CN103730559B - The arrangement method of a kind of LED array and the LED array being arranged on pcb board - Google Patents
The arrangement method of a kind of LED array and the LED array being arranged on pcb board Download PDFInfo
- Publication number
- CN103730559B CN103730559B CN201210382253.0A CN201210382253A CN103730559B CN 103730559 B CN103730559 B CN 103730559B CN 201210382253 A CN201210382253 A CN 201210382253A CN 103730559 B CN103730559 B CN 103730559B
- Authority
- CN
- China
- Prior art keywords
- led
- pcb board
- led array
- distance
- array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000005286 illumination Methods 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 14
- 230000005855 radiation Effects 0.000 claims description 8
- 230000003993 interaction Effects 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 8
- 238000005259 measurement Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 210000002837 heart atrium Anatomy 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000013047 polymeric layer Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The arrangement method that the invention discloses a kind of LED array and the LED array being arranged on pcb board, for improving the illumination consistency of LED on pcb board and reducing energy expenditure, said method comprising the steps of: A. is according to material selection pcb board；B. LED is arranged on pcb board, the minimum range between single led in LED array and pcb board edge is set；C., distance between adjacent LED in LED array is set；D., the spread geometry of the LED constituting LED array is set；E., distance between the LED array on pcb board with step D setting shape is set, the arrangement method of the LED array on the pcb board of the present invention is compared with common equidistant evenly distributed method, significantly improve illumination consistency, concurrently facilitate the service life extending LED.Meanwhile, the invention also discloses a kind of LED array being arranged on pcb board that can improve illumination consistency.
Description
Technical field
The present invention relates to the aligning method of LED, particularly relate to a kind of for improving the inconsistent shortcoming of LED luminance on pcb board
The arrangement method of LED array and a kind of LED array being arranged on pcb board.
Background technology
Along with more and more higher to the demand of green illumination, LED is high and service life with its color saturation
The features such as length are favored in many ways.Show including room lighting, roadway illumination, advertisement, LCD television backlight, traffic light and
Decorative lighting replaces traditional electric filament lamp and fluorescent lamp skill in the interior the most chosen efficient LED technology of multiple illuminator
Art.
The calibration power of single led element is 500mW to 10W, and research worker predicts that its power also has the space promoted.And
It was verified that the luminous efficiency of LED is applied with it has obtained considerable degree of lifting accordingly, originally, the luminous efficacy of LED
Risen to rapidly every watt of 20 lumens, in recent years in be the most slowly promoted to about every watt 100 lumens, its ascendant trend shows under connecing
In several years come, will to be promoted to every watt of 150 lumens the highest for the luminous power of LED.
But, it is ensured that the stability of high-brightness LED element and reliability, light extraction and thermal management are had strict
Requirement.It is, in general, that LED electrical power about 85% is all converted into heat and then significantly reduces the luminous flux of equipment.It addition,
Node high temperature will affect the maximum wavelength of LED, thus change the color of illumination.It was verified that the life-span of LED with junction temperature in
Exponential relationship is successively decreased.Therefore, low temperature node has vital effect to LED.Most practical situations require that LED array has
The highdensity feature of high power, but make to create between power density with running temperature and conflict greatly, especially need LED
When reaching desired level with full power operation.
In order to improve the performance of the LED array of LED element unit or a large amount of LED composition, MCPCB plate, i.e. metal inner core
Printed circuit board (PCB), be usually used in owing to being contained within low value metal material heat radiation.Meanwhile, MCPCB plate comprises and has pyroconductivity
High insulating polymeric layer, it is possible to decrease thermal impedance.But due to economic cause, the pcb board being usually used in high-brightness LED road is FR4PCB
Plate, and select FR4PCB plate, LED array hot property at different conditions still needs to study further.
LED generally has length in service life, low in energy consumption, radiationless feature, belongs to the lighting source of green energy conservation.Advanced
The development of LED material makes LED be expected to become the leading role of the green century energy, improves LED luminous power and also becomes the heat of research
Door.But the key factor affecting LED luminous power is temperature, on pcb board, the temperature problem of the LED array of arrangement is also required to
Solve.
Summary of the invention
The technical problem to be solved in the present invention is, for the drawbacks described above of prior art, it is provided that the row of a kind of LED array
Cloth method and the LED array being arranged on pcb board.
