CN202757096U - Heat dissipation structure of light-emitting diode (LED) lamp - Google Patents

Heat dissipation structure of light-emitting diode (LED) lamp Download PDF

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Publication number
CN202757096U
CN202757096U CN2012204050881U CN201220405088U CN202757096U CN 202757096 U CN202757096 U CN 202757096U CN 2012204050881 U CN2012204050881 U CN 2012204050881U CN 201220405088 U CN201220405088 U CN 201220405088U CN 202757096 U CN202757096 U CN 202757096U
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CN
China
Prior art keywords
heat dissipation
lamp
heat
dissipation structure
aluminum substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2012204050881U
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Chinese (zh)
Inventor
曹承朝
刘德权
吴巨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HUNAN PUSISAT OPTO TECHNOLOGY Co Ltd
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HUNAN PUSISAT OPTO TECHNOLOGY Co Ltd
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Filing date
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Priority to CN2012204050881U priority Critical patent/CN202757096U/en
Application granted granted Critical
Publication of CN202757096U publication Critical patent/CN202757096U/en
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Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a heat dissipation structure of a light-emitting diode (LED) lamp. The heat dissipation structure of the LED lamp comprises chips and an aluminum substrate formed by copper foil, an insulating layer and an aluminum plate in composite mode. The heat dissipation structure of the LED lamp is characterized in that countersunk head holes are formed in the aluminum substrate by penetrating through the copper foil and the insulating layer, each chip is arranged in each countersunk head hole and fixed on the aluminum plate through a high thermal conductivity silver colloid layer, the aluminum substrate is fixed on a heat dissipating body of the lamp, and a heat conduction silicone grease layer is arranged between the aluminum substrate and the radiator. The heat dissipation structure of the LED lamp has the advantages that the chips are directly fixed on the aluminum substrate, the number of thermal conductivity layers is reduced, and the heat dissipation processes of heat of the lamp are: the chip-the high thermal conductivity silver colloid layer-the aluminum substrate-the heat conduction silicone grease layer-the radiator of the lamp. According to the heat dissipation structure, contacting thermal resistance between the thermal conductivity layers is decreased, junction temperature is low, heat dissipation efficiency is remarkably improved, and the problems that in the prior art lighting effect is low, luminous decay is large and service life is short are solved. Packaging steps are decreased, and technological process of production is simplified.

Description

A kind of radiator structure of LED light fixture
Technical field
The utility model belongs to the LED light fixture, is specifically related to a kind of radiator structure of LED light fixture.
Background technology
Heat radiation in the design chips of LED light fixture is an important problem.The structure of existing LED light fixture as shown in Figure 1, the radiator 4 of light fixture is provided with PC cover (or cloche) 1, be provided with a plurality of lamp pearls 2 in the PC cover 1, lamp pearl 2 is fixed on the aluminium base 3, be applied on the aluminium base 3 to reduce the gap of 4 of aluminium base 3 and radiators with heat-conducting silicone grease 207 again, with screw aluminium base 3 be fixed on the radiator 4.Lamp pearl 2 comprises copper pedestal 206, is fixed on the chip 204 on the copper pedestal 206 as shown in Figure 2, is coated with on the chip 204 that fluorescent material 203 and filling gel 202 are rear to be covered with PC lens 201.The heat radiation of chip 204, that chip 204 is fixed on the copper pedestal 206 by high heat conduction elargol 205, chip 204 is welded on the copper stent 208 by gold thread 210, copper stent 208 usefulness scolding tin 209 are welded on the copper pool 301, copper pedestal 206 contacts to reduce LED copper pedestal 206 and copper by the pool of the copper on heat-conducting silicone grease 207 and the aluminium base 3 301 again and moors 301 gap, copper pool 301 is pressed together on the aluminium sheet 303 by insulating barrier 302, and the below fills up the space of 4 of the radiators of aluminium base 3 and light fixture again by heat-conducting silicone grease 207.The heat radiation approach of light fixture heat: the radiator of chip-high heat conduction elargol-copper pedestal-heat-conducting silicone grease-copper pool-insulating barrier-aluminium sheet-heat-conducting silicone grease-light fixture.This radiator structure of LED light fixture, heat-conducting layer is many, and thermal contact resistance is large between the heat-conducting layer, junction temperature is high, radiating efficiency is very low.Use in the high-power LED illumination process in reality, because the heat that the chip thermal source discharges can not derive and shed effectively, cause the problems such as light efficiency is low, light decay is large, the life-span is short, therefore, can not well satisfy the demand of lighting.
The utility model content
In order to overcome above-mentioned the deficiencies in the prior art, the purpose of this utility model provides the radiator structure of the effective LED light fixture of a kind of chip cooling, can effectively prolong the life-span of light source and light fixture.
The technical scheme that realizes the employing of the utility model purpose is as follows:
The radiator structure of the LED light fixture that the utility model provides, comprise chip and by copper pool, insulating barrier, the compound aluminium base that consists of of aluminium sheet, have counter sink at described aluminium base through copper pool, insulating barrier, described chip places in the described counter sink and by high heat conduction elargol layer and is fixed on the described aluminium sheet, described aluminium base is fixed on the radiator of light fixture, and the heat-conducting silicone grease layer is arranged between aluminium base and radiator.
Characteristics of the present utility model: the one, chip directly is fixed on the aluminium base, reduced heat-conducting layer, the heat radiation approach of light fixture heat: the radiator of chip-high heat conduction elargol-aluminium sheet-heat-conducting silicone grease-light fixture.This radiator structure has reduced that thermal contact resistance, junction temperature between the heat-conducting layer is low, radiating efficiency is significantly improved, and can effectively solve the problem that the prior art light efficiency is low, light decay is large, the life-span is short; The 2nd, reduced encapsulation step, simplified the technological process of production.
Further specify the technical solution of the utility model below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 is the structural representation of existing LED light fixture.
Fig. 2 is the structural representation of lamp pearl in the existing LED light fixture.
Fig. 3 is structural representation of the present utility model.
Fig. 4 adopts LED light fixture schematic diagram of the present utility model.
The specific embodiment
Referring to Fig. 3, Fig. 4, the radiator structure of the LED light fixture that the utility model provides, comprise chip 204 and moor 301 by copper, insulating barrier 302, the aluminium base 3 of aluminium sheet 303 compound formations, see through copper pool 301 at described aluminium base 3, insulating barrier 302 has the taper counter sink (also can adopt rectangle, other shape such as cylindrical shape) 304, chip 204 places in the described counter sink 304 and by high heat conduction elargol layer 205 and is fixed on the described aluminium sheet 303, the bottom of aluminium base 3 scribbles heat-conducting silicone grease layer 207 with the gap of minimizing with radiator, with conventional methods such as screw or riveted joints aluminium base 3 is fixed on the radiator 4 of light fixture.

Claims (1)

1. the radiator structure of a LED light fixture, comprise chip and by copper pool, insulating barrier, the compound aluminium base that consists of of aluminium sheet, it is characterized in that having counter sink at described aluminium base through copper pool, insulating barrier, described chip places in the described counter sink and by high heat conduction elargol layer and is fixed on the described aluminium sheet, described aluminium base is fixed on the radiator of light fixture, and the heat-conducting silicone grease layer is arranged between aluminium base and radiator.
CN2012204050881U 2012-08-16 2012-08-16 Heat dissipation structure of light-emitting diode (LED) lamp Expired - Fee Related CN202757096U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012204050881U CN202757096U (en) 2012-08-16 2012-08-16 Heat dissipation structure of light-emitting diode (LED) lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012204050881U CN202757096U (en) 2012-08-16 2012-08-16 Heat dissipation structure of light-emitting diode (LED) lamp

Publications (1)

Publication Number Publication Date
CN202757096U true CN202757096U (en) 2013-02-27

Family

ID=47736276

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012204050881U Expired - Fee Related CN202757096U (en) 2012-08-16 2012-08-16 Heat dissipation structure of light-emitting diode (LED) lamp

Country Status (1)

Country Link
CN (1) CN202757096U (en)

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130227

Termination date: 20140816

EXPY Termination of patent right or utility model