CN102316667A - LED (light emitting diode) printed circuit board and production method thereof - Google Patents
LED (light emitting diode) printed circuit board and production method thereof Download PDFInfo
- Publication number
- CN102316667A CN102316667A CN201010531894A CN201010531894A CN102316667A CN 102316667 A CN102316667 A CN 102316667A CN 201010531894 A CN201010531894 A CN 201010531894A CN 201010531894 A CN201010531894 A CN 201010531894A CN 102316667 A CN102316667 A CN 102316667A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- copper foil
- printed circuit
- heat
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses an LED (light emitting diode) printed circuit board and a production method thereof. The LED printed circuit board comprises a front copper foil, a back copper foil and a plurality through holes, wherein the front copper foil comprises a bonding pad, a wire and a heat-radiating copper foil which is insulated from the bonding pad and the wire; the through holes pass through a board body, and are communicated with the heat-radiating copper foil and the back copper foil; and the insides of the through holes are filled with rivet-shaped heat-conducting copper colloids, and the rivet-shaped heat-conducting copper colloids are connected with the heat-radiating copper foil and the back copper foil. According to the invention, the heat generated by an LED is conducted into the back heat-radiating copper foil by utilizing the outstanding heat-conducting performance of the copper colloid, thereby improving the heat-conducting efficacy of the LED printed circuit board, overcoming the defects that an aluminum-based material in the prior art only can achieve an effect of heat radiation but not heat conduction, and improving the heat radiation effect of the LED printed circuit board. The LED printed circuit board and production method thereof provided by the invention are suitable for the continuous production of molds, the stroke-frequency service life of a produced mold can be prolonged, the production efficiency is improved, and the formation machining cost of the LED printed circuit board is lowered.
Description
[technical field]
The present invention relates to printed circuit board (PCB), relate in particular to a kind of LED printed circuit board (PCB) and production method thereof.
[background technology]
Existing LED printed circuit board (PCB) mainly is to adopt aluminium base material to make, and the aluminium base of aluminum-base printing circuit board is heat radiation only, not heat conduction, and the overall radiating effect of printed circuit board (PCB) is relatively poor.And the aluminum-base printing circuit board material cost is higher, and processing and forming is difficulty comparatively, and processing cost is also higher.The thermal losses cutter life that produces during the CNC moulding; Mould produces quiet Al adsorption bits during the die stamping moulding, influence die life, and the die stamping moulding is difficult to continuous production, and continuous production can cause the bad or product rejection of product quality.
[summary of the invention]
The technical problem that the present invention will solve provides a kind of good heat dissipation effect, is convenient to machine-shaping, lower-cost LED printed circuit board (PCB).
Another technical problem that will solve of the present invention provides a kind of good heat dissipation effect, is convenient to machine-shaping, the production method of lower-cost LED printed circuit board (PCB).
In order to solve the problems of the technologies described above; The technical scheme that the present invention adopts is that a kind of LED printed circuit board (PCB) comprises front Copper Foil, back side Copper Foil and a plurality of through hole; The front Copper Foil comprises pad and cabling, and described front Copper Foil also comprises the heat radiation Copper Foil with said pad, cabling insulation; Described through hole passes plate body, is communicated with described heat radiation Copper Foil and back side Copper Foil, is marked with the heat conduction copper micelle colloid of rivet-like in the described through hole, and the heat conduction copper micelle colloid of said rivet-like connects heat radiation Copper Foil and back side Copper Foil.
The technical scheme of the production method of above-mentioned LED printed circuit board (PCB) may further comprise the steps:
201) on the Copper Foil of the front of double-sided copper-clad substrate, etch circuit, and the heat radiation Copper Foil of formation and circuit insulation;
202) will the complete circuit board of circuit carries out CNC and bores through hole, and described through hole is positioned on the heat radiation Copper Foil;
203) aqueous heat conduction copper glue is injected described through hole;
204) to the circuit board heating of injecting glue, make the adhesive curing of heat conduction copper.
In step 201, also be included in etching on the Copper Foil of the back side and do not reveal the step of the heat radiation male and fomale(M&F) of base material.The male and fomale(M&F) etched depth is 1/3rd to 3/4ths of a back side copper thickness, and the concave surface area is 1/3rd to 3/4ths of the back side Copper Foil gross area.
