CN202009533U - LED printed circuit board - Google Patents
LED printed circuit board Download PDFInfo
- Publication number
- CN202009533U CN202009533U CN2010205919537U CN201020591953U CN202009533U CN 202009533 U CN202009533 U CN 202009533U CN 2010205919537 U CN2010205919537 U CN 2010205919537U CN 201020591953 U CN201020591953 U CN 201020591953U CN 202009533 U CN202009533 U CN 202009533U
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- CN
- China
- Prior art keywords
- copper foil
- circuit board
- printed circuit
- led printed
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an LED (Light-Emitting Diode) printed circuit board which comprises a front copper foil, a rear copper foil and a plurality of through holes, wherein the front copper foil comprises a bonding pad and a wire; the front copper foil further comprises a radiating copper foil which is insulated from the bonding pad and the wire; the through holes penetrate through a board body and communicate the radiating copper foil with the rear copper foil; rivet-shaped heat-conducting copper rubber gels are filled in the through holes; and the rivet-shaped heat-conducting copper rubber gels are connected to the radiating copper foil and the rear copper foil. The LED printed circuit board utilizes the excellent heat-conducting property of copper rubber to conduct the heat generated by the LED to the rear radiating copper foil, thereby achieving a radiating effect, overcoming the defect of the prior art that an aluminum-base material radiates heat but conducts no heat, and improving the radiating effect of the LED printed circuit board. The LED printed circuit board is suitable for mould continuous production, stroking life of a mould can be prolonged, production efficiency is promoted, and molding processing cost of the LED printed circuit board is lowered.
Description
[technical field]
The utility model relates to printed circuit board (PCB), relates in particular to a kind of LED printed circuit board (PCB).
[background technology]
Existing LED printed circuit board (PCB) mainly is to adopt aluminium base material to make, and the aluminium base of aluminum-base printing circuit board is heat radiation only, not heat conduction, and the overall radiating effect of printed circuit board (PCB) is relatively poor.And the aluminum-base printing circuit board material cost is higher, and processing and forming is difficulty comparatively, and processing cost is also higher.The thermal losses cutter life that produces during the CNC moulding; Mould produces quiet Al adsorption bits during the die stamping moulding, influence die life, and the die stamping moulding is difficult to continuous production, and continuous production can cause the bad or product rejection of product quality.
[summary of the invention]
The technical problems to be solved in the utility model provides a kind of good heat dissipation effect, is convenient to machine-shaping, lower-cost LED printed circuit board (PCB).
In order to solve the problems of the technologies described above, the technical solution adopted in the utility model is that a kind of LED printed circuit board (PCB) comprises front Copper Foil, back side Copper Foil and a plurality of through hole, the front Copper Foil comprises pad and cabling, and described front Copper Foil also comprises the heat radiation Copper Foil with described pad, cabling insulation; Described through hole passes plate body, is communicated with described heat radiation Copper Foil and back side Copper Foil, is marked with the heat conduction copper micelle colloid of rivet-like in the described through hole, and the heat conduction copper micelle colloid of described rivet-like connects heat radiation Copper Foil and back side Copper Foil.
The diameter of described through hole is 0.3 millimeter to 0.6 millimeter.
The 1.5-2.5 of the diameter that described heat conduction copper micelle colloid head diameter is a through hole doubly.
Described heat conduction copper micelle colloid is a hollow, and the thickness of heat conduction copper micelle colloid main part is 0.015 to 0.1 millimeter.
The thickness of described heat conduction copper micelle colloid head is 0.01 to 0.1 millimeter.
Described back side Copper Foil comprises a plurality of heat radiation grooves.
The degree of depth of described heat radiation groove is 1/4th to 3/4ths of a back side copper thickness.
The area of described heat radiation groove is 1/4th to 3/4ths of a back side Copper Foil area.
LED printed circuit board (PCB) of the present utility model utilizes the excellent heat conductivity performance of copper glue, the heat that LED is produced imports to the backside heat Copper Foil, aluminium base material is only dispelled the heat thereby the effect that plays heat radiation has overcome prior art, and athermanous shortcoming has been improved the radiating effect of LED printed circuit board (PCB).The utility model is suitable for producing continuously with mould, and the jig frequency life-span of mould can increase, and has promoted production efficiency, reduces the processing and forming cost of LED printed circuit board (PCB).
[description of drawings]
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail.
Fig. 1 is the structural representation in the utility model LED printed circuit board embodiment front.
Fig. 2 is the structural representation at the utility model LED printed circuit board embodiment back side.
Fig. 3 is that A among Fig. 1 is to cutaway view.
