CN202076317U - 一种浅杯支架led灯珠 - Google Patents

一种浅杯支架led灯珠 Download PDF

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CN202076317U
CN202076317U CN2011200983866U CN201120098386U CN202076317U CN 202076317 U CN202076317 U CN 202076317U CN 2011200983866 U CN2011200983866 U CN 2011200983866U CN 201120098386 U CN201120098386 U CN 201120098386U CN 202076317 U CN202076317 U CN 202076317U
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tazza
support
bowl cup
led lamp
bracket
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CN2011200983866U
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肖明忠
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DONGGUAN XINGHUI PHOTOELECTRIC Co Ltd
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DONGGUAN XINGHUI PHOTOELECTRIC Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch

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Abstract

本实用新型公开了一种浅杯支架LED灯珠，包括LED芯片、浅杯支架和两个金线，LED芯片设置有LED灯珠，浅杯支架设置有支架碗杯，LED芯片固定于支架碗杯内，LED灯珠设置于支架碗杯内，且LED灯珠以浅杯支架为基板和框架；两个金线的一端分别以反向焊接方式固定于支架碗杯的两个电极，且两个金线的另一端分别焊接于LED芯片的两个电极，本实用新型结构简单，成本低，减少光线输出的反射次数，提高发光效率，提高散热性能，避免出现焊接不良。

Description

一种浅杯支架LED灯珠
技术领域
本实用新型涉及LED灯技术领域，特指一种浅杯支架LED灯珠。
背景技术
现有技术中，在现有LED照明产品中，SMD3528灯珠均采用1.9mm毫米高，杯深0.85mm的支架封装。制作成成品后，芯片在发光过程中，部分光线须经支架内壁多次反射才能完成光线输出，因光线多次反射，造成光通量损失较大。为解决这一问题，减少光线的多次反射，目前采用的技术手段包括：选用高厚度的芯片，或者选用特殊的浅杯支架封装。采用上述两种方式存在下述缺点：1、使用物料多，成本较高；2、散热性能较差；3、在焊线的过程中，金线焊接须在芯片上方，金钱需要拉起一定的线弧高度才能达到所要求的焊接强度，这样焊接的线弧高度大，易造成金线线弧露出支架表面，易出现焊接不良。
实用新型内容
本实用新型的目的在于针对现有技术的不足提供一种浅杯支架LED灯珠，它结构简单，成本低，减少光线输出的反射次数，提高发光效率，提高散热性能，避免出现焊接不良。
为实现上述目的，本实用新型是通过以下技术方案实现的：
一种浅杯支架LED灯珠，包括LED芯片、浅杯支架和两个金线，LED芯片设置有LED灯珠，浅杯支架设置有支架碗杯，LED芯片固定于支架碗杯内，LED灯珠设置于支架碗杯内，且LED灯珠以浅杯支架为基板和框架；两个金线的一端分别以反向焊接方式固定于支架碗杯的两个电极，且两个金线的另一端分别焊接于LED芯片的两个电极。
所述支架碗杯内灌装有胶水。
所述金线的一端通过以支架碗杯底部为起点拉起一线弧的焊接方式固定于支架碗杯的电极、另一端水平焊接在LED芯片的电极。
所述浅杯支架的支架碗杯选用杯深为0.5-0.7mm的浅杯支架。
所述浅杯支架的支架碗杯选用杯深为0.6mm的浅杯支架。
所述浅杯支架的支架碗杯选用杯深为0.7mm的浅杯支架。
本实用新型由于采用上述技术方案而具有的有益效果：本实用新型结构简单，成本低，减少光线输出的反射次数，提高发光效率约8％-12％；浅杯支架变薄，降低物料成本；浅杯支架的厚度更小，有利于LED芯片散热，延长LED灯珠的使用寿命；采用反向焊线方式，降低线弧高度，避免出现焊接不良，避免LED灯珠因支架碗杯出现金线而露出胶体，提高产品质量。
附图说明
图1为本实用新型的结构示意图。
图2为本实用新型的俯视图。
图3为本实用新型的仰视图。
图中：1——LED芯片、2——浅杯支架、3——金线、4——支架碗杯、5——胶水。
具体实施方式
一种浅杯支架LED灯珠，见1至3所示，包括LED芯片1、浅杯支架2和两个金线3，LED芯片1设置有LED灯珠，浅杯支架2设置有支架碗杯4，LED芯片1固定于支架碗杯4内，LED灯珠设置于支架碗杯4内，且LED灯珠以浅杯支架2为基板和框架，支架碗杯4内灌装有胶水5。
两个金线3的一端分别以反向焊接方式固定于支架碗杯4的两个电极，且两个金线3的另一端分别焊接于LED芯片1的两个电极。具体地说金线3的一端通过以支架碗杯4底部为起点拉起一线弧的焊接方式固定于支架碗杯4的电极、另一端水平焊接在LED芯片1的电极。金线3将LED芯片1上方的两个电极分别与浅杯支架2的两个电极连接起来，起到导电作用，然后在支架碗杯4内灌封胶水5。与传统结构相比较，本实用新型可降低整体的线弧高度，避免线弧外露，从而提高品质。
浅杯支架2的支架碗杯4选用杯深为0.5-0.7mm的浅杯支架2。
于较佳实施方式中，浅杯支架2的支架碗杯4选用杯深为0.6mm的浅杯支架2。
于另一较佳实施方式中，浅杯支架2的支架碗杯4选用杯深为0.7mm的浅杯支架2。浅杯支架2的杯深为0.7mm，比传统的杯深为0.85mm支架更薄，可减少封装胶水5成本，同时较少光线的多次反射，可提高光输出效率。
本新型结构的LED灯优点是：
1.减少光线输出的反射次数，提高发光效率约8％-12％。
2.浅杯支架2变薄，降低物料成本。
3.浅杯支架2的厚度更小，有利于LED芯片1散热，延长LED灯珠的使用寿命。
4.采用反向焊线方式，降低线弧高度，避免LED灯珠因支架碗杯4出现金线3而露出胶体，避免出现焊接不良，提高产品质量。
以上内容仅为本实用新型的较佳实施例，对于本领域的普通技术人员，依据本实用新型的思想，在具体实施方式及应用范围上均会有改变之处，本说明书内容不应理解为对本实用新型的限制。

Claims (6)

1.一种浅杯支架LED灯珠，包括LED芯片(1)，LED芯片(1)设置有LED灯珠，其特征在于：还包括浅杯支架(2)和两个金线(3)，浅杯支架(2)设置有支架碗杯(4)，LED芯片(1)固定于支架碗杯(4)内，LED灯珠设置于支架碗杯(4)内，且LED灯珠以浅杯支架(2)为基板和框架；两个金线(3)的一端分别以反向焊接方式固定于支架碗杯(4)的两个电极，且两个金线(3)的另一端分别焊接于LED芯片(1)的两个电极。
2.根据权利要求1所述的一种浅杯支架LED灯珠，其特征在于：所述支架碗杯(4)内灌装有胶水(5)。
3.根据权利要求1所述的一种浅杯支架LED灯珠，其特征在于：所述金线(3)的一端通过以支架碗杯(4)底部为起点拉起一线弧的焊接方式固定于支架碗杯(4)的电极、另一端水平焊接在LED芯片(1)的电极。
4.根据权利要求1至3之一所述的一种浅杯支架LED灯珠，其特征在于：所述浅杯支架(2)的支架碗杯(4)选用杯深为0.5-0.7mm的浅杯支架(2)。
5.根据权利要求1至3之一所述的一种浅杯支架LED灯珠，其特征在于：所述浅杯支架(2)的支架碗杯(4)选用杯深为0.6mm的浅杯支架(2)。
6.根据权利要求1至3之一所述的一种浅杯支架LED灯珠，其特征在于：所述浅杯支架(2)的支架碗杯(4)选用杯深为0.7mm的浅杯支架(2)。
CN2011200983866U 2011-04-03 2011-04-03 一种浅杯支架led灯珠 Expired - Fee Related CN202076317U (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103515515A (zh) * 2013-09-27 2014-01-15 重庆四联光电科技有限公司 封装结构及方法
WO2014106462A2 (zh) * 2013-01-02 2014-07-10 Ma Fei 一种免焊型贴片led灯具结构

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014106462A2 (zh) * 2013-01-02 2014-07-10 Ma Fei 一种免焊型贴片led灯具结构
WO2014106462A3 (zh) * 2013-01-02 2014-08-28 Ma Fei 一种免焊型贴片led灯具结构
CN103515515A (zh) * 2013-09-27 2014-01-15 重庆四联光电科技有限公司 封装结构及方法

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