WO2014106462A2 - 一种免焊型贴片led灯具结构 - Google Patents

一种免焊型贴片led灯具结构 Download PDF

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Publication number
WO2014106462A2
WO2014106462A2 PCT/CN2014/000184 CN2014000184W WO2014106462A2 WO 2014106462 A2 WO2014106462 A2 WO 2014106462A2 CN 2014000184 W CN2014000184 W CN 2014000184W WO 2014106462 A2 WO2014106462 A2 WO 2014106462A2
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Prior art keywords
led lamp
led
lamp bead
patch
bead
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PCT/CN2014/000184
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English (en)
French (fr)
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WO2014106462A3 (zh
Inventor
马飞
Original Assignee
Ma Fei
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Application filed by Ma Fei filed Critical Ma Fei
Publication of WO2014106462A2 publication Critical patent/WO2014106462A2/zh
Publication of WO2014106462A3 publication Critical patent/WO2014106462A3/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a solderless patch LED lamp structure, which is an enhancement and improvement of the existing patch LED lamp, and belongs to the field of LED decorative lighting.
  • LED SMD beads are better than high-power lamp beads because of their heat dissipation effect. They can be used to assist heat dissipation without using other media (such as aluminum-based circuit boards).
  • the stability of the products is much more reliable than that of the LEDs.
  • the characteristics determine that the LED lamp bead must be individually tested separately before leaving the factory. As a patch LED lamp bead application, it is difficult to achieve fixed and electrical connection due to the small size of the lamp bead.
  • the traditional method is to put the LED lamp bead. One by one is welded together on the conductor (circuit board or wire) to achieve electrical connection, so the processing process is relatively cumbersome, the cost is higher than the high-power lamp bead, so the market is coming with high-power lamps more.
  • SMD LED lamp beads need a long drying process before welding. Otherwise, it is easy to cause dead light or improper quality for future use during soldering process due to improper soldering temperature.
  • the product defect rate caused by the problem is a very important factor in the increase of the indirect cost of the product.
  • LED lamp beads can be more abundant, and many applications are limited by the characteristics that LED lamp beads must be soldered, leading to limitations in LED applications. Processing costs have also increased. At the same time, the welding process will inevitably lead to serious environmental pollution, which is contrary to the principle of environmental protection and low consumption of LED technology.
  • solderless chip LED lamp structure is provided.
  • the luminaire structure is composed of a plurality of patch LED lamp beads, a plurality of LED lamp bead compartments, a plurality of connecting bodies having conductive characteristics, and a driving power source.
  • the patch LED bead is embedded and fixed in the LED bead compartment; a number of patches embedded in the LED bead compartment are electrically connected through a number of connectors.
  • the connector is used to realize the electrical connection between the LED strips of the patch, and the electrical connection between the LED lamp bead and other components (such as resistors), the pins and connectors of the LED strips (such as metal) Wires, metal sheets, etc. are electrically connected by close contact (instead of soldering in conventional processing methods); SMD LED beads are connected to the corresponding power supply in series or parallel or in series and parallel. On the drive module.
  • a plurality of snaps are provided on the LED lamp bead to fix the patch LED bead in the LED bead compartment or to fix the bead compartment On the substrate, the shape and size of the LED lamp bead can be used to clamp the LED lamp beads.
  • the connector is secured by direct winding or pinching or squeezing or directly integral with the LED bead pod and in intimate contact with the LED bead pin.
  • the winding of the connecting body may be directly wound on the LED pin, or may be wrapped around the corresponding position on the LED lamp bead that the pin can be contacted after the LED lamp bead is embedded in the LED lamp bead chamber, thereby enabling the LED lamp to be
  • the connecting body of the beading and patching LED lamp bead pin can be in close contact with the patch LED lamp bead pin; the connecting body can also be directly squeezed into the patch LED lamp bead pin and the LED lamp bead housing. In between, it can also be directly clamped on the pins of the LED; the integral body of the connector and the LED lamp bead can be realized by an injection molding process.
  • LED lamp beads can be integrated, they can also be separate and independent.
  • a number of separate independent LED lamp bays that are not integrated can be fixed together by other carriers (such as a substrate) as needed (to ensure the stability of the LED lamp bead compartment and the connector), or can be fixed without separate, independent LED lamp beads
  • the tanks are connected together by a number of connectors (to ensure application flexibility).
  • the positive effects of the present invention are as follows:
  • the surface of the LED lamp bead pin and the surface of the connector body can be subjected to corresponding levels of anti-corrosion treatment as needed to ensure long-term good electrical conductivity of the contact point, and according to the characteristics of the LED lamp, the contact is
  • the conductive, solderless structure is more suitable for use on LED luminaires.
  • the specially designed structure of the present invention is a revolutionary application of the application of the SMD LED lamp bead, which has been subverted by the conventional patch lamp bead.
  • the lamp bead installation is very convenient and simple, can be firmly embedded in the LED lamp bead chamber with one push, and can be firmly electrically connected with the pre-fixed connector; at the same time, the shape of the connector can be flexibly designed.
  • connection body plays the dual role of the electrical connection and the heat sink, so that the heat dissipation effect of the LED lamp bead can be optimized to the maximum extent, so that the lamp can greatly improve the performance against light decay under the premise of cost saving; LED lamp beads without soldering applications can completely solve the current patch LED lamp beads because of welding plus The phenomenon of dead light caused by high temperature during work and the life hazard caused by damage to the internal structure; Finally, the solderless application of LED lamp beads saves a large amount of material cost while saving a large amount of precious metal solder.
  • the processing and processing links also save several processing steps, which reduces the overall cost of the lamps and greatly improves the production efficiency; the traditional solder processing related industry chain belongs to the heavy pollution industry, and the application of the invention can maximize the production of LED lamps.
  • the link further highlights the concept of green environmental protection, and the future maintenance of the non-welded LED luminaire can be realized by simply replacing the faulty LED lamp bead, avoiding the problem of the traditional LED luminaire maintenance and replacing it as a whole, wasting a lot of available resources.
  • the lamp structure described in the invention can completely produce various application new lamps which are more energy-saving and environmentally friendly, lower in cost, better in light efficiency and more cost-effective, and are applied to various lighting fields such as civil lighting, advertising lighting and commercial lighting.
  • Figure 1 is a schematic diagram of the LED lamp bead and the substrate being integrated, and the connecting body is connected to the LED lamp bead pin by being wrapped around the LED lamp bead, wherein
  • IA is the back side (non-lighting surface) of an LED lamp bead embedded with a patch LED lamp bead:
  • IB is a schematic diagram of a process in which a patch LED lamp bead is embedded in an LED lamp bead;
  • 1C is a schematic cross-sectional view of a horizontal dotted line in 1A of FIG. 1;
  • 1D is a schematic cross-sectional view of a vertical dashed line in 1A of FIG. 1;
  • 1E is a partial cross-sectional view of a plurality of lamps composed of the 1A structure of FIG.
  • the LED lamp bead chamber and the substrate are integrated, and the connecting body is in close contact with the LED lamp bead pin by direct pinching, wherein
  • 2A is a schematic view of the back side (non-lighting surface) of an LED lamp bead in which a patch LED lamp bead is embedded;
  • 2B is a front view of the horizontal dashed line from left to right in 2A of Fig. 2:
  • 2C is a schematic cross-sectional view of a vertical dotted line in 2A of FIG. 2;
  • 2D is a schematic diagram of the process of embedding the LED lamp bead into the LED lamp bead
  • 2E is a schematic cross-sectional view of a horizontal dotted line in 2A of Fig. 2.
  • Separate independent LED lamp bead is fixed on the substrate and the connecting body is connected to the LED lamp bead pin by being wound on the LED lamp bead, wherein
  • 3A is a schematic view of the back side of a separate LED lamp bead
  • 3B is a front view of a separate independent LED lamp bead fixed to the substrate and having a chip LED lamp bead embedded therein and a fixed connector;
  • 3C, 3D and 3E are schematic diagrams showing the installation process based on a partial section of the horizontal dashed line in 3B of Fig. 3;
  • 3F, 3G, and 3H are schematic diagrams showing the mounting process based on a partial cross section of the vertical dashed line in 3B of Fig. 3.
