CN202930363U - Anti-oxidation and blow-dry device for bonding copper wire after annealing - Google Patents
Anti-oxidation and blow-dry device for bonding copper wire after annealing Download PDFInfo
- Publication number
- CN202930363U CN202930363U CN2012204918254U CN201220491825U CN202930363U CN 202930363 U CN202930363 U CN 202930363U CN 2012204918254 U CN2012204918254 U CN 2012204918254U CN 201220491825 U CN201220491825 U CN 201220491825U CN 202930363 U CN202930363 U CN 202930363U
- Authority
- CN
- China
- Prior art keywords
- air inlet
- annealing
- oxidation
- welded
- inlet tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/745—Apparatus for manufacturing wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
- H01L2224/438—Post-treatment of the connector
- H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The utility model relates to an anti-oxidation and blow-dry device for a bonding copper wire after annealing, belonging to the technical field of bonding materials. The device comprises a support (13) and a main air duct (12) mounted on the support (13), wherein the main air duct (12) is divided into three portions including a left air chamber (1), a middle air chamber (6) and a right air chamber (11) via separator plates (3, 10) welded in the air duct; a first air inlet tube nozzle (2) and a third air inlet tube nozzle (7) are welded in the upper end of the middle air chamber, a second air inlet tube nozzle (5) and a fourth air inlet tube nozzle (8) are welded in the lower end of the middle air chamber, the included angle between the main air duct and each air inlet tube nozzle is 30 DEG; and first bell mouths (4) are respectively welded between the first separator plate (3) and the first/second air inlet tube nozzle (2, 5), second bell mouths (9) are respectively welded between the second separator plate (10) and the third/fourth air inlet tube nozzle (7, 8), and the first and second bell mouths (4, 9) are coaxial wire through holes. The anti-oxidation and blow-dry device for the bonding copper wire after annealing has the advantages that structure is simple and cost is low, the temperature of the bonding copper wire after annealing can be effectively reduced, oxidation can be prevented, and anti-oxidant is blown dry.
Description
Technical field:
The utility model relates to anti-oxidation after the annealing of a kind of bonding brass wire and dries up the device of copper wire, belongs to the bonding material technical field.
Background technology:
As the bonding material of semiconductor package lead, bonding gold wire is the product of comparative maturity for a long time, has the advantages such as stable chemical nature.But along with in recent years, sharp rising of gold cost of material, the manufacturing cost that makes domestic and international integrated circuit (IC), semiconductor lighting (LED) and semiconductor separation part encapsulate factory significantly improves, therefore these several years, people are by research and development and industrial test, progressively substitute bonding gold wire with bonding brass wire both at home and abroad, and obtained certain effect.
Bonding brass wire compare with bonding gold wire have good electricity, calorifics, mechanical performance and low intermetallic compound generate and increase.Adapted to the development that low cost, thin space, high exit encapsulate, and improved to a great extent packaged chip frequency and reliability, thereby bonding brass wire becomes the most competitive material that substitutes traditional bonding wire.
At present, domestic market or take the bonding brass wire of the manufacturer's brand of Germany, Korea S, Japan and other countries as main, the bonding brass wire of these brands has replaced the bonding gold wire of low and middle-end use substantially, has reached the level of commercial applications.But also there is some shortcoming in actual use in bonding brass wire, and wherein topmost is exactly copper easier oxidation with respect to gold, and particularly temperature is higher, and the oxidation of copper is stronger, has directly affected the ball bonding performance of its bond sequence; Cause extremely difficult welding in bond sequence, thereby make the bonding frequent operation interrupt, affect production efficiency.
Bonding brass wire preparation technology mainly comprises founding, wire drawing and annealing etc.Because bonding brass wire belongs to glass-coated microwire, its wire diameter is only tens microns to tens microns, and its surperficial a wee bit oxidation on its material property impact greatly.Therefore in order to overcome the major defect of existing bonding brass wire, the utility model patented technology to the final operation stage of finished product, proposes a kind of bonding brass wire annealing anti-oxidation and dry up the device of copper wire afterwards for wire drawing.
The utility model content:
The purpose of this utility model is to overcome the deficiency of prior art aspect, provides anti-oxidation after the annealing of a kind of bonding brass wire and dries up the device of copper wire.This device can reduce the rear soft attitude bonding brass wire of annealing oxidized possibility under the remaining temperature of annealing effectively, satisfies the bonding performance of final finished.
Anti-oxidation and dry up the device of copper wire after bonding brass wire of the present utility model annealing, this device comprises support (13) and is placed in main gas tube (12) on support (13); Wherein: main gas tube (12) is divided into left air chamber (1), middle air chamber (6) and right air chamber (11) three parts by the dividing plate (3,10) that is welded in pipe; The two ends up and down of middle air chamber (6) are welded with respectively the first air inlet ozzles (2), the second air inlet ozzle (5), the 3rd air inlet ozzle (7) that become 30 degree with main gas tube (12), and the 4th air inlet ozzle (8); Be welded with the first horn mouth (4) between the first dividing plate (3) and the first air inlet ozzle (2) and the second air inlet ozzle (5), be welded with the second horn mouth (9) between second partition (10) and the 3rd air inlet ozzle (7) and the 4th air inlet ozzle (8), the first horn mouth (4) and the second horn mouth (9) are coaxial through wires hole.
During use, adopt two cover the utility model devices, be placed in respectively between annealing pipe (14) and dip-coating antioxidant device (15) and between dip-coating antioxidant device (15) and spooler (16).The length of its main gas tube (12) is determined according to the distance of annealing pipe (14) and dip-coating antioxidant device (15) and the actual range between dip-coating antioxidant device (15) and spooler (16).The optimal material of main gas tube (12) and support (13) is stainless steel material.
The utlity model has simple in structure, cost is low, can effectively lower the temperature after bonding brass wire annealing, has anti-oxidation and dries up the effect of antioxidant, provides the facility guarantee for producing high-quality bonding brass wire material.
Description of drawings:
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the schematic diagram that the utility model and the configuration of bonding brass wire annealing rear defence oxidation technology are used.
Embodiment:
As shown in Figure 1, anti-oxidation and dry up the device of copper wire after bonding brass wire of the present utility model annealing, comprise the outlet height that can make annealing pipe and the consistent support 13 of the coaxial through wires hole of this device and be placed in main gas tube 12 on support 13; Wherein: main gas tube 12 is divided into left air chamber 1, middle air chamber 6 and right air chamber 11 3 parts by the dividing plate 3 and 10 that is welded in pipe; The two ends up and down of middle air chamber 6 are welded with respectively the first air inlet ozzle 2, the second air inlet ozzle 5, the 3rd air inlet ozzle 7, reach the 4th air inlet ozzle 8,12 one-tenth 30 degree of each air inlet ozzle and main gas tube, the first dividing plate 3 and the first air inlet ozzle 2 and 5 of the second air inlet ozzles are welded with the first horn mouth 4, second partition 10 and the 3rd air inlet ozzle 7 and 8 of the 4th air inlet ozzles are welded with the second horn mouth 9, the first horn mouths 4 and two horn mouths 9 are coaxial through wires hole.
As shown in Figure 2, during use, adopt two cover devices of the present utility model, be placed in respectively between annealing pipe 14 and dip-coating antioxidant device 15, and between dip-coating antioxidant device 15 and spooler 16.The length of its main gas tube 12 is determined according to the distance of annealing pipe 14 and dip-coating antioxidant device 15 and the actual range between dip-coating antioxidant device 15 and spooler 16.Setting height(from bottom) is coaxial with one heart with the through wires hole in assurance and annealing pipe.The optimal material of main gas tube 12 and support 13 is stainless steel material.
With flexible pipe respectively with the first air inlet ozzle 2, the second air inlet ozzle 5, the 3rd air inlet ozzle 7, and the 4th air inlet ozzle 8 be connected, pass to aborning nitrogen or inert gas and can complete the effect that rear bonding brass wire is anti-oxidation and dry up to annealing.
Practical application shows, this device reaches designing requirement fully.And be suitable for other wire that needs the protection against oxidation operation or nonmetal wires.
