CN202488876U - Metal-based circuit board with radiating structure for LED (Light Emitting Diode) packaging - Google Patents
Metal-based circuit board with radiating structure for LED (Light Emitting Diode) packaging Download PDFInfo
- Publication number
- CN202488876U CN202488876U CN2012201334824U CN201220133482U CN202488876U CN 202488876 U CN202488876 U CN 202488876U CN 2012201334824 U CN2012201334824 U CN 2012201334824U CN 201220133482 U CN201220133482 U CN 201220133482U CN 202488876 U CN202488876 U CN 202488876U
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- Prior art keywords
- heat
- circuit board
- metal
- conductive layer
- layer
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Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 50
- 239000002184 metal Substances 0.000 title claims abstract description 50
- 238000004806 packaging method and process Methods 0.000 title abstract 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000011889 copper foil Substances 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 26
- 150000002739 metals Chemical class 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract description 5
- 230000005855 radiation Effects 0.000 abstract description 5
- 230000005669 field effect Effects 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 47
- 230000005540 biological transmission Effects 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 238000012536 packaging technology Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000001149 thermolysis Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a metal-based circuit board with a radiating structure for LED (Light Emitting Diode) packaging. The metal-based circuit board comprises a copper foil circuit layer, a metal base board and an insulation and heat conduction layer, wherein the insulation and heat conduction layer is adhered between the copper foil circuit layer and the metal base board. According to the metal-based circuit board with a radiating structure for LED packaging, disclosed by the utility model, the heat conduction and heat radiation properties are good, the safe operation of electronic devices can be ensured, a radiator does not need to be additionally arranged, and the subsequent assembly processes can be simplified. Besides the LED packaging, the metal-based circuit board can also be used for packaging various high-power electronic devices such as power modules, thyristors, power transistors, power field effect transistors and the like.
Description
Technical field
The utility model relates to a kind of wiring board, especially has the metal base circuit board of radiator structure.
Background technology
In electronic device wiring board field, especially in high-power electronic devices such as power module and semiconductor light source were used, heat radiation was a critical problem that must solve.Because metal base circuit board has machinery adaptability is installed, high-power electronic devices such as therefore exhausted big multi-power module, semiconductor light source all adopt metal base circuit board in using.
The implementation procedure of cooling system mainly comprises two aspects of heat conduction and heat radiation, and the heat that produces during power component work is transmitted to the surface that contacts with heat absorption bodies such as air, water earlier through " heat conduction " process; Contact surface and heat absorption body carry out heat exchange, realize " heat radiation " process.
The metal base circuit board that adopts during high-power electronic device is used does not at present have radiator structure, and thermolysis is very little, therefore must on high-power electronic device, install the needs that radiator could satisfy its security of operation additional.
The utility model content
The technical problem that the utility model will solve provides a kind of metal base circuit board with radiator structure; Its heat that can components and parts mounted thereto be sent passes to the Metal Substrate surface of metal base circuit board; Again can be through heat being distributed with the incorporate radiator structure of metal base circuit board Metal Substrate; Need not to install additional again radiator, simplify the packaging technology of follow-up use.
For solving the problems of the technologies described above; The technical scheme that the utility model adopts is: a kind of LED package metals base circuit board with radiator structure; Comprise copper foil circuit layer, metal substrate and insulating heat-conductive layer, the insulating heat-conductive layer is bonded between copper foil circuit layer and the metal substrate; The periphery of metal substrate is provided with heat radiating fin.The copper foil circuit layer also has the function of heat conduction except being used for to being installed in wiring board electronic devices and components conduct electricity simultaneously; Bonding copper foil circuit layer of insulating heat-conductive layer and metal substrate.After heat is transmitted to metal substrate, carry out heat exchange by metal substrate and extraneous absorber.
Further technical scheme is: said insulating heat-conductive layer comprises the first insulating heat-conductive layer and the second insulating heat-conductive layer, also is provided with the layer of copper heat-conducting layer between the first insulating heat-conductive layer and the second insulating heat-conductive layer.The insulating heat-conductive layer capacity of heat transmission of single one deck is more weak, and can marked change not take place because of the simple thickness that changes.But the insulating heat-conductive layer that is split up into double-layer structure in contrast to the identical single layer structure of thickness, has good heat-conducting effect, thereby promotes the heat-sinking capability of whole wiring board.
A kind of preferred as the utility model, the periphery of metal substrate is provided with heat radiating fin.Heat is dispersed towards the horizontal direction of metal substrate, and the heat radiating fin of metal substrate periphery setting is used for and heat exchange with outside.
A kind of LED package metals base circuit board with radiator structure of the utility model has good heat conduction and heat radiation performance, guarantees the security of operation of electronic device, need not to install additional radiator again, simplifies the packaging technology of follow-up use.
Description of drawings
Fig. 1 is a kind of structural representation with LED package metals base circuit board of radiator structure of the utility model.
Fig. 2 is the a-quadrant enlarged drawing of Fig. 1.
Fig. 3 is that Fig. 1 is along B direction sketch map.
Fig. 4 is a kind of semi-finished product sketch map with LED package metals base circuit board of radiator structure of the utility model.
Wherein, 1, metal substrate; 11, heat radiating fin; 2, insulating heat-conductive layer; 21, the first insulating heat-conductive layer; 22, the second insulating heat-conductive layer; 3, copper foil circuit layer; 4, copper heat-conducting layer.