The technical solution adopted for the present invention to solve the technical problems is:
There is provided the arrangement method of a kind of LED array, it is adaptable to for improving the unified illumination of LED on pcb board and promoting to dissipate
Heat, it is characterised in that comprise the following steps:
A. according to the material behavior of pcb board, pcb board is selected；
B. LED is arranged on described pcb board, the minimum range between single led and described pcb board edge is set, use
To avoid LED surface temperature to exceed the maximum temperature of permission；
C. distance P between adjacent LED is adjusted, in order to reduce the elevation amplitude of LED surface temperature；
D. it is that P rearranges triangle LED array, in order to reduce by LED according to spacing between adjacent LED on pcb board
The interaction caused by heat radiation between LED array；
E. arrange having the described LED array that step D sets, set distance between described LED array in order to
Ensure that the illumination on described pcb board is consistent.
Preferably, the PCB material that described step A selects is metal-cored MCPCB plate and FR4PCB plate.
Preferably, described step B farther includes, and described minimum range is 0.1DL, and wherein DL is described pcb board diagonal angle
The length of line.
Preferably, described step C includes, distance P=d+a between adjacent LED, and wherein, d constant is adding between LED
Distance, a is the modifying factor relevant to LED service life.
Preferably, the default value of additional distance d between described LED is 0.5mm, and distance P between described LED sets
Range lower limit is more than described default value.
Preferably, described step E farther includes, distance D between described LED array is adjacent along pcb board edge extremely
Central Radical is set according to below equation:
D=(S+a)+nd
Wherein, S constant is the minima of spacing P of two LED, and a is the modifying factor relevant to LED service life, d
Constant is the additional distance between two LED, and n is the number of additional distance, raises with LED temperature and increases.
There is provided a kind of LED array being arranged on pcb board, including pcb board and the LED that is arranged on pcb board, its feature
It is,
Single led distance pcb board edge minimum range be 0.1DL, DL be the cornerwise length of pcb board；
Distance P=d+a between adjacent LED, wherein d is additional distance, and default value is that 0.5mm, a are and LED service life
Relevant modifying factor, the excursion lower limit of P is more than default value;
LED is arranged on pcb board with described P for the LED array of the triangle shape of spacing；
Distance between described LED array is adjacent along the edge of pcb board to center according to the rule of space D=(S+a)+nd
Being arranged on pcb board, wherein S constant is the minima of distance P between two LED, and n is the number of additional distance, with LED temperature
Degree raises and increases.
Preferably, described modifying factor a is the adjustable distance of user setup, changes between LED by adjusting modifying factor
Distance to extend LED service life on pcb board.
Preferably, described pcb board is metal-cored MCPCB plate.
The arrangement method using the LED array of present invention proposition and the LED array being arranged on pcb board, contribute to strengthening
The luminous efficiency of LED array and heat-sinking capability on pcb board, reduce energy consumption, simultaneously as have only to change the arrangement of LED array
Mode, the present invention i.e. can be applicable to multiple LED-PCB product without the main production program changing LED and pcb board.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the detection schematic diagram of the arrangement method of a kind of LED array of the embodiment of the present invention；
Fig. 2 is the single led surface temperature change in the case of distance pcb board edge different distance of the embodiment of the present invention
Figure；
Fig. 3 be the embodiment of the present invention LED between surface temperature variation diagram under spacing different situations；
Fig. 4 is that the LED of three kinds of different arrangement shapes of contrast experiment in the embodiment of the present invention arranges schematic diagram；
Fig. 5 be the embodiment of the present invention three kinds of different spread geometries of contrast under the edge of LED and three-dimensional light according to schematic diagram；
Fig. 6 be the embodiment of the present invention with the conventional equidistant evenly distributed schematic diagram of LED array compared；
Fig. 7 is temperature and the illumination variation figure of the LED array shown in Fig. 6；
Fig. 8 is that another of the embodiment of the present invention is with the centre that compares and the evenly distributed schematic diagram of two-terminal led array；
Fig. 9 is temperature and the illumination variation figure of the LED array shown in Fig. 8；
Figure 10 is the LED array arithmetic arrangement schematic diagram of the embodiment of the present invention；
Figure 11 is temperature and the illumination variation figure of the LED array shown in Figure 10；
Figure 12 is that the LED array of the embodiment of the present invention changes schematic diagram with junction temperature service life；
Figure 13 is the method step flow chart of the embodiment of the present invention.
Detailed description of the invention
The LED that the present invention chooses is the commercial high-quality White LED that US Philips Corporation produces, and the LED chosen passes through
It is connected in series, the E3632A DC source of Agilent company provides constant current.The LED chosen is being perpendicular to the surface of emission
On direction, luminous power is maximum, and LED is encapsulated in the lighting angle of diffusible LED inside plastic lens.
The FR4PCB plate chosen has multi-layer thin copper circuit layer and one layer of insulant, and copper circuit layer makes pcb board flat
The heat conductivity in direction, face is apparently higher than the heat conductivity in the direction penetrating plane.Additionally optional pcb board can also is that metal
Core MCPCB plate, i.e. has the printed circuit board (PCB) of metal inner core, can utilize its high thermal conductivity polymer layer reduce thermal impedance, two
Person compares, and owing to FR4PCB plate cost is lower, on the premise of considering cost consumption, in most cases selects FR4PCB plate to be used for
Installation LED, the 4000-13EP glass epoxy type pcb board that concrete model is Nelco company of the FR4PCB plate that the present invention chooses,
Having the metal inner core of copper aluminium coat, its concrete material behavior is as follows:
Space of a whole page size: 55 × 45 × 1.6mm3,
Welding plate material: 35 μm Cu,
FR4 pyroconductivity: 0.3W/m DEG C,
Aluminum 5052 pyroconductivity: 150W/m DEG C,
Copper C1100 pyroconductivity: 385 400W/m DEG C,
Input current: 0.1 1.0A,
Air velocity: constant gas (natural flow),
Thermal conversion factor: 25W/m2DEG C,
Ambient temperature: 25 DEG C.
In order to verify the substantive distinguishing features of the present invention, need the thermal characteristics of the LED array on the pcb board of the present invention is carried out
Inspection.
As it is shown in figure 1, utilize the surface temperature of infrared probe record LED.1 is the junction point of LED, is used for installing LED, logical
Crossing substrate 2 and weld layer 3 is connected with pcb board 4, the thermal infrared imager 5 chosen, model is NEC-TH9100, by launching
Wavelength is the surface temperature of the infra-red detection LED of 8-14 μm.The available camera lens of thermal camera is TH91-386.Minimum temperature
Detectivity is 0.06 DEG C, and minimum space resolution is 95 × 95 μm2。
LED is encapsulated among plastic material, and arranging infrared emittance according to the thermal imaging table of emissivity is 0.95, although visit
Measuring point is limited, but still Selection utilization thermocouple measures and calibrates, in the variations in temperature temperature that hour record records.Minimum
Variations in temperature is characterized by the voltage between thermocouple.The sampling of a length of 10 minutes in time carrying out temperature in one minute, will
Its average is as the temperature measuring point.In order to reduce the thermal impedance of contact surface between LED and pcb board, choose load-carrying epoxy
Silver strip, its pyroconductivity is up to 1.6W/mK.
As shown in figure 13, on a kind of pcb board of the embodiment of the present invention, the arrangement method of array comprises the steps:
A. according to the material behavior of pcb board, pcb board is selected；
B. LED is arranged on described pcb board, the minimum range between single led and described pcb board edge is set, use
To avoid LED surface temperature to exceed the maximum temperature of permission；
C. distance P between adjacent LED is adjusted, in order to reduce the elevation amplitude of LED surface temperature；
D. on pcb board, LED is rearranged triangle LED array according to spacing P, in order to reduce between LED array
The interaction caused by heat radiation；
E. arrange having the described LED array that step D sets, set distance between described LED array in order to
Ensure that the illumination on described pcb board is consistent.
