CN103762214A - Integrated circuit module applied to switching type adjuster - Google Patents
Integrated circuit module applied to switching type adjuster Download PDFInfo
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- CN103762214A CN103762214A CN201410036423.9A CN201410036423A CN103762214A CN 103762214 A CN103762214 A CN 103762214A CN 201410036423 A CN201410036423 A CN 201410036423A CN 103762214 A CN103762214 A CN 103762214A
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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Abstract
The invention discloses an integrated circuit module applied to a switching type adjuster. The integrated circuit module comprises a power device chip, a control chip and a lead frame. The power device chip comprises a control electrode, a first electrode and a second electrode, wherein the control electrode and the first electrode are arranged on the front face of the power device chip, the second electrode is arranged on the back face of the power device chip, and the second electrode is used as a switch terminal of the switching type adjuster, the control chip comprises a driving electrode on the front face of the control chip and a plurality of input and output electrodes, the lead frame comprises an extension pin, a base and a plurality of split-off pins, and the extension pin and the base are formed integrally. The back face of the power device chip is attached and mounted on the base of the lead frame through conductive materials, the second electrode is electrically connected with the base, the control electrode is electrically connected with the driving electrode, and the input electrodes and the output electrodes of the control chip are electrically connected with the corresponding split-off pins respectively. The integrated circuit module applied to the switching type adjuster can reduce interference of the extension pin with other pins and avoid the electric leakage and failure phenomenon.
Description
Technical field
The present invention relates to semiconductor package, relate more specifically to be applied to the integrated circuit package of switch type regulator.
Background technology
Along with the increase of the demand of miniaturization, lightweight and the multifunction of electronic component, more and more higher to the requirement of semiconductor packaging density, to reach the effect that reduces package dimension.Except integrated circuit (IC) chip, semiconductor packages can also comprise traditional discrete component, for example inductance and power transistor.Can reduce as far as possible the use of peripheral cell like this.In this integrated circuit package, configuration of integrated circuit (IC) chip and discrete component and attaching method thereof has vital impact to the size of package assembling and performance.
In the existing integrated circuit package that is applied to switch type regulator, be applied to there will be peak voltage in the switch pin of integrated circuit package of switch type regulator, easily disturb the pin being adjacent and produce noise.And, also may there is the failure phenomenon that leaks electricity.Meanwhile, the radiating effect of the switch pin in existing integrated circuit package is not good enough.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of integrated circuit package that is applied to switch type regulator, the adverse effect its performance being caused to improve the integrated circuit component structure that is applied to switch type regulator of the prior art.
According to the present invention, a kind of integrated circuit package that is applied to switch type regulator is provided, comprising:
Power device chip, comprises and is positioned at positive control electrode and the first electrode, and the second electrode that is positioned at the back side, and described the second electrode is as the switch terminal of switch type regulator;
Control chip, comprises and is positioned at positive drive electrode and a plurality of input and output electrode;
Lead frame, comprises an extension pin, substrate and a plurality of discrete pin, and described extension pin and described substrate are whole to be formed;
Wherein, fitted and be arranged in the substrate of described lead frame by electric conducting material in the back side of described power device chip, and described the second electrode is electrically connected to described substrate;
Described control electrode and described drive electrode are electrically connected to, and the input and output electrode of described control chip is electrically connected to corresponding discrete pin respectively.
Preferably, described control electrode is gate electrode, and described the first electrode is source electrode, and described the second electrode is drain electrode; Or
Described control electrode is gate electrode, and described the first electrode is drain electrode, and described the second electrode is source electrode.
Preferably, the spacing of described extension pin and adjacent discrete pin is not less than two spacing between adjacent discrete pin.
Preferably, described lead frame comprises four discrete pins, and first, second, third discrete pin is arranged on the first side of described substrate; Described the second discrete pin is arranged between described the first discrete pin and the 3rd discrete pin;
Described the 4th discrete pin is arranged on the second side position relative with described the first discrete pin of described substrate; Described extension pin is arranged on the second side position relative with described the 3rd discrete pin of described substrate;
Described the first side and the second side are opposite side.
