CN202749368U - Encapsulating structure of preamplifier circuit of radio-cassette recorder - Google Patents
Encapsulating structure of preamplifier circuit of radio-cassette recorder Download PDFInfo
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- CN202749368U CN202749368U CN 201220461937 CN201220461937U CN202749368U CN 202749368 U CN202749368 U CN 202749368U CN 201220461937 CN201220461937 CN 201220461937 CN 201220461937 U CN201220461937 U CN 201220461937U CN 202749368 U CN202749368 U CN 202749368U
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- power amplifier
- encapsulating structure
- circuit
- circuit board
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Abstract
The utility model, which belongs to the field of the integrated circuit technology, relates to an encapsulating structure of a preamplifier circuit of a radio-cassette recorder. The encapsulating structure employs a dual-in-line 16-pin encapsulating structure mode; and the dual-in-line 16-pin encapsulating structure mode comprises a circuit board, a housing arranged outside the circuit board and 16 pins. A pre-amplification circuit module, a power amplifier circuit module and an automatic level control circuit module of the preamplifier circuit of the radio-cassette recorder are arranged in the housing and are connected with the circuit board; and the 16 pins are connected to the circuit board and are extended outside the housing. According to the encapsulating structure provided by the utility model, under the circumstances that the main performances of the circuit are ensured, compared with a DIP14 pin encapsulating structure with cooling fins, the provided encapsulating structure enables the encapsulating cost to be substantially reduced and can be compatible with a printed circuit board applied to the DIP14 encapsulating structure with cooling fins.
Description
Technical field
The utility model relates to technical field of integrated circuits, and particularly the integrated circuit package structure technical field specifically refers to a kind of radio-cassette player front-located power amplifier circuit encapsulating structure.
Background technology
Existing radio-cassette player front-located power amplifier circuit comprises the LA4160 type power amplifier of SANYO GS company, the CD4160CP type power amplifier of domestic Hua Jing company, the packing forms of these circuit all is flange-cooled DIP14(dual-in-line 14 pin package) encapsulation, its encapsulating structure is as shown in Figure 1.
Take the CD4160CP power amplifier of domestic Hua Jing company as example, this inside circuit is integrated preposition amplification, power amplification and automatic level control circuit, 5 of total pin ones wherein are connected to fin power amplifier.Its characteristics are: high, the saturated output tonequality of preposition and power amplifier gain is soft, the automatic electric-level control range is wide, jittering noise is little during Switching Power Supply, peripheral components is few etc., this circuit can reach 1W in the situation power amplifier power output of 4 ohm of supply voltage 6V, load resistance, and owing to consisting of separately the recording amplification by the preamplifier of inside circuit, can realize multiple monitoring function, be fit to very much be applied in the compact radio cassette recorder.
But because this DIP14 packing forms is not the standard packaging form of commonly using, so the cost of encapsulation is higher, affected promoting the use of of this power amplifier.
The utility model content
The purpose of this utility model is to have overcome above-mentioned shortcoming of the prior art, a kind of employing DIP16 standard packaging structure is provided, in the situation that guarantee the circuit main performance, significantly reduce packaging cost, be compatible with simultaneously the radio-cassette player front-located power amplifier circuit encapsulating structure of the employed printed circuit board (PCB) of DIP14 encapsulation power amplifier.
In order to realize above-mentioned purpose, radio-cassette player front-located power amplifier circuit encapsulating structure of the present utility model has following formation:
In this radio-cassette player front-located power amplifier circuit encapsulating structure, radio-cassette player front-located power amplifier circuit comprises pre-amplification circuit module, power amplification circuit module and automatic level control circuit module, described encapsulating structure is dual-in-line 16 pin package structures, and these dual-in-line 16 pin package structures comprise circuit board, are arranged at this circuit board outer housing and 16 pins; Described pre-amplification circuit module, power amplification circuit module and automatic level control circuit module all are arranged in the described housing, and connect described circuit board; Described 16 pins all connect described circuit board, and extend to outside the described housing.
In this radio-cassette player front-located power amplifier circuit encapsulating structure, described 16 pins are arranged at respectively the relative both sides of described circuit board, and every side arranges 8 described pins.
In this radio-cassette player front-located power amplifier circuit encapsulating structure, 16 pins in the described dual-in-line 16 pin package structures are for being arranged at ringwise on the described circuit board and according to counterclockwise tactic the first power amplifier ground pin, power amplifier output pin, boot pin, power amplifier negative feedback pin, power amplifier input pin, ALC input pin, preposition output pin, preposition negative feedback pin, phase compensation pin, preposition input pin, ALC output pin, preposition ground pin, the first decoupling pin, the second decoupling pin, power pin and the second power amplifier ground pin.