Detailed process is as follows:
A. according to the material behavior of pcb board, pcb board is selected.
According to conventional equidistant arrangement mode, same number of LED is separately mounted on FR4PCB plate and MCPCB plate,
Constant current is set to 0.3A, and for series connection between LED, the surface temperature being recorded two kinds of pcb boards by infrared acquisition is respectively as follows:
FR4PCB plate, 76 DEG C；MCPCB plate, 55 DEG C.The infrared spectrum of FR4PCB plate shows that the hot profile between FR4PCB onboard led produces
Having given birth to alternate covering, MCPCB plate does not the most possess the phenomenon that heat radiation profile is overlapping.Therefore, it is arranged on the FR4PCB plate of standard
High-brightness LED due to the low heat conductivity of its encapsulating material, substantially dispelled the heat by following pcb board.Traditional FR4PCB
The heat dissipation direction of plate is unidirectional, and MCPCB plate then possesses the function to all directions Homogeneouslly-radiating.Additionally, at constant current be
In the case of 0.3A, the voltage drop value between MCPCB onboard led be 6.489V, FR4PCB plate be then 6.3879V, the most permissible
Show that the output brightness of metal-cored MCPCB onboard led is higher than FR4PCB plate.Therefore, the metal-cored of good heat dispersion performance is chosen
MCPCB plate is favorably improved light electrical efficiency.With improve light electrical efficiency and intensity of illumination as main purpose in the case of, preferably
Pcb board is MCPCB plate, if but in view of economic cause, FR4PCB plate falls within optional scope.
B. LED is arranged on described pcb board, the minimum range between single led and described pcb board edge is set, use
To avoid LED surface temperature to exceed the maximum temperature of permission.
As in figure 2 it is shown, a LED is arranged on the center of pcb board, from pcb board centrally along diagonal this LED
Installing equably at 9 diverse locations, the constant current set as 0.3A, is measured the LED surface variations in temperature drawn, can be obtained
Go out the LED surface temperature at pcb board center minimum, and the temperature of corner location is the highest.It is primarily due to the corner location of pcb board not
The heat of capacity transmission tetra-sides of LED such as energy, therefore along the center of pcb board to corner, the heat radiation profile of LED is equal by close
Even profile gradually becomes scalloped profile, and due in uniform integrity profile radiating effect optimal, therefore pcb board center
LED surface temperature is minimum.Thus proving, pcb board marginal area arranges the most important with the distance of LED.
In order to save the space of pcb board, the minimum range between LED and pcb board edge that the embodiment of the present invention provides is
0.1DL, DL(diagona line of length) it is the cornerwise length of pcb board.The minimum range being arranged on 0.1DL is permissible
Avoid LED surface temperature to raise 10%, thereby guarantee that LED is operationally less than the maximum operating temperature of its regulation.User Ke Yi
According to practical situation, minimum range is set greater than or equal to 0.1DL, and then controls the rising of LED temperature.It should be noted that
From the data recorded it can be seen that slightly difference between the temperature value and the discreet value of simulation that record, measurement error is less than 5%, its
Reason in addition to the electric heating of surrounding is lost, the also changes in material etc. of LED under the accuracy of temperature measurement unit and high temperature.
C. distance P between adjacent LED is adjusted, in order to reduce the elevation amplitude of LED surface temperature.
As it is shown on figure 3, a LED 301 is fixedly mounted on pcb board center, another LED 302 is then at distance center
Float in the range of LED 0.5mm-6mm, during by infrared acquisition it appeared that distance between two LED is 0.5mm, table
Surface temperature has up to reached 159 DEG C, and when the distance between two LED increases to 4mm, the temperature recorded has declined 9% and become
145 DEG C, setting distance P=d+a between two LED according to the temperature variation curve recorded, d is additional distance, for default value, greatly
Little is the modifying factor relevant to LED service life for 0.5mm, a, and a is the biggest, and P is the biggest, and the service life of LED the most also can increase
Adding, for the size of different set a of the pcb board material chosen, the P chosen for FR4PCB plate is 3mm, the embodiment of the present invention
The P value range lower limit set is more than default value, it can be deduced that, during a=1.5mm, LED surface temperature relatively maximum surface temperature reduces
5%, during a=3.5mm, LED surface temperature reduces 9%, the value of a of the present invention can be according to the needs of user self and to light
According to demand be adjusted, be not limited to above-mentioned numerical value.
D. on pcb board, LED is rearranged triangle LED array according to spacing P, in order to reduce between LED array
The interaction caused by heat radiation.
As shown in Figure 4, embodiments of the invention have chosen 4-a square, 4-b hexagon different with 4-c Atria kind
Shape contrast.
