CN201392850Y - Heat resistant hall element - Google Patents
Heat resistant hall element Download PDFInfo
- Publication number
- CN201392850Y CN201392850Y CN200920300900U CN200920300900U CN201392850Y CN 201392850 Y CN201392850 Y CN 201392850Y CN 200920300900 U CN200920300900 U CN 200920300900U CN 200920300900 U CN200920300900 U CN 200920300900U CN 201392850 Y CN201392850 Y CN 201392850Y
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- wafer
- hall element
- heat resistant
- chip
- plastic
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Abstract
The utility model relates to a semiconductor electronic element, in particular to a heat resistant hall element. The heat resistant hall element mainly solves the technical problems that in the prior art, when pins of an electronic element are welded inside a reflow oven or a wave soldering machine, the body of the electronic element is subjected to high temperature to generate high internal stress, so that the functional area of the wafer is extruded, the functions of the wafer may be deteriorated, even the wafer is damaged and failed. The heat resistant hall element comprises a package body (1), and a wafer packed inside the package body (1). The heat resistant hall element is characterized in that the wafer comprises a lower layer wafer (2), an upper layer wafer (3) connected with the upper part of the lower layer wafer (2), and a flexible protective adhesive layer (4) arranged at the top end of the upper layer wafer (3); and two or more electrodes (5) are arranged on the lower layer wafer (2) and are connected with pins (7) through metal wires (6), and the outer ends of the pins extend out of the package body (1).
Description
Technical field
The utility model relates to a kind of semiconductor electronic components and parts, especially relates to the isostructural improvement of a kind of heat-resisting Hall element.
Background technology
At present, known indium antimonide Hall unit is to be made of lower chip, upper chip, plastic-sealed body, pin, and the life-span and the reliability of product had higher requirement.Chinese patent discloses a kind of indium antimonide Hall unit (Granted publication number: CN201017910Y), it mainly is made up of nickel Zinc material substrate, silicon dioxide insulating layer, " ten " font indium antimonide perception film and gold electrode, be coated with " ten " font liquid resin diaphragm on " ten " font indium antimonide perception film, " ten " font liquid resin diaphragm dimension of picture is slightly smaller than " ten " font indium antimonide perception film pattern size; " ten " word width of " ten " font liquid resin diaphragm is greater than " ten " word width of " ten " font indium antimonide perception film.But when this electronic devices and components carry out the pin welding in reflow ovens or crest stove, this cognition is under the high temperature, plastic-sealed body and inner wafer meeting expanded by heating, because the material difference of plastic-sealed body, wafer, its thermal coefficient of expansion has difference, and both heating degrees are also different, thereby can produce bigger internal stress, make the functional area of wafer be squeezed, can cause wafer function deterioration, even damage inefficacy.
The utility model content
The utility model technical issues that need to address provide a kind of heat-resisting Hall element, it mainly is when solving the existing in prior technology electronic devices and components carrying out the pin welding in reflow ovens or crest stove, this cognition is under the high temperature, components and parts can produce bigger internal stress, make the functional area of wafer be squeezed, can cause wafer function deterioration, even the technical problem that damage to lose efficacy etc.
Above-mentioned technical problem of the present utility model is mainly solved by following technical proposals:
A kind of heat-resisting Hall element of the present utility model comprises plastic-sealed body, is packaged with chip in the plastic-sealed body, it is characterized in that described chip includes lower chip, and lower chip top is connected with upper chip, and the upper chip top is provided with the flexible protective glue-line; Lower chip is provided with two and reached with last electrode, and electrode connects pin by metal wire, and stretch out outside the plastic-sealed body pin outer end.On upper chip, add one deck flexible protective glue, protection glue and upper chip are binded firmly by baking.Flexible protective glue has elasticity, absorbs certain stress by deformation energy, alleviates the extruding that the wafer functional area is subjected to, thereby reduces the impaired risk of components and parts, improves the welding heat resistance of components and parts.The main component of flexible protective glue can be silica gel, polyimides, epoxy resin etc.
As preferably, the thickness of described flexible protective glue-line is 10～60 microns.Flexible protective glue-line top can be processed into sphere shape.
As preferably, be provided with lead frame in the described plastic-sealed body, lower chip is connected on the lead frame by the bonding die bond layer, and the lead frame both sides are provided with pin.Lead frame can be made one with pin.
Therefore, the utlity model has the welding temperature that can make Hall element tolerance higher, improve the reliability of components and parts, characteristics such as simple and reasonable for structure.
Description of drawings
Accompanying drawing 1 is a kind of structural representation of the present utility model;
Accompanying drawing 2 is a kind of structure for amplifying schematic diagrames of upper chip, lower chip, flexible protective glue.
Parts, position and numbering among the figure: plastic-sealed body 1, lower chip 2, upper chip 3, flexible protective glue-line 4, electrode 5, metal wire 6, pin 7, lead frame 8, bonding die bond layer 9.
Embodiment
Below by embodiment, and in conjunction with the accompanying drawings, the technical solution of the utility model is described in further detail.
Embodiment: a kind of heat-resisting Hall element of this example, as Fig. 1, a plastic-sealed body 1 is arranged, be packaged with lead frame 8 in the plastic-sealed body 1, lead frame 8 both sides are provided with pin 7, are connected with chip on the lead frame.As Fig. 2, chip includes lower chip 2, and lower chip 2 tops are connected with upper chip 3, and upper chip 3 tops are provided with flexible protective glue-line 4, and the thickness of flexible protective glue-line is 40 microns.Lower chip 2 is provided with four electrodes 5, and electrode connects pin 7 by metal wire 6, and stretch out outside the plastic-sealed body 1 the pin outer end.
During use, the utility model is welded on the wiring board gets final product.
Claims (3)
1. heat-resisting Hall element, comprise plastic-sealed body (1), plastic-sealed body is packaged with chip in (1), it is characterized in that described chip includes lower chip (2), lower chip (2) top is connected with upper chip (3), and upper chip (3) top is provided with flexible protective glue-line (4); Lower chip (2) is provided with two and reaches with last electrode (5), and electrode connects pin (7) by metal wire (6), and stretch out outside the plastic-sealed body (1) the pin outer end.
2. a kind of heat-resisting Hall element according to claim 1, the thickness that it is characterized in that described flexible protective glue-line (4) is 10～60 microns.
3. a kind of heat-resisting Hall element according to claim 1 and 2, it is characterized in that being provided with in the described plastic-sealed body (1) lead frame (8), lower chip (2) is connected on the lead frame by bonding die bond layer (9), and the lead frame both sides are provided with pin (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920300900U CN201392850Y (en) | 2009-02-26 | 2009-02-26 | Heat resistant hall element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920300900U CN201392850Y (en) | 2009-02-26 | 2009-02-26 | Heat resistant hall element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201392850Y true CN201392850Y (en) | 2010-01-27 |
Family
ID=41599671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920300900U Expired - Fee Related CN201392850Y (en) | 2009-02-26 | 2009-02-26 | Heat resistant hall element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201392850Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105206740A (en) * | 2015-11-03 | 2015-12-30 | 常州顶芯半导体技术有限公司 | Encapsulation mode of Hall device |
| CN108075035A (en) * | 2016-11-18 | 2018-05-25 | 旭化成微电子株式会社 | Hall element |
| CN108768128A (en) * | 2018-08-20 | 2018-11-06 | 宁波菲仕电机技术有限公司 | A kind of epoxy-plastic packaging structure of linear motor Hall element and preparation method thereof |
-
2009
- 2009-02-26 CN CN200920300900U patent/CN201392850Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105206740A (en) * | 2015-11-03 | 2015-12-30 | 常州顶芯半导体技术有限公司 | Encapsulation mode of Hall device |
| CN108075035A (en) * | 2016-11-18 | 2018-05-25 | 旭化成微电子株式会社 | Hall element |
| CN108768128A (en) * | 2018-08-20 | 2018-11-06 | 宁波菲仕电机技术有限公司 | A kind of epoxy-plastic packaging structure of linear motor Hall element and preparation method thereof |
| CN108768128B (en) * | 2018-08-20 | 2023-11-24 | 宁波菲仕技术股份有限公司 | Epoxy plastic package structure of linear motor Hall element and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100127 Termination date: 20140226 |