  • a separate independent LED lamp bead is fixed on the substrate and the connecting body is in close contact with the LED lamp bead by direct pinching, wherein
  • 4A is a front view of a separate independent LED lamp bead fixed to the substrate and having a patch LED lamp bead embedded therein and a fixed connector;
  • 4B, 4C and 4D are schematic diagrams showing the installation process based on a partial section of the horizontal dashed line in 4A of Fig. 4;
  • 4E, 4F and 4G are diagrams showing the installation process based on a partial section of the vertical dashed line in 4A of Fig. 4.
  • 5A is a front view (light emitting surface) of a LED lamp housing in which a patch LED lamp bead is embedded and a connector is fixed;
  • 5B is a schematic cross-sectional view of a horizontal dotted line in FIG. 5A;
  • 5C is a schematic cross-sectional view of a vertical dashed line in 5A of FIG. 5;
  • 5D, 5E and 5F are schematic diagrams of the assembly process of the LED lamp bead compartment, the patch LED lamp bead and the connector.
  • Figure 6 is a partial schematic view of a number of separate LED bead bays (with LED bead and connector mounted) secured together by a substrate, wherein
  • FIG. 6A is a schematic diagram of the LED lamp bead chamber (with the LED lamp bead and the connector) as shown in FIG. 5 fixed on the surface of the substrate by bonding;
  • 6B is a schematic diagram of a plurality of separate LED bead compartments with buckles on the bottom (with LED bead and connector mounted) secured to the substrate by snaps on the bottom;
  • FIG. 6C is a front view showing the front surface (light emitting surface) of the structure shown in Figs. 6A and 6B.
  • Figure 7 is a schematic view showing a chain structure by a plurality of separate LED lamp bays (the connecting body is in close contact with the LED lamp bead pins by direct pinching), wherein
  • 7A is a partial front view of the chain structure (light emitting surface);
  • 7C is a schematic diagram of the process of combining the LED lamp bead with the LED lamp bead;
  • 7D is a schematic cross-sectional view of a horizontal dotted line in 7B of Fig. 7.
  • Figure 8 is a schematic diagram of a chain structure formed by a plurality of separate LED lamp bays (the connecting body is tightly clamped to the LED lamp bead by winding), wherein
  • 8B is a schematic diagram of a process in which a LED lamp bead is combined with an LED lamp bead
  • 8C is a schematic diagram of the combination of 8B of Fig. 8.
  • Figure 9 is a partial schematic view of a plurality of separate LED lamp bead chambers fixed to the substrate by bonding (the clip-type connector is in close contact with the LED lamp bead pin), wherein
  • FIGS. 9A, 9B and 9C are partial schematic views of the installation process of the clip-type connector, the patch LED lamp bead and the LED lamp bead.
  • a plurality of LED lamp bead compartments (3) are distributed on the substrate (5), and each LED lamp bead compartment is adapted according to specific needs ( 3)
  • the lamp bead (2) can be accessed by the buckle (6); then the LED bead (1) is embedded in the LED bead compartment (3), and the light emitted by the LED bead (1) is transmitted through the light.
  • the pin (2) of the LED lamp bead (1) can be in close contact with the connector (4), thereby achieving an electrical connection between adjacent LED bead (1).
  • the wire or metal sheet connector (4) can be directly and firmly clamped between the LED lamp pin (2) and the corresponding buckle (6) in a manner as shown in FIG. contact.
  • the optimal electrical connection of all LED lamp beads (1) can be achieved with suitable connections: series or parallel or serial-to-parallel.
  • the winding and fixing manner of the wire-like connecting body can also be replaced by the pinching and fixing method of the metal plate-like connecting body, and the corresponding LED lamp bead chamber and the buckle are made suitable for squeezing the metal sheet-like connecting body.
  • Shape and structure, in order to improve the heat dissipation effect, the exposed area of the metal sheet-like connector can be made as large as possible to increase the heat dissipation area.
  • 3C - 3H firstly, several holes of appropriate size are drawn on the substrate (5), and then the LED lamp housing (3) is fixed on the substrate (5) through the buckle (7).
  • the two ends of the wire-like connector (4) are respectively wound around the buckles (6) which the LED lamp bead pins (2) can contact in the adjacent two LED lamp housings (3), and then The LED lamp bead (1) is embedded in the LED lamp bead chamber (3), and the light emitted from the LED lamp bead (1) is passed through the light transmission hole (8).
  • the pin (2) of the LED lamp bead (1) can be in close contact with the connector (4), thereby achieving an electrical connection between adjacent LED bead (1).
  • the wire or metal sheet connector (4) can be directly and firmly clamped between the LED lamp pin (2) and the corresponding buckle (6) in a manner as shown in FIG. contact.
  • the optimal electrical connection of all LED beads (1) can be achieved with suitable connections: in series or in parallel or in series and in parallel.
  • the winding or pinching fixing manner of the wire-shaped connecting body can also be replaced by the pinching and fixing method of the metal plate-like connecting body, and the LED lamp bead chamber and the buckle are correspondingly formed to be suitable for pinching the metal sheet.
  • the shape and structure of the connector in order to improve the heat dissipation effect, the exposed area of the metal sheet-like connector can be made as large as possible to increase the heat dissipation area.
  • Example 4 As shown in FIG. 6, the LED lamp housing (3) of the structure shown in FIG. 5 is fixed on the substrate (5) by a back adhesive method or a buckle (7).
  • a back adhesive method or a buckle (7) For other implementations, refer to the embodiment. 1 and the corresponding process of embodiment 2.
  • the connecting body (4) is a clip-on metal piece or a wire which has elasticity, and as shown in FIG. 9A, a plurality of LED lamp housings (3) are fixed by the clip type connecting body (4). Connected together, and then the LED lamp bead (1) is firmly embedded in the LED lamp bead compartment (3).
  • the clip-type connector (4) of the present embodiment is also applicable to the other embodiments described above.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

一种免焊型贴片LED灯具结构，是对现有LED灯具的增强和改进，属于LED装饰照明领域。其简单新颖的结构可以完全实现LED灯珠的免焊工艺，在节约了材料成本的同时，在生产加工环节上也省去几道加工工序，从而使灯具的整个成本降低并大大降低产品在加工高温焊接过程中导致LED灯珠的不良率；同时特殊的结构可以使LED的应用领域更加灵活和宽广，而且无焊接LED灯具的日后维护可以通过只更换出现故障的LED灯珠的简单方式实现，从而最大程度的使LED灯具的生产和应用环节更加突出绿色环保概念。

Description

一种免焊型贴片 LED灯具结构 所属技术领域
本发明涉及一种免焊型贴片 LED灯具结构， 是对现有贴片 LED灯具的增强和改进， 属于 LED装饰照明领域。
背景技术
LED贴片灯珠由于其散热效果要比大功率灯珠好， 可以不用借助其他介质（比如铝基电路 板）辅助散热， 其产品的稳定性相比而言要可靠的多， 但 LED的电气特性决定了 LED灯珠在出 厂前必须一颗一颗单独进行质检， 作为贴片 LED灯珠应用， 由于灯珠体积很小， 很难实现固定 和电气连接， 传统的方法是把 LED灯珠一个个通过焊在导电体 （电路板或导线）上串接起来， 实现电气的连接， 这样加工工序就要相对繁琐， 成本就要比大功率灯珠要高， 所以市场上大 功率灯具越来越多。
众所周知， 贴片 LED灯珠在焊接前都需要一个长时间的烘干过程， 否则在焊接过程中， 很 容易因为焊接温度的不合适导致死灯或为以后的使用带来质量隐患， 由于焊接温度问题导致 的产品不良率是引发产品的间接成本增加的一个很重要因素。
再者， LED灯珠的应用本来可以更为丰富， 很多应用都受限于 LED灯珠必须焊接的特性， 导致 LED应用的局限性。 加工成本也因此增高。 同时， 焊接的工艺必然导致严重的环境污染， 这是与 LED技术的环保低耗的宗旨相悖的。
综上所述， 现有的 LED灯具的加工过程都无法脱离焊接的工序， 无论从加工成本和环保以 及应用灵活性等方面看， 多少限制了贴片 LED灯珠的应用和发展。
发明内容
为了克服现有 LED灯具结构单一、 加工工序繁琐以及材料成本和加工成本高的缺点， 特提 供一种免焊型贴片 LED灯具结构。
该发明所采用的具体方案是： 灯具结构由若干贴片 LED灯珠、 若干 LED灯珠舱、 若干具有 导电特性的连接体以及驱动电源组成。贴片 LED灯珠嵌入并固定在 LED灯珠舱内； 若干嵌入 LED 灯珠舱的贴片 LED灯珠通过若干连接体实现之间的电气连接。 连接体用来实现贴片 LED灯珠之 间的电气连接， 也可以实现 LED灯珠与其他元器件 （比如电阻） 之间的电气连接， 贴片 LED灯 珠的管脚与连接体（比如金属丝， 金属片等）之间通过紧密接触实现电气连接 (而不是像传统 加工方式中用焊锡来实现）； 贴片 LED灯珠按照串联或并联或串联与并联相结合的方式连接到 相应的电源驱动模块上。
LED灯珠舱上设有若干卡扣用来把贴片 LED灯珠固定在 LED灯珠舱内或用来使灯珠舱固定 在基板上， LED灯珠舱的形状和大小已可以夹固住贴片 LED灯珠为宜。
连接体是通过直接缠绕或挤夹或挤压或直接与 LED灯珠舱做成一体的方式实现连接体的 固定并与 LED灯珠管脚之间紧密接触。 其中， 连接体的缠绕可以直接缠绕在 LED管脚上， 也可 以缠绕在贴片 LED灯珠嵌入 LED灯珠舱后其管脚可以接触到的 LED灯珠舱上相应位置，从而使被 LED灯珠舱和贴片 LED灯珠管脚挤夹的连接体能与贴片 LED灯珠管脚实现紧密的接触；连接体还 可以被直接挤夹在贴片 LED灯珠管脚和 LED灯珠舱之间， 也可以直接被挤夹在 LED的管脚上； 连 接体与 LED灯珠舱做成一体可以通过注塑的工艺实现。
若千 LED灯珠舱可以是一体的， 也可以是单独独立的。 不是一体的若干单独独立的 LED灯 珠舱根据需要可以通过其他载体（如基板）固定在一起（以保证 LED灯珠舱和连接体的稳固）， 也可以不需要固定， 相互独立的 LED灯珠舱通过若干连接体连接在一起 （以保证应用的灵活 性）。
本发明的积极效果如下： LED灯珠管脚的表面以及连接体表面可以根据需要进行相应级 别的防腐蚀处理， 以保证接触点长期良好的导电性能， 而且根据 LED灯具的特点， 这种靠接触 导电的无焊接结构更加适合用在 LED灯具上， 首先， 本发明的这种特殊设计的结构， 是当今贴 片 LED灯珠应用的一次革命性应用， 颠覆了以往贴片灯珠必须通过焊接实现电气连接的概念， 灯珠安装异常方便简单， 只需一按就可以牢固嵌入 LED灯珠舱中， 并且能牢固的与事先固定好 的连接体实现电气接触； 同时可以灵活的设计连接体的形状和结构， 使得连接体起到电气连 接和散热片的双重作用，使 LED灯珠的散热效果能够得到最大程度优化， 从而灯具可以在节省 成本的前提下大大提髙抗光衰的性能；其次， LED灯珠无焊接的应用可以完全解决目前贴片 LED 灯珠因为焊接加工过程中的高温导致的死灯现象以及因内部结构受损而导致的寿命隐患； 最 后 LED灯珠的无焊接应用在节约大量的贵重金属焊锡的前提下， 不仅节省了巨额材料成本， 同 时在生产加工环节上也省去几道加工工序，从而使灯具的整个成本降低并大大提高生产效率； 传统的焊锡加工相关产业链属于重污染行业，本发明的应用可以最大程度的使 LED灯具的生产 环节更加突出绿色环保概念， 而且无焊接 LED灯具的日后维护可以通过只更换出现故障的 LED 灯珠的简单方式实现， 避免了传统 LED灯具维护那样出了问题就整体更换， 浪费了大量可用资 源。 用本发明所述的灯具结构完全可以生产出更节能环保、 成本更低， 光效更好、 性价比更 高的各种应用新型灯具， 应用到民用照明、 广告照明、 商用照明等各个照明领域。
附图说明
图 1 LED灯珠舱和基板为一体并且连接体通过缠绕在 LED灯珠舱上实现与贴片 LED灯珠 管脚挤夹接触在一起的示意图， 其中，
1A为某个嵌入有贴片 LED灯珠的 LED灯珠舱的背面 （非发光面） 示意图： IB为贴片 LED灯珠嵌入 LED灯珠舱的过程示意图；
1C为图 1的 1A中水平虚线的剖面示意图；
1D为图 1的 1A中垂直虚线的剖面示意图；
1E为若干个如图 1的 1A结构所组成灯具的局部剖面示意图。
LED灯珠舱和基板为一体且连接体通过直接挤夹的方式与 LED灯珠管脚紧密接触的 示意图， 其中，
2A为某个嵌入有贴片 LED灯珠的 LED灯珠舱的背面 （非发光面） 示意图； 2B为图 2的 2A中沿水平虚线自左向右方向的正视示意图：
2C为图 2的 2A中垂直虚线的剖面示意图；
2D为贴片 LED灯珠嵌入 LED灯珠舱的过程示意图；
2E为图 2的 2A中水平虚线的剖面示意图。
单独独立的 LED灯珠舱固定在基板上并且连接体通过缠绕在 LED灯珠舱上实现与 LED灯珠管脚挤夹接触在一起的示意图， 其中，
3A为单独独立的 LED灯珠舱背面正视示意图；
3B为一个固定在基板上并且其内部嵌入有贴片 LED灯珠、 固定了连接体的单独独 立的 LED灯珠舱背面正视示意图；
3C、 3D和 3E为以图 3的 3B中水平虚线的局部剖面为基础， 示意安装过程的示意 图；
3F、 3G和 3H为以图 3的 3B中垂直虚线的局部剖面为基础， 示意安装过程的示意 图。
单独独立的 LED灯珠舱固定在基板上并且连接体通过直接挤夹的方式与 LED灯珠 管脚紧密接触的示意图， 其中，
4A为一个固定在基板上并且其内部嵌入有贴片 LED灯珠、 固定了连接体的单独独 立的 LED灯珠舱背面正视示意图；
4B、 4C和 4D为以图 4的 4A中水平虚线的局部剖面为基础， 示意安装过程的示意 图；
4E、 4F和 4G为以图 4的 4A中垂直虚线的局部剖面为基础， 示意安装过程的示图。 一种单独独立的 LED灯珠舱且连接体通过直接挤夹的方式与 LED灯珠管脚紧密接 触的示意图， 其中，
5A为一个嵌入有贴片 LED灯珠并且固定有连接体的 LED灯珠舱的正面 （发光面） 正视示意图； 5B为图 5的 5A中水平虚线的剖面示意图；
5C为图 5的 5A中垂直虚线的剖面示意图；
5D、 5E和 5F为 LED灯珠舱、 贴片 LED灯珠以及连接体的组装过程示意图。
图 6 若干单独独立的 LED灯珠舱 （安装有 LED灯珠和连接体） 通过基板固定在一起的 局部示意图， 其中，
6A为若千如图 5中所示的 LED灯珠舱 （安装有 LED灯珠和连接体） 通过粘接固定 在基板表面上的示意图；
6B为若干底部带有卡扣的单独独立的 LED灯珠舱 （安装有 LED灯珠和连接体） 通 过底部卡扣固定在基板上的示意图；
6C为图 6的 6A和 6B所示结构的正面 （发光面） 的正视示意图。
图 7 —种由若干单独独立的 LED灯珠舱（连接体通过直接挤夹的方式与 LED灯珠管脚紧 密接触） 构成链状结构的示意图， 其中，
7A为链状结构局部正面 （发光面） 正视示意图；
7B为链状结构局部背面 （非发光面） 正视示意图；
7C为贴片 LED灯珠与 LED灯珠舱组合在一起的过程示意图；
7D为图 7的 7B中水平虚线的剖面示意图。
图 8 —种由若干单独独立的 LED灯珠舱（连接体通过缠绕方式与 LED灯珠管脚紧密挤夹 接触） 构成链状结构的示意图， 其中，
8A为链状结构局部正面 （发光面） 正视示意图；
8B为贴片 LED灯珠与 LED灯珠舱组合在一起的过程示意图；
8C为图 8的 8B组合后的示意图。
图 9 一种若干单独独立的 LED灯珠舱通过粘接固定在基板上（夹型连接体与 LED灯珠管 脚紧密挤夹接触） 的局部示意图， 其中，
9A、 9B和 9C为夹型连接体、 贴片 LED灯珠与 LED灯珠舱安装过程的局部示意图。 图中， 1. 贴片 LED灯珠， 2. 贴片 LED灯珠管脚 /引脚， 3. LED灯珠舱， 4. 连接体， 5. 基板， 6. LED灯珠舱上的卡扣， 7. 单独独立的 LED灯珠舱上用来把其固定在基板上的卡扣， 8. LED灯珠舱的透光孔。
具体实施方式
实施例 1
若千 LED灯珠舱和基板做成一体的时候： 首先， 如图 1所示， 在基板（5 )上分布有若干 LED灯珠舱（3)， 根据具体需要， 每个 LED灯珠舱 （3 )底部有一个透光孔 （8)， 透光孔 （8 ) 的周围设置有若干卡扣 （6)， 用来固定 LED灯珠（1 )， 用金属丝状的连接体（4)两端分别缠 绕在相邻的两个 LED灯珠舱 （3) 中 LED灯珠管脚 （2) 能接触到的卡扣 （6) 上； 然后把 LED 灯珠（1 ) 嵌入 LED灯珠舱 （3 ) 中， 并且使 LED灯珠 （1 ) 发出的光通过透光孔 （8)。 这样， LED灯珠 （1 ) 的管脚 （2 ) 就可以与连接体 （4) 紧密的接触， 从而实现相邻 LED灯珠 （1 ) 之间的电气连接。 也可以如图 2所示的方式， 把金属丝或金属片状的连接体（4 )直接牢固的 挤夹在 LED灯珠管脚 （2 ) 与相应的卡扣 （6) 之间并紧密的接触。 最后， 根据具体情况和驱 动电源的特性， 可以用适合的连接方式实现所有 LED灯珠（1 )的最佳电气连接： 串联或并联 或串并混联。
本实施例中金属丝状连接体的缠绕固定方式还可以用金属片状连接体的挤夹固定方式来 代替， 相应的把 LED灯珠舱及卡扣做成适合挤夹金属片状连接体的形状和结构， 为了提高散 热效果， 可以尽可能把金属片状连接体的外露面积做大些， 以提高散热面积。
实施例 2
若干单独独立 LED灯珠舱通过基板固定在一起的时候： 首先， 如图 3的 3A所示的 LED灯 珠舱（3)， 带有固定 LED灯珠（1 )用的卡扣（6)和固定基板用的卡扣 （7)。 如图 3的 3C - 3H 所示的过程， 先在基板（5 )上幵出若干大小合适的孔， 然后把 LED灯珠舱（3)通过卡扣（7 ) 固定在基板 （5 ) 上， 然后再用金属丝状的连接体 （4 ) 两端分别缠绕在相邻的两个 LED灯珠 舱 （3 ) 中 LED灯珠管脚 （2 ) 能接触到的卡扣 （6) 上， 然后把 LED灯珠 （1 ) 嵌入 LED灯珠 舱（3 )中， 并且使 LED灯珠（1 )发出的光通过透光孔（8)。 这样， LED灯珠（1 )的管脚（2 ) 就可以与连接体 （4) 紧密的接触， 从而实现相邻 LED灯珠 （1 ) 之间的电气连接。 也可以如 图 4所示的方式， 把金属丝或金属片状的连接体 （4) 直接牢固的挤夹在 LED灯珠管脚 （2) 与相应的卡扣 （6)之间并紧密的接触。 最后， 根据具体情况和驱动电源的特性， 可以用适合 的连接方式实现所有 LED灯珠 （1 ) 的最佳电气连接： 串联或并联或串并混联。
本实施例中金属丝状连接体的缠绕或挤夹固定方式还可以用金属片状连接体的挤夹固定 方式来代替， 相应的把 LED灯珠舱及卡扣做成适合挤夹金属片状连接体的形状和结构， 为了 提高散热效果， 可以尽可能把金属片状连接体的外露面积做大些， 以提高散热面积。
实施例 3
如图 5、 图 7和图 8所示， 若千单独独立的 LED灯珠舱（3 ) 可以使 LED灯珠 （1 ) 发光 面朝上嵌入 LED灯珠舱 （3)， 其他实施过程可以参照实施例 1和实施例 2的相应过程， 这样 就形成各种形式的链状结构的 LED灯珠舱（3) 链， 这几种结构的 LED灯珠舱 （3 ) 链可以更 灵活的应用到更多 LED灯具中。
实施例 4 如图 6所示， 图 5中所示结构的 LED灯珠舱 （3) 通过背面粘胶方式或设置卡扣 （7) 来 固定在基板（5) 上， 其余的具体实施过程可以参照实施例 1和实施例 2的相应过程。
实施例 5
如图 9所示， 连接体 （4) 为自身具有弹性的夹型金属片或金属丝， 如图 9的 9A所示， 通过夹型连接体（4)把若干 LED灯珠舱（3 ) 固定连接在一起， 然后把 LED灯珠（1 )牢固的 嵌入 LED灯珠舱 （3) 中， 剩余的实施方式可以参照实施例 1和实施例 2的具体步骤。
本实施例所述的夹型连接体 （4) 也适用于上述的其他实施例中。

Claims

权 利 要 求 书 、 一种免焊型贴片 LED灯具结构， 由若千贴片 LED灯珠、 若干贴片 LED灯珠舱、 若干具有 导电特性的连接体以及驱动电源组成， LED灯珠按照串联或并联或串联与并联相结合的 方式连接到相应的电源驱动模块上。其特征是： 贴片 LED灯珠嵌入并固定在两端有连接 体的 LED灯珠舱内，贴片 LED灯珠的两个管脚分别与 LED灯珠舱两端的连接体紧密接触， 贴片 LED灯珠之间或贴片 LED灯珠与其他电子元件之间的电气连接是通过连接体实现的， 连接体与贴片 LED管脚之间是通过紧密接触而实现电气连接的。
、 根据权利要求 1所述的一种免焊型贴片 LED灯具结构， 其特征是： 连接体是独立存在的， 其固定方式且与 LED灯珠管脚之间紧密接触是通过缠绕 LED灯珠舱且能被嵌入的贴片 LED 灯珠管脚紧密接触或直接缠绕在贴片 LED管脚的方式实现。
、 根据权利要求 1所述的一种免焊型贴片 LED灯具结构， 其特征是： 连接体是独立存在的， 其固定方式且与 LED灯珠管脚之间紧密接触是通过被贴片 LED灯珠管脚和 LED灯珠舱挤 夹或挤压的方式实现。
、 根据权利要求 1所述的一种免焊型贴片 LED灯具结构， 其特征是： 连接体不是独立存在 的， 其固定方式是通过与 LED灯珠舱整体注塑为一体的方式实现的。
、 根据权利要求 1所述的一种免焊型贴片 LED灯具结构， 其特征是： 若干 LED灯珠舱可以 是一体的。
、 根据权利要求 1所述的一种免焊型贴片 LED灯具结构， 其特征是： 若干 LED灯珠舱可以 是单独分离的， 不是一体的若干单独分离的 LED灯珠舱可以是通过其他载体固定在一起 的， 也可以是不固定的。
、 根据权利要求 1所述的一种免焊型贴片 LED灯具结构， 其特征是： LED灯珠舱上设有若 干卡扣。
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