Claims (1)
1. anti-oxidation after bonding brass wire annealing and dry up the device of copper wire, it is characterized in that this device comprises support (13) and is placed in main gas tube (12) on support (13); Wherein: main gas tube (12) is divided into left air chamber (1), middle air chamber (6) and right air chamber (11) three parts by the dividing plate (3,10) that is welded in pipe; The two ends up and down of middle air chamber (6) are welded with respectively the first air inlet ozzles (2), the second air inlet ozzle (5), the 3rd air inlet ozzle (7) that become 30 degree with main gas tube (12), and the 4th air inlet ozzle (8); Be welded with the first horn mouth (4) between the first dividing plate (3) and the first air inlet ozzle (2) and the second air inlet ozzle (5), be welded with the second horn mouth (9) between second partition (10) and the 3rd air inlet ozzle (7) and the 4th air inlet ozzle (8), the first horn mouth (4) and the second horn mouth (9) are coaxial through wires hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204918254U CN202930363U (en) | 2012-09-25 | 2012-09-25 | Anti-oxidation and blow-dry device for bonding copper wire after annealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204918254U CN202930363U (en) | 2012-09-25 | 2012-09-25 | Anti-oxidation and blow-dry device for bonding copper wire after annealing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202930363U true CN202930363U (en) | 2013-05-08 |
Family
ID=48220295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012204918254U Expired - Lifetime CN202930363U (en) | 2012-09-25 | 2012-09-25 | Anti-oxidation and blow-dry device for bonding copper wire after annealing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202930363U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109573341A (en) * | 2018-10-31 | 2019-04-05 | 贵州固达电缆有限公司 | A kind of copper wire coils anti-oxidation storage device, method and burning bucket |
-
2012
- 2012-09-25 CN CN2012204918254U patent/CN202930363U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109573341A (en) * | 2018-10-31 | 2019-04-05 | 贵州固达电缆有限公司 | A kind of copper wire coils anti-oxidation storage device, method and burning bucket |
| CN109573341B (en) * | 2018-10-31 | 2019-10-11 | 贵州固达电缆有限公司 | A kind of copper wire coils anti-oxidation storage device, method and burning bucket |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103022318B (en) | A kind of LED display packaging technology based on COB technology and LED display | |
| EP2341541A3 (en) | Image sensor packaging structure with predetermined focal length | |
| CN203085305U (en) | Piezoresistor | |
| WO2008093544A1 (en) | Bus-bar connecting structure, and inverter-integrated type electric compressor | |
| CN202930363U (en) | Anti-oxidation and blow-dry device for bonding copper wire after annealing | |
| CN201549505U (en) | Glass passivation packaging transient voltage suppression diode structure | |
| CN206713166U (en) | The different ultrasonic sensor of lead welding manner | |
| CN201392850Y (en) | Heat resistant hall element | |
| CN202854165U (en) | Anemometer measuring rod capable of simultaneously measuring wind temperature/humidity and wind speed | |
| CN104810457A (en) | Light emitting diode (LED) packaging technology based on palladium plated copper wire | |
| CN203312622U (en) | TO pedestal | |
| CN202111082U (en) | Multi-loop arrangement integrated circuit (IC) chip package element | |
| MY160010A (en) | Bonding wire and a method of manufacturing the same | |
| CN202150452U (en) | Square nail head lead wire used in diode | |
| CN203481221U (en) | Framework CSP package adopting ball mounting optimization technology | |
| CN206432259U (en) | Stamp-mounting-paper diode framework | |
| CN103545435A (en) | High-reliability weld wire device applied to SMD (surface mount device) light-emitting diode | |
| CN104037148A (en) | Low-rejection-rate axial diode lead and soldering method of low-rejection-rate axial diode lead | |
| CN202423267U (en) | Lead frame | |
| CN201440142U (en) | Measuring bar of hot-bulb anemometer | |
| CN203053627U (en) | Pressure sensor | |
| CN204332912U (en) | The bonding wire structure of LED chip and LED chip bonding equipment | |
| CN202178252U (en) | Multi-loop arranged carrier-free double-IC chip packaging part | |
| CN201532952U (en) | Leading wire of 3A Schottky diode | |
| CN201655810U (en) | Miniature surface mount diode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130508 |
|
| CX01 | Expiry of patent term |