiment below will be into one
The relevant technologies content of the utility model is described in detail in step, but disclosure of that is not the protection to limit the utility model
Range.
[first embodiment]
Referring to Fig.2, the utility model first embodiment provides a kind of crystal-coated light-emitting module, it is adapted to fit to a main electricity
Road plate 7, to match with main circuit board 7 together with running, or, crystal-coated light-emitting module can also be carried out with diameter and external power supply
It is electrically connected, to be driven running.Its using mode and field, the emphasis of non-the utility model, herein not with repeat.
Crystal-coated light-emitting module include a heat-radiating substrate 1, a luminescent wafer 2, a conductive adhesive layer 3, a package assembling 4 and
One electric conductor 6.
Heat-radiating substrate 1 is selected from aluminum substrate, copper base or any including thermally conductive or heat-sinking capability substrate.Heat-radiating substrate 1
Side can be used to be electrically connected with main circuit board 7, and the other side and luminescent wafer 2 are electrically connected.
Luminescent wafer 2 is arranged in heat-radiating substrate 1, and sends out including a top conductive junction point 21, a bottom end conductive junction point 22, one
Smooth surface 23 and an outwardly extending optical axis L of spontaneous smooth surface 23.Top conductive junction point 21 and light-emitting surface 23 are respectively positioned in contrast to scattered
The same side of hot substrate 1.Bottom end conductive junction point 22 and heat-radiating substrate 1 are electrically connected, it is preferable that bottom end conductive junction point 22 is to pass through
Conductive adhesive layer 3 is bonded to heat-radiating substrate 1.Top conductive junction point 21 is one of them of positive or negative pole, and bottom end conductive junction point
22 be another of positive or negative pole.Luminescent wafer 2 is selected from light emitting diode (LED), resonator light emitting diode (RCLED),
Or vertical cavity laser diodes (VCSEL).It in the first embodiment, is that use plane radial type laser chip be example as saying
It is bright.
Package assembling 4 defines an optical channel 5 extended along optical axis L, and including a frame body 41, a conductive path 42, one
Lens unit 44 and a filling glue-line 44.Frame body 41 surrounds heat-radiating substrate 1, and the side including one on the outside of heat-radiating substrate 1
Wall portion 411 and the extending wall 412 that extends from sidewall portion 411 towards top conductive junction point 21.Extending wall 412 is led with top
Electric contact 21 is relative to each other.The material of frame body 41 can be plastic material, ceramic material or any insulating materials, wherein
Because ceramic material includes preferable mechanical strength and heat resistance, thus first embodiment be use ceramic material for example as
Explanation.
The setting of conductive path 42 connects outside in frame body 41, and including an outer connecting pin 421, an inner connecting end 422 and one
Connect the path ontology 423 extended between end 421 and inner connecting end 422.Sidewall portion 411 of the outer connecting pin 421 in frame body 41, and
For being electrically connected with outer member.Inner connecting end 422 extending wall 412 in frame body 41, and be used to be electrically connected
To top conductive junction point 21.Path ontology 423 is set to the mode of frame body 41, can be formed in the inner surface of frame body 41 (such as
Fig. 2), it is formed in the outer surface (such as Fig. 3) of frame body 41, or is embedded in the inside (such as Fig. 4) of frame body 41.In the present embodiment
In, path ontology 423 is disposed on the inner surface of frame body 41.Conductive path 42 can use conducting wire, metal clips or its equal tool to lead
The analog of electrical property.First embodiment is that conducting wire is used to explain for example.
The inside of frame body 41 is arranged in filling glue-line 43, and connect with heat-radiating substrate 1 and luminescent wafer 2.Therefore, glue is filled
Layer 43 is to be filled between frame body 41 and heat-radiating substrate 1 and luminescent wafer 2 to be formed by gap, makes to be bonded to each other more firm,
And promote the structural strength of the utility model crystal-coated light-emitting module entirety.
Lens unit 44 is arranged in frame body 41, and including a bracket 441 and a lens 442.Bracket 441 is using opaque
Material is made, and is to extend from frame body 41 along optical axis L, and define optical channel 5 around optical axis L jointly with frame body 41.Bracket
The mode of 411 installation to frame bodies 41 is not restricted, and any mode can be used for it, and being in the first embodiment will using viscose glue
The two is bonded as example to explain.Lens 442 are arranged in bracket 441, and position is in optical channel 5.Plane can be used in lens 442
Lens, light-focusing type lens, astigmatism type lens and other types lens.Transparent plastic or glass can be used in the material of lens 442
Glass.Aforementioned transparent plastics can be selected from polyacids methyl esters (Polymethylmethacrylate, PMMA), polycarbonate
(Polycarbonate, PC), polyetherimide (Polyetherimide, PEI), cyclic olefine copolymer (Cyclo olefin
Coplymer, COC) or its etc. mixing.In the first embodiment, lens 442 are to use planar lenses 442, and material is
Glass is example to explain.However, the selection of aforementioned structure and material is only to enumerate, it is not limited thereto.
It is noted that the quantity of lens 442 can also be two or more in lens unit 44, and the lens class used
Type or material may be the same or different, and end depends on the needs.
Electric conductor 6 is arranged between luminescent wafer 2 and package assembling 4, and conductive path 42 is electrically connected to the crystalline substance that shines
The top conductive junction point 21 of piece 2.Wherein, electric conductor 6 be using solder sphere, and be folded in the extending wall 412 of frame body 41 with
It, will be by conductive path of the position in extending wall 412 between the top conductive junction point 21 of luminescent wafer 2, therefore after remelting
42 are electrically connected to top conductive junction point 21.
The production method of crystal-coated light-emitting module can enumerate such as: first pass through conductive adhesive layer 3 for heat-radiating substrate 1 and the crystalline substance that shines
Piece 2 is bonded to each other, and solder sphere is as electric conductor 6 on 21 points of top conductive junction point, then, by heat-radiating substrate 1 and the crystalline substance that shines
Piece 2 is placed in frame body 41, and pushes frame body 41 and luminescent wafer 2 close to each other, so that electric conductor 6 acts against the extension of frame body 41
412 inside of wall portion, then, conductive path 42 and top conductive junction point 21 are electrically connected to each other, are further filled with by remelting electric conductor 6
Glue-line 43 is filled, and installs lens unit 44 to frame body 41, so completes the production of crystal-coated light-emitting module.Aforementioned production
Method is only exemplified by out a kind of feasible technique, manufacturer can according to its actual needs, easily adjusting process sequence or
Step, the production method of crystal-coated light-emitting module are not limited certainly with foregoing.
It is designed by the structure of package assembling 4, luminescent wafer 2 is assembled using flip chip packaging technologies, group
With more simply, it can effectively improve and speed is made and increases production capacity.Also, this mode can also remove wire bonding (wire from
Bonding the shortcomings that) reserved space being needed to be electrically connected to wire rod, effectively reduces the volume of crystal-coated light-emitting module, helps
In applied to micromation product.
It is noted that by luminescent wafer 2 top conductive junction point 21 and bottom end conductive junction point 22 configure orientation not
Together, the wiring in package assembling 4, which can also match, is adjusted.Such as Fig. 5, in another variation pattern of first embodiment, shine
Chip 2 further includes another top conductive junction point 21, and top conductive junction point 21 distinguishes position in two opposite sides of light-emitting surface 23, together
When, package assembling 4 further includes another conductive path 42.The crystal-coated light-emitting module further includes another electric conductor 6, electric conductor 6
Top conductive junction point 21 is respectively and electrically connected to conductive path 42.In this variation pattern, 22 conduct of bottom end conductive junction point
One of them of positive or negative pole, and top conductive junction point 21 then as positive or negative pole another.It is another it is noted that
One of them of top conductive junction point 21 can also be used as the conductive junction point of transmitting signal.Such as Fig. 6, first embodiment it is another
Variation pattern, luminescent wafer 2 do not have bottom end conductive junction point 22, include but two top conductive junction points 21, at this point, top conductive junction point
21 respectively as anode and cathode.The conductive path 42 of package assembling 4 is corresponding with two, and is respectively and electrically connected to top conduction
Contact 21.However, the conductive junction point regardless of luminescent wafer 2 configures, the structure design of package assembling 4 remains to allow luminescent wafer
2 are assembled using flip chip packaging technologies, have identical effect.
By above description, the advantages of first embodiment, can be summarized as follows again:
One, luminescent wafer 2 and heat-radiating substrate 1 are bonded, and can effectively improve heat dissipation effect.Also, by frame body 41
Conductive path 42, luminescent wafer 2 can be electrically connected to outside by package assembling 4, are not necessary to reserved space and carry out lead, can have
Effect reduces the volume of crystal-coated light-emitting module, helps to be applied to micromation product.
Two, in frame body 41 extending wall 412 design, be conducive between the conductive path 42 on luminescent wafer 2 and frame body 41
It is electrically connected.When being assembled, when electric conductor 6 touches extending wall 412, that is, it is neighbouring or by being against to represent electric conductor 6
On conductive path 42, as long as carrying out the operation being electrically connected at this time, such as: by solder sphere reflow, can effectively allow luminescent wafer 2
Electrically connect each other with conductive path 42.
Three, the design of frame body 41, suitable for the luminescent wafer 2 of a variety of different conductive junction point configurations, as long as luminescent wafer 2 is set
There is top conductive junction point 21, it will be able to cooperatively be assembled using flip chip packaging technologies with frame body 41.
Four, filling glue-line 43, which is filled between frame body 41 and heat-radiating substrate 1 and luminescent wafer 2, is formed by gap, makes that
This combination is more firm, and is avoided that between frame body 41 and luminescent wafer 2 and moves relative to each other, and electric conductor 6 is allowed to fall off damage.And
And filling glue-line 43 can also touch heat-radiating substrate 1 to avoid conductive path 42 and short circuit occurs.In this way, filling 43 energy of glue-line
The benefits of improving whole stabilized structure degree, and also preventing short circuit.
Five, since the mode of flip can be used without carrying out lead, so using luminescent wafer 2 in luminescent wafer 2
Electronic product luminescent wafer 2 can be switched fast without having the problem of signal is procrastinateed.
Six, since the luminescent wafer of the utility model 2 can use more than two conductive junction points, so luminescent wafer 2
The transmitting of electric power and signal can be carried out simultaneously.
[second embodiment]
Refering to Fig. 7, the utility model second embodiment is substantially identical with the first embodiment, and difference is: luminescent wafer 2 wraps
Two top conductive junction points 21 and two bottom end conductive junction points 22 are included, and accordingly, heat-radiating substrate 1 includes two plate separately
11.Two adjacent plates 11 define a heat dissipation channel 12 jointly.
The quantity of plate 11 can be two, three or four or more, and quantity can be adjusted according to actual
Whole, in the present embodiment, the quantity of plate 11 is two, and the quantity of heat dissipation channel 12 is one.
In this way, this second embodiment not only has outside the advantages of first embodiment, another luminescent wafer 2 is further disclosed
Feasible configurations comprising multiple bottom end conductive junction points 22.Corresponding such structure will only correspondingly adopt the composition of multi-disc plate 11
Heat-radiating substrate 1, and pass through the heat dissipation channel 12 in it, moreover it is possible to further increase heat dissipation effect.
Even if can equally be constituted using multi-disc plate 11 scattered it is noted that bottom end conductive junction point 22 only has one
Hot substrate 1 is covered on the plate 11 of two or three pieces or more with a bottom end conductive junction point 22, this mode can equally allow scattered
Hot substrate 1 has the function of conduction, and can also further increase heat dissipation effect by heat dissipation channel 12.
[3rd embodiment]
Refering to Fig. 8, the utility model 3rd embodiment is substantially identical with the first embodiment, and difference is only that: lens unit
44 do not include bracket 441 (such as Fig. 2), and lens 431 are to be set up directly on frame body 41, and also and, frame body 41 has undertaken bracket simultaneously
441 function.
By removing bracket 441 (such as Fig. 2), it can further reduce the height of crystal-coated light-emitting module, further reduce
Overall volume.In this way, this third embodiment not only has outside the advantages of first embodiment, moreover it is possible to further reduction volume.
In addition, in 3rd embodiment either shown in the conductive junction point configuration mode of luminescent wafer 2 and first embodiment
Formula is identical, and user can be adjusted according to actual demand, and there is no any restrictions.However, for ease of description, this third
The luminescent wafer 2 of embodiment is by the way of two top conductive junction points 21 and a bottom end conductive junction point 22.
[fourth embodiment]
Refering to Fig. 9, the utility model fourth embodiment is substantially identical with the first embodiment, and main difference is: bracket 441
It is to be fabricated in one piece with frame body 41.
By by bracket 441 and frame body 41, not needing not only to carry out when assembling crystal-coated light-emitting module in one piece
The step of both is mutually assembled, and can also further reinforce the intensity of 4 structure of package assembling.
In this way, this fourth embodiment not only has outside the advantages of first embodiment, still further has simplified technique
And the advantages of improving structural strength.
In addition, in fourth embodiment either shown in the conductive junction point configuration mode of luminescent wafer 2 and first embodiment
Formula is identical, and user can be adjusted according to actual demand, and there is no any restrictions.However, for ease of description, this 4th
The luminescent wafer 2 of embodiment is by the way of two top conductive junction points 21 and a bottom end conductive junction point 22.
In conclusion the structure design of package assembling 4 enables luminescent wafer 2 to be assembled with flip chip packaging technologies, can save
The space reserved needed for wire bonding is gone to, and luminescent wafer 2 can be allowed directly to paste with heat-radiating substrate 1, therefore this reality can be reached really
With novel reduction volume and the purpose of raising thermal diffusivity, the missing of the prior art is solved.In addition, since luminescent wafer 2 can make
With the mode of flip without carrying out lead, so the electronic product using luminescent wafer 2 can carry out quickly luminescent wafer 2
Switching is without having the problem of signal is procrastinateed.
Content disclosed above is only the preferred possible embodiments of the utility model, not thereby limits to the utility model
Claims protection scope, so all equivalence techniques for being done with the utility model specification and accompanying drawing content become
Change, is both contained in the protection scope of claims of the utility model.
Claims (10)
1. a kind of crystal-coated light-emitting module, which is characterized in that the crystal-coated light-emitting module includes:
One heat-radiating substrate；
One package assembling comprising one the lens unit of the frame body is arranged in around the frame body of the heat-radiating substrate and one,
The frame body includes a conductive path；And
One luminescent wafer is arranged in the heat-radiating substrate, and the luminescent wafer includes that the top conduction positioned at the same side connects
Point and a light-emitting surface, the top conductive junction point are electrically connected at the conductive path by an electric conductor.
2. crystal-coated light-emitting module according to claim 1, which is characterized in that the frame body includes one around the heat dissipation
The extending wall that sidewall portion and one on the outside of substrate extend from the sidewall portion towards the top conductive junction point, the conductive path
Diameter includes an outer connecting pin and an inner connecting end, and the outer connecting pin position is in the sidewall portion, and the inner connecting end position is in institute
Extending wall is stated, and the top conductive junction point is electrically connected to by the electric conductor.
3. crystal-coated light-emitting module according to claim 2, which is characterized in that the conductive path further includes one described
The path ontology extended between outer connecting pin and the inner connecting end, inner surface, outer of described this position of path in the frame body
One of them in surface and inside.
4. crystal-coated light-emitting module according to claim 1, which is characterized in that the heat-radiating substrate uses metal plate, institute
Stating luminescent wafer further includes a bottom end conductive junction point being electrically connected with the heat-radiating substrate.
5. crystal-coated light-emitting module according to claim 1, which is characterized in that the luminescent wafer further includes another top
Conductive junction point, the package assembling further include another conductive path, and the crystal-coated light-emitting module further includes another electric conductor, institute
It states another electric conductor and another top conductive junction point is respectively and electrically connected to another conductive path.
6. crystal-coated light-emitting module according to claim 5, which is characterized in that the heat-radiating substrate be by it is multiple separately
Plate constitute, the plate is metal plate, and the two adjacent plates define a heat dissipation channel, the luminescent wafer jointly
It further include multiple bottom end conductive junction points, the bottom end conductive junction point is electrically connected with the plate respectively.
7. crystal-coated light-emitting module according to claim 1, which is characterized in that the luminescent wafer further includes one described in
The outwardly extending optical axis of light-emitting surface, the lens unit further include a bracket that the frame body is arranged in and a lens, described
Bracket and the frame body define an optical channel around the optical axis jointly, and the lens are installed in the bracket and position described
Optical channel.
8. crystal-coated light-emitting module according to claim 7, which is characterized in that the bracket and the frame body be one at
Shape it is fabricated.
9. crystal-coated light-emitting module according to claim 1, which is characterized in that the package assembling further includes one being filled in
Filling glue-line between the frame body and the heat-radiating substrate.
10. crystal-coated light-emitting module according to claim 1, which is characterized in that the frame body of the package assembling is to use
Ceramic material is made, and the luminescent wafer is selected from light emitting diode, resonator light emitting diode or plane radial type laser chip, institute
Stating electric conductor is solder sphere, and the conductive path is conducting wire.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107207550 | 2018-06-06 | ||
| TW107207550U TWM568501U (en) | 2018-06-06 | 2018-06-06 | Flip-chip light-emitting module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208589461U true CN208589461U (en) | 2019-03-08 |
Family
ID=64871584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820946447.1U Active CN208589461U (en) | 2018-06-06 | 2018-06-19 | Flip chip type light emitting module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN208589461U (en) |
| TW (1) | TWM568501U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110571320A (en) * | 2018-06-06 | 2019-12-13 | 海华科技股份有限公司 | Flip chip type light emitting module |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI691671B (en) | 2018-12-05 | 2020-04-21 | 海華科技股份有限公司 | Flip-chip light-emitting module |
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2018
- 2018-06-06 TW TW107207550U patent/TWM568501U/en unknown
- 2018-06-19 CN CN201820946447.1U patent/CN208589461U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110571320A (en) * | 2018-06-06 | 2019-12-13 | 海华科技股份有限公司 | Flip chip type light emitting module |
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| Publication number | Publication date |
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| TWM568501U (en) | 2018-10-11 |
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