Adopted the radio-cassette player front-located power amplifier circuit encapsulating structure of this utility model, because it adopts dual-in-line 16 pin package structures, these dual-in-line 16 pin package structures comprise circuit board, are arranged at this circuit board outer housing and 16 pins; The pre-amplification circuit module of radio-cassette player front-located power amplifier circuit, power amplification circuit module and automatic level control circuit module all are arranged in the described housing, and connect described circuit board; Described 16 pins all connect described circuit board, and extend to outside the described housing, so that in the situation that guarantee the circuit main performance, compared to flange-cooled DIP14 pin package structure, the cost of this encapsulating structure significantly reduces, simultaneously can to encapsulate employed printed circuit board (PCB) compatible mutually with being applied to flange-cooled DIP14.
Description of drawings
Fig. 1 is the schematic diagram of radio-cassette player front-located power amplifier circuit DIP14 encapsulating structure of the prior art.
Fig. 2 is the schematic diagram of radio-cassette player front-located power amplifier circuit encapsulating structure of the present utility model.
Fig. 3 is the power consumption curve comparison figure of DIP14 and DIP16 encapsulated circuit of the present utility model.
Embodiment
In order more clearly to understand technology contents of the present utility model, describe in detail especially exemplified by following examples.
See also shown in Figure 2ly, be radio-cassette player front-located power amplifier circuit encapsulating structure schematic diagram of the present utility model.
In one embodiment, radio-cassette player front-located power amplifier circuit comprises pre-amplification circuit module, power amplification circuit module and automatic level control circuit module, wherein, described this radio-cassette player front-located power amplifier circuit encapsulating structure is dual-in-line 16 pin package structures, and these dual-in-line 16 pin package structures comprise circuit board, are arranged at this circuit board outer housing and 16 pins; Described pre-amplification circuit module, power amplification circuit module and automatic level control circuit module all are arranged in the described housing, and connect described circuit board; Described 16 pins all connect described circuit board, and extend to outside the described housing.
In preferred embodiment, described 16 pins are arranged at respectively the relative both sides of described circuit board, and every side arranges 8 described pins.16 pins are for being arranged at ringwise on the described circuit board and according to counterclockwise tactic the first power amplifier ground pin, power amplifier output pin, boot pin, power amplifier negative feedback pin, power amplifier input pin, ALC input pin, preposition output pin, preposition negative feedback pin, phase compensation pin, preposition input pin, ALC output pin, preposition ground pin, the first decoupling pin, the second decoupling pin, power pin and the second power amplifier ground pin.
In actual applications, the utility model adopts the DIP16 packing forms of standard to replace the original DIP14 packing forms with fin of CD4160CP type power amplifier, save original fin, be connected to two unnecessary pins the power amplifier that originally links to each other with fin.The pin of two kinds of encapsulated circuits distributes (pin sequence number difference correspondence as depicted in figs. 1 and 2) as shown in table 1 below.
Table 1DIP14 packing forms and the DIP16 packing forms pin distribution table of comparisons
Pin by upper table 1 is arranged more as can be known, and the pin of circuit is arranged in fact and do not changed behind the change packing forms, only is that original fin is replaced by two common external pins, and these two pins are connected to the power amplifier ground of inside circuit.So still use at present the producer with the circuit of the DIP14 encapsulation of fin to need not to repaint PCB complete machine plate or change outside line and device, can be directly replace with the circuit that DIP16 encapsulates at the CD4160CP circuit with the DIP14 encapsulation of fin of using that the complete machine plate will be originally.
The DIP16 packing forms has saved fin, and the power consumption curve of flange-cooled DIP14 and two kinds of encapsulated circuits of not flange-cooled DIP16 is (FDIP14 refers to the DIP14 encapsulated circuit with fin) as shown in Figure 3.
The maximum power dissipation of the circuit of two kinds of packing forms when normal temperature is identical, but power consumption is better than the circuit of common DIP16 encapsulation along with the variation tendency of ambient temperature is different with the FDIP14 encapsulation power consumption of fin.
Adopt the new later on variation of the power consumption curve of circuit of DIP16 encapsulation in order to adapt to, the utility model has been done restriction for the extreme operating conditions of this circuit, maximum power supply voltage is reduced to 9V from original 13V, and operating ambient temperature range is adjusted into-20 ℃ ~ 60 ℃ from original-20 ℃ ~ 75 ℃.
Because the packaging cost of DIP16 is cheap, so after adopting packing forms of the present utility model, the cost of whole circuit will have significantly decline.Simultaneously, the circuit of flange-cooled DIP14 encapsulation originally when work its fin owing to wanting ground connection, so the welding hole next door at the DIP14 dual-in-line also has two welding holes that are used for specially inserting fin on the complete machine plate.Adopt after the encapsulation of DIP16, two pins that circuit has more just can be inserted in the welding hole of script fin.So still use at present the producer with the circuit of the DIP14 encapsulation of fin to need not to repaint PCB complete machine plate, can be directly replace with the circuit that DIP16 encapsulates at the CD4160CP circuit with the DIP14 encapsulation of fin of using that the complete machine plate will be originally.
Adopted the radio-cassette player front-located power amplifier circuit encapsulating structure of this utility model, because it adopts dual-in-line 16 pin package structures, these dual-in-line 16 pin package structures comprise circuit board, are arranged at this circuit board outer housing and 16 pins; The pre-amplification circuit module of radio-cassette player front-located power amplifier circuit, power amplification circuit module and automatic level control circuit module all are arranged in the described housing, and connect described circuit board; Described 16 pins all connect described circuit board, and extend to outside the described housing, so that in the situation that guarantee the circuit main performance, compared to flange-cooled DIP14 pin package structure, the cost of this encapsulating structure significantly reduces, simultaneously can to encapsulate employed printed circuit board (PCB) compatible mutually with being applied to flange-cooled DIP14.
In this specification, the utility model is described with reference to its specific embodiment.But, still can make various modifications and conversion obviously and not deviate from spirit and scope of the present utility model.Therefore, specification and accompanying drawing are regarded in an illustrative, rather than a restrictive.
Claims (3)
1. radio-cassette player front-located power amplifier circuit encapsulating structure, described radio-cassette player front-located power amplifier circuit comprises pre-amplification circuit module, power amplification circuit module and automatic level control circuit module, it is characterized in that, described encapsulating structure is dual-in-line 16 pin package structures, and these dual-in-line 16 pin package structures comprise circuit board, are arranged at this circuit board outer housing and 16 pins; Described pre-amplification circuit module, power amplification circuit module and automatic level control circuit module all are arranged in the described housing, and connect described circuit board; Described 16 pins all connect described circuit board, and extend to outside the described housing.
2. radio-cassette player front-located power amplifier circuit encapsulating structure according to claim 1 is characterized in that, described 16 pins are arranged at respectively the relative both sides of described circuit board, and every side arranges 8 described pins.
3. radio-cassette player front-located power amplifier circuit encapsulating structure according to claim 2, it is characterized in that, 16 pins in the described dual-in-line 16 pin package structures are for being arranged at ringwise on the described circuit board and according to counterclockwise tactic the first power amplifier ground pin, the power amplifier output pin, the bootstrapping pin, power amplifier negative feedback pin, the power amplifier input pin, the ALC input pin, preposition output pin, preposition negative feedback pin, the phase compensation pin, preposition input pin, the ALC output pin, preposition ground pin, the first decoupling pin, the second decoupling pin, power pin and the second power amplifier ground pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220461937 CN202749368U (en) | 2012-09-12 | 2012-09-12 | Encapsulating structure of preamplifier circuit of radio-cassette recorder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220461937 CN202749368U (en) | 2012-09-12 | 2012-09-12 | Encapsulating structure of preamplifier circuit of radio-cassette recorder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202749368U true CN202749368U (en) | 2013-02-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220461937 Expired - Fee Related CN202749368U (en) | 2012-09-12 | 2012-09-12 | Encapsulating structure of preamplifier circuit of radio-cassette recorder |
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| Country | Link |
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| CN (1) | CN202749368U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107683525A (en) * | 2016-03-11 | 2018-02-09 | 新电元工业株式会社 | Semiconductor device and lead frame |
-
2012
- 2012-09-12 CN CN 201220461937 patent/CN202749368U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107683525A (en) * | 2016-03-11 | 2018-02-09 | 新电元工业株式会社 | Semiconductor device and lead frame |
| CN107683525B (en) * | 2016-03-11 | 2020-08-14 | 新电元工业株式会社 | Semiconductor device and lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 214135 -6, Linghu Avenue, Wuxi Taihu international science and Technology Park, Wuxi, Jiangsu, China, 180 Patentee after: China Resources micro integrated circuit (Wuxi) Co.,Ltd. Address before: No.180-22, Linghu Avenue, Wuxi, Jiangsu 214000 Patentee before: WUXI CHINA RESOURCES SEMICO Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130220 Termination date: 20210912 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |