CN201479459U

CN201479459U - Circuit board provided with radiating fin inside

Info

Publication number: CN201479459U
Application number: CN2009201692907U
Authority: CN
Inventors: 林立明; 何继伟; 王劲; 文署光; 童杨; 张志明
Original assignee: CHENGDU TOMORROW HIGH TECHNOLOGY INDUSTRY Co Ltd
Current assignee: CHENGDU TOMORROW HIGH TECHNOLOGY INDUSTRY Co Ltd
Priority date: 2009-08-21
Filing date: 2009-08-21
Publication date: 2010-05-19
Anticipated expiration: 2019-08-21

Abstract

The utility model discloses a circuit board provided with a radiating fin inside. The circuit board is a multilayer board which at least comprises a copper foil layer, a base board layer and a heat conduction glue layer. The utility model is characterized in that the copper foil layer is fixedly arranged on the base board layer; the heat conduction glue layer is arranged on the copper foil layer, the radiating fin is arranged on the heat conduction glue layer, and heat conduction columns connected with the radiating fin are arranged in the heat conduction glue layer; the radiating fin is made of silver material; and one side of the radiating fin combined with the heat conduction glue layer is provided with the uniformly distributed heat conduction columns, and the other side of the radiating fin is provided with radiating columns in the shape of a sugarcoated haw string. The radiating columns are distributed in an involute shape by taking the center of the radiating fin as a center, and the heights of the radiating columns are larger and larger from inside to outside. The overall radiation area of the circuit board provided with the radiating fin inside is greatly increased, and the radiation efficiency is increased.

Description

In be provided with the circuit board of fin

Technical field

The utility model relates to circuit board manufacturing technology field, be specifically related to be provided with in a kind of the circuit board of fin, the heat that electronic building brick is produced can conduct fast, can produce better heat-dissipating space to increase its radiating effect, further promotes the usefulness of its heat radiation.

Background technology

Applied aspect of circuit board and field are quite wide at present, electronic building brick in the general electronic products all will be inserted in the circuit board, and circuit board is the assembly that meets high power and high heat now, is all strengthening to some extent aspect the circuit board heat radiation, to improve its radiating efficiency high power.

In fact, textural in traditional circuit-board, because electronic building brick quantity and consumed power are low, the heat that electronic building brick produced mostly can be conducted out by copper foil layer, directly dissipate in the surrounding air, yet electronic building brick power height of being laid on the circuit board and quantity are many again now, incident problem is to increase with electric current, the electrical power that is consumed increases, and the problem that the generation amount of localized heat excessively raises, the mode of utilizing electronic building brick to lead the haptic element heat extraction can't shed most of heat, make electronic building brick and circuit board can't maintain the demand of normal working temperature, overheated working temperature can cause the electronic building brick physical characteristic to change, and makes electronic building brick can't reach predetermined task performance, even can burn and shorten the useful life of electronic building brick.

Therefore there is no any radiator structure on the present traditional circuit-board, so that when assembling can produce the electronic building brick of high heat, need on electronic building brick, to install a metal fin (mostly being aluminium or copper) additional as transmitting medium with thermal grease or heat radiation paster, the heat that utilizes the metallic character of fin that electronic building brick is produced can conduct fast, to assist circuit board and electronic building brick efficiently radiates heat.

And a kind of preferable aluminium base that dispels the heat is also arranged on the market, can be used for to produce the electronic building brick of high heat, its way of this aluminium base is as primary structure with a copper foil layer and an aluminium sheet, and between copper foil layer and aluminium sheet, lay a film, when pressing,, at first form an aluminium base by film cementation copper foil layer and aluminium sheet; As above-mentioned structure, when producing heat, the electronic building brick that assembles on the aluminium base can conduct to aluminium sheet by copper foil layer, and utilize the metallic character of aluminium sheet that heat is dissipated to air, reinforced platoon's thermal effect.Yet, as above-mentioned traditional circuit-board or aluminium base, see the disappearance that its structure but is implied with many manufacturings and uses:

1, know that on business circuit board is to strengthen the metal fin that radiating effect added, the apostle increases outside the integral production cost, and because of the bulky problem that causes assembling inconvenience or insufficient space of metal fin.

2, known aluminium base its utilize the aluminium sheet radiating mode, can determine the effect of dispelling the heat because of the thickness of aluminium sheet, and the thickness of known aluminium base is generally 1.6mm, and the aluminium base of this thickness can't effectively be discharged the heat that electronic building brick and chip module produced, and can't reach predetermined radiating effect.

3, known circuits plate and fin are in order to make contact-making surface better, can be between the two lay a thermal grease, so that a good conductor to be provided, but because of its heat transfer efficiency of thermal grease not as good as metal, and using and to harden rotten for a long time and become a thermal resistance, and causing heat transfer efficiency to descend.

Therefore, how to obtain the more good circuit board of thermal diffusivity, be the general problem of industry.

The utility model content

Technical problem to be solved in the utility model is: how the circuit board that is provided with fin in a kind of is provided, and this circuit board combines fin with the heat conduction glue-line, make heat can conduct to fin fast by metallic character, to increase the radiating efficiency of circuit board; The three-dimensional area of dissipation and the efficient of this fin moulding can dissipate in the air heat faster, and the heat of effectively getting rid of electronic building brick and being produced; Can reduce the extra time of on electronic building brick, laying fin, also can further reduce cost.

For achieving the above object, the technical scheme that the utility model adopted is: the circuit board that is provided with fin in a kind of is provided, and this circuit board is a multi-layer sheet, wherein comprises a copper foil layer at least, a substrate layer, a heat conduction glue-line; It is characterized in that: described copper foil layer is fixedly installed on the substrate layer; Described heat conduction glue-line is arranged on the copper foil layer, and the heat conduction glue-line is provided with fin, is provided with the heating column that all is connected with fin in the heat conduction glue-line; Described fin adopts silver material; The one side that described fin combines with the heat conduction glue-line is provided with equally distributed heating column, and another side is provided with the thermal column that is " sugarcoated haws string " shape.

Circuit board according to being provided with fin in provided by the utility model is characterized in that: described thermal column is that the center is the involute shape and distributes with the center of fin, and the height of thermal column is increasing from inside to outside.

As mentioned above, when the circuit board that is provided with fin in provided by the utility model uses, on circuit board, lay most electronic building bricks, electronic building brick can produce high heat behind electric action, the high heat that is produced absorbs via copper foil layer, and be transmitted to fin fast by the heat conduction glue-line, increase by this fin area of dissipation, provide heat to dissipate in the air fast, allow the circuit board whole efficiency promote, unlikely overheated to guarantee that electronic building brick and circuit board can maintain normal working temperature, and can prolong its useful life, and can reduce the time of extra laying fin and reduce cost, can reach the purpose of quick heat radiating relatively.

Accompanying drawing and explanation thereof

Fig. 1 is a schematic appearance of the present utility model;

Fig. 2 is the decomposing schematic representation of Fig. 1;

Fig. 3 is the structure diagram of fin.

Wherein, 1, fin; 101, heating column; 102, thermal column; 2, heat conduction glue-line; 3, copper foil layer; 4, substrate layer.

Embodiment

Below in conjunction with accompanying drawing the utility model is further described:

As shown in the figure, be provided with the circuit board of fin in this, be multi-layer sheet, wherein comprise a copper foil layer 3, one substrate layers 4, a heat conduction glue-line 2 at least; It is characterized in that: described copper foil layer 3 is fixedly installed on the substrate layer 4; Described heat conduction glue-line 2 is arranged on the copper foil layer 3, and heat conduction glue-line 2 is provided with fin 1, is provided with the heating column 101 that all is connected with fin 1 in the heat conduction glue-line 2; Described fin 1 adopts silver material; The one side that described fin 1 combines with heat conduction glue-line 2 is provided with equally distributed heating column 101, and another side is provided with the thermal column 102 that is " sugarcoated haws string " shape.

Above-mentioned thermal column 102 is that the center is the involute shape and distributes with the center of fin 1, and the height of thermal column 102 is increasing from inside to outside.

The above, it only is preferred embodiment of the present utility model, when not limiting the scope that the utility model is implemented with this, promptly change according to the utility model claim and the simple equivalent done of creation description generally and modify, all should still belong in the scope that the utility model patent contains.

Claims

1. be provided with the circuit board of fin in one kind, this circuit board is a multi-layer sheet, wherein comprises a copper foil layer at least, a substrate layer, a heat conduction glue-line; It is characterized in that: described copper foil layer is fixedly installed on the substrate layer; Described heat conduction glue-line is arranged on the copper foil layer, and the heat conduction glue-line is provided with fin, is provided with the heating column that all is connected with fin in the heat conduction glue-line; Described fin adopts silver material; The one side that described fin combines with the heat conduction glue-line is provided with equally distributed heating column, and another side is provided with the thermal column that is " sugarcoated haws string " shape.

2. be provided with the circuit board of fin in according to claim 1, it is characterized in that: described thermal column is that the center is the involute shape and distributes with the center of fin, and the height of thermal column is increasing from inside to outside.