CN104747948A - High heat dissipation LED - Google Patents

High heat dissipation LED Download PDF

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Publication number
CN104747948A
CN104747948A CN201510131081.3A CN201510131081A CN104747948A CN 104747948 A CN104747948 A CN 104747948A CN 201510131081 A CN201510131081 A CN 201510131081A CN 104747948 A CN104747948 A CN 104747948A
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CN
China
Prior art keywords
radiator
led
heat
center
branch
Prior art date
Application number
CN201510131081.3A
Other languages
Chinese (zh)
Other versions
CN104747948B (en
Inventor
胡振强
Original Assignee
胡振强
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Filing date
Publication date
Application filed by 胡振强 filed Critical 胡振强
Priority to CN201510131081.3A priority Critical patent/CN104747948B/en
Publication of CN104747948A publication Critical patent/CN104747948A/en
Application granted granted Critical
Publication of CN104747948B publication Critical patent/CN104747948B/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices

Abstract

The invention provides a high heat dissipation LED. The high heat dissipation LED comprises a metal radiator, wherein the metal radiator is a geometric revolving body and comprises a bottom face and a backward folded side face; cooling fins are evenly distributed on the side face in the circumferential direction; a heat insulation layer is laid on the rear surface of the bottom face; an inner cavity is defined between the heat insulation layer and the side face of the radiator; a circuit board is arranged inside the inner cavity; a center through hole is formed in the center of the bottom face of the heat radiator; the circumference of the radiator is averagely divided into sub-portions of an even number with the center of the bottom face as the circle center; the sub-portions are separated by insulation media; the adjacent sub-portions are electrically connected to different electrodes of the output end of the circuit board; the adjacent sub-portions form equal-width edge joints on the bottom face; LED wafers are evenly attached to the edge joints along the edge joints; two patch pins of each LED wafer are connected to the adjacent sub-portions on the two sides of the corresponding edge joint in a cross mode. The LED has a good heat dissipation effect and low energy consumption.

Description

High-heat-dispersion LED
Technical field
The present invention relates to lighting field, especially, is a kind of LED illumination lamp.
Background technology
LED has good energy saving and stability due to it, so obtain good popularization; Meanwhile, the problem that LED runs into is also fairly obvious, is mainly heating problem; LED wafer is as the basic original paper forming LED, and because the PN junction of its inside is very responsive to temperature, therefore, along with the rising of LED temperature, the luminous efficiency of LED wafer will obviously decline; If do not handle the heat dissipation problem of LED well, then its efficiency is also very limited; For this reason, for power and little LED, also need the radiator being equipped with suitable volume; The outside of radiator mainly comprises radiating fin, inner then comprise the heat-conducting substrate fitted with the bottom of LED wafer; But, because current LED wafer is all welded on circuit board, therefore, the contact area of heat-conducting substrate and LED wafer is very limited, and the temperature of heat-conducting substrate is higher than the temperature of external heat fins, cause the heat transference efficiency between LED wafer and heat-conducting substrate very low, in the case, the volume scale of the external heat fins increasing radiator can only be relied on, improve radiating efficiency as much as possible; And for highlighted LED, because caloric value is comparatively large, the volume of radiator is subject to again environment restriction, so the temperature that the maintenance of the LED wafer of its inside can not be allowed all the time lower, this causes current highlighted LED energy consumption larger.
Summary of the invention
For the problems referred to above, the object of the present invention is to provide a kind of high-heat-dispersion LED, this LED has excellent radiating effect, and has lower power consumption.
The technical solution adopted for the present invention to solve the technical problems is: this high-heat-dispersion LED comprises metal heat sink, and described metal heat sink is geometry rotary body, the side comprising bottom surface and turn down backward; On described side, circumference is evenly equipped with radiating fin; The rear surface of described bottom surface is laid by one deck thermal insulation layer; Surround an inner chamber between the side of described thermal insulation layer and described radiator, in described inner chamber, be provided with circuit board; The bottom surface central authorities of described radiator have center through hole; With described bottom center for the center of circle, described radiator circumference is divided into even numbered blocks branch, is separated between each branch by dielectric, and adjacent branch is electrically connected to the Different electrodes of described circuit board output; Adjacent branch forms wide piece on described bottom surface; Each described piece to be evenly sticked LED wafer along piece, and two paster pins of described LED wafer are connected across in the adjacent branch of piece both sides.
As preferably, the inwall of the side of described radiator is also laid with one deck thermal insulation layer, make described inner chamber and radiator heat insulation; For circuit board provides a low temperature environment.
As preferably, the front surface of described radiator bottom surface makes minute surface, to strengthen the illumination to the projection of front, bottom surface.
As preferably, the front of described radiator bottom surface is coated with a soft light cover, makes the uniform illumination of LED soft.
As preferably, the center through hole of described radiator bottom surface is filled by the circular block that insulate, and dielectric between this circular block and each described branch is one-body molded by hard material of the same race, forms the support of fixing each described branch.
Beneficial effect of the present invention is: this high-heat-dispersion LED in use, because LED wafer is not made in circuit board surface, and is directly attached on the bottom surface of metal heat sink, so make the heat radiation contact surface of LED wafer significantly improve; Meanwhile, circuit board and radiator are completely isolated again, make circuit board surface keep lower temperature; Therefore, not only make LED wafer have higher luminous efficiency, and the job stability of circuit board is largely increased, there is reduction power consumption, the effect increased the service life.
Accompanying drawing explanation
Fig. 1 is the side view of this high-heat-dispersion LED embodiment.
Fig. 2 is the front view of Fig. 1 embodiment.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is further described:
In the embodiment shown in Fig. 1, Fig. 2, this high-heat-dispersion LED comprises metal heat sink 1, and described metal heat sink 1 is geometry rotary body, the side 12 comprising bottom surface 11 and turn down backward; On described side 12, circumference is evenly equipped with radiating fin 13.
The rear surface of described bottom surface 11 is laid by one deck thermal insulation layer 2; Surround an inner chamber 10 between described thermal insulation layer 2 and the side of described radiator 1, in described inner chamber 10, be provided with circuit board 3; The power line 6 of connecting circuit board 3 is connected to power supply through the cover plate 7 covered at inner chamber 10 rear.
The bottom surface central authorities of described radiator 1 have center through hole 100; With described bottom center for the center of circle, described radiator 1 circumference be divided into even numbered blocks branch 1 ', separated by dielectric between each branch 1 ', and adjacent branch 1 ' is electrically connected to the Different electrodes of described circuit board 3 output; Adjacent branch 1 ' forms wide piece 101 on described bottom surface; Each described piece 101 to be evenly sticked LED wafer 4 along piece, and two paster pins of described LED wafer 4 are connected across in the adjacent branch of piece 101 both sides.
Above-mentioned high-heat-dispersion LED, the center through hole 100 of described radiator bottom surface 11 is filled by insulation circular block, and this circular block and each described branch 1 ' between dielectric one-body molded by hard material of the same race, form the support fixing each described branch 1 '.
Above-mentioned high-heat-dispersion LED, the front of described radiator bottom surface 11 is coated with a soft light cover 5, makes the uniform illumination of LED soft.
In addition, the front surface of described radiator bottom surface 11 can be made minute surface, to strengthen the illumination to the projection of front, bottom surface.
Above-mentioned high-heat-dispersion LED in use, because LED wafer 4 is not made in circuit board 3 surface, and is directly attached on the bottom surface 11 of metal heat sink, so make the heat radiation contact surface of LED wafer 4 significantly improve; Meanwhile, circuit board 3 is completely isolated again with radiator 1, makes circuit board 3 surface keep lower temperature; Therefore, not only make LED wafer 4 have higher luminous efficiency, and the job stability of circuit board 3 is largely increased, there is reduction power consumption, the effect increased the service life.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, all should be included within protection scope of the present invention.

Claims (5)

1. a high-heat-dispersion LED, comprises metal heat sink (1), and described metal heat sink (1) is geometry rotary body, the side (12) comprising bottom surface (11) and turn down backward; The upper circumference in described side (12) is evenly equipped with radiating fin (13); It is characterized in that: the rear surface of described bottom surface (11) is laid by one deck thermal insulation layer (2); Surround an inner chamber (10) between the side of described thermal insulation layer (2) and described radiator (1), in described inner chamber, be provided with circuit board (3); Bottom surface (11) central authorities of described radiator have center through hole (100); With described bottom center for the center of circle, described radiator (1) circumference is divided into even numbered blocks branch, and (1 '), is separated by dielectric between each branch, and adjacent branch is electrically connected to the Different electrodes of described circuit board output; Adjacent branch's (1 ') forms wide piece (101) on described bottom surface; Each described piece to be evenly sticked LED wafer (4) along piece, and two paster pins of described LED wafer (4) are connected across the adjacent branch of piece (101) both sides (on 1 ').
2. high-heat-dispersion LED according to claim 1, is characterized in that: the inwall of the side of described radiator (1) is also laid with one deck thermal insulation layer, makes described inner chamber (10) and radiator (1) heat insulation.
3. high-heat-dispersion LED according to claim 1, is characterized in that: the front surface of described radiator bottom surface (11) makes minute surface.
4. high-heat-dispersion LED according to claim 1, is characterized in that: the front of described radiator bottom surface (11) is coated with a soft light cover (5).
5. high-heat-dispersion LED as claimed in any of claims 1 to 4, it is characterized in that: the center through hole (100) of described radiator bottom surface is filled by insulation circular block, and this circular block and each described branch (dielectric between 1 ') is one-body molded by hard material of the same race, forms the support of fixing each described branch.
CN201510131081.3A 2015-03-25 2015-03-25 High-heat-dispersion LED CN104747948B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510131081.3A CN104747948B (en) 2015-03-25 2015-03-25 High-heat-dispersion LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510131081.3A CN104747948B (en) 2015-03-25 2015-03-25 High-heat-dispersion LED

Publications (2)

Publication Number Publication Date
CN104747948A true CN104747948A (en) 2015-07-01
CN104747948B CN104747948B (en) 2017-07-07

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Family Applications (1)

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CN201510131081.3A CN104747948B (en) 2015-03-25 2015-03-25 High-heat-dispersion LED

Country Status (1)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105276419A (en) * 2015-11-19 2016-01-27 华蓥市双河第三小学 Bulb base of high-power bulb
CN107543058A (en) * 2017-07-31 2018-01-05 兰溪市拜瑞珂科技服务有限公司 It is mining to position laser illuminator system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060043401A1 (en) * 2004-09-01 2006-03-02 Samsung Electro-Mechanics Co., Ltd. High power light emitting diode package
CN201344406Y (en) * 2009-02-13 2009-11-11 深圳市聚作实业有限公司 LED lamp
CN101788109A (en) * 2009-10-09 2010-07-28 中山市中茗电器有限公司 White light LED

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060043401A1 (en) * 2004-09-01 2006-03-02 Samsung Electro-Mechanics Co., Ltd. High power light emitting diode package
CN201344406Y (en) * 2009-02-13 2009-11-11 深圳市聚作实业有限公司 LED lamp
CN101788109A (en) * 2009-10-09 2010-07-28 中山市中茗电器有限公司 White light LED

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105276419A (en) * 2015-11-19 2016-01-27 华蓥市双河第三小学 Bulb base of high-power bulb
CN107543058A (en) * 2017-07-31 2018-01-05 兰溪市拜瑞珂科技服务有限公司 It is mining to position laser illuminator system

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Inventor after: Zhou Bin

Inventor after: Hu Youbao

Inventor after: Yang Yonghua

Inventor after: Li Jiugao

Inventor before: Hu Zhenqiang

CB03 Change of inventor or designer information
TA01 Transfer of patent application right

Effective date of registration: 20170602

Address after: 225651 Gaoyou City, Yangzhou Province, the town to send Yang Ling Road

Applicant after: JIANGSU SHENZHOU TRAFFIC EQUIPMENT CO., LTD.

Address before: 210000 Nanjing City, Yuhuatai Province, software and Software Park Road, No. 168,

Applicant before: Hu Zhenqiang

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