CN106300006A - A kind of heat sink for chip of laser array package - Google Patents
A kind of heat sink for chip of laser array package Download PDFInfo
- Publication number
- CN106300006A CN106300006A CN201610896457.4A CN201610896457A CN106300006A CN 106300006 A CN106300006 A CN 106300006A CN 201610896457 A CN201610896457 A CN 201610896457A CN 106300006 A CN106300006 A CN 106300006A
- Authority
- CN
- China
- Prior art keywords
- chip
- heat sink
- array
- locating slot
- transmission line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a kind of heat sink for chip of laser array package, including: heat sink substrate, location wall, array chip locating slot and transmission line array board locating slot.In the present invention, array chip locating slot is corresponding with the size of array chip and transmission line array board respectively with the size of transmission line array board locating slot；And the degree of depth of transmission line array board locating slot is greater than the degree of depth of chip positioning groove, to ensure that transmission line array board and chip array upper surface are in same plane.By location wall and the use of locating slot, it is ensured that placement accuracy, reduce encapsulation difficulty.
Description
Technical field
The present invention relates to photoelectron/field of microelectronic devices, particularly a kind of for chip of laser array package
Heat sink.
Background technology
Along with the sharp increase of optical communication capacity, light emitting devices is proposed higher rate requirement.But, due to list
The operating rate of individual light emitting devices promotes limited, is extremely difficult to the requirement of 100Gbps or 400Gbps transmission.Common solution
Method is to use single chip integrated multidiameter delay light emission array, will the integrated system of chip of laser of multiple different operating wavelength
Make on the same substrate, to meet high rate data transmission requirement.But, the single-chip integration of multichannel transmitting chip faces an a lot of difficult problem.
Such as, chip array to have good electric isolution to reduce the electrical crosstalk impact on device performance between each chip；Light string
Disturb and also to avoid as far as possible.It addition, the operation wavelength of each chip ITU to be met standard of wavelength.Further, if there being a core
Sheet work is abnormal, then whole chip array just cannot use.These problems make the yield rate of single-chip integration array chip
The lowest, cost of manufacture is high.To this end, use discrete chip accurately to control each chip position by attachment process form one
Array is considered as a kind of effective scheme.This scheme can filter out the chip meeting wavelength requirement in advance, and
One of them other chip while of can also changing that break down is unaffected.But, for separate chip, the accurate control of mounting position
System is to ensure that the premise of proper device operation.
Summary of the invention
(1) to solve the technical problem that
For solving the problem in above-mentioned background technology, the present invention proposes a kind of heat for chip of laser array package
Heavy, both may be used for single-chip integration array chip, may be used for again separate chip array integrated.Greatly reduce the difficulty of encapsulation
Degree, and improve placement accuracy.
(2) technical scheme
The invention provides a kind of heat sink for chip of laser array package, described chip of laser array includes battle array
Row chip and transmission line array board, it is characterised in that:
Described heat sink include heat sink substrate；
Being formed with transmission line array board locating slot in described heat sink substrate, it is for installing and fixed transmission lines array board；
The part of the heat sink substrate around described transmission line array board locating slot constitutes location wall；
Being formed with array chip locating slot on the wall of described location, described array chip locating slot is for attachment and fixed core
Sheet.
In such scheme, described heat sink substrate is writing board shape, and described transmission line array board locating slot is formed at described heat
The upper surface of heavy substrate.
In such scheme, the side of described transmission line array board locating slot is opened on a side of described heat sink substrate.
In such scheme, described heat sink substrate is rectangular flat shape, and described transmission line array board locating slot is cuboid
Shape.
In such scheme, described array chip locating slot both sides connect with the side of described location wall.
In such scheme, described array chip locating slot is rectangular shape.
In such scheme, described heat sink substrate is tungsten copper, copper or kovar alloy material.
In such scheme, the size of array chip locating slot matches with the size of array chip.
In such scheme, the size of transmission line array board locating slot matches with the size of transmission line array board.
In such scheme, after chip array and the attachment of transmission line array board, upper surface is in same level.
(3) beneficial effect
A kind of heat sink for chip of laser array package that the present invention provides, wherein the use of chip positioning groove, makes
The position obtaining separate chip can accurately control.The length of chip positioning groove equal to whole separate chip length and, so exist
During chip attachment, it is only necessary to each chip is sequentially embedded into the most permissible.This greatly reduces the difficulty of encapsulation, and carries
High placement accuracy.
Accompanying drawing explanation
Fig. 1 diagrammatically illustrates a kind of heat sink schematic diagram for chip of laser array package of the embodiment of the present invention.
Fig. 2 diagrammatically illustrates a kind of heat sink application for chip of laser array package of the embodiment of the present invention and illustrates
Figure.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with specific embodiment, and reference
Accompanying drawing, the present invention is described in further detail.
The invention provides a kind of heat sink for chip of laser array package, both may be used for single-chip integration array core
Sheet, may be used for again separate chip array integrated.
Fig. 1 diagrammatically illustrates a kind of heat sink schematic diagram for chip of laser array package of the embodiment of the present invention.
Heat sink include as it is shown in figure 1, described: array chip locating slot 1, transmission line array board locating slot 2, heat sink substrate 3
And location wall 4.Described transmission line array board locating slot 2 is formed in heat sink substrate 3 by milling process, and it is fixed to be formed about
Position wall 4, described array chip locating slot 1 is formed on the wall 4 of location by milling process.
According to embodiments of the invention, heat sink substrate has good electric conductivity and heat conductivity, can be tungsten copper, copper or can
Cut down the materials such as alloy.According to embodiments of the present invention, heat sink substrate is rectangular flat shape.
According to embodiments of the present invention, transmission line array board locating slot 2 is formed at the upper surface of heat sink substrate 3, passes through milling
Technique, proceeds by milling from heat sink substrate, and part surplus is left on other three limits, forms a three sides surrounded groove
Structure, the i.e. side of transmission line array board locating slot 2 are opened on a side of described heat sink substrate 3.Described groove structure is for long
Cube structure.The matching size of the size of transmission line array board locating slot and transmission line array board closes, in order to install and to fix biography
Defeated linear array strake.
According to embodiments of the present invention, the part of the heat sink substrate around transmission line array board locating slot 2 constitutes location wall 4,
Described location wall 4 for forming three face wall bodies left by transmission line array board locating slot 2 in heat sink substrate 1 by milling process
Structure, this structure plays location and the effect of constraint transmission line array board.
According to embodiments of the present invention, array chip locating slot 1 is formed on the wall 4 of location by milling process, selected location
Wall is relative without wall side, location with transmission line array board locating slot, described array chip locating slot 1 both sides and described location wall 4
Side connects, and described array chip locating slot is rectangular structure, the size of array chip locating slot and the size of array chip
Match, and the error in length of locating slot is ± 0.05mm, to reach good locating effect.When the present invention heat sink for
Discrete lasers chip array encapsulation time, the length of array chip locating slot equal to whole separate chip length and, so exist
During chip attachment, it is only necessary to each chip is sequentially embedded into array chip locating slot.Array chip locating slot 1 and transmission
The centerline deviation of linear array strake locating slot 2 must not exceed 0.02mm.The degree of depth of array chip locating slot 1 cannot be greater than transmission line
The degree of depth of array board locating slot 2, to ensure that transmission line array board and chip array upper surface are in same plane, to ensure to connect
Spun gold length is the shortest.
Fig. 2 diagrammatically illustrates a kind of heat sink application for chip of laser array package of the embodiment of the present invention and illustrates
Figure.
As in figure 2 it is shown, include: array chip locating slot 1, transmission line array board locating slot 2, heat sink substrate 3, location wall 4,
Separate chip 5, spun gold 6, transmission line array board 7, build-out resistor 8 and chip electrode 9.
According to embodiments of the present invention, use described in Fig. 1 heat sink, encapsulate discrete lasers chip array.Described heat sink include
Above-mentioned array chip locating slot 1, transmission line array board locating slot 2, heat sink substrate 3, location wall 4.
Separate chip 5 is sequentially embedded and is mounted in array chip locating slot 1.The length etc. of described array chip locating slot
In whole separate chip length and, with fixed chip position.
Transmission line array board 7 is embedded in transmission line array board locating slot 2.Described transmission line array board locating slot size with
Transmission line array board matching size closes, with fixed transmission lines array board position.The degree of depth of described transmission line array board locating slot is big
In the degree of depth of described array chip locating slot, to ensure that the transmission line array board fixed is in same with array chip upper surface
Plane.
Bond technology is utilized to be coupled together with holding wire in transmission line array board 7 by 6 chip electrodes 9 of spun gold, to ensure
High-frequency signal can be injected in chip smoothly.Holding wire spacing is identical with the attachment spacing of separate chip 5, and one_to_one corresponding.Cause
It is low internal resistance device for directly modulated lasers chip, it is therefore desirable to a build-out resistor 8 of connecting is to ensure good signal transmission performance.
Particular embodiments described above, has been carried out the purpose of the present invention, technical scheme and beneficial effect the most in detail
Describe in detail bright it should be understood that the foregoing is only the specific embodiment of the present invention, be not limited to the present invention, all
Within the spirit and principles in the present invention, any modification, equivalent substitution and improvement etc. done, should be included in the protection of the present invention
Within the scope of.
Claims (10)
1. one kind is used for the heat sink of chip of laser array package, and described chip of laser array includes array chip and transmission line
Array board, it is characterised in that:
Described heat sink include heat sink substrate (3)；
Being formed with transmission line array board locating slot (2) in described heat sink substrate (3), it is for installing and constant transmissions linear array
Plate；
The part of described transmission line array board locating slot (2) heat sink substrate around constitutes location wall (4)；
Being formed with array chip locating slot (1) on described location wall (4), described array chip locating slot is for attachment and fixed core
Sheet.
Heat sink for chip of laser array package the most according to claim 1, it is characterised in that described heat sink substrate
(3) being writing board shape, described transmission line array board locating slot (2) is formed at the upper surface of described heat sink substrate.
Heat sink for chip of laser array package the most according to claim 2, it is characterised in that described transmission linear array
The side of strake locating slot (2) is opened on a side of described heat sink substrate.
Heat sink for chip of laser array package the most according to claim 3, it is characterised in that described heat sink substrate
(3) being rectangular flat shape, described transmission line array board locating slot (2) is rectangular shape.
Heat sink for chip of laser array package the most according to claim 1, it is characterised in that described array chip
Locating slot (1) both sides connect with the side of described location wall (4).
Heat sink for chip of laser array package the most according to claim 5, it is characterised in that described array chip
Locating slot (1) is rectangular shape.
Heat sink for chip of laser array package the most according to any one of claim 1 to 6, it is characterised in that
Described heat sink substrate is tungsten copper, copper or kovar alloy material.
Heat sink for chip of laser array package the most according to any one of claim 1 to 6, it is characterised in that
The size of array chip locating slot matches with the size of array chip.
Heat sink for chip of laser array package the most according to any one of claim 1 to 6, it is characterised in that
The size of transmission line array board locating slot matches with the size of transmission line array board.
Heat sink for chip of laser array package the most according to any one of claim 1 to 6, it is characterised in that
After chip array and the attachment of transmission line array board, upper surface is in same level.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610896457.4A CN106300006A (en) | 2016-10-13 | 2016-10-13 | A kind of heat sink for chip of laser array package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610896457.4A CN106300006A (en) | 2016-10-13 | 2016-10-13 | A kind of heat sink for chip of laser array package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106300006A true CN106300006A (en) | 2017-01-04 |
Family
ID=57718494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610896457.4A Pending CN106300006A (en) | 2016-10-13 | 2016-10-13 | A kind of heat sink for chip of laser array package |
Country Status (1)
| Country | Link |
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| CN (1) | CN106300006A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111868589A (en) * | 2018-04-09 | 2020-10-30 | 华为技术有限公司 | Laser, packaging structure and packaging subassembly of laser array |
| CN113281853A (en) * | 2020-02-19 | 2021-08-20 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Citations (6)
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|---|---|---|---|---|
| CN1338736A (en) * | 2000-07-21 | 2002-03-06 | 株式会社三协精机制作所 | Optical resource device for optical head |
| CN101048880A (en) * | 2004-10-25 | 2007-10-03 | 克里公司 | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
| CN201166344Y (en) * | 2008-02-20 | 2008-12-17 | 陈雅惠 | Luminous body assembly structure |
| CN202333437U (en) * | 2011-11-21 | 2012-07-11 | 无锡亮源激光技术有限公司 | Single-tube laser with lead circuit board |
| CN103915402A (en) * | 2013-01-04 | 2014-07-09 | 矽品精密工业股份有限公司 | Photoelectric module structure |
| CN203871650U (en) * | 2014-03-13 | 2014-10-08 | 丽水市银星轻工电子有限公司 | Surface-mount laser |
-
2016
- 2016-10-13 CN CN201610896457.4A patent/CN106300006A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1338736A (en) * | 2000-07-21 | 2002-03-06 | 株式会社三协精机制作所 | Optical resource device for optical head |
| CN101048880A (en) * | 2004-10-25 | 2007-10-03 | 克里公司 | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
| CN201166344Y (en) * | 2008-02-20 | 2008-12-17 | 陈雅惠 | Luminous body assembly structure |
| CN202333437U (en) * | 2011-11-21 | 2012-07-11 | 无锡亮源激光技术有限公司 | Single-tube laser with lead circuit board |
| CN103915402A (en) * | 2013-01-04 | 2014-07-09 | 矽品精密工业股份有限公司 | Photoelectric module structure |
| CN203871650U (en) * | 2014-03-13 | 2014-10-08 | 丽水市银星轻工电子有限公司 | Surface-mount laser |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111868589A (en) * | 2018-04-09 | 2020-10-30 | 华为技术有限公司 | Laser, packaging structure and packaging subassembly of laser array |
| CN113281853A (en) * | 2020-02-19 | 2021-08-20 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170104 |