Embodiment
As shown in Figure 1, a kind of LED package metals base circuit board with radiator structure of the utility model comprises copper foil circuit layer 3, metal substrate 1 and insulating heat-conductive layer 2, and insulating heat-conductive layer 2 is bonded between copper foil circuit layer 3 and the metal substrate 1; The periphery of metal substrate 1 is provided with heat radiating fin 11.Copper foil circuit layer 3 also has the capacity of heat transmission except the electrical connection that realizes electronic device, heat passes on the metal substrate 1 via insulating heat-conductive layer 2, disperses along the horizontal direction of metal substrate 1, finally carries out heat exchange by heat radiating fin 11 and extraneous air.As shown in Figures 2 and 3, insulating heat-conductive layer 2 comprises between the first insulating heat-conductive layer 21 and the second insulating heat-conductive layer, 22, the first insulating heat-conductive layer 21 and the second insulating heat-conductive layer 22 and also is provided with layer of copper heat-conducting layer 4.The insulating heat-conductive layer also can be processed single one deck and not add copper heat-conducting layer 4, but the insulating heat-conductive layer capacity of heat transmission of single one deck is relatively poor, and the thickness that only changes the insulating heat-conductive layer can not make its capacity of heat transmission that significant variation is arranged.And after opening the first insulating heat-conductive layer 21 and the second insulating heat-conductive layer in 22 minutes, its capacity of heat transmission has had significant lifting, thereby promotes the heat-sinking capability of whole wiring board.After high-power electronic device (including but not limited to power module, the high power semi-conductor light source) encapsulation; The heat that its work produced can conduct on the metal substrate 1 through copper foil circuit layer 3, the first insulating heat-conductive layer 21, copper heat-conducting layer 4 and the second insulating heat-conductive layer 22; Heat radiating fin 11 on the metal substrate 1 distributes heat, has guaranteed the security of operation of high-power electronic device.High-power electronic device after the encapsulation need not to install additional radiator again, has simplified the packaging technology of follow-up use, and is easy to use.
Manufacturing process:
According to electronic device; The design power of power module, high power semi-conductor light source etc. for example; The heat that calculating device is produced when work then according to the metal species (for example copper, aluminum or aluminum alloy etc.) of heat selection metal substrate 1, calculates the data of desired thickness and area.Centre at metal substrate 1 makes insulating heat-conductive layer 2 and copper foil circuit layer 3.The shape of making heat radiating fin 11 in the marginal portion of metal substrate 1, the concrete shape and size of heat radiating fin 11 are decided according to the caloric value of electronic device equally, and are for example shown in Figure 4, heat radiating fin 11 be shaped as the square column shape.Heat radiating fin 11 bendings, finally process structure shown in Figure 1, make heat radiating fin 11 have heat sinking function.
A kind of LED package metals base circuit board with radiator structure of the utility model has good heat-sinking capability; Be particularly useful for the encapsulation of led light source; But be not only limited to substrate as the LED encapsulation yet; Can also be used for the encapsulation of various high-power electronic devices, for example power module, thyristor, power transistor, power field effect pipe etc.
To one skilled in the art, can make other various corresponding changes and deformation, and these all changes and deformation should belong within the protection range of the utility model claim all according to the technical scheme and the design of above description.
Claims (3)
1. LED package metals base circuit board with radiator structure, it is characterized in that: comprise copper foil circuit layer, metal substrate and insulating heat-conductive layer, the insulating heat-conductive layer is bonded between copper foil circuit layer and the metal substrate.
2. the LED package metals base circuit board with radiator structure according to claim 1; It is characterized in that: said insulating heat-conductive layer comprises the first insulating heat-conductive layer and the second insulating heat-conductive layer, also is provided with the layer of copper heat-conducting layer between the first insulating heat-conductive layer and the second insulating heat-conductive layer.
3. the LED package metals base circuit board with radiator structure according to claim 1 and 2, it is characterized in that: the periphery of metal substrate is provided with heat radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201334824U CN202488876U (en) | 2012-04-01 | 2012-04-01 | Metal-based circuit board with radiating structure for LED (Light Emitting Diode) packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201334824U CN202488876U (en) | 2012-04-01 | 2012-04-01 | Metal-based circuit board with radiating structure for LED (Light Emitting Diode) packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202488876U true CN202488876U (en) | 2012-10-10 |
Family
ID=46963258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201334824U Expired - Lifetime CN202488876U (en) | 2012-04-01 | 2012-04-01 | Metal-based circuit board with radiating structure for LED (Light Emitting Diode) packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202488876U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105953103A (en) * | 2016-06-14 | 2016-09-21 | 广东祥新光电科技有限公司 | LED non-planar heat-dissipating PCB bulb and processing technology thereof |
-
2012
- 2012-04-01 CN CN2012201334824U patent/CN202488876U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105953103A (en) * | 2016-06-14 | 2016-09-21 | 广东祥新光电科技有限公司 | LED non-planar heat-dissipating PCB bulb and processing technology thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Baoan District Fuyong Town, Shenzhen city of Guangdong province and 518000 new HUAFA Industrial Park building A5 Patentee after: Shenzhen hi tech materials Limited by Share Ltd Address before: Baoan District Fuyong Town, Shenzhen city of Guangdong province and 518000 new HUAFA Industrial Park building A5 Patentee before: Shenzhen Kerui Electronic Industrial Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121010 |
|
| CX01 | Expiry of patent term |