Preferably, described the first discrete pin is that grounding pin, the second discrete pin are that energization pins, the 3rd discrete pin are that voltage detecting pin, the 4th discrete pin are current detecting pin; And described extension pin is switch pin.
Preferably, also comprise encapsulating compound, described encapsulating compound covers described control chip, power device chip and lead frame.
Preferably, described encapsulating compound is the encapsulating compound that permittivity is greater than predetermined value.
Preferably, the back side of described control chip is arranged on described power device chip by the separator laminating of insulation.
Preferably, the back side of described control chip is arranged in described substrate by the separator laminating of insulation.
Preferably, the first electrode of described power device chip is electrically connected to an input and output electrode of described control chip.
The present invention, by the extension pin and the whole formation of lead frame substrate that make to be connected with second electrode as switch terminal of power device chip, has improved electrical connection situation and the heat dissipation environment of the integrated circuit package inside that is applied to switch type regulator.Meanwhile, by being arranged on the position away from other pin by extending pin, reduced owing to extending pin to the interference of other pin and having avoided occurring electric leakage failure phenomenon.
Accompanying drawing explanation
By the description to the embodiment of the present invention referring to accompanying drawing, above-mentioned and other objects, features and advantages of the present invention will be more clear, in the accompanying drawings:
Fig. 1 is the circuit diagram of existing switch type regulator;
Fig. 2 is the existing schematic diagram that is applied to the integrated circuit package of switch type regulator;
Fig. 3 is according to the schematic diagram of the integrated circuit package that is applied to switch type regulator of the first embodiment of the present invention;
Fig. 4 is according to the schematic cross-section of the integrated circuit package that is applied to switch type regulator of the first embodiment of the present invention;
Fig. 5 is the schematic diagram of the integrated circuit package that is applied to switch type regulator according to a second embodiment of the present invention;
Fig. 6 is the schematic cross-section of the integrated circuit package that is applied to switch type regulator according to a second embodiment of the present invention.
Embodiment
Hereinafter with reference to accompanying drawing, various embodiment of the present invention is described in more detail.In each accompanying drawing, identical element adopts same or similar Reference numeral to represent.
For the sake of clarity, the various piece in accompanying drawing is not drawn in proportion.For brevity, the modular construction obtaining can be described in a width figure after several steps.In addition, also may omit some known details, for example, at all attached not shown scolders, the not shown backing material for supporting wire frame and/or external frame in some drawings.
Be to be understood that, when describing modular construction, when one deck, region are called be positioned at another layer, another region " above " or when " top ", can refer to be located immediately at another layer, another is above region, or its and another layer, also comprise between another region other layer or region.And if by device upset, this one deck, a region will be positioned at another layer, another region " below " or " below ".If be located immediately at another layer, another situation above region in order to describe, will adopt herein " directly exist ... above " or " ... above and with it in abutting connection with " form of presentation.
Should be appreciated that the connection between element can be physically, in logic or its combination when claiming element " to be couple to " or during " being connected to " another element, it can be directly couple or be connected to another element or can have intermediary element.On the contrary, when claiming element " to be directly coupled to " or during " being directly connected to " another element, meaning that both do not exist intermediary element.
Described hereinafter many specific details of the present invention, the structure, material, size, treatment process and the technology that for example encapsulate, to more clearly understand the disclosure.But just as the skilled person will understand, can realize the disclosure not according to these specific details.
Fig. 1 is the circuit diagram of existing switch type regulator.Switch type regulator comprises control chip U1 and power device chip Q1 and power supply terminal VCC, earth terminal GND, current detecting terminal I
sEN, voltage detection terminal V
sENwith switch terminal SW.Switch terminal refers to power switch pipe in the power stage circuit in switch type regulator and the common node of inductance.
Power device chip Q1 comprises control electrode, the first electrode and the second electrode.Wherein, control electrode is connected with the drive electrode of control chip U1.The second electrode is couple to input voltage, and the first electrode is couple to earth point.Drive electrode is for output switch control signal, and power device chip Q1 receives the switch controlling signal from drive electrode by control electrode, according to control conducting or the shutoff of switch controlling signal.Control chip U1 also comprises input and output electrode CS, and the first electrode of power device chip Q1 (source electrode or drain electrode) is connected with input and output electrode CS, and and then by control chip U1 ground connection.The input and output electrode of control chip U1 is electrically connected to corresponding input and output terminal respectively.The control chip U1 of switch type regulator and power device chip Q1 can be encapsulated in an integrated circuit package, form the integrated circuit package that is applied to switch type regulator.
Fig. 2 is the existing schematic diagram that is applied to the integrated circuit package of switch type regulator, and wherein, the integrated circuit package 00 that is applied to switch type regulator comprises power device chip 01, control chip 02, encapsulating compound 03 and lead frame.Lead frame comprises the first substrate 04 of isolation setting and a plurality of pins of the second substrate 05 and discrete setting.Power device chip 01 is arranged in the first substrate 04, and control chip 02 is arranged in the second substrate 05, and switch terminal is drawn out to the switch pin SW of lead frame by bonding line.The input and output electrode of control chip 02 is respectively by bonding line and energization pins VCC, grounding pin GND, current detecting pin I
sEN, voltage detecting pin V
sENconnect.Switch terminal is drawn out to the switch pin SW of lead frame by bonding line.While there is peak voltage on switch pin SW, easily disturb the pin being adjacent and produce noise.Switch pin SW and adjacent pin-pitch are less also may easily cause electric leakage failure phenomenon.And the existing radiating effect that is applied to the pin that is connected with inductance component in the integrated circuit package of switch type regulator is not good enough yet.
Fig. 3 is according to the schematic diagram of the integrated circuit package that is applied to switch type regulator of the first embodiment of the present invention.Fig. 4 is that Fig. 3 is along the sectional view of A-A ' direction.Below in conjunction with Fig. 3 and Fig. 4, illustrate according to the structure of the integrated circuit package that is applied to switch type regulator of the first embodiment of the present invention.The integrated circuit package 10 that is applied to switch type regulator comprises separator 13 and control chip 14 and the encapsulating compound 15 of lead frame 11, power device chip 12, insulation.At this, be applied in the integrated circuit package 10 of switch type regulator, power device chip 12 and control chip 14 are arranged on lead frame 11 with stack manner.It should be noted that this integrated circuit package that is applied to switch type regulator 10 can comprise more transistor and/or integrated circuit.In the scope that substrate 112 allows at package dimension, manufacture as far as possible greatly to be conducive to heat radiation.
In an optimal way of the present embodiment, in order to realize, to extend pin 111 and arrange away from a plurality of discrete pins 113, discrete pin 113 is arranged on respectively the first side (A ' place side) and second side (A place side) of substrate 112.The first side and the second side are suprabasil opposite side.The quantity that is positioned at the discrete pin 113 of the first side is greater than the quantity of the discrete pin 113 that is positioned at the second side, and difference is more than or equal to 2.
As shown in Figure 3, in an optimal way of the present embodiment, encapsulation circuit as shown in Figure 1 in the integrated circuit package with 5 pins.Wherein, lead frame 11 comprises 4 discrete pins, wherein, first, second, third discrete pin is arranged on the first side of substrate 112, the second discrete pin is arranged between the first discrete pin and the 3rd discrete pin, also, the first discrete pin and the 3rd discrete pin lay respectively at the two ends of the second side of substrate 112.The 4th discrete pin is arranged on the second side, and relative with the first discrete pin.
Meanwhile, extend the second side that pin 111 is arranged on substrate 112, by one end of the second side, stretched out, and away from the discrete pin that is positioned at described the second side.As shown in Figure 3, extend pin 111 and be arranged on the position relative with the 3rd discrete pin 113, also, the 4th discrete pin and extension pin 111 are separately positioned on the two ends of the second side of substrate 112.Thus, extend pin 111 and be maximized with the spacing of all discrete pin, can avoid the noise jamming to adjacent leads that causes due to peak voltage, meanwhile, also can prevent electric leakage failure phenomenon.
Preferably, described the first discrete pin is that grounding pin, the second discrete pin are that energization pins, the 3rd discrete pin are that voltage detecting pin, the 4th discrete pin are current detecting pin; And described extension pin is switch pin.
More preferably, the integrated circuit package that is applied to switch type regulator 10 with 5 pins shown in Fig. 3 and Fig. 4 encapsulates with SOT23-5 form.It is little that SOT23-5 encapsulation has size, the advantage that volume is little, and because it has smaller size smaller, easily there is noise jamming and electric leakage failure phenomenon in original structure.The structure of application the present embodiment can be avoided the appearance of above-mentioned situation.
More preferably, the integrated circuit package that is applied to switch type regulator of the present embodiment can be used as LED driver, driving LED load running.
Certainly, those skilled in the art can understand, the discrete pin number of the integrated circuit package that is applied to switch type regulator 10 of the present embodiment and discrete pin are not limited to above-mentioned particular form with the set-up mode that extends pin, as long as can arrange to such an extent that all can be applied to the present embodiment away from the pin set-up mode of other pin by extending pin.
Preferably, in the integrated circuit package that is applied to switch type regulator 10 shown in Fig. 3, the first electrode 122 of power device chip 12 is electrically connected to an input and output electrode of control chip 14 by bonding line.Thereby make the first electrode 122 by control chip 14 ground connection.
One of ordinary skill in the art will readily recognize that in the present invention, above-mentioned annexation is also nonessential, and it arranges when only the power device chip in switch type regulator 12 need to be connected to earth point by control chip 14.When the power device chip 12 in switch type regulator does not need to be connected to earth point by control chip, control chip 14 only drive electrode 141 is connected with the drive electrode 121 of power device chip 12, putting before this, the first electrode 122 of power device chip 12 is electrically connected to specific discrete pin conventionally.
Being fitted and be arranged in the substrate 112 of lead frame 11 by electric conducting material in the back side of power device chip 12, makes to be thus electrically connected to substrate 112 as the second electrode of switch terminal.Preferably, can paste or welding procedure realizes power device chip 12 and installs with the laminating of substrate 112 by conducting resinl.Owing to extending pin 111, form with substrate 112 is whole, there is electrical connection in both, therefore, can realize the second electrode of power device chip 12 and being connected of extension pin 111 without bonding line.And due to global formation, the resistance of electrical connection is between the two less, is conducive to heat radiation and avoids out electric leakage failure phenomenon.
The control electrode 121 of power device chip 12 is electrically connected to by bonding line and drive electrode 141.The input and output electrode of control chip 14 is electrically connected to each corresponding discrete pin 113 respectively by bonding line.
Encapsulating compound 15 Coverage Control chips 14, power device chip 12 and lead frame 11, and there is the permittivity of the predetermined value of being greater than, expose from encapsulating compound 15 end of each pin of lead frame 110, for providing, is applied to the integrated circuit package 10 of switch type regulator and being electrically connected to of external circuit (for example circuit board).Larger permittivity can improve the insulation characterisitic of extending between pin and discrete pin, and then avoids occurring electric leakage failure phenomenon.
In the integrated circuit package that is applied to switch type regulator of the first embodiment, with the extension pin being connected as the second electrode of switch terminal in power device chip with lead frame substrate is whole forms, the electrical connection situation of switch type regulator inside and the heat dissipation environment of pin have been improved.Meanwhile, by being arranged on the position away from other pin by extending pin, reduced owing to extending pin to the interference of other pin and can avoid occurring electric leakage failure phenomenon.
Fig. 5 is the schematic diagram of the integrated circuit package that is applied to switch type regulator according to a second embodiment of the present invention.Fig. 6 is that Fig. 5 is along the sectional view of A-A ' direction.Structure below in conjunction with Fig. 5 and Fig. 6 explanation integrated circuit package that is applied to switch type regulator according to a second embodiment of the present invention.
Identical with the first embodiment, the integrated circuit package that is applied to switch type regulator 20 of the present embodiment comprises separator 23 and control chip 24 and the encapsulating compound 25 of lead frame 21, power device chip 22, insulation.It should be noted that this integrated circuit package that is applied to switch type regulator 20 can comprise more transistor and/or integrated circuit.
In a second embodiment, lead frame 21 is identical with the set-up mode of the first embodiment, it comprises extension pin 211, substrate 212 and a plurality of discrete pin 213, extending pin 211 forms with substrate 212 is whole, and be positioned at the position away from a plurality of discrete pins 213, the spacing of also, extending between pin 211 and adjacent discrete pin 213 is not less than the spacing between any two adjacent discrete pins.
Meanwhile, control chip 24 comprises and is positioned at positive drive electrode 241 and a plurality of input and output electrode.
The second embodiment is from the different of the first embodiment, control chip 24 is not stacking to be arranged on power device chip 22, at this, be applied in the integrated circuit package 20 of switch type regulator, power device chip 22 and control chip 24 are installed on lead frame 21.Particularly, fitted and be arranged in substrate 212 by electric conducting material in the back side of power device chip 22, so that be positioned at second electrode at power device chip 22 back sides, is electrically connected to substrate 212.And the back side of control chip 24 is arranged in substrate 212 by separator 23 laminatings of insulating, drive electrode 241 is electrically connected to the control electrode 221 of power device chip 22 by bonding line.
Preferably, the first electrode 222 of power device chip 22 is electrically connected to an input and output electrode of control chip 24 by bonding line, so that the first electrode 222 is by control chip 24 ground connection.
One of ordinary skill in the art will readily recognize that in the present invention, above-mentioned annexation is also nonessential, and it arranges when only the power device chip in switch type regulator 22 need to be connected to earth point by control chip 24.When the power device chip 22 in switch type regulator does not need to be connected to earth point by control chip, control chip 24 only drive electrode 241 is connected with the drive electrode 221 of power device chip 22, putting before this, the first electrode 222 of power device chip 22 is electrically connected to by bonding line with specific discrete pin conventionally.
In the present embodiment, the extension pin being connected with second electrode as switch terminal of power device chip and lead frame substrate are whole to be formed, and has improved the electrical connection situation of switch type regulator inside and the heat dissipation environment of pin.Meanwhile, by being arranged on the position away from other pin by extending pin, reduced owing to extending pin to the interference of other pin and can avoid occurring electric leakage failure phenomenon.
Should be noted that, in this article, relational terms such as the first and second grades is only used for an entity or operation to separate with another entity or operating space, and not necessarily requires or imply and between these entities or operation, have the relation of any this reality or sequentially.In addition,, in description of the invention, except as otherwise noted, the implication of " a plurality of " is two or more.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thereby the process, method, article or the equipment that make to comprise a series of key elements not only comprise those key elements, but also comprise other key elements of clearly not listing, or be also included as the intrinsic key element of this process, method, article or equipment.The in the situation that of more restrictions not, the key element being limited by statement " comprising ... ", and be not precluded within process, method, article or the equipment that comprises described key element and also have other identical element.
According to embodiments of the invention as described above, these embodiment do not have all details of detailed descriptionthe, and also not limiting this invention is only described specific embodiment.Obviously, according to above description, can make many modifications and variations.These embodiment are chosen and specifically described to this specification, is in order to explain better principle of the present invention and practical application, thereby under making, technical field technical staff can utilize the present invention and the modification on basis of the present invention to use well.The present invention is only subject to the restriction of claims and four corner and equivalent.
Claims (10)
1. an integrated circuit package that is applied to switch type regulator, comprising:
Power device chip, comprises and is positioned at positive control electrode and the first electrode, and the second electrode that is positioned at the back side, and described the second electrode is as the switch terminal of switch type regulator;
Control chip, comprises and is positioned at positive drive electrode and a plurality of input and output electrode;
Lead frame, comprises an extension pin, substrate and a plurality of discrete pin, and described extension pin and described substrate are whole to be formed;
Wherein, fitted and be arranged in the substrate of described lead frame by electric conducting material in the back side of described power device chip, and described the second electrode is electrically connected to described substrate;
Described control electrode and described drive electrode are electrically connected to, and the input and output electrode of described control chip is electrically connected to corresponding discrete pin respectively.
2. the integrated circuit package that is applied to switch type regulator according to claim 1, is characterized in that, the spacing of described extension pin and adjacent discrete pin is not less than two spacing between adjacent discrete pin.
3. the integrated circuit package that is applied to switch type regulator according to claim 1, is characterized in that, described control electrode is gate electrode, and described the first electrode is source electrode, and described the second electrode is drain electrode; Or
Described control electrode is gate electrode, and described the first electrode is drain electrode, and described the second electrode is source electrode.
4. the integrated circuit package that is applied to switch type regulator according to claim 1, is characterized in that, described lead frame comprises four discrete pins, and first, second, third discrete pin is arranged on the first side of described substrate; Described the second discrete pin is arranged between described the first discrete pin and the 3rd discrete pin;
Described the 4th discrete pin is arranged on the second side position relative with described the first discrete pin of described substrate; Described extension pin is arranged on the second side position relative with described the 3rd discrete pin of described substrate;
Described the first side and the second side are opposite side.
5. the integrated circuit package that is applied to switch type regulator according to claim 4, it is characterized in that, described the first discrete pin is that grounding pin, the second discrete pin are that energization pins, the 3rd discrete pin are that voltage detecting pin, the 4th discrete pin are current detecting pin; And described extension pin is switch pin.
6. according to the integrated circuit package that is applied to switch type regulator described in any one in claim 1-3, it is characterized in that, described integrated circuit package also comprises encapsulating compound, and described encapsulating compound covers described control chip, power device chip and lead frame.
7. the integrated circuit package that is applied to switch type regulator according to claim 6, is characterized in that, described encapsulating compound is the encapsulating compound that permittivity is greater than predetermined value.
8. the integrated circuit package that is applied to switch type regulator according to claim 1, is characterized in that, the back side of described control chip is arranged on described power device chip by the separator laminating of insulation.
9. the integrated circuit package that is applied to switch type regulator according to claim 1, is characterized in that, the back side of described control chip is arranged in described substrate by the separator laminating of insulation.
10. according to the integrated circuit package that is applied to switch type regulator described in claim 4,5,8 or 9, it is characterized in that, the first electrode of described power device chip is electrically connected to an input and output electrode of described control chip.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410036423.9A CN103762214B (en) | 2014-01-24 | 2014-01-24 | It is applied to the integrated circuit package of switch type regulator |
| US14/601,098 US10043738B2 (en) | 2014-01-24 | 2015-01-20 | Integrated package assembly for switching regulator |
| US15/996,774 US10741481B2 (en) | 2014-01-24 | 2018-06-04 | Integrated package assembly for switching regulator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410036423.9A CN103762214B (en) | 2014-01-24 | 2014-01-24 | It is applied to the integrated circuit package of switch type regulator |
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| Publication Number | Publication Date |
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| CN103762214A true CN103762214A (en) | 2014-04-30 |
| CN103762214B CN103762214B (en) | 2016-08-17 |
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| CN201410036423.9A Active CN103762214B (en) | 2014-01-24 | 2014-01-24 | It is applied to the integrated circuit package of switch type regulator |
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| CN106409806A (en) * | 2016-12-06 | 2017-02-15 | 四川富美达微电子有限公司 | IC lead bracket |
| CN109962048A (en) * | 2019-03-28 | 2019-07-02 | 江西芯诚微电子有限公司 | A kind of integrated circuit package structure of five pins of band heat dissipation |
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|---|---|
| CN103762214B (en) | 2016-08-17 |
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