CN202333437U - Single-tube laser with lead circuit board - Google Patents
Single-tube laser with lead circuit board Download PDFInfo
- Publication number
- CN202333437U CN202333437U CN2011204645248U CN201120464524U CN202333437U CN 202333437 U CN202333437 U CN 202333437U CN 2011204645248 U CN2011204645248 U CN 2011204645248U CN 201120464524 U CN201120464524 U CN 201120464524U CN 202333437 U CN202333437 U CN 202333437U
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- Prior art keywords
- heat sink
- laser
- circuit board
- laser chip
- negative electrode
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a single-tube laser with a lead circuit board, which is suitable for package of single-tube semiconductor laser chips of various watts. The single-tube laser comprises a laser chip, a heat sink and a shaping lens, wherein the shaping lens is matched with the laser chip and arranged on the heat sink; the heat sink is provided with the circuit board; the bottom surface of the circuit board is fixed on the heat sink, a positive electrode conductive disc and a negative electrode conductive disc are arranged on the end face of the circuit board, and a notch is formed on one side of the circuit board; a ceramic radiating fin, which is matched with the notch in size, is arranged in the notch; the bottom surface of the ceramic radiating fin is fixed on the heat sink; the end face of the ceramic radiating fin is divided into two metallic areas to form a positive electrode and a negative electrode; the positive electrode of the laser chip is welded on the positive electrode area of the ceramic radiating fin, and the positive electrode area is connected with the positive electrode conductive disc through a gold wire; and the negative electrode of the laser chip is connected with the negative electrode conductive disc through a gold wire. The single-tube laser with the lead electrode disclosed by the utility model has the advantages of convenience in mounting, convenience in leading during use by users, and high radiating efficiency.
Description
Technical field
The utility model relates to a kind of laser illuminator set, especially relates to a kind of single tube laser of tool lead wire circuit plate.
Background technology
At present, the single tube laser all be mostly adopt with laser chip directly be welded on heat sink on, it is heat sink that the bottom surface of chip be a positive pole as anodal, end face is a negative pole, there is following shortcoming in this structure:
1), uses inconvenience, when the user uses, cause relatively difficulty of user's line because of the volume of laser chip is very for a short time;
2), during laser works, the heat that laser chip produces is through heat sink heatsink transverse, and radiating efficiency is not high, is unfavorable for the performance of Laser Devices overall performance.
The utility model content
The utility model purpose is to provide a kind of single tube laser of tool lead wire circuit plate, its have convenient install, lead-in wire and the high characteristics of radiating efficiency when user-friendly, to solve the problem that the single tube laser exists in the prior art.
The purpose of the utility model is to realize through following technical scheme:
A kind of single tube laser of tool lead wire circuit plate, it comprises laser chip, heat sink and shaping lens, said shaping lens cooperate laser chip install with heat sink on; Wherein, saidly circuit board is set on heat sink, the bottom surface of said circuit board be fixed in heat sink on; Its end face is provided for connecting two conductive plates of positive and negative electrode of laser chip positive and negative electrode and the switching of device aerial lug; And offer breach on the side of said circuit board, be provided with in the said breach cooperate its big or small ceramic heat-dissipating sheet, the bottom surface of said ceramic heat-dissipating sheet to be close to be fixed in heat sink on; Its end face is divided into two metallized areas and forms positive and negative electrode; And the positive pole of welding laser chip on the positive pole zone of said ceramic heat-dissipating sheet, this positive pole zone is connected with anodal conductive plate through gold thread, and said laser chip negative pole is connected with cathode conductive disk through gold thread.
Especially, the bottom surface of said ceramic heat-dissipating sheet be weldingly fixed on heat sink on.
Especially, said heat sink be the H type structure of metal solid, offer fixing hole on its two sides, and the end face of the medial surface of said heat sink two sides and middle linkage section forms mounting groove, the bottom surface of said circuit board be fixedly welded on heat sink on.
Especially, said shaping lens cooperate laser chip through ultra-violet curing glue glue be bonded at heat sink on.
The beneficial effect of the utility model does, the single tube laser of said tool lead wire circuit plate is applicable to the single tube semiconductor laser chip encapsulation of various wattages, and it is used to dispel the heat and heat sink and powered electrode that usefulness is installed insulate fully, installation during convenient use; Line provided user-friendly than large space when the conductive plate on the circuit board used for the user; The laser heat dissipation direction helps the performance of Laser Devices performance; Compared with prior art have convenient install, lead-in wire and the high advantage of radiating efficiency when user-friendly.
Description of drawings
According to accompanying drawing and embodiment the utility model is done further explain below.
Fig. 1 is the structural representation of the single tube laser of the utility model tool lead wire circuit plate;
Fig. 2 is the explosive view of the single tube laser of the utility model tool lead wire circuit plate;
Fig. 3 is the structural representation of circuit board of the single tube laser of the utility model tool lead wire circuit plate;
Fig. 4 is laser chip and the assembling sketch map of ceramic heat-dissipating sheet of the single tube laser of the utility model tool lead wire circuit plate;
Fig. 5 is the heat sink structural representation of the single tube laser of the utility model tool lead wire circuit plate.
Among the figure:
1, metal heat sink; 2, circuit board; 21, anodal conductive plate; 22, cathode conductive disk; 3, laser chip; 4, shaping lens; 5, fixing hole; 6, ceramic heat-dissipating sheet; 61, ceramic heat-dissipating sheet positive pole zone; 62, ceramic heat-dissipating sheet negative pole zone; 7, mounting groove; 8, breach.
Embodiment
Please referring to figs. 1 through shown in Figure 5, in the present embodiment, a kind of single tube laser of tool lead wire circuit plate comprises laser chip 3, metal heat sink 1 and shaping lens 4; The H type structure that said metal heat sink 1 is an entity; Offer fixing hole 5 on its two sides, and the end face of the medial surface of 1 two sides of said metal heat sink and middle linkage section formation mounting groove 7, be provided with circuit board 2 in the said mounting groove 7; The bottom surface of said circuit board 2 is fixedly welded on the metal heat sink 1; And its end face is provided for connecting the anodal conductive plate 21 and cathode conductive disk 22 of laser chip 3 positive and negative electrodes and the switching of device aerial lug, and outside lead is welded to circuit board 2 upper surfaces, power supply is provided for circuit board 2; Said shaping lens 4 cooperates laser chip 3 to be bonded on the metal heat sink 1 through ultra-violet curing glue glue; After laser chip 3 sends laser, adjust, reach the beam shaping effect through beam shaping lens 4.
Offer breach 8 on one side of said circuit board 2; Be provided with in the said breach 8 and cooperate its big or small ceramic heat-dissipating sheet 6; Two regional metalizations are divided in ceramic heat-dissipating sheet 6 upper surfaces, form ceramic heat-dissipating sheet positive pole zone 61 and ceramic heat-dissipating sheet negative pole zone 62, and the positive pole of precoating scolder in order to welding laser chip 3 arranged on the surface of ceramic heat-dissipating sheet positive pole zone 61; Anodal non-precoating scolder part and ceramic heat-dissipating sheet negative pole zone 62 are the bonding wire zone; The ceramic heat-dissipating sheet 6 of welding laser chip 3 is welded on the metal heat sink 1 through scolder, and the heat that laser chip 3 is produced transmits heat downwards through ceramic heat-dissipating sheet 6 and metal heat sink 1, and said metal heat sink 1 is realized electric insulation with circuit board 2 and the electrode on the ceramic heat-dissipating sheet 6; And a large amount of heats that produce in the course of the work exhale through metal heat sink 1.Play insulation, the effect of heat radiation.
Said ceramic heat-dissipating sheet positive pole zone 61 is connected with anodal conductive plate 21 through gold thread, and the negative pole of said laser chip 3 is connected with cathode conductive disk 22 through gold thread.
The single tube laser of above-mentioned tool lead wire circuit plate is used to dispel the heat and metal heat sink 1 that usefulness is installed insulate with powered electrode fully, installs during convenient the use; Line provided user-friendly than large space when the conductive plate on the circuit board 2 used for the user; The heat dissipation direction of laser chip 3 to ceramic heat-dissipating sheet 6 and metal heat sink 1, has improved radiating efficiency from top to bottom, helps the performance of Laser Devices overall performance, is applicable to the encapsulation of the single tube semiconductor laser chip of various wattages.
Claims (4)
1. the single tube laser of a tool lead wire circuit plate; It comprises laser chip, heat sink and shaping lens; Said shaping lens cooperate laser chip install with heat sink on, it is characterized in that: saidly circuit board is set on heat sink, the bottom surface of said circuit board be fixed in heat sink on; Its end face is provided for connecting two conductive plates of positive and negative electrode of laser chip positive and negative electrode and the switching of device aerial lug; And offer breach on the side of said circuit board, be provided with in the said breach cooperate its big or small ceramic heat-dissipating sheet, the bottom surface of said ceramic heat-dissipating sheet to be close to be fixed in heat sink on; Its end face is divided into two metallized areas and forms positive and negative electrode; And the positive pole of welding laser chip on the positive pole zone of said ceramic heat-dissipating sheet, this positive pole zone is connected with anodal conductive plate through gold thread, and said laser chip negative pole is connected with cathode conductive disk through gold thread.
2. the single tube laser of tool lead wire circuit plate according to claim 1 is characterized in that: the bottom surface of said ceramic heat-dissipating sheet be weldingly fixed on heat sink on.
3. according to the single tube laser of claim 1 or 2 each described tool lead wire circuit plates; It is characterized in that: said heat sink for the H type structure of metal solid; Offer fixing hole on its two sides; And the medial surface of said heat sink two sides and the end face of middle linkage section form mounting groove, the bottom surface of said circuit board be fixedly welded on heat sink on.
4. the single tube laser of tool lead wire circuit plate according to claim 1 is characterized in that: said shaping lens cooperate laser chip through ultra-violet curing glue glue be bonded at heat sink on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204645248U CN202333437U (en) | 2011-11-21 | 2011-11-21 | Single-tube laser with lead circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204645248U CN202333437U (en) | 2011-11-21 | 2011-11-21 | Single-tube laser with lead circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202333437U true CN202333437U (en) | 2012-07-11 |
Family
ID=46445404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204645248U Expired - Fee Related CN202333437U (en) | 2011-11-21 | 2011-11-21 | Single-tube laser with lead circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202333437U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102386558A (en) * | 2011-11-21 | 2012-03-21 | 无锡亮源激光技术有限公司 | Single emitter with lead wire circuit board |
| CN104283108A (en) * | 2013-07-11 | 2015-01-14 | 山东浪潮华光光电子股份有限公司 | High-power laser module and packaging method thereof |
| CN106300006A (en) * | 2016-10-13 | 2017-01-04 | 中国科学院半导体研究所 | A kind of heat sink for chip of laser array package |
| CN108321674A (en) * | 2015-03-30 | 2018-07-24 | 青岛海信宽带多媒体技术有限公司 | Laser emitter |
| WO2020143232A1 (en) * | 2019-01-10 | 2020-07-16 | 青岛海信激光显示股份有限公司 | Laser light source and laser projecting device |
| CN112505856A (en) * | 2020-12-23 | 2021-03-16 | 江苏奥雷光电有限公司 | High-speed mini photoelectric conversion module design and process method |
| US11570411B2 (en) | 2019-01-10 | 2023-01-31 | Hisense Laser Display Co., Ltd. | Laser light source and laser projection device |
| US11592145B2 (en) | 2019-01-10 | 2023-02-28 | Hisense Laser Display Co., Ltd. | Laser light source and laser projection device |
-
2011
- 2011-11-21 CN CN2011204645248U patent/CN202333437U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102386558A (en) * | 2011-11-21 | 2012-03-21 | 无锡亮源激光技术有限公司 | Single emitter with lead wire circuit board |
| CN104283108A (en) * | 2013-07-11 | 2015-01-14 | 山东浪潮华光光电子股份有限公司 | High-power laser module and packaging method thereof |
| CN108321674A (en) * | 2015-03-30 | 2018-07-24 | 青岛海信宽带多媒体技术有限公司 | Laser emitter |
| CN106300006A (en) * | 2016-10-13 | 2017-01-04 | 中国科学院半导体研究所 | A kind of heat sink for chip of laser array package |
| WO2020143232A1 (en) * | 2019-01-10 | 2020-07-16 | 青岛海信激光显示股份有限公司 | Laser light source and laser projecting device |
| US11570411B2 (en) | 2019-01-10 | 2023-01-31 | Hisense Laser Display Co., Ltd. | Laser light source and laser projection device |
| US11592145B2 (en) | 2019-01-10 | 2023-02-28 | Hisense Laser Display Co., Ltd. | Laser light source and laser projection device |
| CN112505856A (en) * | 2020-12-23 | 2021-03-16 | 江苏奥雷光电有限公司 | High-speed mini photoelectric conversion module design and process method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Single emitter with lead wire circuit board Effective date of registration: 20140626 Granted publication date: 20120711 Pledgee: Agricultural Bank of China Limited by Share Ltd Wuxi science and Technology Branch Pledgor: Wuxi LumiSource Technologies Co., Ltd. Registration number: 2014990000516 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20150629 Granted publication date: 20120711 Pledgee: Agricultural Bank of China Limited by Share Ltd Wuxi science and Technology Branch Pledgor: Wuxi LumiSource Technologies Co., Ltd. Registration number: 2014990000516 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120711 Termination date: 20141121 |
|
| EXPY | Termination of patent right or utility model |