In step 203, through silk screen printing aqueous heat conduction copper glue is injected described through hole with the printing screen that pre-sets: the position corresponding with the circuit board through hole of said completion circuit is provided with and passes through hole for injecting glue on described printing screen; On the circuit board of said completion circuit, cover printing screen; And make the described hole for injecting glue of passing through aim at corresponding through hole, more aqueous heat conduction copper glue is injected corresponding through hole through the described hole for injecting glue of respectively passing through.
Between step 202 and step 203, comprise grinding, cleaning, anti-welding printing, the step of cleaning again.
Will be in step 204 circuit board of injecting glue in the hot blast type baking box segmentation heating that heats up gradually, make the adhesive curing of heat conduction copper, curing temperature is 60-170 ℃, the time of heating is 30-90 minute.
The component of said heat conduction copper glue mainly comprises copper powder, modified epoxy and phenol-formaldehyde resin modified.
LED printed circuit board (PCB) of the present invention utilizes the excellent heat conductivity performance of copper glue; The heat that LED is produced imports to the backside heat Copper Foil, thereby improves the effect of heat radiation, has overcome the aluminium base material of prior art and has only dispelled the heat; Athermanous shortcoming has been improved the radiating effect of LED printed circuit board (PCB).The utility model is suitable for producing continuously with mould, and the jig frequency life-span of mould can increase, and has promoted production efficiency, has reduced the processing and forming cost of LED printed circuit board (PCB).
[description of drawings]
Below in conjunction with accompanying drawing and embodiment the present invention is done further detailed explanation.
Fig. 1 is the composing sketch map of LED printed circuit board embodiment of the present invention.
Fig. 2 is the positive structural representation of LED printed circuit board embodiment of the present invention.
Fig. 3 is the structural representation at the LED printed circuit board embodiment of the present invention back side.
Fig. 4 is that A among Fig. 1 is to cutaway view.
Fig. 5 is the flow chart of LED printed circuit plate producing process of the present invention.
[embodiment]
To the embodiment of LED printed circuit board (PCB) of the present invention shown in Figure 4, the LED printed circuit board (PCB) adopts double face copper (like papery material plate: FR-1, FR-2 at Fig. 2; Glass fiber material plate: CEM-1, CEM-3, FR-4 etc.) makes.Front Copper Foil 1 comprises pad 101, cabling (not shown) and the heat radiation Copper Foil 102 that insulate with pad, cabling; Through hole 2 passes plate body, is communicated with heat radiation Copper Foil 1 and back side Copper Foil 3, is marked with the heat conduction copper micelle colloid 4 of rivet-like in the through hole, and the heat conduction copper micelle colloid 4 of rivet-like connects heat radiation Copper Foil 1 and back side Copper Foil 3.
The diameter d of through hole 2 is 0.3 millimeter in the present embodiment.Heat conduction copper micelle colloid head diameter D is that the diameter of through hole 2 is 0.6 millimeter.Heat conduction copper micelle colloid is a hollow, and the thickness B of heat conduction copper micelle colloid 4 main parts is 0.05 millimeter.The thickness H of heat conduction copper micelle colloid 4 heads is 0.05 millimeter.
Back side Copper Foil 3 has a plurality of heat radiation grooves 301.The degree of depth of heat radiation groove 301 is 1/2nd of a back side copper thickness.The area of heat radiation groove 301 surpasses 1/3rd of back side Copper Foil 3 entire areas.
Like Fig. 1 and shown in Figure 5, the production method of LED printed circuit board (PCB) of the present invention may further comprise the steps:
1) opens material according to required size with double-sided copper-clad substrate (substrate thickness 0.4mm and above thickness, 0.5 ounce of copper thickness and above thickness), on flitch, bore the location hole M that uses when making circuit;
2) on the Copper Foil of the front of double-sided copper-clad substrate, etch circuit, and the heat radiation Copper Foil of formation and circuit insulation; The heat radiation male and fomale(M&F) of base material is not revealed in etching on the Copper Foil overleaf, to increase cooling surface area, strengthens radiating effect; A plurality of heat radiation grooves 301 among heat radiation male and fomale(M&F) such as the above-mentioned embodiment, heat radiation groove 301 etched depth are 1/3rd to 3/4ths of back side copper thickness, the gross area of heat radiation groove is 1/3rd to 3/4ths of the back side Copper Foil gross area;
3) will the complete circuit board of circuit carries out CNC and bores through hole, and the position of through hole all is positioned on the heat radiation Copper Foil;
4) to circuit board grinding, cleaning, anti-welding printing, cleaning again;
5) aqueous heat conduction copper glue is injected described through hole: the printing screen with pre-setting injects described through hole through silk screen printing with aqueous heat conduction copper glue: the position corresponding with the circuit board through hole of said completion circuit is provided with and passes through hole for injecting glue on described printing screen; On the circuit board of said completion circuit, cover printing screen; And make the described hole for injecting glue of passing through aim at corresponding through hole, more aqueous heat conduction copper glue is injected corresponding through hole through the described hole for injecting glue of respectively passing through.
6) to the circuit board heating of injecting glue; Make the adhesive curing of heat conduction copper: will be the circuit board of injecting glue in the hot blast type baking box segmentation heating that heats up gradually; Make the adhesive curing of heat conduction copper; Curing temperature is 60-170 ℃, and the time of heating is 60-90 minute, with the carrier that is solidified into heat transferred of the colloid in the through hole.
The component of heat conduction copper glue mainly comprises copper powder, modified epoxy and phenol-formaldehyde resin modified.The heat conduction copper glue that present embodiment uses produces as Japan, and product grade is TH-1168.
LED printed circuit board (PCB) of the present invention utilizes the excellent heat conductivity performance of copper glue; The heat that LED is produced imports to the backside heat Copper Foil, the etching of backside heat Copper Foil do not reveal the heat radiation male and fomale(M&F) of base material, can increase cooling surface area; Thereby improve the effect of heat radiation; Overcome the aluminium base material of prior art and only dispelled the heat, athermanous shortcoming has been improved the radiating effect of LED printed circuit board (PCB).The present invention is suitable for producing continuously with mould, and the jig frequency life-span of mould can increase, and has promoted production efficiency, reduces the processing and forming cost of LED printed circuit board (PCB).
Claims (8)
1. a LED printed circuit board (PCB) comprises front Copper Foil, back side Copper Foil, and the front Copper Foil comprises pad and cabling, it is characterized in that, comprises a plurality of through holes, and described front Copper Foil comprises the heat radiation Copper Foil with said pad, cabling insulation; Described through hole passes plate body, is communicated with described heat radiation Copper Foil and back side Copper Foil, is marked with the heat conduction copper micelle colloid of rivet-like in the described through hole, and the heat conduction copper micelle colloid of said rivet-like connects heat radiation Copper Foil and back side Copper Foil.
2. the production method of the said LED printed circuit board (PCB) of claim 1 is characterized in that, may further comprise the steps:
201) on the Copper Foil of the front of double-sided copper-clad substrate, etch circuit, and the heat radiation Copper Foil of formation and circuit insulation;
202) will the complete circuit board of circuit carries out CNC and bores through hole, and described through hole is positioned on the heat radiation Copper Foil;
203) aqueous heat conduction copper glue is injected described through hole;
204) to the circuit board heating of injecting glue, make the adhesive curing of heat conduction copper.
3. the production method of LED printed circuit board (PCB) according to claim 2 is characterized in that, 301) in step 201, also be included in the step that the heat radiation male and fomale(M&F) of base material is not revealed in etching on the Copper Foil of the back side.
4. the production method of LED printed circuit board (PCB) according to claim 2 is characterized in that, the male and fomale(M&F) etched depth is 1/3rd to 3/4ths of a back side copper thickness, and the concave surface area is 1/3rd to 3/4ths of the back side Copper Foil gross area.
5. the production method of LED printed circuit board (PCB) according to claim 2; It is characterized in that; In step 203, through silk screen printing aqueous heat conduction copper glue is injected described through hole with the printing screen that pre-sets: the position corresponding with the circuit board through hole of said completion circuit is provided with and passes through hole for injecting glue on described printing screen; On the circuit board of said completion circuit, cover printing screen; And make the described hole for injecting glue of passing through aim at corresponding through hole, more aqueous heat conduction copper glue is injected corresponding through hole through the described hole for injecting glue of respectively passing through.
6. the production method of LED printed circuit board (PCB) according to claim 2 is characterized in that, between step 202 and step 203, comprises grinding, cleaning, anti-welding printing, the step of cleaning again.
7. the production method of LED printed circuit board (PCB) according to claim 2; It is characterized in that, will be in step 204 circuit board of injecting glue in the hot blast type baking box segmentation heating that heats up gradually, make the adhesive curing of heat conduction copper; Curing temperature is 60-170 ℃, and the time of heating is 60-90 minute.
8. the production method of LED printed circuit board (PCB) according to claim 2 is characterized in that, the component of said heat conduction copper glue mainly comprises copper powder, modified epoxy and phenol-formaldehyde resin modified.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010531894A CN102316667A (en) | 2010-11-04 | 2010-11-04 | LED (light emitting diode) printed circuit board and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010531894A CN102316667A (en) | 2010-11-04 | 2010-11-04 | LED (light emitting diode) printed circuit board and production method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102316667A true CN102316667A (en) | 2012-01-11 |
Family
ID=45429365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010531894A Pending CN102316667A (en) | 2010-11-04 | 2010-11-04 | LED (light emitting diode) printed circuit board and production method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102316667A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102856466A (en) * | 2011-06-29 | 2013-01-02 | 海洋王照明科技股份有限公司 | LED radiating substrate |
| CN103009432A (en) * | 2012-12-11 | 2013-04-03 | 四川海英电子科技有限公司 | PCB (printed circuit board) stamping and V-cutting production method |
| CN104600187A (en) * | 2014-01-22 | 2015-05-06 | 胡文松 | Heat radiation structure of high illumination surface adhesive LED |
| CN104842815A (en) * | 2015-05-28 | 2015-08-19 | 徐州云意科技发展有限公司 | Conducting copper sheet for electric vehicle controller |
| CN105234517A (en) * | 2015-10-31 | 2016-01-13 | 成都海沃斯电气技术有限公司 | Penetrating-welding hole welding and tin-penetrating method for double-face PCB |
| CN107620871A (en) * | 2017-10-30 | 2018-01-23 | 赛尔富电子有限公司 | A kind of LED light source module and its manufacture method |
| CN108650778A (en) * | 2018-05-17 | 2018-10-12 | 中国科学院电工研究所 | A kind of PCB heat dissipating methods and device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3305167A1 (en) * | 1983-02-15 | 1984-08-16 | Robert Bosch Gmbh, 7000 Stuttgart | Electrical circuit arrangement having a printed-circuit board |
| CN2116944U (en) * | 1992-03-14 | 1992-09-23 | 汉颖电子股份有限公司 | Luminescent diode indicator based on printed circuit board |
| JPH10208546A (en) * | 1997-01-24 | 1998-08-07 | Sumitomo Bakelite Co Ltd | Conductive copper paste composition |
| JPH11298106A (en) * | 1998-04-07 | 1999-10-29 | Asahi Chem Ind Co Ltd | Via hole filling type of both-sided printed wiring board and its manufacture |
| CN2835786Y (en) * | 2005-09-27 | 2006-11-08 | 光磊科技股份有限公司 | Heat radiation type LED light source module and lamp thereof |
-
2010
- 2010-11-04 CN CN201010531894A patent/CN102316667A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3305167A1 (en) * | 1983-02-15 | 1984-08-16 | Robert Bosch Gmbh, 7000 Stuttgart | Electrical circuit arrangement having a printed-circuit board |
| CN2116944U (en) * | 1992-03-14 | 1992-09-23 | 汉颖电子股份有限公司 | Luminescent diode indicator based on printed circuit board |
| JPH10208546A (en) * | 1997-01-24 | 1998-08-07 | Sumitomo Bakelite Co Ltd | Conductive copper paste composition |
| JPH11298106A (en) * | 1998-04-07 | 1999-10-29 | Asahi Chem Ind Co Ltd | Via hole filling type of both-sided printed wiring board and its manufacture |
| CN2835786Y (en) * | 2005-09-27 | 2006-11-08 | 光磊科技股份有限公司 | Heat radiation type LED light source module and lamp thereof |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102856466A (en) * | 2011-06-29 | 2013-01-02 | 海洋王照明科技股份有限公司 | LED radiating substrate |
| CN102856466B (en) * | 2011-06-29 | 2016-08-03 | 海洋王照明科技股份有限公司 | LED heat radiation substrate |
| CN103009432A (en) * | 2012-12-11 | 2013-04-03 | 四川海英电子科技有限公司 | PCB (printed circuit board) stamping and V-cutting production method |
| CN103009432B (en) * | 2012-12-11 | 2015-07-01 | 四川海英电子科技有限公司 | PCB (printed circuit board) stamping and V-cutting production method |
| CN104600187A (en) * | 2014-01-22 | 2015-05-06 | 胡文松 | Heat radiation structure of high illumination surface adhesive LED |
| CN104600187B (en) * | 2014-01-22 | 2017-06-30 | 胡文松 | Heat radiation structure of high illumination surface adhesive LED |
| CN104842815A (en) * | 2015-05-28 | 2015-08-19 | 徐州云意科技发展有限公司 | Conducting copper sheet for electric vehicle controller |
| CN105234517A (en) * | 2015-10-31 | 2016-01-13 | 成都海沃斯电气技术有限公司 | Penetrating-welding hole welding and tin-penetrating method for double-face PCB |
| CN105234517B (en) * | 2015-10-31 | 2017-10-31 | 成都海沃斯电气技术有限公司 | The saturating welding hole of double-sided PCB board welds saturating tin method |
| CN107620871A (en) * | 2017-10-30 | 2018-01-23 | 赛尔富电子有限公司 | A kind of LED light source module and its manufacture method |
| CN108650778A (en) * | 2018-05-17 | 2018-10-12 | 中国科学院电工研究所 | A kind of PCB heat dissipating methods and device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102316667A (en) | LED (light emitting diode) printed circuit board and production method thereof | |
| CN104955278B (en) | A kind of method that three-dimensional circuit is manufactured on moulding surface | |
| US9504165B2 (en) | Method of forming conductive traces on insulated substrate | |
| US20120222888A1 (en) | Pcb with heat dissipation structure and processing methods thereof | |
| CN104701443A (en) | LED substrate applicable to simple line COB package and method for preparing same | |
| CN108770191B (en) | New energy automobile copper base line circuit board and manufacturing method thereof | |
| CN202009533U (en) | LED printed circuit board | |
| CN104180696A (en) | Ultra-thin reticular self-vibration heat pipe heat dissipation film and processing method thereof | |
| CN102646369B (en) | Heat-conduction base plate of LED (Light-Emitting Diode) display and manufacturing method thereof | |
| CN209234096U (en) | A kind of copper-based wiring board of new-energy automobile | |
| CN113225901B (en) | Multilayer thick film ceramic-based circuit board and preparation process thereof | |
| CN111355022B (en) | Antenna oscillator and manufacturing method thereof | |
| CN201927604U (en) | LED (light-emitting diode) light source | |
| CN201306682Y (en) | Heat-dissipating LED module plate | |
| CN211012624U (en) | Surface coarsening temperature-uniforming plate bottom plate | |
| CN102931332A (en) | Substrate type light-emitting diode (LED) integrated packaging method | |
| CN209787555U (en) | Single-side double-layer copper substrate | |
| CN209545982U (en) | A kind of multilayer high frequency blind hole PCB circuit board | |
| CN206775816U (en) | A kind of insulating radiation plastic circuit board | |
| CN202018963U (en) | Integrated LED bracket | |
| CN111683475A (en) | Production method of composite high-frequency circuit board | |
| CN202364467U (en) | LED (light emitting diode) circuit board manufactured all by leads | |
| CN204369750U (en) | There is the glass mold of insulation construction | |
| CN211429619U (en) | LED circuit board with high heat dissipation performance | |
| CN110808232A (en) | Copper-aluminum composite radiator and processing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120111 |