Being set to equal by the distance between two LED in the case of above-mentioned three kinds, LED modifying factor in service life is also provided with
Identical, respectively 9,7,8 LED are arranged according to the grid shape of square, hexagon and triangle the pcb board of formed objects
Upper composition grid cell.Although set up grid cell in LED number different, it is negative that three described grid cells are different heat
The basic configuration unit compared it is easy under the conditions of lotus.It is between LED in each shape grid and is connected in series, control formed objects
Electric current by all of LED.Respectively the LED at three kinds of shape grid centers is numbered, wherein square grid center LED
Numbered S5；The hexagonal grid center numbered H4 of LED；The triangular lattice center numbered T5 of LED.By measuring three centers
The surface temperature of LED, voltage and light output ratio are compared with the quality of three kinds of shape grids.
First, the square row of equispaced is the conventional selection of LED encapsulation cooling settings.But, the tables of data recorded
The mean temperature of Ming Qi center LED S5 is up to 109 DEG C.The temperature of LED being distributed on four angles of square detection indicate that into
Minimum, value is 98 DEG C, and possible reason is that the symmetrical cooling system of surrounding is arranged, and the temperature of remaining four LED is measured as 105
About DEG C, result shows that remaining four higher reasons of LED temperature is probably the overlap of heat between LED.
Compared to square grid center LED S5, the temperature of hexagonal centre LED H4 is relatively low, is 102 DEG C.
And the temperature of triangular lattice center LED T5 is only 96 DEG C, it is minimum in the grid of three kinds of shapes.
Result shows, the LED spread geometry of optimization can reduce the surface temperature of LED, and then reduces phase between LED array
Mutual by influencing each other that heat produces.
Additionally, as shown in the table, by the voltage of measuring center LED with light output it can be seen that compared with S5, H4,
T5 has the highest magnitude of voltage and light output.
| Grid array | Square | Hexagon | Triangle |
| LED numbers | S5 | H4 | T5 |
| LED voltage (V) | 3.06 | 3.11 | 3.18 |
| Light output (lux) | 423 | 454 | 463 |
As it is shown in figure 5, according to the three-dimensional light output display figure of the three kinds of shape grids recorded it can be seen that 5-a is square
Shape, 5-b hexagon, the minimum/High Light Output amount of 5-c Atria kind shape grid are respectively as follows: square 1970/
2390lux, hexagon 2050/2450lux, triangle 2130/2510lux.The inconsistent degree of illumination of three kinds of grids is respectively
9.6%, 8.8%, 8.2%.Result above shows can be by illumination by the optimization of square grid to triangular lattice by LED array
Concordance improve 1.4%.
Although the spread geometry of LED is triangle in the LED array of the embodiment of the present invention, its LED density is in square
And between hexagon, but triangular lattice is the optimum selection of LED array arrangement, can be obtained by rounded projections arranged method
Low surface temperature, High Light Output and best illumination consistency.
E. arrange having the described LED array that step D sets, set distance between described LED array in order to
Ensure that the illumination on described pcb board is consistent.
If the distance between LED array arranges the least to affect the illumination consistency of specific region, it is primarily due to
The surface temperature rising of the least initiation of distance can cause the voltage on LED to reduce, and the corresponding power produced also will reduce.Set
Input current is constant current, and the spacing between LED array changes, and corresponding power consumption changes.By set different between
Away from, comparison and detection go out illumination consistent time LED array between distance.
Employing specification is the FR4PCB plate of 200mm × 30mm × 1.6mm, is arranged on this pcb board by 9 groups of LED array, if
Determining constant current is 0.3A.
Normal conditions use the form arrangement LED array of equidistantly arrangement, as shown in Figure 6,9 LED array orders are compiled
Number being 1-9,9 LED array are uniformly arranged on pcb board, and distance S between adjacent two LED array represents, wherein LED5 peace
Being contained at the pcb board central authorities distance farthest 10cm in edge, arrange 9 measurement points of numbering 1-9, the distance between adjacent measurement points sets
For 23mm, each light area measuring some corresponding A 1-A9.
As it is shown in fig. 7, due to symmetry principle, LED array LED5 in an intermediate position have the highest surface temperature and
Relatively low illumination.The standardization illumination of LED array under this arrangement mode can be deduced according to the maximal illumination measured.By surveying
Amount result can be seen that the illumination of LED array exists at middle and two ends and declines phenomenon, and the reason that centre position illumination declines is
The voltage of LED array reduces, and two ends illumination is then mainly affected by the distributing inhomogeneity of LED array.By LED in LED array
Between distance be set to 3mm, average illumination be more than 85% region be set to effective light area, detection draws effective area of illumination
The a length of 150mm in territory, the inconsistent degree of illumination is 4.8%.
As shown in Figure 8, in order to unify the spacing of centre and two ends, by the distance between two closest LED array
It is set to S/2, is respectively provided with three central areas at the two ends of pcb board and center and is respectively mounted LED array at LED2, LED5
And LED8.
Measurement result as shown in Figure 9, the change of surface temperature has driven the fluctuating of illumination.Measure simultaneously and draw effective light
According to a length of 159mm that increases in region, but the inconsistent degree of illumination still has fluctuating, it can thus be seen that non-uniform temperature is drawn
Send out the decline of LED voltage.
In order to improve the shortcoming that in both the above aligning method, LED array surface temperature is uneven, embodiments of the invention
The arithmetic distance method to set up of LED array as follows:
As shown in Figure 10, the distance between LED array is expressed as D=(S+a)+nd, wherein S is the minimum of LED spacing
Value, a is the modifying factor relevant to LED service life, and d is additional distance, the present embodiment acquiescence d value be 2mm, n be add away from
From number, n with temperature raise and increase, LED5 is positioned at pcb board centre position, the distance between LED6 and LED5 be (S+a)+
Distance between 4d, LED7 and LED6 is that (S+a)+3d, n is gradually decremented to 1, i.e. distance between LED8 and LED9 be (S+a)+
D, 9 LED array symmetric arrays, therefore the queueing discipline of LED1-LED4 is identical with LED6-LED9.
As shown in Figure 10,9 measure point variations in temperature the least, and then between each LED array heat effect produce mutual
Affecting the least, therefore each illumination of point of measuring is close to consistent.The light output of each LED and voltage are the most relatively.Measurement draws
The a length of 167mm in effective light area, and the inconsistent degree of illumination is the least, and value is only 2.1%, thus can obtain unified
Intensity of illumination.
The measurement result of above-described embodiment shows to combine what the arithmetic distance of the rounded projections arranged of LED and LED array was arranged
The arrangement method that on pcb board, LED array is set up can obtain the light output of maximum and the highest illumination consistency, simultaneously because electric
Power is converted into that heat is minimum thus LED surface temperature is minimum.The present invention contributes to arranging in the LED-PCB product use cycle
Energy-conservation benchmark.
Additionally, choose arithmetic aligning method to contribute to extending the service life of LED.
Traditional equidistant aligning method is used to record LED5 in central authorities' LED array, LED surface under the electric current of 0.35A
Temperature is 135 DEG C, and LED junction point temperature can be obtained by following equation:
Tj=TC+Pθjc
Wherein, Tj=LED junction temperature (DEG C), Tc=LED surface temperature (DEG C), P=drives power (W), θjc=LED junction point temperature
Spend the thermal impedance (DEG C/W) between LED surface temperature.
If the thermal impedance between LED junction point temperature and LED surface temperature is 25 DEG C/W, the size driving power is 1W, meter
Calculation show that junction temperature Tj is 171 DEG C.
It is the relation between LED service life and LED junction point temperature as shown in figure 12.Therefore deduce that equidistantly arrangement
During service life corresponding to junction temperature that method is lower 171 DEG C a length of 36000 hours, the B50L70 in figure represented selected
The performance characteristic of LED, B50 represents that anticipated LED's uses the 50% invalid of duration total amount, and L70 represents that the lux maintenance of LED is
70%.And utilizing in the LED array that the arithmetic aligning method of step E is installed, under same current, the surface temperature of LED5 is 124
DEG C, the LED junction point temperature calculated is 149 DEG C, during corresponding service life a length of 60000 hours, compares conventional arrangement side
Method, uses the LED arrangement method of the present invention to make extend 24000 hours the service life of LED.Therefore, user can basis
Need to arrange the duration that uses of LED array on pcb board and LED array spacing is adjusted the modifying factor in referred to as LED service life
a.The embodiment of the present invention changes LED distance between LED array by the size of regulation modifying factor a, such as during a=0,
LED spacing P=0.5mm, center LED surface temperature is measured as 159 DEG C, is adjusted by a to 1.5mm, and center LED surface temperature declines
5%, continue to increase a to 3.5mm, then LED spacing becomes 4mm, and it is 145C that center LED surface temperature declines 9%, and thus LED makes
During with, surface temperature is minimized, and the service life of LED is extended, and can be seen that the present invention from the measurement result of Figure 12
In embodiment, the LED array spacing of the present invention makes extend to 60000 hours the service life of LED pipe, and user also can be according to certainly
The needs of body and a is chosen by the demand of illumination.
On the pcb board provide the present invention, the arrangement method of LED array is applied to traditional FR4PCB plate, it is possible to substantially increase
The heat-sinking capability of strong LED array.
The LED array being arranged on pcb board utilizing the arrangement method of LED array of the present invention to design has and side
The corresponding feature of method, can promote LED array heat radiation on pcb board and improve LED array illumination consistency on pcb board.
The foregoing is only presently preferred embodiments of the present invention, be not limiting as the present invention, all in the spirit and principles in the present invention
Within any amendment, equivalent or the improvement etc. made, should be included within the scope of the present invention.
Claims (8)
1. an arrangement method for LED array, is used for improving LED on pcb board and unifies illumination and promote heat radiation, it is characterised in that
Comprise the following steps:
A. according to the material behavior of pcb board, pcb board is selected；
B. LED is arranged on described pcb board, the minimum range between single led and described pcb board edge is set, in order to keep away
Exempt from LED surface temperature and exceed the maximum temperature of permission；
C. distance P between adjacent LED is adjusted, in order to reduce the elevation amplitude of LED surface temperature；Distance P between adjacent LED
=d+a, wherein, d constant is the additional distance between LED, for default value, size be 0.5mm, a be relevant for service life to LED
Modifying factor；
D. on pcb board, LED is rearranged triangle LED array according to spacing P, in order to reduce between LED array by dispelling the heat
The interaction caused；
E. the described LED array with the setting of step D is arranged, set the distance between described LED array in order to ensure
Illumination on described pcb board is consistent.
The arrangement method of a kind of LED array the most according to claim 1, it is characterised in that the PCB that described step A selects
Material is metal-cored MCPCB plate or FR4PCB plate.
The arrangement method of a kind of LED array the most according to claim 1, it is characterised in that described step B is wrapped further
Including, described minimum range >=0.1DL, wherein DL is the cornerwise length of described pcb board.
The arrangement method of a kind of LED array the most according to claim 1, it is characterised in that distance P between described LED
The range lower limit set is more than described default value.
The arrangement method of a kind of LED array the most according to claim 1, it is characterised in that described step E is wrapped further
Including, from pcb board edge to center, distance D between adjacent described LED array is set according to below equation:
D=(S+a)+nd
Wherein, S constant is the minima of spacing P of two LED, and a is the modifying factor relevant to LED service life, d constant
Be the additional distance between two LED, d value be 2mm, n be the number of additional distance, n with LED temperature raise and increase.
6. it is arranged in the LED array on pcb board, including pcb board and the LED that is arranged on pcb board, it is characterised in that
Single led distance pcb board edge minimum range be 0.1DL, DL be the cornerwise length of pcb board；
Distance P=d+a between adjacent LED, wherein d is additional distance, and default value is that 0.5mm, a are and LED phase in service life
The modifying factor closed, the excursion lower limit of P is more than default value；
LED is arranged on pcb board with described P for the LED array of the triangle shape of spacing；
Described LED array is from pcb board edge to center, and adjacent LED array exists according to the regular array of space D=(S+a)+nd
On pcb board, wherein S constant is the minima of distance P between two LED, and n is the number of additional distance, and n is with LED temperature liter
High and increase.
A kind of LED array being arranged on pcb board the most according to claim 6, it is characterised in that described modifying factor a
It is by the adjustable distance of user setup, by adjusting distance that modifying factor changes between LED to extend making of LED on pcb board
Use the life-span.
A kind of LED array being arranged on pcb board the most according to claim 6, it is characterised in that described pcb board is gold
Belong to MCPCB plate and the FR4PCB plate of core.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210382253.0A CN103730559B (en) | 2012-10-10 | 2012-10-10 | The arrangement method of a kind of LED array and the LED array being arranged on pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210382253.0A CN103730559B (en) | 2012-10-10 | 2012-10-10 | The arrangement method of a kind of LED array and the LED array being arranged on pcb board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103730559A CN103730559A (en) | 2014-04-16 |
| CN103730559B true CN103730559B (en) | 2016-08-17 |
Family
ID=50454561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210382253.0A Active CN103730559B (en) | 2012-10-10 | 2012-10-10 | The arrangement method of a kind of LED array and the LED array being arranged on pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103730559B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105045955B (en) * | 2015-06-12 | 2018-01-23 | 中国地质大学（武汉） | A kind of LED light source junction temperature value based on genetic algorithm reduces method |
| CN106298751B (en) * | 2016-08-24 | 2018-11-20 | 江西联创光电科技股份有限公司 | A kind of LED filament |
| CN112149199B (en) * | 2020-09-21 | 2022-10-18 | 成都奔流标识制作有限责任公司 | Luminous body arrangement method, luminous system and identification device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1614659A (en) * | 2003-11-07 | 2005-05-11 | 熊小梅 | Three-light arranging method for three basic color LEDs |
| CN102042521A (en) * | 2010-09-29 | 2011-05-04 | 林浩泽 | Soft high-efficiency light-emitting diode (LED) surface light source |
| CN102425738A (en) * | 2011-12-26 | 2012-04-25 | 同辉电子科技股份有限公司 | LED (light-emitting diode) illumination device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4445436B2 (en) * | 2005-06-10 | 2010-04-07 | シチズン電子株式会社 | LED light source unit |
| GB0722054D0 (en) * | 2007-11-09 | 2007-12-19 | Photonstar Led Ltd | LED with enhanced light extraction |
-
2012
- 2012-10-10 CN CN201210382253.0A patent/CN103730559B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1614659A (en) * | 2003-11-07 | 2005-05-11 | 熊小梅 | Three-light arranging method for three basic color LEDs |
| CN102042521A (en) * | 2010-09-29 | 2011-05-04 | 林浩泽 | Soft high-efficiency light-emitting diode (LED) surface light source |
| CN102425738A (en) * | 2011-12-26 | 2012-04-25 | 同辉电子科技股份有限公司 | LED (light-emitting diode) illumination device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103730559A (en) | 2014-04-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103398358A (en) | Low-light-degradation and high-power LED street lamp and manufacturing method thereof | |
| CN203225144U (en) | High-efficiency water-cooling resistor with heat radiation rib | |
| CN103939870A (en) | Cooling fin suitable for high-power LED lamp heat radiator | |
| CN103730559B (en) | The arrangement method of a kind of LED array and the LED array being arranged on pcb board | |
| US20150276201A1 (en) | Light-emitting diode light fixture with channel-type heat dissipation system | |
| CN102856466B (en) | LED heat radiation substrate | |
| CN207922160U (en) | A kind of LED radiator | |
| CN108006540B (en) | Intelligent LED street lamp | |
| CN206803082U (en) | A kind of ceramic heat radiator | |
| CN201748246U (en) | Multi-chip high-power LED light source | |
| CN204403877U (en) | The integrated module of a kind of LED with radiator | |
| CN201521878U (en) | Novel LED street lamp | |
| CN104235794A (en) | Fastening type vertical convection LED (light emitting diode) heat radiator and LED module lamp | |
| CN105674094A (en) | LED lamp long in service life | |
| CN103216736A (en) | High-packaging-density LED (Light Emitting Diode) lighting lamp adopting simple radiating structure | |
| CN208703890U (en) | A kind of LED lamp radiator | |
| CN201050763Y (en) | LED equal distance heat-radiation light booster | |
| CN205645861U (en) | Energy -conserving LED filament | |
| CN203949132U (en) | LED radiating module | |
| CN203273808U (en) | Radiator for LED lamp | |
| CN204494338U (en) | LED phase transformation heronsbill radiator | |
| CN202423378U (en) | High-efficiency radiator | |
| CN207080961U (en) | A kind of LED strand | |
| CN203810340U (en) | LED (light-emitting diode) high bay light with plurality of radiators | |
| CN202598253U (en) | Carbon crystal heat dissipation light-emitting diode (LED) lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |