CN202150452U - Square nail head lead wire used in diode - Google Patents
Square nail head lead wire used in diode Download PDFInfo
- Publication number
- CN202150452U CN202150452U CN201120218726U CN201120218726U CN202150452U CN 202150452 U CN202150452 U CN 202150452U CN 201120218726 U CN201120218726 U CN 201120218726U CN 201120218726 U CN201120218726 U CN 201120218726U CN 202150452 U CN202150452 U CN 202150452U
- Authority
- CN
- China
- Prior art keywords
- square
- diode
- wafer
- wire
- nail head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48455—Details of wedge bonds
- H01L2224/48456—Shape
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
The utility model discloses a square nail head lead wire used in a diode made of a copper wire. The lead wire comprises a welding part located at one end of the lead wire and welded with a square wafer, a flat part connected with the welding part integrally, and a cylindrical part extended out the flat part. The square nail head lead wire used in the diode is characterized in that the welding part is a square having the same shape and size as the square wafer. The welding part of the utility model is the square having the same shape and size as the square wafer, so that the wafer can be protected completely, and the wafer is prevented from being damaged due to a stress generated by a product during a thermal expansion and contraction process; and at the same time, a packaging size of the product is shortened, and a miniaturization is achieved. A square frustum of the utility model can be stretched into a welding area in a glass passivation part of the wafer, so that the glass passivation part is not damaged when welded, and accordingly, the performances of the diode are improved.
Description
Technical field
The utility model relates to the diode preparing technical field, and particularly a kind of diode goes between with the boat nail head.
Background technology
Diode is the electronic device of using always, and it comprises wafer and lead-in wire, and is also different according to the structure of the difference of diode package structure lead-in wire.Like the pancake lead-in wire that adopts among the Chinese utility model patent Granted publication CN2328099 disclosed " directly welded pancake plastic package diode ", this type lead-in wire adopts the copper sheet punch forming, and it is big to there is copper sheet consumption, the problem that cost is high.Based on considering that from saving the raw material aspect industry has many technical staff that the lead-in wire of diode is improved, adopt copper cash to make lead-in wire.This type patent is applied for just like the applicant; China's utility model patent Granted publication number is the used lead-in wire of CN2370569 disclosed " a kind of diode "; One end of embodiment 1 employed lead-in wire is provided with a vertical flat engagement plate, the plat part that the other end then extends to the stage casing.Just like Chinese utility model Granted publication number is CN2415461 disclosed " stamp-mounting-paper diode ", and its lead-in wire is vertical configuration with crystal grain, and is flat structure.China utility model patent Granted publication CN201191607 disclosed " SMA stamp-mounting-paper diode ", its lead-in wire are through hammering flat forming into shape by round Kufil gold thread.China utility model patent Granted publication CN201536105 disclosed " miniature exhibition hem facing sheet diode ", its lead-in wire is flat, but this lead-in wire separates manufacturing with weld tabs, weld very difficulty.Although having solved, the lead-in wire that above-mentioned all kinds of copper cash is made adopt copper sheet to make the problem of lead-in wire; But the area of the welding position between these lead-in wires and the wafer is the area greater than wafer; This is for being not suitable for through the wafer after the glassivation; Cause the glassivation position of wafer to break during welding easily, and have influence on the performance of diode.
At present, wafer manufacture producer a kind of square wafer that begins to dispatch from the factory is because above-mentioned patent is circle with the weld part that wafer welds; All there is following problem when therefore causing above-mentioned lead-in wire and square wafer welding encapsulation: if the diameter of 1 circular weld portion equals the width of wafer; Weld part has only about 80% the protection area of wafer, and product is in process of expansion and contraction, and the expand with heat and contract with cold stress that produced of encapsulating compound can act on four angles of wafer; Be very easy to damage wafer; Therefore in order to filter out qualified product, need to drop into a large amount of checkout equipment and personnel, production efficiency is low.If 2 in order absolutely to protect wafer; Just need the diameter of circular weld portion be made the catercorner length that equals square wafer; To cause the diameter of weld part excessive like this; And then cause the product size after the encapsulation to become big, and do not meet the microminiaturized requirement of current electronic devices and components, also waste more encapsulating compound simultaneously.
The utility model content
The utility model technical problem to be solved is to provide a kind of structure improved diode to go between with the boat nail head to the deficiency of existing diode lead.
The utility model technical problem to be solved can realize through following technical scheme:
A kind of diode is with boat nail head lead-in wire, and it is processed by copper cash, and said lead-in wire comprises and is positioned at the weld part and plat part that is connected with said weld part one and the columnar portion that is extended out by said plat part that lead-in wire one end and square wafer weld; It is characterized in that said weld part is identical with size with said square wafer shape square.
On the solder side of said weld part and said square wafer, has a frustum.
The said frustum side of being frustum.
The floor space of said side's frustum equates with the solder side area of weld part.
The height of said side's frustum is 0.13 ± 0.03.
The junction of said plat part and weld part is provided with contraction flow region.
Because it be identical with size with said square wafer shape square having adopted technique scheme, the utility model weld part, can be fully to the protection of wafer, avoid the stress that wafer produced because of product and damage in process of expansion and contraction.The package dimension of the product that dwindles has again simultaneously been accomplished microminiaturization.The square frustum of the utility model can extend in the inner welding region of wafer glassivation, can not damage the glassivation position when therefore welding, thereby improve the performance of diode.
Description of drawings
Fig. 1 is the structural representation of the utility model.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the left view of Fig. 1.
Embodiment
For technological means, creation characteristic that the utility model is realized, reach purpose and be easy to understand understanding with effect, below in conjunction with concrete diagram, further set forth the utility model.
Referring to Fig. 1 and Fig. 2, a kind of diode is with boat nail head lead-in wire, and it is processed by copper cash, and this lead-in wire comprises the columnar portion 3 that is positioned at the weld part 1 that lead-in wire one end and wafer weld and the plat part 2 that is connected with weld part 1 one and is extended out by plat part 2; Weld part 1 is identical with size with square wafer (not shown) shape square.On the solder side 4 of weld part 1 and wafer, has side's frustum 5.The floor space of this side's frustum 5 equates with solder side 4 areas of weld part 1.The height of side's frustum 5 is 0.13 ± 0.03.Plat part 2 is provided with contraction flow region 6 with the junction of weld part 1.
More than show and described basic principle of the utility model and the advantage of principal character and the utility model.The technical staff of the industry should understand; The utility model is not restricted to the described embodiments; The principle of describing in the foregoing description and the specification that the utility model just is described; Under the prerequisite that does not break away from the utility model spirit and scope, the utility model also has various changes and modifications, and these variations and improvement all fall in the utility model scope that requires protection.The utility model requires protection range to be defined by appending claims and equivalent thereof.
Claims (6)
1. a diode is with boat nail head lead-in wire, and it is processed by copper cash, and said lead-in wire comprises and is positioned at the weld part and plat part that is connected with said weld part one and the columnar portion that is extended out by said plat part that lead-in wire one end and square wafer weld; It is characterized in that said weld part is identical with size with said square wafer shape square.
2. a kind of diode as claimed in claim 1 is characterized in that on the solder side of said weld part and said square wafer, having a frustum with boat nail head lead-in wire.
3. a kind of diode as claimed in claim 2 is characterized in that the said frustum side of being frustum with boat nail head lead-in wire.
4. a kind of diode as claimed in claim 3 is characterized in that with boat nail head lead-in wire the floor space of said side's frustum equates with the solder side area of weld part.
5. a kind of diode as claimed in claim 3 is characterized in that with boat nail head lead-in wire the height of said side's frustum is 0.13 ± 0.03.
6. a kind of diode as claimed in claim 1 is characterized in that with boat nail head lead-in wire the junction of said plat part and weld part is provided with contraction flow region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120218726U CN202150452U (en) | 2011-06-24 | 2011-06-24 | Square nail head lead wire used in diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120218726U CN202150452U (en) | 2011-06-24 | 2011-06-24 | Square nail head lead wire used in diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202150452U true CN202150452U (en) | 2012-02-22 |
Family
ID=45591504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120218726U Expired - Fee Related CN202150452U (en) | 2011-06-24 | 2011-06-24 | Square nail head lead wire used in diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202150452U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106424466A (en) * | 2015-08-12 | 2017-02-22 | 朋程科技股份有限公司 | Manufacturing method and device for lead structure of rectifier diode |
-
2011
- 2011-06-24 CN CN201120218726U patent/CN202150452U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106424466A (en) * | 2015-08-12 | 2017-02-22 | 朋程科技股份有限公司 | Manufacturing method and device for lead structure of rectifier diode |
| CN106424466B (en) * | 2015-08-12 | 2019-05-24 | 朋程科技股份有限公司 | The manufacturing method and device of the pin configuration of rectifier diode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120222 Termination date: 20170624 |