CN102856466B - LED heat radiation substrate - Google Patents
LED heat radiation substrate Download PDFInfo
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- CN102856466B CN102856466B CN201110179816.1A CN201110179816A CN102856466B CN 102856466 B CN102856466 B CN 102856466B CN 201110179816 A CN201110179816 A CN 201110179816A CN 102856466 B CN102856466 B CN 102856466B
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Abstract
A kind of LED heat radiation substrate, including basic unit, line layer, the first heat-conducting layer, the second heat-conducting layer, louvre with connect heat-conducting layer.First heat-conducting layer and line layer are arranged at substrate surface, and the second heat-conducting layer is arranged at the basic unit back side relative with substrate surface, and louvre runs through substrate surface and the back side.Connection heat-conducting layer is arranged in described louvre, connects the first heat-conducting layer and the second heat-conducting layer.The LED heat radiation substrate that the invention discloses, saves the thermal insulation layer between traditional heat-dissipating substrate basic unit and line layer and realizes good radiating effect simultaneously, reduce the cost of manufacture of LED heat radiation substrate.
Description
[technical field]
The present invention relates to LED light source field, especially relate to LED heat radiation substrate.
[background technology]
Along with the development of light emitting diode (LED) industry, in LED light source product, LED not only luminous power is also constantly rising in improvement but also the quantity of LED.But, what such change was brought is but the accumulation of heat.The life-span of LED can be directly influenced when LED temperature is too high.
Therefore, general LED light source is provided with heat-radiating substrate.General LED heat radiation substrate is made up of basic unit, thermal insulation layer, line layer.The commonly used aluminum-based copper-clad plate of basic unit.Thermal insulation layer is the core of whole heat-radiating substrate, and it is usually the special polymer filled by special cermacis and constitutes, and thermal resistance is little.Line layer (i.e. Copper Foil) generally goes through etching and forms printed circuit, it is achieved all parts of element is connected with each other.Traditional heat-radiating substrate is to be coated with insulating heat-conduction material in basic unit, then by Copper Foil and basic unit's pressing, in bonding processes, forms thermal insulation layer after insulant pressurized between copper foil layer and basic unit.
Tradition LED heat radiation substrate is to have preferable radiating effect, then the selection of the material that thermal insulation layer is used will be the most fastidious, directly increases the cost of manufacture of heat-radiating substrate.
[summary of the invention]
Based on this, it is necessary to provide a kind of LED heat radiation substrate, the insulating heat-conduction material eliminating the employing of traditional heat-dissipating substrate realizes good LED radiating effect simultaneously, reduces the cost of manufacture of LED heat radiation substrate.
The LED heat radiation substrate of the present invention includes basic unit, line layer, the first heat-conducting layer, the second heat-conducting layer, louvre and connects heat-conducting layer.First heat-conducting layer and line layer are arranged at substrate surface, and the second heat-conducting layer is arranged at the basic unit back side relative with substrate surface.Louvre runs through substrate surface and the back side.Connection heat-conducting layer is arranged in louvre, connects the first heat-conducting layer and the second heat-conducting layer.
In the preferred embodiment, connection heat-conducting layer is arranged at louvre inwall.
In the preferred embodiment, the first heat-conducting layer includes that radiating part, louvre are positioned at the position of the basic unit of radiating part and the covering of the second heat-conducting layer.
In the preferred embodiment, LED heat radiation substrate is provided with some louvres, and some louvres are in row's matrix arrangement.
In the preferred embodiment, the first heat-conducting layer also includes that some connecting portions, some connecting portions the most vertically connect described radiating part.
In the preferred embodiment, the material of line layer and the first heat-conducting layer, the second heat-conducting layer and connection heat-conducting layer is identical.
In the preferred embodiment, line layer and the first heat-conducting layer, the second heat-conducting layer and connection heat-conducting layer are Copper Foil.
In the preferred embodiment, basic unit is epoxy glass fiber plate.
In the preferred embodiment, the first heat-conducting layer is identical with described second heat-conducting layer shape and direction is consistent.
Above-mentioned LED heat radiation substrate, the two sides relative in basic unit directly arranges heat-conducting layer, the heat dissipation element that first heat-conducting layer of the substrate surface at line layer place is connected with LED heat radiation substrate connects, and realizes good heat radiation by being communicated with the heat-conducting layer on the louvre connection basic unit two sides of heat-conducting layer.Therefore, the LED heat radiation substrate that the invention discloses, save the thermal insulation layer between traditional heat-dissipating substrate basic unit and line layer and realize good radiating effect simultaneously, reduce the cost of manufacture of LED heat radiation substrate.
[accompanying drawing explanation]
Fig. 1 is the substrate surface schematic diagram of LED heat radiation substrate preferred embodiment of the present invention；
Fig. 2 is the substrate back schematic diagram of LED heat radiation substrate preferred embodiment of the present invention；
Fig. 3 is that LED heat radiation substrate preferred embodiment shown in Fig. 1 is along the schematic cross-section in A-A direction.
[detailed description of the invention]
This specific embodiment provides a kind of LED heat radiation substrate, eliminates the thermal insulation layer between traditional heat-dissipating substrate basic unit and line layer and realizes good LED radiating effect simultaneously, reduces the cost of manufacture of LED heat radiation substrate.
As depicted in figs. 1 and 2, LED heat radiation substrate 100 includes basic unit 10, line layer the 12, first heat-conducting layer the 14, second heat-conducting layer 15, louvre 16 and connects heat-conducting layer 17 LED heat radiation substrate 100 structure of one embodiment.First heat-conducting layer 14 and line layer 12 are arranged at basic unit 10 surface.As in figure 2 it is shown, the second heat-conducting layer 15 is arranged at the back side of the basic unit 10 relative with basic unit 10 surface.Louvre 16 runs through basic unit 10 surface and the back side.Connection heat-conducting layer 17 is arranged in louvre 16, connects the first heat-conducting layer 14 and the second heat-conducting layer 15.
In the present embodiment, basic unit 10 is preferably epoxy glass fiber plate.The base material price that other LED heat radiation substrate in the market compared by epoxy glass fiber plate is much lower.Hence in so that the price of this LED heat radiation substrate has again stronger price advantage relative to other LED heat radiation substrate.Certainly basic unit 10 may be used without materials making that other are similar.
In the present embodiment, refer to the heat dissipation element that Fig. 1, LED13 are LED heat radiation substrate 100.Line layer 12 electrically connects the two ends of LED13.First heat-conducting layer 14 includes some connecting portions 141, radiating part 142.Some connecting portions 141 connect different heat dissipation element-LED13 respectively and install the bottom of pedestal, collect heat.Further, preferably absorbing LED13 for ease of connecting portion 141 and install the heat that the bottom of pedestal is distributed, LED13 installs and is provided with thermal grease between base bottom and connecting portion 141.Preferably, some connecting portions 141 the most vertically connect radiating part 142.
Referring to Fig. 1, in the present embodiment, LED heat radiation substrate is provided with some louvres 16, to improve heat radiation and heat conduction efficiency.Some louvres 16 are in row's matrix arrangement, to facilitate it to make.Certainly louvre 16 is not limited to the shape that the present embodiment provides, and can be designed to different shapes, the most square or strip as required.For effectively utilizing the area of basic unit, improving radiating efficiency, please refer to Fig. 1 and Fig. 2, louvre 16 is positioned at the position of the basic unit 10 of radiating part 142 and the covering of the second heat-conducting layer 15.
Referring to the schematic cross-section along Figure 1A A direction shown in Fig. 3, in the present embodiment, connection heat-conducting layer 17 is arranged at louvre 16 inwall, connects the first heat-conducting layer 14 and the second heat-conducting layer 15.The present embodiment relatively, can fill Heat Conduction Material in louvre 16 and also can realize the first heat-conducting layer 14 and connection of the second heat-conducting layer 15.But, relative to the advantage of other embodiments, the present embodiment is that connecting heat-conducting layer 17 can make with the first heat-conducting layer 14 simultaneously so that the manufacturing process of LED heat radiation substrate is the simplest, and fabrication cycle is short.The heat that the radiating part 142 of the first heat-conducting layer 14 gathers conducts the second heat-conducting layer 15 to basic unit 10 back side by connection heat-conducting layer 17, forms good radiating efficiency.
Refer to Fig. 2, it is preferable that in the present embodiment, to be positioned at the shape of second heat-conducting layer 15 at basic unit 10 back side identical with the shape of the first heat-conducting layer 14 shown in Fig. 1 for LED heat radiation substrate, and direction is consistent.The purpose of the shape of this preferably second heat-conducting layer is to facilitate the making of the second heat-conducting layer 15.
In the present embodiment, further, first heat-conducting layer the 14, second heat-conducting layer 15 is identical with the material of line layer 12 with the material connecting heat-conducting layer 17.Material is preferably the Copper Foil that current processing technology is ripe.Therefore, on the premise of they materials are identical, the LED heat radiation substrate of the present embodiment can make the first heat-conducting layer 14 and connect heat-conducting layer 17 while making line layer 12, shortens the fabrication cycle of whole LED heat radiation substrate 100.Material uses Copper Foil, both can reduce its cost of manufacture, can improve the yield rate of LED heat radiation substrate simultaneously.
In sum, the LED heat radiation substrate that the present embodiment discloses, the two sides relative in basic unit 10 directly arranges heat-conducting layer, heat dissipation element-LED13 that first heat-conducting layer of the substrate surface at line layer place is connected with LED heat radiation substrate connects, and realizes good heat radiation by being communicated with the louvre 16 of heat-conducting layer 17 and connecting the heat-conducting layer on basic unit two sides.The LED heat radiation substrate of the present embodiment eliminates traditional heat-dissipating substrate thermal insulation layer between basic unit and line layer and realizes good LED radiating effect simultaneously, reduces the cost of manufacture of LED heat radiation substrate.
Above example only have expressed the several embodiments of the present invention, and it describes more concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that, for the person of ordinary skill of the art, without departing from the inventive concept of the premise, it is also possible to make some deformation and improvement, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (8)
1. a LED heat radiation substrate, for dispelling the heat to LED, it is characterised in that include basic unit, line layer, the first heat-conducting layer, the second heat-conducting layer, louvre and connect heat-conducting layer；Described first heat-conducting layer and line layer are arranged at described substrate surface, described second heat-conducting layer is arranged at the basic unit back side relative with substrate surface, described louvre runs through described substrate surface and the back side, described connection heat-conducting layer is arranged in described louvre, connect described first heat-conducting layer and described second heat-conducting layer, described first heat-conducting layer includes radiating part and some connecting portions, described some connecting portions the most vertically connect described radiating part, described connecting portion installs the bottom of pedestal for connecting LED, described line layer is for electrically connecting the two ends of LED, described line layer is three, and form gap between adjacent two line layers and be used for arranging LED, a corresponding connecting portion is set in each gap, and make the first heat-conducting layer and connect heat-conducting layer while making line layer.
LED heat radiation substrate the most according to claim 1, it is characterised in that described connection heat-conducting layer is arranged at described louvre inwall.
LED heat radiation substrate the most according to claim 2, it is characterised in that described louvre is positioned at the position of the basic unit of described radiating part and the covering of the second heat-conducting layer.
LED heat radiation substrate the most according to claim 3, it is characterised in that described LED heat radiation substrate is provided with some louvres, described some louvres are in row's matrix arrangement.
LED heat radiation substrate the most according to claim 1, it is characterised in that described line layer is identical with the material of described first heat-conducting layer, the second heat-conducting layer and connection heat-conducting layer.
LED heat radiation substrate the most according to claim 5, it is characterised in that described line layer and described first heat-conducting layer, the second heat-conducting layer and connect heat-conducting layer and be Copper Foil.
LED heat radiation substrate the most according to claim 1, it is characterised in that described basic unit is epoxy glass fiber plate.
LED heat radiation substrate the most according to claim 1, it is characterised in that described first heat-conducting layer is identical with described second heat-conducting layer shape and direction is consistent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110179816.1A CN102856466B (en) | 2011-06-29 | 2011-06-29 | LED heat radiation substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110179816.1A CN102856466B (en) | 2011-06-29 | 2011-06-29 | LED heat radiation substrate |
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| Publication Number | Publication Date |
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| CN102856466A CN102856466A (en) | 2013-01-02 |
| CN102856466B true CN102856466B (en) | 2016-08-03 |
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| CN201110179816.1A Expired - Fee Related CN102856466B (en) | 2011-06-29 | 2011-06-29 | LED heat radiation substrate |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105509003A (en) * | 2016-01-18 | 2016-04-20 | 蔡鸿 | Cooling structure and method of self-cooled LED light source substrate |
| CN106231780A (en) * | 2016-07-28 | 2016-12-14 | 广东欧珀移动通信有限公司 | Pcb board and there is its mobile terminal |
| CN107586437A (en) * | 2017-07-26 | 2018-01-16 | 合肥捷力钣金科技有限公司 | A kind of processing technology of substrate installation version |
| CN112652945B (en) * | 2019-10-12 | 2021-12-31 | 三赢科技（深圳）有限公司 | Heat dissipation substrate and light-emitting device with same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201549500U (en) * | 2009-12-17 | 2010-08-11 | 李亚平 | All-metal heat conducting double-sided radiating LED substrate |
| CN102005530A (en) * | 2010-10-15 | 2011-04-06 | 深圳市中庆微科技开发有限公司 | High-power LED heat radiating unit |
| CN201853740U (en) * | 2010-10-20 | 2011-06-01 | 木林森股份有限公司 | Novel radiating substrate for high-power light-emitting diode (LED) |
| CN102316667A (en) * | 2010-11-04 | 2012-01-11 | 深圳松维电子股份有限公司 | LED (light emitting diode) printed circuit board and production method thereof |
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2011
- 2011-06-29 CN CN201110179816.1A patent/CN102856466B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201549500U (en) * | 2009-12-17 | 2010-08-11 | 李亚平 | All-metal heat conducting double-sided radiating LED substrate |
| CN102005530A (en) * | 2010-10-15 | 2011-04-06 | 深圳市中庆微科技开发有限公司 | High-power LED heat radiating unit |
| CN201853740U (en) * | 2010-10-20 | 2011-06-01 | 木林森股份有限公司 | Novel radiating substrate for high-power light-emitting diode (LED) |
| CN102316667A (en) * | 2010-11-04 | 2012-01-11 | 深圳松维电子股份有限公司 | LED (light emitting diode) printed circuit board and production method thereof |
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