[embodiment]
To the embodiment of the utility model LED printed circuit board (PCB) shown in Figure 3, the LED printed circuit board (PCB) adopts double face copper (as papery material plate: FR-1, FR-2 at Fig. 1; Glass fibre material plate: CEM-1, CEM-3, FR-4 etc.) makes.Front Copper Foil 1 comprises pad 101, cabling (not shown) and the heat radiation Copper Foil 102 that insulate with pad, cabling; Through hole 2 passes plate body, is communicated with heat radiation Copper Foil 1 and back side Copper Foil 3, is marked with the heat conduction copper micelle colloid 4 of rivet-like in the through hole, and the heat conduction copper micelle colloid 4 of rivet-like connects heat radiation Copper Foil 1 and back side Copper Foil 3.
The diameter d of through hole 2 is 0.3 millimeter in the present embodiment.Heat conduction copper micelle colloid head diameter D is that the diameter of through hole 2 is 0.6 millimeter.Heat conduction copper micelle colloid is a hollow, and the thickness B of heat conduction copper micelle colloid 4 main parts is 0.05 millimeter.The thickness H of heat conduction copper micelle colloid 4 heads is 0.05 millimeter.
Used heat conduction copper glue is that Japan produces in the present embodiment, and product grade is TH-1168.
Back side Copper Foil 3 has a plurality of heat radiation grooves 301.The degree of depth of heat radiation groove 301 is 1/2nd of a back side copper thickness.The area of heat radiation groove 301 surpasses 1/3rd of back side Copper Foil 3 entire areas.
LED printed circuit board (PCB) of the present utility model utilizes the excellent heat conductivity performance of copper glue, the heat that LED is produced imports to the backside heat Copper Foil, aluminium base material is only dispelled the heat thereby the effect that plays heat radiation has overcome prior art, and athermanous shortcoming has been improved the radiating effect of LED printed circuit board (PCB).The utility model is suitable for producing continuously with mould, and the jig frequency life-span of mould can increase, and has promoted production efficiency, reduces the processing and forming cost of LED printed circuit board (PCB).
Claims (8)
1. a LED printed circuit board (PCB) comprises front Copper Foil, back side Copper Foil, and the front Copper Foil comprises pad and cabling, it is characterized in that, comprises a plurality of through holes, and described front Copper Foil comprises the heat radiation Copper Foil with described pad, cabling insulation; Described through hole passes plate body, is communicated with described heat radiation Copper Foil and back side Copper Foil, is marked with the heat conduction copper micelle colloid of rivet-like in the described through hole, and the heat conduction copper micelle colloid of described rivet-like connects heat radiation Copper Foil and back side Copper Foil.
2. LED printed circuit board (PCB) according to claim 1 is characterized in that, the diameter of described through hole is 0.3 millimeter to 0.6 millimeter.
3. LED printed circuit board (PCB) according to claim 2 is characterized in that, the 1.5-2.5 of the diameter that described heat conduction copper micelle colloid head diameter is a through hole doubly.
4. LED printed circuit board (PCB) according to claim 2 is characterized in that, described heat conduction copper micelle colloid is a hollow, and the thickness of heat conduction copper micelle colloid main part is 0.015 to 0.1 millimeter.
5. LED printed circuit board (PCB) according to claim 2 is characterized in that, the thickness of described heat conduction copper micelle colloid head is 0.01 to 0.1 millimeter.
6. according to the described LED printed circuit board (PCB) of arbitrary claim in the claim 1 to 6, it is characterized in that described back side Copper Foil comprises a plurality of heat radiation grooves.
7. LED printed circuit board (PCB) according to claim 7 is characterized in that, the degree of depth of described heat radiation groove is 1/3rd to 3/4ths of a back side copper thickness.
8. LED printed circuit board (PCB) according to claim 7 is characterized in that, the area of described heat radiation groove is 1/3rd to 3/4ths of a back side Copper Foil area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205919537U CN202009533U (en) | 2010-11-04 | 2010-11-04 | LED printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205919537U CN202009533U (en) | 2010-11-04 | 2010-11-04 | LED printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202009533U true CN202009533U (en) | 2011-10-12 |
Family
ID=44751185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205919537U Expired - Fee Related CN202009533U (en) | 2010-11-04 | 2010-11-04 | LED printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202009533U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102809130A (en) * | 2012-09-18 | 2012-12-05 | 梁首强 | Efficient-radiation LED lamp and production method thereof |
| CN114650670A (en) * | 2020-12-18 | 2022-06-21 | 宏恒胜电子科技（淮安）有限公司 | Circuit board with heat dissipation block and preparation method thereof |
-
2010
- 2010-11-04 CN CN2010205919537U patent/CN202009533U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102809130A (en) * | 2012-09-18 | 2012-12-05 | 梁首强 | Efficient-radiation LED lamp and production method thereof |
| CN114650670A (en) * | 2020-12-18 | 2022-06-21 | 宏恒胜电子科技（淮安）有限公司 | Circuit board with heat dissipation block and preparation method thereof |
| CN114650670B (en) * | 2020-12-18 | 2024-03-12 | 宏恒胜电子科技（淮安）有限公司 | Circuit board with heat dissipation block and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111012 Termination date: 20171104 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |