CN202750329U - Film circuit substrate - Google Patents
Film circuit substrate Download PDFInfo
- Publication number
- CN202750329U CN202750329U CN 201220327457 CN201220327457U CN202750329U CN 202750329 U CN202750329 U CN 202750329U CN 201220327457 CN201220327457 CN 201220327457 CN 201220327457 U CN201220327457 U CN 201220327457U CN 202750329 U CN202750329 U CN 202750329U
- Authority
- CN
- China
- Prior art keywords
- sticky
- thin film
- insulation
- circuit substrate
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model provides a film circuit substrate, which comprises a heat conductive film, a circuit layer and an insulation film, wherein the heat conductive film comprises a first sticky surface and a second sticky surface; the surface of the circuit layer is provided with an electronic circuit and comprises a first surface and a second surface; the second surface is connected to the first sticky surface; the insulation film comprises a non-sticky insulation surface, a sticky insulation surface and a plurality of tinned holes; and the sticky insulation surface is connected to the first surface. According to the film circuit substrate disclosed by the utility model, the problems of being poor in heat dissipation, poor in voltage resistance, easy for being broken, inconvenient for installation and the like in the traditional circuit substrate can be solved; the heat conduction performance and the voltage-resistant performance are increased; furthermore, the film circuit substrate is difficult to break; and the problem of being inconvenient for installation caused by repetitive screwing action in the prior art is also solved.
Description
Technical field
The utility model relates to the circuit base plate technical field, particularly relates to a kind of wiring thin film substrate.
Background technology
Because far away not as good as novel LED energy-saving lighting equipment, the LED electricity-saving lamp has replaced traditions of the past lamp source at present at aspects such as brightness, useful life and power consumption for the progress of science and technology, old-fashioned lighting apparatus, and by a large amount of each different fields that is applied in.
Usually, LED lamp driver substrate is aluminium base or ceramic substrate, but these two kinds of substrates are all deposited defective in the use.Thermal conductance and the proof voltage of aluminium base are poor, are unfavorable for heat radiation, thereby reduce the useful life of LED, and installing also and need to assisting to fix with the loaded down with trivial details action of tightening up a screw repeatedly, use quite inconvenience; Although ceramic substrate has good proof voltage, manufacturing cost is higher, quality is frangible and installing also quite inconvenience with aluminium base is the same.We have invented a kind of new wiring thin film substrate for this reason, have solved above technical problem.
Summary of the invention
The purpose of this utility model provides a kind of perfect heat-dissipating, proof voltage is strong, quality is non-friable and easy for installation wiring thin film substrate.
The purpose of this utility model can be achieved by the following technical measures: the wiring thin film substrate, this wiring thin film substrate comprises heat conduction film, line layer and insulation film, this heat conduction film comprises the first glutinous face and the second glutinous face, this line layer surface has electronic circuit, and comprise first surface and second surface, this second surface is connected in this first glutinous face, and this insulation film comprises inviscid insulating surfaces, viscosity insulating surfaces and a plurality of zinc-plated hole, and this viscosity edge face is connected in this first surface.
The purpose of this utility model also can be achieved by the following technical measures:
This heat conduction film is the heat conductive insulating double faced adhesive tape.
The second glutinous face is connected on the pedestal of LED equipment.
The electronic circuit on this line layer surface is made for the development etching by medicament.
This electronic circuit is produced in development etching by medicament on this first surface.
This electronic circuit is produced in development etching by medicament on this second surface.
This insulation film is the high-temperature insulation film.
These a plurality of zinc-plated holes are to utilize punching to make from this inviscid insulating surfaces, to be used for being electrically connected LED equipment.
Wiring thin film substrate in the utility model because using the heat conduction film, promotes the heat conductivility of wiring thin film substrate and withstand voltage properties, and is not easy fragmentation; Use the heat conduction film to paste the radiator with LED, easy for installation, solve the problem of the installation inconvenience that causes because of the perseveration of tightening up a screw on the conventional art; The making of heat conduction film can be carried out simultaneously from two ends, reduces performance constraint, enhances productivity.
Description of drawings
Fig. 1 is the expansion schematic diagram of a specific embodiment of wiring thin film substrate of the present utility model;
Fig. 2 be wiring thin film substrate of the present utility model a specific embodiment the combination schematic diagram;
Fig. 3 is wiring thin film substrate and LED radiator connection diagram;
Fig. 4 is the manufacture method flow chart of a specific embodiment of wiring thin film substrate of the present utility model;
Fig. 5 is the manufacture method flow chart of another specific embodiment of wiring thin film substrate of the present utility model.
Embodiment
For above and other purpose of the present utility model, feature and advantage can be become apparent, cited below particularlyly go out preferred embodiment, and cooperate appended graphicly, be described in detail below.
To shown in Figure 3, Fig. 1 is the expansion schematic diagram of a specific embodiment of wiring thin film substrate of the present utility model such as Fig. 1; Fig. 2 be wiring thin film substrate of the present utility model a specific embodiment the combination schematic diagram; Fig. 3 is wiring thin film substrate and LED radiator connection diagram.This wiring thin film substrate comprises heat conduction film 1, line layer 2 and insulation film 3.Wherein, heat conduction film 1 has the first glutinous face 11 and the second glutinous face 12; Line layer 2 has first surface 21 and second surface 22; Insulation film 3 has inviscid insulating surfaces 31, viscosity insulating surfaces 32 and a plurality of zinc-plated hole 33.Heat conduction film 1 has heat conduction, insulate and pastes function, and second surface 22, the second glutinous faces 12 that the first glutinous face 11 is connected in line layer 2 can directly stick in LED radiator 4, need not tighten up a screw repeatedly the purpose that reaches fixing.
Electronic circuit is produced by the development etching of medicament in line layer 2 surfaces, and wherein, first surface 21 is connected in the viscosity insulating surfaces 32 of insulation film 3.In one embodiment, produce electronic circuit for the development etching by medicament on first surface 21.In another embodiment, produce electronic circuit for the development etching by medicament on second surface 22
Claims (2)
1. wiring thin film substrate, it is characterized in that, this wiring thin film substrate comprises heat conduction film, line layer and insulation film, this heat conduction film comprises the first glutinous face and the second glutinous face, this line layer surface has electronic circuit, and comprises that first surface and second surface, this second surface are connected in this first glutinous face, this insulation film comprises inviscid insulating surfaces, viscosity insulating surfaces and a plurality of zinc-plated hole, and this viscosity insulating surfaces is connected in first surface.
2. wiring thin film substrate according to claim 1 is characterized in that, this electronic circuit is that the development etching by medicament is produced on second surface.
3. wiring thin film substrate according to claim 1 is characterized in that, these a plurality of zinc-plated holes are to utilize punching to make from inviscid insulating surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220327457 CN202750329U (en) | 2012-07-09 | 2012-07-09 | Film circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220327457 CN202750329U (en) | 2012-07-09 | 2012-07-09 | Film circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202750329U true CN202750329U (en) | 2013-02-20 |
Family
ID=47709673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220327457 Expired - Fee Related CN202750329U (en) | 2012-07-09 | 2012-07-09 | Film circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202750329U (en) |
-
2012
- 2012-07-09 CN CN 201220327457 patent/CN202750329U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101014418B1 (en) | Board for an electronic parts and lighting unit included the board | |
| CN202285457U (en) | Heat dissipation substrate | |
| CN202750329U (en) | Film circuit substrate | |
| CN103068151B (en) | Heat radiating material | |
| CN201983003U (en) | Integrated heat-dissipation LED daylight lamp | |
| CN201758488U (en) | Heat-conductive self-adhesive circuit substrate | |
| TWI509194B (en) | Illumination apparatus | |
| CN103107275B (en) | Device for light emitting diode (LED) heat conduction and dissipation and insulation and voltage resistance | |
| CN202262036U (en) | Novel printed circuit board | |
| CN201820792U (en) | Novel LED patch thermoelectric insulation support | |
| CN203131523U (en) | Light-emitting diode (LED) light source module with heat conduction column | |
| CN210103830U (en) | Copper foil patch for mobile phone display screen | |
| CN202738258U (en) | Efficient heat dissipating flexible circuit board | |
| TWM394569U (en) | Thermal conductive self-adhesive wiring substrate | |
| CN201368359Y (en) | LED luminous module | |
| CN206329932U (en) | A kind of high and pressure-resistant LED aluminum base plate of electrical strength | |
| CN201475950U (en) | Heat dissipation substrate of LED lamp | |
| CN201487652U (en) | LED lamp | |
| CN216120282U (en) | MOS manages heat radiation structure | |
| CN203596351U (en) | LED-COB (chip on board) light source | |
| CN203656875U (en) | LED (light emitting diode) lamp based on flexible circuit | |
| CN204441322U (en) | A kind of aluminium base of high-power high heat dispersion | |
| CN201821574U (en) | Aluminium base board with radiating function | |
| CN203151859U (en) | A ceramic-based printed circuit board used for installing LEDs | |
| CN203967990U (en) | UPS power plate and ups power |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130220 Termination date: 20130709 |