CN204361078U - The semiconductor cooler that a kind of multiple power supplies controls - Google Patents
The semiconductor cooler that a kind of multiple power supplies controls Download PDFInfo
- Publication number
- CN204361078U CN204361078U CN201420770616.2U CN201420770616U CN204361078U CN 204361078 U CN204361078 U CN 204361078U CN 201420770616 U CN201420770616 U CN 201420770616U CN 204361078 U CN204361078 U CN 204361078U
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- Prior art keywords
- out area
- draw
- flow deflector
- semiconductor cooler
- loop circuit
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 46
- 238000003466 welding Methods 0.000 claims abstract description 24
- 230000005611 electricity Effects 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 239000003086 colorant Substances 0.000 claims abstract description 5
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 4
- 230000008676 import Effects 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 abstract description 8
- 238000001816 cooling Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 3
- 235000012149 noodles Nutrition 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000013475 authorization Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses the semiconductor cooler that a kind of multiple power supplies controls, comprise, infrabasal plate and the semi-conductor electricity couple between upper and lower base plate, flow deflector, semi-conductor electricity couple is all connected in series formation single loop circuit, upper substrate or infrabasal plate are provided with the welding draw-out area of more than at least three or three and are welded with wire, welding draw-out area is connected with the flow deflector of diverse location in single loop circuit respectively, the utility model by increasing the welding draw-out area connecting corresponding flow deflector on substrate, single-circuit cooler can be changed into and possess different capacity switching, the multiloop semiconductor cooler of region refrigeration is in whole or in part provided, meet the selection requirement of client, the identification of the wire person easy to use of different colours.
Description
Technical field
The utility model relates to a kind of semiconductor cooler, refers more particularly to a kind of semiconductor cooler that the multiple power supplies of multiple cold and temperature can be provided to control.
Background technology
Traditional semiconductor cooler is all by upper and lower substrate, flow deflector and semiconductor element composition, its operation principle is peltier effect, after cooler energising, upper and lower surface just refrigeration and the heat release respectively of substrate, refrigeration face can cool different components and parts as requested, only needs the device that will cool to be affixed on cooler surface during use.
Thermoelectric cooling module circuit conventional is at present all generally that single power supply controls, namely single series loop, as depicted in figs. 1 and 2, mainly design easily, production and processing is convenient, overall huyashi-chuuka (cold chinese-style noodles) refrigeration is formed after energising, hot side heat release, if Authorization Notice No. is CN201655855U, name is called the Chinese utility model patent of semiconductor chilling plate, just relate to a kind of semiconductor chilling plate, outer extraction two wires, there is mechanical strength higher, the feature of long service life, whole coldface temperature is even, but due to the series loop that cooling piece is single, the refrigeration requirement selecting region in whole or in part cannot be realized by user's requirement, namely the refrigeration requirement in a region in whole or in part cannot be realized, or the requirement that different capacity switches, also the requirement of different cryogenic temperature cannot be met.
Utility model content
The utility model mainly overcome existing semiconductor cooler unitary series of operations loop cannot satisfied temperature and cold conversion technical problem; A kind of semiconductor cooler that the multiple power supplies of multiple cold and temperature can be provided to control is provided.
In order to solve the technical problem of above-mentioned existence, the utility model mainly adopts following technical proposals:
The semiconductor cooler that a kind of multiple power supplies of the present utility model controls, semiconductor cooler comprises upper substrate, infrabasal plate and the semi-conductor electricity couple between upper and lower base plate, flow deflector, described semi-conductor electricity couple is all connected in series formation single loop circuit, described upper substrate or infrabasal plate are provided with the welding draw-out area of more than at least three or three and are welded with wire, described welding draw-out area is connected with the flow deflector of diverse location in described single loop circuit respectively, single loop circuit is separated into the multistage performance loop of series connection mutually by welding draw-out area, external power supply imports semiconductor cooler by different welding draw-out areas, by increasing the welding draw-out area connecting corresponding flow deflector on substrate, single-circuit cooler can be changed into and possess different capacity switching, the multiloop semiconductor cooler of region refrigeration is in whole or in part provided, two or more performance loop is made to concentrate on a cooler, meet the selection requirement of client, correspondingly also extend the useful life of cooler.
As preferably, described welding draw-out area is three, all be located on described infrabasal plate, welding draw-out area comprises head end draw-out area, tail end draw-out area and draw-out area, middle part, wherein head end draw-out area is connected with the head flow deflector of described single loop circuit, tail end draw-out area is connected with the afterbody flow deflector of single loop circuit, draw-out area, middle part is connected with the middle part flow deflector of single loop circuit, welding draw-out area also can be arranged on upper substrate, the single loop circuit of original single power is transformed into three performance loop that can control respectively by cooler, the conversion requirement of different capacity or refrigerating capacity can be met by external different power supply.
As preferably, the quantity of the semi-conductor electricity couple between described middle part flow deflector and described head flow deflector be semiconductor galvanic between middle part flow deflector and described afterbody flow deflector to the twice of quantity, the third gear power of 33%, 66% and 100% or the conversion of refrigerating capacity can be met.
As preferably, the wire of described welding draw-out area all adopts the wire of different colours, indicates different welding draw-out areas respectively, to show identification, facilitates the plant-grid connection of different capacity or size.
The beneficial effects of the utility model are: by increasing the welding draw-out area connecting corresponding flow deflector on substrate, single-circuit cooler can be changed into the multiloop semiconductor cooler possessing different capacity and switch, region refrigeration is in whole or in part provided, meet the selection requirement of client, the identification of the wire person easy to use of different colours.
Accompanying drawing explanation
Fig. 1 is the cooler structural representation of prior art.
Fig. 2 is the performance loop schematic diagram of Fig. 1 structure cooler.
Fig. 3 is the performance loop schematic diagram of the utility model cooler.
1. upper substrates, 2. infrabasal plate in figure, 3. semi-conductor electricity couple, 4. flow deflector, 5. wire, 6. head end draw-out area, 7. tail end draw-out area, draw-out area 8..
Embodiment
Below by embodiment, and by reference to the accompanying drawings, the technical solution of the utility model is described in further detail.
Embodiment: the semiconductor cooler of a kind of multiple power supplies control of the present embodiment, as shown in Figure 3, semiconductor cooler comprises upper substrate 1, infrabasal plate 2 and the semi-conductor electricity couple 3 between upper and lower base plate, flow deflector 4, semi-conductor electricity couple is all connected in series formation single loop circuit, infrabasal plate is provided with three and welds draw-out areas and the wire 5 being welded with different colours, welding draw-out area comprises head end draw-out area 6, tail end draw-out area 7 and draw-out area, middle part 8, wherein head end draw-out area is connected with the head flow deflector of single loop circuit, tail end draw-out area is connected with the afterbody flow deflector of single loop circuit, draw-out area, middle part is connected with the middle part flow deflector of single loop circuit and single loop circuit is separated into two sections of parallel circuits of mutually connecting, the quantity of semi-conductor electricity couple between middle part flow deflector and head flow deflector is that semiconductor galvanic between middle part flow deflector and afterbody flow deflector is to the twice of quantity, external power supply imports semiconductor cooler by three welding draw-out areas, can 33% be met, the third gear power of 66% and 100% or the switching of refrigerating capacity.
User also can as required, the cooler of customized different size and specification or different circuit.
During use, 100% cold is provided as needed cooler, then can the positive wire of power supply be welded on head end draw-out area, and by power cathode wire bonds on tail end draw-out area, now, all semi-conductor electricity couples on cooler all participate in work, form a complete refrigerating circuit, upper substrate produces the refrigerating capacity of rated value 100%, or minimum cryogenic temperature is provided.
The refrigerating capacity of rated value 66% or higher cryogenic temperature is provided as only needed cooler, then can by positive source wire bonds on head end draw-out area, and power cathode is welded on draw-out area, middle part, now, cooler only has the most of semi-conductor electricity couple participation work between head flow deflector and middle part flow deflector, other fraction semi-conductor electricity couple does not participate in work owing to not having electric current to flow through, cooler constitutes part refrigerating circuit, achieve less refrigerating capacity or higher cryogenic temperature, also extend the useful life of cooler.
The refrigerating capacity of rated value 33% or higher cryogenic temperature is provided as only needed cooler, then can by positive source wire bonds on draw-out area, middle part, and power cathode is welded on afterbody draw-out area, now, cooler only has the small part semi-conductor electricity couple participation work between middle part flow deflector and afterbody flow deflector, most of semi-conductor electricity couple does not in addition participate in work owing to not having electric current to flow through, cooler constitutes part refrigerating circuit, achieves less refrigerating capacity or higher cryogenic temperature.
Therefore, user can according to the refrigerating capacity of the size of self components and parts and needs or chilling temperature, to the parts of cooling be needed to be placed in cooler huyashi-chuuka (cold chinese-style noodles) in use, electric current is applied in the loop of correspondence, the single cooler of single power can obtain different cooling powers, or the components and parts needing different cooling position requirement are placed in certain region of cooler huyashi-chuuka (cold chinese-style noodles), different electric currents are applied to corresponding circuit and reaches cooling object.
In description of the present utility model, technical term " on ", D score, " front ", " afterwards ", " interior ", " outward " etc. represent that direction or position relationship are based on direction shown in the drawings or position relationship, be only for convenience of description with understand the technical solution of the utility model, more than illustrate and not restriction has been done to the utility model, the utility model is also not limited only to the citing of above-mentioned explanation, the change that those skilled in the art make in essential scope of the present utility model, remodeling, increase or replace, all should be considered as protection range of the present utility model.
Claims (4)
1. the semiconductor cooler of a multiple power supplies control, semiconductor cooler comprises upper substrate (1), infrabasal plate (2) and the semi-conductor electricity couple (3) between upper and lower base plate, flow deflector (4), it is characterized in that: described semi-conductor electricity couple is all connected in series formation single loop circuit, described upper substrate or infrabasal plate are provided with the welding draw-out area of more than at least three or three and are welded with wire (5), described welding draw-out area is connected with the flow deflector of diverse location in described single loop circuit respectively, single loop circuit is separated into the multistage performance loop of series connection mutually by welding draw-out area, external power supply imports semiconductor cooler by different welding draw-out areas.
2. the semiconductor cooler of a kind of multiple power supplies control according to claim 1, it is characterized in that: described welding draw-out area is three, all be located on described infrabasal plate, welding draw-out area comprises head end draw-out area (6), tail end draw-out area (7) and draw-out area, middle part (8), wherein head end draw-out area is connected with the head flow deflector of described single loop circuit, tail end draw-out area is connected with the afterbody flow deflector of single loop circuit, and draw-out area, middle part is connected with the middle part flow deflector of single loop circuit.
3. the semiconductor cooler that controls of a kind of multiple power supplies according to claim 2, is characterized in that: the quantity of the semi-conductor electricity couple between described middle part flow deflector and described head flow deflector is that semiconductor galvanic between middle part flow deflector and described afterbody flow deflector is to the twice of quantity.
4. the semiconductor cooler of a kind of multiple power supplies control according to claim 1, is characterized in that: the wire of described welding draw-out area all adopts the wire of different colours, indicates different welding draw-out areas respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420770616.2U CN204361078U (en) | 2014-12-09 | 2014-12-09 | The semiconductor cooler that a kind of multiple power supplies controls |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420770616.2U CN204361078U (en) | 2014-12-09 | 2014-12-09 | The semiconductor cooler that a kind of multiple power supplies controls |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204361078U true CN204361078U (en) | 2015-05-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420770616.2U Withdrawn - After Issue CN204361078U (en) | 2014-12-09 | 2014-12-09 | The semiconductor cooler that a kind of multiple power supplies controls |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204361078U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112614928A (en) * | 2020-12-11 | 2021-04-06 | 杭州大和热磁电子有限公司 | Deep semiconductor refrigeration module with shielding layer and base |
-
2014
- 2014-12-09 CN CN201420770616.2U patent/CN204361078U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112614928A (en) * | 2020-12-11 | 2021-04-06 | 杭州大和热磁电子有限公司 | Deep semiconductor refrigeration module with shielding layer and base |
| CN112614928B (en) * | 2020-12-11 | 2022-10-25 | 杭州大和热磁电子有限公司 | Deep semiconductor refrigeration module with shielding layer and base |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20150527 Effective date of abandoning: 20231222 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20150527 Effective date of abandoning: 20231222 |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |